CN203535079U - Probe apparatus - Google Patents
Probe apparatus Download PDFInfo
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- CN203535079U CN203535079U CN201320566428.3U CN201320566428U CN203535079U CN 203535079 U CN203535079 U CN 203535079U CN 201320566428 U CN201320566428 U CN 201320566428U CN 203535079 U CN203535079 U CN 203535079U
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- probe
- force
- arm
- sensing element
- vacancy section
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Abstract
The utility model discloses a probe apparatus comprising a moment arm, a probe set, a probe and at least one sensing element. One end of the moment arm is fixed on a spot measurement machine. The moment arm has a penetrating hollow area, and the moment arm is a metal block moulded into one piece. The other end of the moment arm, opposite to the spot measurement machine, is connected with the probe seat. The other end of the probe seat, opposite to the moment arm, is connected with the probe. The sensing element is positioned on the moment arm. When the moment arm is deformed by bearing a force, the sensing element generates observed value change along the deformation of the moment arm. The probe apparatus can improve the measurement accuracy of probe force, is high in sensitivity, cannot enable wafers to rise to overshoot, and further protect wafers from being damaged by the probe on the probe apparatus. The wear of the probe on the probe apparatus is also reduced.
Description
Technical field
The utility model relates to a kind of probe unit, relates in particular to a kind of detection such as relevant probe units of semiconductor grain performance such as light emitting diodes.
Background technology
In recent years; the application of integrated circuit (integrated circuit) is universal gradually; in order effectively to promote the yield that dispatches from the factory of product wafer; after wafer manufacturing completes; conventionally can electric current be sent to the LED crystal grain on wafer by test machine; and by measuring the characteristics of luminescence (such as wavelength, brightness, color etc.) of LED crystal grain, control the yield that dispatches from the factory of wafer.
Schematic diagram when Fig. 1 is existing probe unit 410 measurement wafer 510.Existing probe unit 410 comprises base 412, swing arm 414, spring 416 and probe 418.One end of swing arm 414 has conductive junction point 415, and the other end is articulated in base 412.The two ends of spring 416 are connected to base 412 and swing arm 414.Base 412 has conductive junction point 413, can form path or open circuit with conductive junction point 415.Probe 418 is arranged on the edge of base 412, can be used to contact wafer 510.When wafer 510 is when moving on direction d, probe 418 can be subject to the power of wafer 510, and spring 416 is compressed along direction d by swing arm 414, and then conductive junction point 415 and conductive junction point 413 are separated.Now, probe 418 can receive foreign current, and is sent to the LED crystal grain on wafer 510, makes LED crystal grain luminous and measured by integrating sphere (integrating sphere) 420.
Yet if the downforce of spring 416 is excessive, wafer 510 is difficult for promoting probe 418, may cause wafer 510 and probe 418 to damage.If the downforce of spring 416 is too small, the surface of probe 418 and wafer 510 meeting loose contact, the accuracy that impact is measured.In addition, the downforce of spring 416 not only can change with service time, and different technician also can produce difference when adjusting or change spring 416.
Utility model content
For solving a difficult problem for prior art, the utility model provides a kind of probe unit to comprise the arm of force, probe base, probe and at least one sensing element.One end of the arm of force is in order to be fixed on point measurement machine.The arm of force has the vacancy section of running through, and the derby that is formed in one of the arm of force.Probe base is connected in the arm of force with respect to the other end of point measurement machine.Probe is connected in probe base with respect to the other end of the arm of force.Sensing element is positioned on the arm of force.When the arm of force stressed and when distortion, sensing element produces observed reading with the deflection of the arm of force to be changed.
So fundamental purpose of the present utility model is to provide a kind of probe unit, this kind of probe unit comprises the arm of force and at least one sensing element.Therefore, probe unit of the present utility model can promote the accuracy that surveyingpin is pressed (probe force), and highly sensitive, thus can not make wafer rising overshoot, and then can not make the probe on probe unit damage wafer; Can also make the probe on probe unit reduce wear.
Secondary objective of the present utility model is to provide a kind of probe unit, and this kind of probe unit comprises the arm of force and at least one sensing element.Therefore, the number of spare parts of probe unit of the present utility model is less, therefore cost is lower.
Accompanying drawing explanation
Schematic diagram when Fig. 1 is existing probe unit measurement wafer.
