CN203549459U - LED (light emitting diode) bulb lamp - Google Patents
LED (light emitting diode) bulb lamp Download PDFInfo
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- CN203549459U CN203549459U CN201320612496.9U CN201320612496U CN203549459U CN 203549459 U CN203549459 U CN 203549459U CN 201320612496 U CN201320612496 U CN 201320612496U CN 203549459 U CN203549459 U CN 203549459U
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- light source
- led
- glass
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- bulb lamp
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- 239000011521 glass Substances 0.000 claims description 99
- 239000000758 substrate Substances 0.000 claims description 67
- 239000004020 conductor Substances 0.000 claims description 17
- 239000003292 glue Substances 0.000 claims description 15
- 239000005357 flat glass Substances 0.000 claims description 11
- 239000003365 glass fiber Substances 0.000 claims description 8
- 230000000737 periodic effect Effects 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 7
- 230000004907 flux Effects 0.000 description 17
- 238000012360 testing method Methods 0.000 description 10
- 229910017083 AlN Inorganic materials 0.000 description 9
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000003595 mist Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 208000019901 Anxiety disease Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004939 coking Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model relates to an LED (light emitting diode) bulb lamp, and belongs to the technical field of application of LED lighting lamps. The LED bulb lamp comprises an LED light source, a bracket, a lamp shade, a lamp base and a power supply, wherein the LED light source is arranged on the bracket, is placed in the lamp shade and is connected with the power supply through a power line; the power supply is fixed in the lamp base. The cost is reduced, and meanwhile, a preparation process is simplified.
Description
Technical field
the utility model relates to a kind of LED bulb lamp, belongs to LED lamp applications technical field.
Background technology
from market angle analysis LED bulb lamp, generally all adopt spherical or class globular bulb, the Jiang Shi commercial market, market that it is maximum, because civilian maximum in city are spherical bulbs, LED bulb lamp is the novel green light source that substitutes conventional incandescent bulb.
from government's level analysis; that conventional incandescent (tengsten lamp) consumes energy is high, the life-span is short; under under the overall situation of global resources anxiety; gradually, by national governments, forbidden producing, substitute products are electronic energy-saving lamps thereupon, although electronic energy-saving lamp has improved energy-saving effect; but owing to having used the heavy metal element of many contaminated environment; run counter to again the main trend of environmental protection, all living under the major premise of environmental protection in the whole world, the product of this contaminated environment must Hui Bei government be eliminated.
along with the high speed development LED illumination of LED technology becomes the only choosing of novel green illumination gradually, LED is far superior to traditional lighting product in the aspect of principle of luminosity, energy-saving and environmental protection.
at present traditional LED bulb lamp is mainly by forming with lower member: 1, cloche or acrylic cover; 2, lens; 3, radiator; 4, aluminium base; 5, power supply prepackage cavity (generally in radiator the inside); 6, plastic fastening (mainly playing insulating effect); 7, lamp socket interface (minute E27, M16 etc.); 8, light source: light source divides again granular pattern and the large class of high-power integrated type two; 9, power supply.Mechanism is complicated, assembling trouble, and cost is expensive, to restrict at present the factor that LED bulb lamp market further replaces a most key property of incandescent lamp, so awaiting us removes to find a kind of assembling degeneracy and can reduce costs, what is more important can further improve the new technology of LED bulb lamp performance, realizes LED bulb lamp and in global commercial market, substitutes other class bulb lamps completely.
Summary of the invention
inventor of the present utility model provides a kind of LED bulb lamp and preparation method thereof, to simplify the labyrinth of current LED bulb lamp, reduces costs simultaneously, further improves the performance of LED bulb lamp.
first from light source, we choose usings glass as substrate, replace traditional aluminium base to improve the light extraction efficiency of LED chip, because traditional aluminium base is under light source works state, the bright dipping at the LED chip back side is almost lost to the greatest extent, the utility model is chosen the glass of full impregnated light almost as substrate, can realize the bright dipping of LED chip full angle.On each glass substrate, be at least provided with two electrodes; for being electrically connected with LED chip afterwards; LED chip of the present utility model selects fluorescent glue to be fixed on glass baseplate surface; to utilizing metal lead wire to be electrically connected between chip and chip, chip and electrode; on glass substrate (except electrode area), chip, lead-in wire, be all coated fluorescent glue; by the coated of fluorescent glue, can effectively excite LED chip bright dipping in working order; can be fixed protection to lead-in wire again, in order to avoid lead-in wire is subject to the impact of extraneous factor to occur the dead lamp phenomenon of off-line simultaneously.
