CN203559121U - Device for depositing diamond film on inner hole of micropore wiredrawing mould - Google Patents
Device for depositing diamond film on inner hole of micropore wiredrawing mould Download PDFInfo
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- CN203559121U CN203559121U CN201320736185.3U CN201320736185U CN203559121U CN 203559121 U CN203559121 U CN 203559121U CN 201320736185 U CN201320736185 U CN 201320736185U CN 203559121 U CN203559121 U CN 203559121U
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- mould
- diamond film
- wiredrawing
- heated filament
- inner hole
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Abstract
The utility model discloses a device for depositing a diamond film on an inner hole of a micropore wiredrawing mould. The device comprises a vacuum furnace cover, and a placing platform arranged on the vacuum furnace cover, wherein an air inlet is formed in a position, which is close to the end part, of the vacuum furnace cover, and an extraction opening is formed in the bottom end of the vacuum furnace cover. The device is characterized in that a heater frame is arranged above the placing platform, and fans are arranged on the top, which is just opposite to a draw bench and a wiredrawing mould, of the vacuum furnace cover. An existing method for depositing the diamond film by using a heater method is overturned, the phenomenon that a mould is directly rejected when a heater sags in a heating process and the surface of an inner hole of the mould is damaged by shaking due to a smaller inner hole of the mould is effectively prevented, the diamond film is deposited when the heater is arranged outside the draw bench, the yield is increased, the problem that the diamond film is hardly deposited by the micropore wiredrawing mould is solved, and the production cost is lowered.
Description
Technical field
The utility model relates to depositing diamond film field in wortle, relates in particular to deposition method in minute aperture wortle.
Background technology
Diamond thin is described as at present new functional materials in the world, and its excellent properties is in every respect made great contributions in Materials science, information technology, biotechnology and other technologies for the mankind.Along with the tight demand of social development and reaching its maturity to its growing technology thereof, the growth of diamond thin is also slowly grasped rapidly and progressively industrialization by scientific worker in advance from scientific research and testing chamber, and the performance of its high quality product matter is fully utilized.
Growing diamond membrane method is a lot, mainly with hot wire process, Plasma Enhanced Chemical Vapor Deposition (PECVD), microwave plasma chemical vapour deposition process etc.But through being engaged in diamond thin scientific research personnel's thousands of times test, hot wire process is more cheap with its equipment, produces growing film easy to control, and the speed of growth is very fast, production cost cost performance is the highest and used widely by people.Additive method is because of apparatus expensive, and growth film forming is difficult to grasp and makes us forbidding.Except test, all the other generally all do not adopt the industrialization of being engaged in product.
At present domestic existing several families with thermal filament chemical vapor deposition of diamond film for wire-drawing die endoporus, such mould because of its matrix toughness good, working face has adamantine high rigidity, surface smoothness is high and be subject to the favor of vast wire drawing industry.But the mould for the minute aperture of endoporus Φ 3.00 is difficult to successfully, and production efficiency is low.Because hot wire process is that heated filament is through among mould endoporus, because mould endoporus is very little and heated filament self sagging and fragile mould bore surface of shake in heat-processed, cause mould directly to be scrapped.
Summary of the invention
The utility model is for the deficiencies in the prior art, providing a kind of utilizes heated filament method heated filament heats direct growth method above mould through mould endoporus without utilizing, it effectively prevents that heated filament is sagging and shakes and damage bore surface, improves the success ratio of endoporus deposition, reduces production costs.
The growth of diamond thin must possess following condition: 1. fine wortle matrix does not have catalyticing decomposition action or acts on very little diamond thin, the matrix that we adopt is that the carbon tungsten alloy after cobalt is removed on surface, and such material is very little to diamond thin catalytic decomposition; 2. gas must be intensified, and high temperature heated filament is to utilize heated filament to send high temperature to make gas become plasma body; 3. in gas, must contain carbon source, we generally adopt methane as carbon source aborning; 4. in gas atmosphere, must there is etching graphite to grow up or suppress the element that graphite is grown up, people generally acknowledge it is that hydrogen atom adapts to most at present, so we pass in vacuum bonnet by High Purity Hydrogen, thereby the growth of etching or inhibition graphite makes the diamond thin speed of growing; 5. will have motivating force to make the carbon atom of plasma arrive the surface of matrix, yet be exactly this point, all vacuum moulding machine stoves that we use at present are not all accomplished.A high temperature steel fan is installed at vacuum bell jar top now.Because have certain temperature in the inherent process of growth of vacuum (-tight) housing, but be generally no more than 250 ℃, so motor must be placed on outside vacuum bell jar.Like this in diamond film growth process, without heated filament being through among mould endoporus, the carbon atom of the ionizations such as the wind-force that the rotation by fan produces orders about is deposited on wire-drawing die endoporus, thereby in fine mould endoporus, grows the uniform diamond thin of one deck.
