CN203551542U - Gas sensor module capable of automatically refrigerating or heating - Google Patents
Gas sensor module capable of automatically refrigerating or heating Download PDFInfo
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- CN203551542U CN203551542U CN201320732290.XU CN201320732290U CN203551542U CN 203551542 U CN203551542 U CN 203551542U CN 201320732290 U CN201320732290 U CN 201320732290U CN 203551542 U CN203551542 U CN 203551542U
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- gas sensor
- sensor
- lower cover
- temperature
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000002463 transducing effect Effects 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 6
- 239000008358 core component Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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Abstract
The utility model discloses a gas sensor module capable of automatically refrigerating or heating, and relates to a constant-temperature gas sensor device. In order to solve the problems that the low-temperature sensitivity of an existing gas sensor is reduced, so that the misjudgment is easily generated and the service life in a high-temperature environment is reduced, the gas sensor module comprises a sensor upper cover, a control circuit board, a temperature control semiconductor component, a gas sensor, an air inlet and a sensor lower cover; the sensor upper cover and the sensor lower cover are barrels; the sensor upper cover is matched with the sensor lower cover to form a sealed box body; the control circuit board, the temperature control semiconductor component and the gas sensor are arranged inside an inner cavity of the box body; a transparent hole is formed in the center of the bottom of the sensor lower cover; the air inlet is formed in the hole; the temperature control semiconductor component comprises a ceramic shell, a metal film, a metal ring and L semiconductor elements; the gas sensor is arranged inside an inner cavity of the metal ring. The gas sensor module is applicable to the constant-temperature gas sensor device.
Description
Technical field
The utility model relates to gas sensor thermostat.
Background technology
Gas detector is in actual use because temperature is brought huge error on the meeting that affects of sensor to the accuracy detecting.Because gas activity difference has at various temperatures caused sensor, sensitivity is different at various temperatures.
In the prior art, only have two kinds of ways to address the above problem: one, by temperature compensation, but because the sensitivity of generalized case high temperature detector increases, low temperature sensitivity causes the circuit of temperature compensation will have very large gain space guarantee gamut to test, and because temperature sensor and gas sensor are to the different often overcompensate of the speed of thermotonus or too smallly cause erroneous judgement disconnected.Two,, by thermostat, in gas constant temperature device, only have heating function at present, but conventional outdoor air just may be up to 40 even 50 degrees Celsius, so requirement all will be heated to the constant of 60 degrees Celsius or higher temperature guarantee temperature whole equipment.But gas sensor its life-span under hot environment can reduce greatly, whole life of equipment is shortened, increased the difficulty of safeguarding.
Utility model content
The purpose of this utility model is easily to produce in order to solve existing gas sensor low temperature sensitivity the problem that under the disconnected and hot environment of erroneous judgement, its life-span can reduce, and the gas sensor module of a kind of Automatic-cooling or heating is provided.
The gas sensor module of Automatic-cooling or heating, it comprises sensor upper cover, control circuit board, temperature control semiconductor subassembly, gas sensor, air admission hole and sensor lower cover, sensor upper cover and sensor lower cover are staving, and sensor upper cover and the airtight casing of sensor lower cover mix proportion, control circuit board, temperature control semiconductor subassembly and gas sensor are all placed in the inner chamber body of described casing, center, sensor bottom of the next cover has penetrating hole, and air admission hole is placed in described hole; Temperature control semiconductor subassembly comprises ceramic case, metal film, a becket and L semiconductor element, L is greater than 1 integer, ceramic case and becket coaxial rings cover arrange, metal film is fixed on the madial wall of ceramic case, one end of L semiconductor element is uniformly distributed along becket lateral wall radial, the other end of L semiconductor element is connected respectively on metal film, and gas sensor is arranged in the inner chamber of becket.
The utility model is adjusted into gas sensor optimum working temperature by the temperature of gas sensor air chamber of living in automatically by temperature control semiconductor subassembly, thus the impact of the variation that has overcome environment temperature on the sensitivity of gas sensor and life-span.Make gas sensor can adapt to on-the-spot wide temperature and use, the life cycle that has extended to greatest extent gas sensor, makes under identical operating mode service condition, and the life-span of gas sensor at least improves 70%.