electrode on glass substrate described in the utility model is hollow sputter in PVD, be to improve adhesive force, first sputter one deck Cr on glass substrate, then on Cr layer sputter layer of Ni, be prepared into electrode.In sputter process, Control of Voltage is between 300V-600V, and Current Control is between 4A-8A, and chamber pressure is 5*10
-3
pa, the time is 0.5 hour-1.0 hours.The thickness of Cr layer is 0.5-1 μ m, and the thickness of Ni layer is 50-100nm.
it is fixing that inventor of the present utility model finds that through test LED light source and conductor wire are electrically connected, and preferably, by prepare outer electrode on conductor wire, the electrode card insert type in LED light source top glass substrate is fixed on the outer electrode on conductor wire.The outer electrode of directly preparing LED chip due to being limited in of its material of glass substrate is above very difficult, be all generally by metal outer electrode with adhesive glue or scolding tin lamp material adhesive on glass substrate, this mode is simple, with low cost, technique is easy to realize, but it exists great drawback, this class mode high temperature resistance is poor especially.Our LED bulb lamp of the present utility model is assurance vacuum seal, LED light source is put into after lampshade, need to pass through glass lamp shade and glass supporter base high-temperature fusion sealing by fusing, temperature is about 250 ℃ of left and right, in this hot environment, by the fixing outer electrode of bonding way, it very easily comes off with glass substrate and causes dead lamp.The utility model adopts fixedly outer electrode of card insert type, can, at the good contact that guarantees outer electrode and glass substrate electrode, avoid again pasting the drawback that connects non-refractory.Also reduced the difficulty that lamp plate electrode is manufactured, reduced cost simultaneously.
inventor of the present utility model finds that the glass substrate of different-thickness has different impacts to LED bulb lamp, and glass substrate divides sheet glass and glass fiber by different in width, the broadband of the width G reatT.GreaT.GT glass fiber of sheet glass.Sheet glass THICKNESS CONTROL between 0.5-1.1mm, LED bulb lamp best results of the present invention.The width of glass fiber is between 0.5mm-10mm, and its thickness is between 0.3mm-1.2mm, is preferably 0.3mm-0.6mm.
the LED light source of having prepared is fixed, for improving the sealing of light efficiency and follow-up LED lamp, choose the glass hollow stent with glass base, in glass supporter base, melting is fixed with two conductor wires, all draw from support at conductor wire two ends, wire one end is connected with LED light source for fixed L ED light source one end, the conduction other end is drawn and is respectively used to be connected with the positive and negative of power supply from bracket base, conductor wire is fixed by the melting of glass supporter base, can reduce conductor wire vibration on the one hand and make LED light source unstable, improve on the other hand sealing effectiveness.
when LED bulb lamp of the present utility model is only provided with a LED light source, above-mentioned for being connected with LED light source and the conductor wire of fixed L ED light source is electrically connected with two electrodes of this LED light source respectively; When LED bulb lamp of the present utility model is provided with two or more LED light sources, LED light source adds up to N, suppose X+Y=N, X, Y are integer, each LED light source one end is electrically connected and is fixed on the non-base end of glass supporter mutually, the other end is that X the LED light source P utmost point drawn with positive source and be electrically connected and fix, and Y the LED light source N utmost point drawn with power cathode and be electrically connected and fix.Be connected and fixed part generally at glass supporter base position with positive-negative power line.
choose the glass lamp shade that our bulb lamp need be used, the stentplacement that is fixed with LED light source in glass lamp shade, bracket base is connected with glass lamp shade is melting sealed, by glass supporter hollow part, the air in glass lamp shade is emptying, can prevent that the gas later stage in former air from having a negative impact to LED light source, to injecting the mist of helium and nitrogen in glass lamp shade, gas volume ratio is between 5:1-2:1, support is melting sealed, gas pressure in lampshade is at room temperature controlled between 0.05-0.15MPa.The mist volume ratio of the helium in glass lamp shade and nitrogen is when between 5:1-2:1, pressure is at room temperature controlled between 0.05-0.15MPa, make LED bulb lamp descend in working order radiating effect best, the conductor wire that is arranged at power supply in lamp socket and bracket base is electrically connected, and lamp socket is fixedly connected with lampshade.Realize the preparation of LED bulb lamp.
