CN203526009U

CN203526009U - Wafer gluing fixture for producing crystal oscillator

Info

Publication number: CN203526009U
Application number: CN201320733614.1U
Authority: CN
Inventors: 杨峰
Original assignee: RUICHENG JINFENGRUI ELECTRONICS Co Ltd
Current assignee: RUICHENG JINFENGRUI ELECTRONICS Co Ltd
Priority date: 2013-11-20
Filing date: 2013-11-20
Publication date: 2014-04-09
Anticipated expiration: 2023-11-20

Abstract

The utility model relates to a tool for producing a crystal oscillator, in particular to a wafer gluing fixture. The wafer gluing fixture for producing the crystal oscillator comprises an upper gluing fixture and a lower gluing fixture, wherein the upper gluing fixture comprises an upper beam body; a positioning body is processed on the bottom surface of each of the two ends of the upper beam body; wafer grooves for placing wafers are formed in one side surface of the upper beam body side by side; slot holes which correspond to the wafer grooves one by one and through which the wafers in the wafer grooves can penetrate are formed in the bottom surface of the upper beam body; the lower gluing fixture comprises a lower beam body; a positioning hole corresponding to the positioning body of the upper beam body is formed in each of the two ends of the lower beam body; pin holes corresponding to the slot holes of the upper beam body one by one are formed in the lower beam body. The wafer gluing fixture for producing the crystal oscillator is reasonable in design, and a support does not fall out of the lower beam body easily, so that the gluing operation is simple and feasible, the manpower is saved and the working efficiency is improved.

Description

Wafer point plastic clip tool for the preparation of crystal oscillator

Technical field

The utility model relates to the instrument of preparing of crystal oscillator, is specially a kind of wafer point plastic clip tool.

Background technology

Quartz oscillator is a kind of resonating device that utilizes the piezo-electric effect of quartz crystal (crystalline solid of silica) to make, its basic structure is roughly by certain azimuth, to cut thin slice (referred to as wafer from a quartz crystal, it can be square, rectangle or circle etc.), on its two corresponding surfaces, plating silver layer is as electrode, then the wafer that is coated with electrode is passed through to a some plastic clip tool insulating cement, conductive silver glue sticks on support, allow silver-plated wafer be fixed between support two lead-in wires, its double-sided electrode is connected with support two lead-in wires respectively, add package casing and just formed quartz-crystal resonator, referred to as quartz crystal or crystal, crystal oscillator.Its product is generally used packed by metal casing, also can use ceramic package.

Existing some plastic clip tool comprises a plastic clip tool and lower some plastic clip tool (angle of chamfer, partly wrap up in support), quartz wafer is placed on a plastic clip tool, support is arranged on lower some plastic clip tool, but the shortcoming existing is: support easily departs from from lower some plastic clip tool, can not put wafer equipment with automation, automation point insulating gluing equipment supports the use, service efficiency is low, inconvenient operation.

Summary of the invention

The problems referred to above that the utility model exists in order to solve existing some plastic clip tool, provide a kind of new some plastic clip tool.

The utility model is to adopt following technical scheme to realize:

A kind of wafer point plastic clip tool for the preparation of crystal oscillator, comprise a plastic clip tool and lower some plastic clip tool, described upper some plastic clip tool comprises upper beam body, the bottom surface, two ends of described upper beam body is processed with respectively positioning body, one side of described upper beam body is processed with the wafer slots that several hold wafer side by side, and upper beam body bottom surface is processed with and the wafer slots slotted eye that the wafer in corresponding and wafer slots can pass one by one.

Described lower some plastic clip tool comprises underbeam body, and the two ends of described underbeam body have the locating hole coordinating with upper beam body positioning body, has and upper beam body slotted eye pin hole one to one on underbeam body.

During use, put into a support in each pin hole of underbeam body, the pin of support inserts in the pin hole of underbeam body, and the top of support is placed in the upper surface of underbeam body, on the top of support, coats the binding agents such as insulating cement.Then, in the locating hole of the positioning body insertion underbeam body of upper beam body, coordinate location (as shown in Figure 4), due to the pin hole of underbeam body and the slotted eye of upper beam body corresponding one by one, the also slotted eye of a corresponding upper beam body just in time of the top of each support, quartz wafer is put into the wafer slots of upper beam body, then by inertia force, makes quartz wafer pass slotted eye, stick on the top of support, complete the some glue operation of wafer.

The utility model is reasonable in design, and support can not come off from underbeam body easily, can matched automation equipment work, and the operation of some glue is simple, saves manpower, has improved operating efficiency.

Accompanying drawing explanation

Fig. 1 is the structural representation of upper some plastic clip tool.

Fig. 2 is the upward view of Fig. 1.

Fig. 3 is the structural representation of lower some plastic clip tool.

Fig. 4 is the cooperation schematic diagram of upper and lower some plastic clip tool.

In figure, 10-upper beam body, 11-positioning body, 12-wafer slots, 13-slotted eye, 20-angle of chamfer is wrapped up in underbeam body entirely, 21-locating hole, 22-pin hole.

The specific embodiment

Below in conjunction with accompanying drawing, specific embodiment of the utility model is elaborated.

For the preparation of a wafer point plastic clip tool for crystal oscillator, comprise a plastic clip tool and lower some plastic clip tool.

As shown in Figure 1, 2, described upper some plastic clip tool comprises upper beam body 10, the bottom surface, two ends of described upper beam body 10 is processed with respectively positioning body 11, one side of described upper beam body 10 is processed with the wafer slots 12 that holds wafer side by side, and upper beam body 10 bottom surfaces are processed with and wafer slots 12 slotted eye 13 that the wafer in corresponding and wafer slots 12 can pass one by one.

As shown in Figure 3, described lower some plastic clip tool comprises underbeam body 20, the two ends that described angle of chamfer is wrapped up in underbeam body 20 entirely have the locating hole 21 corresponding with upper beam body 10 positioning bodies 11, and angle of chamfer is entirely wrapped up in and on underbeam body 20, had and upper beam body 10 slotted eyes 13 pin hole 22 one to one.

Claims

1. the wafer point plastic clip tool for the preparation of crystal oscillator, comprise a plastic clip tool and lower some plastic clip tool, it is characterized in that: described upper some plastic clip tool comprises upper beam body (10), the bottom surface, two ends of described upper beam body (10) is processed with respectively positioning body (11), one side of described upper beam body (10) is processed with the wafer slots (12) that holds wafer side by side, and upper beam body (10) bottom surface is processed with and wafer slots (12) slotted eye (13) that the wafer in corresponding and wafer slots (12) can pass one by one;

Described lower some plastic clip tool comprises that angle of chamfer wraps up in underbeam body (20) entirely, the two ends of described underbeam body (20) have the locating hole (21) corresponding with upper beam body (10) positioning body (11), have and upper beam body (10) slotted eye (13) pin hole (22) one to one on underbeam body (20).