Accompanying drawing explanation
Fig. 1 is cut-open view of the present utility model, and Fig. 2 is the vertical view of the temperature control semiconductor subassembly in embodiment one.
Embodiment
embodiment one:in conjunction with Fig. 1 and Fig. 2, present embodiment is described, the gas sensor module of Automatic-cooling or heating described in present embodiment, it comprises sensor upper cover 1, control circuit board 2, temperature control semiconductor subassembly 3, gas sensor 4, air admission hole 6 and sensor lower cover 7, sensor upper cover 1 and sensor lower cover 7 are staving, and sensor upper cover 1 and the airtight casing of sensor lower cover 7 mix proportion, control circuit board 2, temperature control semiconductor subassembly 3 and gas sensor 4 are all placed in the inner chamber body of described casing, sensor lower cover 7 bottom centre have penetrating hole, air admission hole 6 is placed in described hole, temperature control semiconductor subassembly 3 comprises ceramic case 3-1, metal film 3-2, becket 3-3 and L semiconductor element 3-4, L is greater than 1 integer, ceramic case 3-1 and becket 3-3 coaxial rings cover arrange, metal film 3-2 is fixed on the madial wall of ceramic case 3-1, one end of L semiconductor element 3-4 is uniformly distributed along becket 3-3 lateral wall radial, the other end of L semiconductor element 3-4 is connected respectively on metal film 3-2, and gas sensor 4 is arranged in the inner chamber of becket 3-3.
embodiment two:in conjunction with Fig. 1, present embodiment is described, present embodiment is the further restriction to the gas sensor module of Automatic-cooling described in embodiment one or heating, gas sensor 4 coaxially arranges with air admission hole 6, gas sensor 4 be arranged on air admission hole 6 directly over.
embodiment three:in conjunction with Fig. 1, present embodiment is described, present embodiment is the further restriction to the gas sensor module of Automatic-cooling described in embodiment one or heating, and it also comprises flame proof net 5, and flame proof net 5 is arranged between air admission hole 6 and gas sensor 4.
Temperature control semiconductor subassembly 3 in the utility model is core components of whole sensor temperature control, and the shell of temperature control semiconductor subassembly 3 is comprised of ceramic case 3-1 and the metal film 3-2 that is fixed in ceramic case 3-1 inwall.Ceramic case 3-1 is fixed by becket 3-3 inside.Fixing semiconductor element 3-4 is installed between inwall metal film 3-2 and becket 3-3, when electric current flows to metal film 3-2 by becket 3-3 by semiconductor element 3-4, the heat of air chamber D1 in becket 3-3 inner chamber is absorbed by the N2 end of semiconductor element 3-4, N1 by semiconductor element 3-4 holds releases heat again, described heat comprises that heat and electric current that semiconductor N 2 ends absorb flow through the heat that semiconductor element self sends, thereby reduces the temperature of air chamber D1.Contrary when electric current flows to becket 3-3 by metal film 3-2 by semiconductor element 3-4 in this, by the temperature of heating air chamber D1.Reach the temperature Automatic-cooling of gas sensor 4 air chamber D1 of living in or the object of heating, and can control by changing sense of current and intensity the temperature of gas sensor 4 air chamber D1 of living in.Make gas sensor 4 all the time in optimum working temperature, the life-span of gas sensor 4 has been improved more than 70%.
embodiment four:in conjunction with Fig. 1, present embodiment is described, present embodiment is the further restriction to the gas sensor module of Automatic-cooling described in embodiment one or heating, sensor upper cover 1 top center has penetrating hole, the power input of control circuit board 2 is communicated with the output terminal of external power source by the wire through described hole, and the output terminal of the transducing signal of control circuit board 2 is communicated with the input end of external sense signal by the signal transmssion line through described hole.