for simplifying traditional LED ball bulb lamp structure at present, lED bulb lamp of the present utility model is only comprised of LED light source, support, lampshade, lamp socket and power supply, structure, LED light source is arranged on support, be positioned in lampshade, power supply is arranged in the lamp socket of support, confined space is fixed and formed to the lamp socket of support and glass lamp shade, the conductor wire of LED light source prolongs bracket base and is connected with the power turn-on in lamp socket, in lampshade, be filled with the mist of helium and nitrogen, gas volume ratio is between 5:1-2:1, and gas pressure is at room temperature controlled between 0.05-0.15MPa.
lED bulb lamp of the present utility model, its each LED light source can be fixed on glass substrate by fluorescent glue by the above chips of two or two, and the conducting that goes between, at glass substrate and chip, lead-in wire, except the electrode place of glass substrate, surface all applies that fluorescent glue encapsulation forms.
lED bulb lamp of the present utility model, the glass substrate of its LED light source is for increasing the surface area of glass substrate, improve heat radiation, glass substrate can be graphical glass substrate, in order to make its radiating effect optimization, it is patterned into the shape of protruding hemispherical, taper shape, sharp cone distal, polyhedron taper or the yurt shape of array periodic arrangement, the projection cycle is 1 μ m-10 μ m, and bottom width is 5 μ m-25 μ m, is highly 0.1 μ m-5 μ m; Graphical glass substrate further comprises the patterned aln layer of one deck, its figure is netted space formula patterned structures, gap is regular equilateral triangle or positive equilateral polygon, every the length of side is greater than 0.8 μ m, area is between 10 μ m2-1000 μ m2, and the distance between adjacent space is no more than 10 μ m; On glass while preparing aln layer temperature be no more than 130 ℃, the thickness of aln layer is between 500-3000 dust, for improving glass substrate etching effect, glass substrate is used acid solution clean surface before etching, described acid solution is that the volume ratio of acid and water is between 1:5-1:10, described acid is the follow-up acid of carrying out etching glass substrate, is selected from hydrochloric acid or phosphoric acid or sulfuric acid, and etching period is 3-8min.Glass substrate preparation comprises following two kinds of methods: method one, first prepare graphical glass plate, glass substrate is carried out preparing photoresistance after acid solution cleaning, after graphically being developed, photoresistance carries out etching, after etching required figure, the glass substrate after graphical is prepared to photoresistance again, photoresistance is carried out plating aluminium nitride after graphical development, now plating omnidistance temperature in the process of aluminium nitride is all controlled at below 130 ℃, in order to avoid negative photoresistance is because excess Temperature coking is in glass baseplate surface, affect subsequent technique, plated and removed photoresistance after aluminium nitride and obtain the graphical aluminium nitride on graphical glass substrate.Method two, at glass baseplate surface, first plate aluminium nitride, then at aln surface, prepare photoresistance, photoresistance is graphically developed, after development, to being coated with the glass substrate of aln layer, carry out etching, be prepared into the graphical glass substrate with graphical aln layer.The utility model glass substrate plates aluminium nitride after graphical treatment again, having improved aluminium nitride is attached directly to the adhesive force on glass substrate on the one hand, glass substrate can increase its surface area by graphical treatment on the other hand, improved its radiating effect, graphical and the aluminium nitride of glass is graphical simultaneously, because its figure is nanoscale, though later stage glass baseplate surface when prepared by LED light source applies fluorescent glue, but because fluorescent glue particle more very much not can infiltrate graphics field, make to form pore between substrate figure and fluorescent glue, air under LED light source duty in pore is because being affected by the heat energy under LED light source duty, by gas constantly high speed convection accelerate substrate and dispel the heat.
if the LED light source quantity in a LED bulb lamp of the present utility model is greater than 1, and each LED light source is all the same, supposes that LED light source quantity is N, X+Y=N, and X, Y are integer, and N is even number, and X=Y.But the electrical parameter of each LED light source is the most approaching during X=Y, under this LED bulb lamp duty, properties is the most stable relatively.
