CN203521749U - Connection device for power semiconductor device with a shell and power semiconductor device - Google Patents
Connection device for power semiconductor device with a shell and power semiconductor device Download PDFInfo
- Publication number
- CN203521749U CN203521749U CN201320423136.4U CN201320423136U CN203521749U CN 203521749 U CN203521749 U CN 203521749U CN 201320423136 U CN201320423136 U CN 201320423136U CN 203521749 U CN203521749 U CN 203521749U
- Authority
- CN
- China
- Prior art keywords
- jockey
- power semiconductor
- split
- encapsulant molding
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/50—Bases; Cases formed as an integral body
- H01R13/501—Bases; Cases formed as an integral body comprising an integral hinge or a frangible part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5205—Sealing means between cable and housing, e.g. grommet
- H01R13/5208—Sealing means between cable and housing, e.g. grommet having at least two cable receiving openings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/521—Sealing between contact members and housing, e.g. sealing insert
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/42—Securing in a demountable manner
Abstract
The utility model relates to a connection device for a power semiconductor device with a shell and a power semiconductor device. The connection device comprises a connector and a sealing material molding body. The connector comprises a lead wire of a connecting contact device. The contact device is configured to have a positioning device. The sealing material molding body (40) is singly configured to have two corresponding split bodies (41) which can be jointed. The connection device (10) sealed on the outer side of a second recess relative to the second recess (21) configured inside the housing (20) of the power semiconductor device (1) has a first thin sheet (410) and a second thin sheet (420) arranged on the inner side of each split body (4). The second thin sheets (420) of the split bodies (41) are arranged in a mutually engaged way. A first recess (430) for accommodating the lead wire (31) and the contact device (32) is further included. In addition, the utility model further relates to the power semiconductor device.
Description
Technical field
The utility model relates to a kind of for having the jockey of the power semiconductor arrangement of housing, wherein, jockey has connector and encapsulant molding, and this connector has the lead-in wire with the contact device connecting, advantageously, jockey has a plurality of connectors.This jockey is applied in power electric device.
Background technology
This jockey must work all the year round under difficult environmental condition.The Joint failure that corrosive load causes use to be restricted or to cause being set up as moisture, steam, water etc.And for security reasons also must avoid from externalities by safeguard industries connector, such as the impact of dust, water etc.This protection must guarantee by housing and locking system thereof and suitable sealing device.
Be well known that, for seal plug assembly avoid water spray impact, according to protection class IP54 or higher protection class, use special-purpose connector, these special-purpose connectors can be anti-spraying and can seal installation.The connector that business is general has by the elaxtic seal sealing device with the general mode moulding in this area that for example silicon forms.
By printed document WO2006/054574, a kind of waterproof jacket coupling sleeve that can be connected with connector is disclosed, wherein, connector is provided with a plurality of plug connection parts, wherein each plug connection part has front section as electrical connection section section, wherein, plug connection part stretches out forward and is kept by this plug casing from plug casing, wherein, plug casing is provided with protuberance, wherein each protuberance stretches out from the front end face of the plug casing for corresponding plug connection part, to cover the rear portion of electrical connection section section, wherein, waterproof jacket coupling sleeve has: a plurality of sleeve connection parts, the electrical connection section section that correspondingly can pack therein plug connection part into, cover cylinder shell, it has for holding the connection part accommodating chamber of corresponding sleeve connection part and importing the connection part lock part section in opening for connection part accommodating chamber and plug connection part sleeve connection part being locked at separately, plug connection part can correspondingly import this plug connection part and import in opening to pack in sleeve connection part, wherein, plug connection part imported open construction before sleeve connection part, the waterproof seal consisting of elastomeric material, it has for the shape of the front end face close contact with cover cylinder shell with for keeping the seal retainer of waterproof seal.
The shortcoming of above-mentioned prior art is, the anti-spraying connector that business is general usually causes extra cost, because the connector of batch production must be adaptive with it in advance, and the connector having existed if desired must be substituted by anti-spraying connector.
Utility model content
Task of the present utility model is; a kind of jockey is provided; this jockey has at least one according to protection class IP54, especially according to the protection of IP65; wherein; can use the standard connector of batch production in advance; wherein, this jockey is answered itself and is subject to seal protection with anti-spraying with respect to housing.