A kind of device of minute aperture wortle endoporus depositing diamond film, comprise vacuum bonnet, be arranged at the placement platform of vacuum bonnet, described vacuum bonnet close end offers inlet mouth, bottom offers bleeding point, it is characterized in that placement platform top is provided with heated filament frame, described vacuum bonnet top is provided with fan over against wire drawing and wortle.
On described heated filament frame, horizontal interval is wound with heated filament, and the spacing between adjacent heated filament is 8 ~ 10mm.
Described placement platform is rotatable platform.
The beneficial effects of the utility model: the utility model has been overturned the method for existing hot wire process depositing diamond film, effectively prevent that mould endoporus is very little, heated filament self sagging and shake mold damage bore surface in heat-processed, the phenomenon that causes mould directly to be scrapped, employing is arranged at wortle by heated filament and carries out depositing diamond film outward, improve yield rate, and solved the problem of micropore wortle depositing diamond film difficulty, reduced production cost.
Accompanying drawing explanation
Fig. 1 is the hot wire process structure iron of prior art.
Fig. 2 is the schematic diagram of device of the present utility model.
Embodiment
A kind of device of minute aperture wortle endoporus depositing diamond film, comprise vacuum bonnet 001, be arranged at the placement platform 002 of vacuum bonnet 001, described vacuum bonnet 001 close end offers inlet mouth 011, bottom offers bleeding point 012, placement platform 002 top is provided with heated filament frame 003, and described vacuum bonnet 001 top is provided with fan 004 over against wire drawing and wortle.On described heated filament frame 003, horizontal interval is wound with heated filament, and the spacing between adjacent heated filament is 8 ~ 10mm.Described placement platform 002 is rotatable platform.
Claims (3)
1. the device of a minute aperture wortle endoporus depositing diamond film, comprise vacuum bonnet, be arranged at the placement platform of vacuum bonnet, described vacuum bonnet close end offers inlet mouth, bottom offers bleeding point, it is characterized in that placement platform top is provided with heated filament frame, described vacuum bonnet top is provided with fan over against wire drawing and wortle.
2. the device of a kind of minute aperture wortle endoporus depositing diamond film according to claim 1, is characterized in that on described heated filament frame, horizontal interval is wound with heated filament, and the spacing between adjacent heated filament is 8 ~ 10mm.
3. the device of a kind of minute aperture wortle endoporus depositing diamond film according to claim 1, is characterized in that described placement platform is rotatable platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320736185.3U CN203559121U (en) | 2013-11-21 | 2013-11-21 | Device for depositing diamond film on inner hole of micropore wiredrawing mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320736185.3U CN203559121U (en) | 2013-11-21 | 2013-11-21 | Device for depositing diamond film on inner hole of micropore wiredrawing mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203559121U true CN203559121U (en) | 2014-04-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320736185.3U Expired - Fee Related CN203559121U (en) | 2013-11-21 | 2013-11-21 | Device for depositing diamond film on inner hole of micropore wiredrawing mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203559121U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113549894A (en) * | 2021-07-29 | 2021-10-26 | 久钻科技(成都)有限公司 | Diamond coating wire drawing mould processingequipment |
-
2013
- 2013-11-21 CN CN201320736185.3U patent/CN203559121U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113549894A (en) * | 2021-07-29 | 2021-10-26 | 久钻科技(成都)有限公司 | Diamond coating wire drawing mould processingequipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140423 Termination date: 20151121 |
|
| EXPY | Termination of patent right or utility model |