Claims (4)
1. the gas sensor module of Automatic-cooling or heating, it is characterized in that, it comprises sensor upper cover (1), control circuit board (2), temperature control semiconductor subassembly (3), gas sensor (4), air admission hole (6) and sensor lower cover (7), sensor upper cover (1) and sensor lower cover (7) are staving, and sensor upper cover (1) and the airtight casing of sensor lower cover (7) mix proportion, control circuit board (2), temperature control semiconductor subassembly (3) and gas sensor (4) are all placed in the inner chamber body of described casing, sensor lower cover (7) bottom centre has penetrating hole, air admission hole (6) is placed in described hole, temperature control semiconductor subassembly (3) comprises ceramic case (3-1), metal film (3-2), becket (3-3) and L semiconductor element (3-4), L is greater than 1 integer, ceramic case (3-1) arranges with becket (3-3) coaxial rings cover, metal film (3-2) is fixed on the madial wall of ceramic case (3-1), one end of L semiconductor element (3-4) is uniformly distributed along becket (3-3) lateral wall radial, the other end of L semiconductor element (3-4) is connected respectively on metal film (3-2), gas sensor (4) is arranged in the inner chamber of becket (3-3).
2. the gas sensor module of Automatic-cooling or heating according to claim 1, is characterized in that, gas sensor (4) coaxially arranges with air admission hole (6), gas sensor (4) be arranged on air admission hole (6) directly over.
3. the gas sensor module of Automatic-cooling or heating according to claim 2, is characterized in that, it also comprises flame proof net (5), and flame proof net (5) is arranged between air admission hole (6) and gas sensor (4).
4. the gas sensor module of Automatic-cooling or heating according to claim 1, it is characterized in that, sensor upper cover (1) top center has penetrating hole, the power input of control circuit board (2) is communicated with the output terminal of external power source by the wire through described hole, and the output terminal of the transducing signal of control circuit board (2) is communicated with the input end of external sense signal by the signal transmssion line through described hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320732290.XU CN203551542U (en) | 2013-11-20 | 2013-11-20 | Gas sensor module capable of automatically refrigerating or heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320732290.XU CN203551542U (en) | 2013-11-20 | 2013-11-20 | Gas sensor module capable of automatically refrigerating or heating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203551542U true CN203551542U (en) | 2014-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320732290.XU Expired - Fee Related CN203551542U (en) | 2013-11-20 | 2013-11-20 | Gas sensor module capable of automatically refrigerating or heating |
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| CN (1) | CN203551542U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103728416A (en) * | 2013-11-20 | 2014-04-16 | 哈尔滨东方报警设备开发有限公司 | Gas sensor module capable of realizing automatic cooling or heating |
| CN105158416A (en) * | 2015-08-12 | 2015-12-16 | 浙江工商大学 | System for detecting volatile dimethylbenzene in experimental environment as well as method |
| CN105738564A (en) * | 2014-12-11 | 2016-07-06 | 哈尔滨东方报警设备开发有限公司 | Gas sensor capable to conduct automatic temperature control |
-
2013
- 2013-11-20 CN CN201320732290.XU patent/CN203551542U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103728416A (en) * | 2013-11-20 | 2014-04-16 | 哈尔滨东方报警设备开发有限公司 | Gas sensor module capable of realizing automatic cooling or heating |
| CN105738564A (en) * | 2014-12-11 | 2016-07-06 | 哈尔滨东方报警设备开发有限公司 | Gas sensor capable to conduct automatic temperature control |
| CN105158416A (en) * | 2015-08-12 | 2015-12-16 | 浙江工商大学 | System for detecting volatile dimethylbenzene in experimental environment as well as method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Gas sensor module capable of realizing automatic cooling or heating Effective date of registration: 20151029 Granted publication date: 20140416 Pledgee: Bank of Harbin Limited by Share Ltd. Nangang branch Pledgor: HARBIN EAST ALARM EQUIPMENT DEVELOPMENT Co.,Ltd. Registration number: 2015990000935 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20161108 Granted publication date: 20140416 Pledgee: Bank of Harbin Limited by Share Ltd. Nangang branch Pledgor: HARBIN EAST ALARM EQUIPMENT DEVELOPMENT Co.,Ltd. Registration number: 2015990000935 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Gas sensor module capable of realizing automatic cooling or heating Effective date of registration: 20161108 Granted publication date: 20140416 Pledgee: Bank of Harbin Limited by Share Ltd. Nangang branch Pledgor: HARBIN EAST ALARM EQUIPMENT DEVELOPMENT Co.,Ltd. Registration number: 2016990000958 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20190416 Granted publication date: 20140416 Pledgee: Bank of Harbin Limited by Share Ltd. Nangang branch Pledgor: HARBIN EAST ALARM EQUIPMENT DEVELOPMENT Co.,Ltd. Registration number: 2016990000958 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 |