Fig. 2 is according to the stereographic map of the probe unit of the utility model one embodiment.
Fig. 3 is the side view of the probe unit of Fig. 2.
Fig. 4 is the schematic diagram that the probe unit of Fig. 3 is applied to point measurement machine.
Fig. 5 is according to the side view of the probe unit of another embodiment of the utility model.
Fig. 6 is according to the side view of the probe unit of the another embodiment of the utility model.
Fig. 7 is according to the utility model side view of the probe unit of an embodiment again.
Embodiment
Below will disclose a plurality of embodiment of the present utility model with accompanying drawing, as clearly stated, many concrete details will be explained in the following description.Yet, should be appreciated that, these concrete details do not apply to limit the utility model.That is to say, in the utility model part embodiment, these concrete details are non-essential.In addition,, for the purpose of simplifying accompanying drawing, some existing habitual structures and element represent the mode simply to illustrate in the accompanying drawings.
Fig. 2 is according to the stereographic map of the probe unit 100 of the utility model one embodiment.Fig. 3 is the side view of the probe unit 100 of Fig. 2.Consult Fig. 2 and Fig. 3, probe unit 100 comprises the arm of force 110 and sensing element 130a, 130b, 130c, 130d simultaneously.Wherein, the derby that the arm of force 110 is formed in one, and there is the vacancy section 112 of running through, the length direction of vacancy section 112 is identical with the length direction D of the arm of force 110 haply; When the arm of force 110 is stressed, the arm of force 110 with vacancy section 112 can produce deflection.Above-mentioned sensing element 130a, 130b, 130c, 130d is positioned on the arm of force 110, and therefore, when the arm of force 110 stressed and when distortion, these sensing elements 130a, 130b, 130c, 130d can produce along with the deflection of the arm of force 110 observed reading to be changed.Wherein observed reading can be resistance value or magnitude of voltage, does not limit the utility model.In the present embodiment, sensing element 130a, 130b, 130c, 130d can be strainometer, and strainometer can be with the variation of deflection value of having a resistance of the arm of force 110, and one end of sensing element 130a, 130b next-door neighbour vacancy section 112, the other end of sensing element 130c, 130d next-door neighbour vacancy section 112.Or in other embodiments, sensing element 130a, 130b, 130c, 130d can be piezoelectric, and piezoelectric also can produce with the deflection of the arm of force 110 variation of magnitude of voltage.Certainly, if sensing element 130a, 130b, 130c, 130d have adopted piezoelectric, do not need to be used in the Wheatstone bridge that will illustrate in subsequent embodiment, because piezoelectric can direct voltage output signal.The selection of above-mentioned sensing element and observed reading thereof, is determined by actual demand, to exemplify, is not limited.
Specify, the quantity of sensing element is not limited with four, and can make at least one sensing element be positioned on the arm of force can apply, and can determine according to deviser's demand, and detailed employing strainometer, as the embodiment of sensing element, repeats after appearance.
Please continue to refer to Fig. 2 and Fig. 3, be to adopt strainometer as sensing element in the present embodiment, vacancy section 112 be shaped as bone-shaped, but it should be noted that, the shape of vacancy section 112 is not limited to bone-shaped, also can, for strip or other shapes, by actual demand, be determined.Vacancy section 112 comprises central area 114 and end region 116,118, and end region 116,118 is communicated in respectively the two ends of central area 114.Central area 114 has width W 1, and the width W 2 of end region 116 and the width W 3 of end region 118 are all greater than the width W 1 of central area 114, make vacancy section 112 be bone-shaped.Please continue to refer to Fig. 3, such vacancy section 112 designs, the main effect of wanting to reach is for when the arm of force 110 is stressed, because the arm of force 110 is thinner near the position of end region 116,118, therefore the arm of force 110 can be out of shape in advance near the position of end region 116,118, and can produce larger deflection, therefore can promote the distortion sensitivity of the arm of force 110 when stressed.Moreover, to compare with the solid arm of force, the arm of force 110 of tool vacancy section 112 is better at side direction (the vertical paper direction of Fig. 2) the more solid arm of force of anti-twist (Twist) intensity, is therefore not easy the problem of easy generation torsional deformation as the solid arm of force.