Accompanying drawing explanation
accompanying drawing of the present utility model is for the present invention is further described, but not restriction to invention scope of the present invention.
fig. 1 the utility model LED light source is adhesive with the glass substrate schematic diagram of LED chip
fig. 2 the utility model LED light source schematic diagram
fig. 3 the utility model LED light source schematic diagram
fig. 4 the utility model glass fiber LED bulb lamp schematic diagram
fig. 5 the utility model sheet glass LED bulb lamp schematic diagram
1 is chip, 2 for being coated with the figure glass substrate of graphical aluminium nitride, 2a be graphical aln layer on glass substrate, 3 for lead-in wire, 4 for fluorescent glue, 5 for glass substrate, 6 for electrode, 7 for lamp socket, 8 for power supply, 9 for LED light source, 10 be glass capsulation lampshade, 11 supports, 12 gases, 13 outer electrodes, 14 conductor wires.
The specific embodiment
embodiment of the present utility model is for the present invention is further described, but not restriction to invention scope of the present utility model.
embodiment 1 glass substrate
select glass substrate, glass baseplate surface is carried out to mask etch, etch the yurt shape projection of array periodic arrangement, the projection cycle is 5 μ m left and right, and bottom width is 10 μ m left and right, is highly 2.5 μ m left and right.Glass baseplate surface after graphical treatment plates aln layer, then carry out mask etch, etch netted space formula patterned structures, gap is regular equilateral hexagon, the length of side is 3 μ m left and right, and the distance between adjacent space is 3 μ m-7 μ m left and right.At glass substrate table, prepare electrode; paste fixed L ED chip; between chip and chip; between chip and electrode, by lead-in wire, be connected, lead-in wire has connected, at glass baseplate surface, removes electrode zone; other positions all apply fluorescent glue; and coated whole LED chip and institute leaded, with reach farthest excite the bright dipping of LED chip and effectively protection lead-in wire do not touched, the dead lamp of off-line of avoiding going between.
the contrast of the various LED bulb lamp of embodiment 2 test data
we test following various LED bulb lamps, dividing 5 groups carries out, use respectively 15 lamps for every group, A group is traditional LED bulb lamp, cloche, lens, radiator, aluminium base, power supply prepackage cavity, plastic fastening, lamp socket interface, light source, power supply, consists of; B group is for pressing the utility model glass substrate, the LED bulb lamp that in seal glass lampshade prepared by inflation method; C group, on B group basis, glass substrate being carried out to etching by the utility model method, is etched into patterned substrate and is prepared into LED bulb lamp; D group is for being coated with at graphical substrate surface the LED bulb lamp that one deck aln layer is prepared on the basis in C group preparation method; The LED bulb lamp of E group for aln layer being carried out by the technical solution of the utility model being prepared into after graphical treatment on the basis in D group.Each chip quality, quantity, various performance parameters of organizing in LED bulb lamp is all the same, we carry out the test of temperature and luminous flux to each LED bulb lamp, after lighting, tests each group LED bulb lamp its lampshade surface temperature, light source table surface temperature and the light flux values line item of going forward side by side under stable state, each cell mean of technology (mean value get decimal point after one), charges to the table with test results that table 1, various LED bulb lamps carry out temperature and luminous flux.
each is organized LED bulb lamp and is 1.2w; LED drives type: capacitance-resistance drives; Testing equipment: 1 meter of integrating sphere, general beautiful TMC-16 temperature polling instrument (K type surface thermocouple probe+standard couple probe); Test environment: LED laboratory, 26 ℃ of environment temperatures, envionmental humidity 75%.
as known from Table 1, by the LED bulb lamp that utilizes the technical solution of the utility model to prepare, although light source table surface temperature is slightly more higher than tradition, its light flux values has obtained effective raising, integrated temperature and luminous flux parameter, the LED bulb lamp best results of E group.
the thermal analysis experiment of the LED bulb lamp of embodiment 3 different-thickness sheet glass
use identical 1023 chips, different glass sheet thickness, in air, measure respectively LED light source, re-use same light source and put into bulb lamp, after recharging mixed gas after vacuumizing, seal, measure respectively initial luminous flux after lighting and stable after luminous flux, and calculate hot stack rate, the sheet glass of deriving different-thickness affects situation to LED bulb lamp.