According to the utility model, this task solves for having the jockey of the power semiconductor arrangement of housing by a kind of, wherein, described jockey has encapsulant molding and at least one connector, described connector has the lead-in wire with the contact device connecting, and wherein, described contact device is configured with positioner, and wherein, described encapsulant molding
Be configured with at least two splits that can engage of correspondence mutually single-piece or multi-piece type,
For described jockey is sealed on its outside and has the first thin slice with respect to second recess of attaching troops to a unit in the housing of described power semiconductor arrangement,
Have the second thin slice on the corresponding inner side that is arranged in described split, wherein, the second thin slice of described split is intermeshing under the state engaging, and
There is at least one for holding the first recess of described lead-in wire and described contact device.
Task of the present utility model also solves by a kind of power semiconductor arrangement, and wherein, described power semiconductor arrangement has housing and above-mentioned jockey.
Task of the present utility model is also by a kind of method for utilizing described jockey structure to connect, and described method comprises following methods step:
Connector is put into the split of encapsulant molding;
Separation and sealed by described encapsulant molding;
Described encapsulant molding is engaged with described housing.
According to jockey of the present utility model, be especially arranged for control circuit is connected with the power semiconductor arrangement with housing.Jockey has encapsulant molding and at least one connector, this connector has the lead-in wire with the contact device connecting, wherein, contact device is configured with respectively positioner, and wherein, encapsulant molding is preferably configured with to single-piece two pieceable splits of correspondence mutually.For sealing and connecting device is sealed on its outside and has the first thin slice with respect to second recess of attaching troops to a unit in the housing of power semiconductor arrangement.On the inner side separately of split, be furnished with the second thin slice, wherein, these of split the second thin slice is arranged intermeshingly.In addition, jockey preferably has a plurality of for holding the lead-in wire of attaching troops to a unit or the first recess of contact device.
According to jockey of the present utility model, by potted component, preferably only an element, consist of, this element is configured to the encapsulant molding of single-piece, and it has two pieceable splits of correspondence mutually, and these two splits connect by flexible contact pin.Thus, can carry out connector fast and simply mount and dismount.This execution mode provides the advantage of for example producing at low cost encapsulant molding by die casting.Alternatively, encapsulant molding also can consist of two or more mutual corresponding splits.
In addition advantageously, various connector make can be set, there is different contact devices and different lead-in wires.In other words can apply the various make of light wave guide or electric conductor.
Another advantage is that encapsulant molding is only coated portion's section of connector under the state engaging.Thus, a part for contact device is exposed, and this part can be arranged in attached socket, and this socket is not a part for jockey.
In addition, prove advantageously, encapsulant molding consists of elastomeric material on the whole.Guaranteed thus long-time sealing function.When encapsulant molding consists of electrical insulating material, be also favourable.Do not need thus the extra insulation of connector.
In addition, prove advantageously, encapsulant molding has other contact pin in split, and these splits are also come-at-able in housing according to being arranged in jockey.Can easily jockey be inserted in housing and also and can easily again from housing, be removed thus.The advantage that contact pin additionally provides is, by contact pin being forced together when encapsulant molding is removed from housing, and the fixing lead-in wire of connector.
In addition, prove advantageously, split has protruding nose, preferably locks protruding nose, and corresponding split has the recess of attaching troops to a unit.Reciprocally machinery is fixing extraly in split thus.Another execution mode is a kind of not releasable jockey, and wherein, split exemplarily connects by bonding.
In addition, prove advantageously, encapsulant molding has at least one backstop seamed edge, and this backstop seamed edge is configured to respectively on bearing that backstop attaches troops to a unit in housing.More sealing and more durable arrangement have been guaranteed thus.
In addition, the utility model has also been described a kind of for construct the method for jockey according to following methods step:
Connector is put into the split of encapsulant molding;
Separation and sealed by encapsulant molding;
Encapsulant molding is engaged with housing.
When putting into connector, with the lead-in wire of the contact device connecting, be placed in the first recess in of two splits.At this, connector is placed into lighter pressure, thereby sheet segment ground surrounds lead-in wire.
When two splits of close encapsulation material molding, split is pressed together.At this, the protruding nose of the locking of a split is engaged in the engaging recessed part that corresponding split attaches troops to a unit.
Last method step comprises close engaging closure material molding and housing.Here jockey is inserted in the housing of power semiconductor arrangement.
The advantage of the method is, jockey can be mounted rapidly according to said method step.In addition, the method simplicity of design, thus layman also can carry out the method step.
Accompanying drawing explanation
Preferred implementation of the present utility model is being described in detail shown in Fig. 1 to Fig. 4 and hereinafter.In the accompanying drawings:
Fig. 1 illustrate with the stereogram of the interior zone of encapsulant molding according to jockey of the present utility model;
Fig. 2 illustrates the graphics according to jockey of the present utility model;
Fig. 3 illustrate with housing according to the graphics of jockey of the present utility model;
Fig. 4 illustrates according to the profile of the jockey of Fig. 3.