In addition, the arm of force 110 has relative first surface 121 and second surface 122, and relative the 123 and the 4th surface 124, the 3rd surface.When probe unit 100 only has single sensing element, sensing element can be positioned on first surface 121 or second surface 122.When probe unit 100 has two sensing elements, two sensing elements can lay respectively on first surface 121 and second surface 122.Please continue to refer to Fig. 3, in the present embodiment, the quantity of sensing element is four, therefore probe unit 100 will have higher sensitivity, wherein sensing element 130a, 130c can be positioned on the first surface 121 of the arm of force 110, and sensing element 130b, 130d can be positioned on the second surface 122 of the arm of force 110.And, due in the present embodiment, vacancy section 112 is the design of bone-shaped, therefore sensing element 130a, 130b should be toward each other and the end region 116 of next-door neighbour vacancy section 112, sensing element 130c, 130d toward each other and next-door neighbour vacancy section 112 end region 118, thus, the probe unit 100 of present embodiment can have higher sensitivity.In addition, the 123 and the 4th surface 124, the 3rd surface of the arm of force 110 can be run through in vacancy section 112.
Please continue to refer to Fig. 2 and Fig. 3, in the present embodiment, the length L of vacancy section 112 is greater than the 3rd surface the 123 and the 4th surface distance D 1 of 124, and the width W 2 of the end region 116 of vacancy section 112 and the width W 3 of end region 118 are greater than respectively the width W 1 of central area 114.That is to say, the breadth extreme of vacancy section 112 can be width W 2 or width W 3.In the present embodiment, width W 2 can be identical with width W 3, and width W 2 and width W 3 are all greater than half of distance D 2 of 122 of first surface 121 and second surfaces.Such design is easier to produce deflection in the time of can allowing the arm of force 110 stressed; But, it should be noted that, above-mentioned explanation, wherein the shape of vacancy section 112 for example not take bone-shaped, as restrictive condition: above-mentioned explanation can be applied equally in the vacancy section in the arm of force 110 with strip.
Particularly, when the arm of force 110 stressed and when distortion, because first surface 121 and second surface 122 can produce larger deflection near the position of end region 116,118, and sensing element 130a, 130b, 130c, 130d can produce with the deflection of the arm of force 110 observed reading to be changed, therefore the force-bearing situation that sensing element 130a, 130b, 130c, 130d can the rapid reaction arm of forces 110, the observed reading that sensing element 130a, 130b, 130c, 130d are produced changes and is sent to delicately point measurement machine 200 (seeing Fig. 4).Thus, the deflection that probe unit 100 of the present utility model can be by the arm of force 110 and sensing element 130a, 130b, 130c, 130d promote the accuracy that surveyingpin is pressed (probe force), make probe unit 100 have higher sensitivity.
Please continue to refer to Fig. 3, in the present embodiment, the angle theta between the arm of force 110 and surface level is acute angle, and namely the arm of force 110 is inclined.Because the arm of force 110 is inclined, the arm of force 110 of inclination can reduce shared space.In addition,, in the design of the arm of force 110, longer deflection when stressed of the length of the arm of force 100 is larger, so sensitivity meeting is higher, more easily measures pin and presses.But in other embodiments, the arm of force 110 can be parallel with surface level, not with restriction the utility model.Probe base 140 of the present utility model comprises folder pin part 142 and adaptor 144, and adaptor 144 is connected between folder pin part 142 and the arm of force 110.Probe 150 is positioned on folder pin part 142.Folder pin part 142 further has probe positioning structure 143 (as shown in Figure 2), and probe positioning structure 143 can press from both sides on pin part 142 so that probe 150 can more easily be dismantled or be positioned at.For instance, probe positioning structure 143 can pass through perforation 145 and snap fit 146 position probe 150, but the utility model should be as restriction.
Please continue to refer to Fig. 3, in the present embodiment, sensing element 130a, 130b, 130c, 130d are to design according to Wheatstone bridge principle in the position of the arm of force 110, can form Hui Sitong full-bridge equivalent electrical circuit.Wherein, sensing element 130a, 130b, 130c, 130d all can be considered resistance.When the arm of force 110 produces deflection, sensing element 130a, 130b, 130c, 130d can the value of having a resistance change for point measurement machine 200 (seeing Fig. 4) interpretation.