prepare LED light source, choosing sheet glass thickness is respectively 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, each 15 of every kind of thickness, each glass substrate is provided with two electrodes, uses fluorescent glue fixed chip on substrate, to chip and chip, between chip and electrode, go between and be connected, at glass substrate, chip, on lead-in wire, be all directly coated fluorescent glue, be prepared into LED light source, the glass substrate of various thickness all extracts 5 at random, measures respectively the initial luminous flux value of each LED light source, light stable amount of flux is calculated hot stack rate, hot stack rate=(initial luminous flux value-light stable flux)/initial luminous flux value, to every kind of thickness substrate calculating mean value line item of going forward side by side, specifically in Table 2, every kind of LED light source extracts 5 preparation LED bulb lamps at random simultaneously, each LED light source is placed in a glass lamp shade after being fixed on a glass supporter, seal, and all charged pressure is 0.10MPa, volume ratio is the helium of 3:1 and the mist of nitrogen, the conductor wire that is arranged at power supply in lamp socket and bracket base is electrically connected, and lamp socket is fixedly connected with lampshade, be prepared into the initial luminous flux value of measuring again LED bulb lamp after LED bulb lamp of the present utility model, light stable amount of flux, calculates hot stack rate, to every kind of thickness substrate calculating mean value line item of going forward side by side, specifically in Table 2.Remaining LED light source, for the preparation of LED candle bubble lamp, calculates equally as stated above hot stack rate and carries out record, and the luminous flux during in Table the larger arrival stationary value of 2(hot stack is lower).
the hot stack of the utility model LED light source is about 12%, after being prepared into bulb lamp bubble of the present utility model, half has almost fallen, but test many times discovery through inventor of the present utility model, the hot stack rate that the thickness of the glass substrate of LED light source is prepared into LED bulb lamp of the present utility model, LED candle bubble lamp to the later stage has very large impact, but be not that glass substrate is more thick better, neither get over Bao Yuehao, but have between certain caliper zones, when the THICKNESS CONTROL of glass substrate is between 0.5mm-1.1mm, LED bulb lamp hot stack rate of the present utility model is minimum.
table 1, various LED bulb lamps carry out the table with test results of temperature and luminous flux
| Group | Lampshade surface temperature | Light source table surface temperature | Light flux values |
| A | 74.3 ℃ (spreader surface temperature) | 91.6℃ | 85.4Lm |
| B | 41.2 ℃ (glass lamp shade surface) | 104.1℃ | 114.9Lm |
| C | 39.7 ℃ (glass lamp shade surface) | 102.8℃ | 115.2Lm |
| D | 39.4 ℃ (glass lamp shade surface) | 95.5℃ | 89.3Lm |
| E | 39.5 ℃ (glass lamp shade surface) | 96.1℃ | 114.1Lm |
the hot analytical table of the LED bulb lamp of table 2, different-thickness sheet glass
| The thickness of glass substrate | The hot stack rate of LED light source | Be prepared into the hot stack rate after LED bulb lamp | Be prepared into the hot stack rate after LED candle bubble lamp |
| 0.3mm | 13.93% | 9.91% | 8.23% |
| 0.4mm | 13.70% | 9.34% | 7.75% |
| 0.5mm | 11.55% | 6.07% | 5.22% |
| 0.6mm | 11.21% | 6.12% | 4.86% |
| 0.7mm | 10.87% | 6.19% | 5.35% |
| 0.8mm | 10.12% | 6.27% | 5.32% |
| 0.9mm | 10.57% | 6.41% | 5.41% |
| 1.0mm | 11.94% | 6.21% | 5.30% |
| 1.1mm | 12.90% | 6.32% | 5.31% |
| 1.2mm | 13.40% | 6.79% | 5.96% |
Claims (11)
1. a LED bulb lamp, comprise LED light source, support, lampshade, lamp socket and power supply, it is characterized in that described lampshade is glass lamp shade, described support is glass hollow stent and has glass base, and in lampshade, LED light source is arranged on support, is positioned in lampshade, power supply is arranged in the lamp socket of support, confined space is fixed and formed to the lamp socket of support and glass lamp shade, and the conductor wire of LED light source prolongs bracket base and is connected with the power turn-on in lamp socket, is filled with gas in lampshade.