Fig. 4 is the schematic diagram that the probe unit 100 of Fig. 3 is applied to point measurement machine 200.Consult Fig. 3 and Fig. 4 simultaneously, further, wherein can be fixing by fixture 160 between the arm of force 110 and point measurement machine 200, fixture 160 can be so that one end of the arm of force 110 of probe unit 100 be fixed on point measurement machine 200.Probe base 140 is connected in the arm of force 110 with respect to the other end of point measurement machine 200.Probe 150 is connected in probe base 140 with respect to the other end of the arm of force 110.What specify is, because fixture 160 is insulator with adaptor 144, the arm of force 110 is conductor, therefore, can make sensing element 130a, 130b, 130c, 130d and the arm of force 110 be in the environment that independently insulate, the wire that can avoid being electrically connected point measurement machine 200 and sensing element 130a, 130b, 130c, 130d and the situation that is electrically connected the wire of point measurement machine 200 with probe 150 and is short-circuited or disturbs.
Please continue to refer to Fig. 4, because the arm of force 110 of probe unit 100 has the vacancy section 112 of running through, and point measurement machine 200 is fixed on by fixture 160 in one end of the arm of force 110, therefore when wafer 310 moves and while touching probe 150, probe 150 can drive probe base 140 to move along direction D3 along direction D3 with platform 210.Thus, one end of the arm of force 110 of linking probe seat 140 just can be subject to the power of direction D4 and produce deflection.Thus, sensing element 130a, the 130b, 130c, the 130d that are positioned at the arm of force 110 just can change with deflection value of having a resistance of the arm of force 110, use the point measurement machine 200 of this probe unit 100 can the resistance change judgement wafer 310 by sensing element 130a, 130b, 130c, 130d touch the probe 150 of probe unit 100, then can in the LED crystal grain in probe 150 Injection Currents to wafer 310, be measured by test machine.
Should be appreciated that, in above narration, the element annexation of having narrated and use-pattern general do not repeat repeating, identical with above stated specification.In addition, other embodiment of follow-up key diagram 5 to Fig. 7, are also to adopt strainometer as sensing element.
Fig. 5 is according to the side view of the probe unit 100a of another embodiment of the utility model.Probe unit 100a comprises the arm of force 110, sensing element 130a, probe base 140 and probe 150.The place that Fig. 5 is different from Fig. 3 embodiment is: probe unit 100a only has single sensing element 130a.The end region 116 of sensing element 130a next-door neighbour vacancy section 112, can be positioned on the first surface 121 or second surface 122 of the arm of force 110.In the present embodiment, the arm of force 110 can form Hui Sitong 1/4 bridge equivalent electrical circuit with sensing element 130a.
Fig. 6 is according to the side view of the probe unit 100b of the another embodiment of the utility model.Probe unit 100b comprises the arm of force 110, sensing element 130a, 130b, probe base 140 and probe 150.Fig. 6 and Fig. 3,5 the different place of embodiment are: probe unit 100b has on first surface 121 that sensing element 130a, 130b lay respectively at the arm of force 110 and second surface 122. Sensing element 130a, 130b toward each other and next-door neighbour vacancy section 112 end region 116.In the present embodiment, the arm of force 110 can form Hui Sitong half-bridge equivalent electrical circuit with sensing element 130a, 130b.
Fig. 7 is according to the utility model side view of the probe unit 100c of an embodiment again.Probe unit 100c comprises the arm of force 110, sensing element 130a, 130b, 130c, 130d, probe base 140 and probe 150.Fig. 7 and Fig. 3,5, the different place of 6 embodiments are: the vacancy section 112 of probe unit 100c be shaped as strip, and one end of sensing element 130a, 130b next-door neighbour vacancy section 112, the other end of sensing element 130c, 130d next-door neighbour vacancy section 112.In the present embodiment, the arm of force 110 can form Hui Sitong full-bridge equivalent electrical circuit with sensing element 130a, 130b, 130c, 130d.The arm of force 110 with strip vacancy section 112 can reduce side direction (vertical paper direction) displacement, the pin trace shape better (little) that probe 150 is offset on wafer.
Although the utility model with embodiment openly as above; so it is not in order to limit the utility model; any those skilled in the art; within not departing from spirit and scope of the present utility model; when doing various changes and retouching, therefore protection domain of the present utility model is when being as the criterion depending on claims person of defining.
Claims (15)
1. a probe unit, is characterized in that, comprises:
The arm of force, its one end is in order to be fixed on point measurement machine, and the wherein said arm of force has the vacancy section of running through, and the derby that is formed in one of the described arm of force;
Probe base, it is connected in the described arm of force with respect to the other end of described point measurement machine;
Probe, it is connected in described probe base with respect to the other end of the described arm of force; And
At least one sensing element, it is positioned on the described arm of force, and while being wherein out of shape when the described arm of force is stressed, described at least one, sensing element produces observed reading variation with the deflection of the described arm of force.
2. probe unit as claimed in claim 1, is characterized in that, the length direction of described vacancy section is identical with the length direction of the described arm of force.
3. probe unit as claimed in claim 1, is characterized in that, described sensing element is close to one end of described vacancy section.
4. probe unit as claimed in claim 1, is characterized in that, described vacancy section be shaped as bone-shaped, described vacancy section comprises:
Central area;
Two end region, it is communicated in respectively the two ends of described central area, and wherein described in each, the width of end region is greater than the width of described central area.
5. probe unit as claimed in claim 4, is characterized in that, described sensing element is close to one of described two end region.
6. probe unit as claimed in claim 1, it is characterized in that, the described arm of force has relative first surface and second surface, and the 3rd relative surface and the 4th surface, described sensing element is positioned on described first surface or described second surface, and described the 3rd surface and described the 4th surface run through in described vacancy section.
7. probe unit as claimed in claim 6, it is characterized in that, the quantity of described sensing element is two, and described two sensing elements lay respectively on described first surface and described second surface, and described two sensing elements toward each other and be close to one end of described vacancy section.
8. probe unit as claimed in claim 6, it is characterized in that, the quantity of described sensing element is four, described four sensing elements are positioned on described first surface and described second surface, described four sensing elements both toward each other and be close to one end of described vacancy section, described four sensing elements another both toward each other and be close to the other end of described vacancy section.
9. probe unit as claimed in claim 6, is characterized in that, the length of described vacancy section is greater than the distance between described the 3rd surface and described the 4th surface.
10. probe unit as claimed in claim 6, is characterized in that, the breadth extreme of described vacancy section is greater than half of distance between described first surface and described second surface.
11. probe units as claimed in claim 1, is characterized in that, the described arm of force parallel with surface level or folder an acute angle.
12. probe units as claimed in claim 1, is characterized in that, described probe base comprises:
Folder pin part, described probe is positioned on described folder pin part; And
Adaptor, it is connected between described folder pin part and the described arm of force.
13. probe units as claimed in claim 1, described sensing element is strainometer or piezoelectric.
14. probe units as claimed in claim 1, described observed reading is resistance value or magnitude of voltage.
15. probe units as claimed in claim 1, described vacancy section be shaped as strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320566428.3U CN203535079U (en) | 2013-09-12 | 2013-09-12 | Probe apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320566428.3U CN203535079U (en) | 2013-09-12 | 2013-09-12 | Probe apparatus |
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| CN203535079U true CN203535079U (en) | 2014-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320566428.3U Expired - Lifetime CN203535079U (en) | 2013-09-12 | 2013-09-12 | Probe apparatus |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109387773A (en) * | 2018-10-22 | 2019-02-26 | 青岛海信宽带多媒体技术有限公司 | Powering on mechanism |
| CN113533939A (en) * | 2021-08-09 | 2021-10-22 | 苏州联讯仪器有限公司 | Probe station for chip test |
| CN113533938A (en) * | 2021-07-28 | 2021-10-22 | 苏州联讯仪器有限公司 | Chip testing machine |
-
2013
- 2013-09-12 CN CN201320566428.3U patent/CN203535079U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109387773A (en) * | 2018-10-22 | 2019-02-26 | 青岛海信宽带多媒体技术有限公司 | Powering on mechanism |
| CN113533938A (en) * | 2021-07-28 | 2021-10-22 | 苏州联讯仪器有限公司 | Chip testing machine |
| CN113533938B (en) * | 2021-07-28 | 2022-02-18 | 苏州联讯仪器有限公司 | Chip testing machine |
| CN113533939A (en) * | 2021-08-09 | 2021-10-22 | 苏州联讯仪器有限公司 | Probe station for chip test |
| CN113533939B (en) * | 2021-08-09 | 2022-03-15 | 苏州联讯仪器有限公司 | Probe station for chip test |
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Granted publication date: 20140409 |
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