2. LED bulb lamp according to claim 1, is characterized in that each LED bulb lamp only has a LED light source, and for being connected with LED light source, the also conductor wire of fixed L ED light source is electrically connected with two electrodes of this LED light source respectively; Or each LED bulb lamp is while having two or more LED light sources, quantity of light source is N, X+Y=N, X, Y are integer, each LED light source one end is electrically connected and is fixed on the non-base end of glass supporter mutually, the other end is that X the LED light source P utmost point drawn with positive source and be electrically connected and fix, and Y the LED light source N utmost point drawn with power cathode and be electrically connected and fix.
3. LED bulb lamp according to claim 2, is characterized in that described quantity of light source is N, X+Y=N, and X, Y are integer, and N is even number, and X=Y.
4. according to the LED bulb lamp described in claim 1-3 any one, it is characterized in that each described LED light source is comprised of one or two or two above independent LED light sources, each LED light source is fixed on glass substrate by fluorescent glue by more than two or two chips, conducting goes between, at glass substrate and chip, lead-in wire, except the electrode place of glass substrate, surface all applies that fluorescent glue encapsulation forms.
5. lED bulb lamp according to claim 4, is characterized in that electrode is directly prepared on glass substrate, and electrode is by Cr and Ni is two-layer forms, and Cr layer is directly prepared on transparent substrates, and Ni layer is prepared in above Cr layer.
6. LED bulb lamp according to claim 5, the thickness that it is characterized in that Cr layer is 0.5-1 μ m, the thickness of Ni layer is 50-100nm.
7. LED bulb lamp according to claim 4, is characterized in that LED light source and conductor wire are electrically connected fixing, is that the electrode card insert type in LED light source top glass substrate is fixed on the outer electrode on conductor wire by prepare outer electrode on conductor wire.
8. LED bulb lamp according to claim 7, it is characterized in that described glass substrate is graphical glass substrate, it is patterned into the shape of protruding hemispherical, taper shape, sharp cone distal, polyhedron taper or the yurt shape of array periodic arrangement, the projection cycle is 1 μ m-10 μ m, bottom width is 5 μ m-25 μ m, is highly 0.1 μ m-5 μ m.
9. LED bulb lamp according to claim 8, it is characterized in that graphical glass substrate further comprises the patterned aln layer of one deck, its figure is netted space formula patterned structures, gap is regular equilateral triangle or positive equilateral polygon, every the length of side is greater than 0.8 μ m, area is between 10 μ m2-1000 μ m2, and the distance between adjacent space is no more than 10 μ m, and the thickness of aln layer is between 500-3000 dust.
10. LED bulb lamp according to claim 4, is characterized in that glass substrate glass substrate divides sheet glass and glass fiber by different in width, the width of the width G reatT.GreaT.GT glass fiber of sheet glass, and sheet glass THICKNESS CONTROL is between 0.5-1.1mm; The width of glass fiber is between 0.5mm-10mm, and thickness is between 0.3mm-1.2mm.
11. LED bulb lamps according to claim 10, the thickness that it is characterized in that glass fiber is 0.3mm-0.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320612496.9U CN203549459U (en) | 2013-09-30 | 2013-09-30 | LED (light emitting diode) bulb lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320612496.9U CN203549459U (en) | 2013-09-30 | 2013-09-30 | LED (light emitting diode) bulb lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203549459U true CN203549459U (en) | 2014-04-16 |
Family
ID=50467572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320612496.9U Expired - Fee Related CN203549459U (en) | 2013-09-30 | 2013-09-30 | LED (light emitting diode) bulb lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203549459U (en) |
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2013
- 2013-09-30 CN CN201320612496.9U patent/CN203549459U/en not_active Expired - Fee Related
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Effective date of registration: 20170122 Address after: 201201 Shanghai, Pudong New Area East Road, No. 9, building 1, building 6101 Patentee after: OPPEL LIGHTING Co.,Ltd. Address before: Shanghai 200137 quarter of Pudong New Area City, Lane 555, room 402 No. 18 road Patentee before: Sun Ming Patentee before: Chen Xingbao Patentee before: SHANGHAI OPPEL LIGHTING Co.,Ltd. |
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Granted publication date: 20140416 |