Identical thin portion marks by same drawing reference numeral respectively in Fig. 1 to Fig. 4, thereby without describing respectively all thin portions in detail in conjunction with institute's drawings attached.
Embodiment
Fig. 1 illustrate with the stereogram of the interior zone of encapsulant molding 40 according to the graphics of jockey 10 of the present utility model.The encapsulant molding 40 that single-piece ground forms here illustrates under the state of opening together with two splits 41.Illustrate, be inserted with connector 30 in one in two splits 41, in other words two lead-in wires 31 with the contact device 32 of connection.Contact device 32 is connected by the coupler 323 of axle shape respectively with lead-in wire 31.Coupler 323 can consist of metal or plastics.Another positioner 322 that has face formula disc-shape in coupler 323 arranged beneath, the cylindrical contact plug with positioner 321 is connected on this another positioner 322.
Lead-in wire 31 is surrounded by thin slice 420 in the region above coupler 323.Thus, lead-in wire 31 is arranged in split anti-skiddingly.Thin slice 420 is installed on the height that thin slice 410 on the outside with split 41 is identical and is connected with thin slice 410 in two splits 41.In addition, these sheet plane formulas and line up two row and be configured with for going between 31 the recess of lining up separately two row 430 and mutually stagger and be arranged in split.Thus, thin slice 420 is intermeshing and seal these splits when the split 41 of encapsulant molding 40 engages.
Corresponding split 41 has two recesses 430 perpendicular to sealing seamed edge 440, and these two recesses 430 extend to sealing seamed edge 440 from the downside of split 41.In top, be configured with the recess 430 that is matched with lead-in wire 31.In the bottom of split 41, be configured with the recess 430 that is contact device 32 shapes.In addition, recess 430 also has another positioner 322 and the columniform contact plug of coupler 323 shapes of axle shape, the face formula dish type under it.Recess 430 can at random and for various dissimilar connectors 30 design separately for itself in principle.
In the bottom of split 41, be additionally furnished with and lock protruding nose 45.This lock protruding nose 45 be configured with cylindrically by the material identical with encapsulant molding 40, made around thin slice and perpendicular to sealing seamed edge 440 arrange.In corresponding split 41, be furnished with attached engaging recessed part 46.By this engaging function, extraly two splits 41 are kept together under engagement state.
Two splits 41 interconnect by elasticity contact pin 42.Contact pin 42 is configured to following bridging piece, and this bridging piece is medially arranged with respect to sealing seamed edge 440 at the upside of encapsulant molding 40.For better foldability, contact pin 42 medially has material and thins (Ausd ü nnung).
Fig. 2 illustrates according to the graphics of jockey 10 of the present utility model, and this jockey 10 has two connectors 30 and encapsulant molding 40, and this connector 30 has two lead-in wires 31 with the contact device 32 connecting.As described in Fig. 1, encapsulant molding 40 has contact pin 42 and the semicircular contact pin 43 for two splits 41 are connected on upside.The top of encapsulant molding 40 is rectangular parallelepiped shape and is configured with rounding in opposed wide side.At this below an upper section, on the outside of split 41, be furnished with around thin slice 410.410 formula ground structures of these thin slices are arranged into two row and arrange stackedly.
The bottom of encapsulant molding 40 is designed to rectangular parallelepiped equally, and this rectangular parallelepiped becomes inclined-plane in wide side stairstepping.In addition, this bottom has towards the inclined-plane of the downside of encapsulant molding 40 by the pore structure of the rectangle of very little location placed in the middle.By step-like inclined-plane, in the wide side of split 41, molded backstop seamed edge 44, these backstop seamed edges 44 stop jockey 10 slippages to pass housing 20(referring to Fig. 4).
The contact device 32 with positioner 321 protrudes from the bottom of encapsulant molding 40 through recess 430 perpendicular to sealing seamed edge 440, these contact devices 32 in jockey 10 is inserted to housings 20 after (referring to Fig. 3 and Fig. 4) be connected with attached socket.Protrude in two lead-in wire 31 spaces in the longitudinal side of sealing seamed edge 440 that is medially passed in encapsulant molding 40 between semicircular contact pin 43, and these two lead-in wires 31 are configured to electric conductor or light wave guide.By the location between contact pin 43, lead-in wire 31 can fix and avoid slippage when encapsulant molding 40 is removed or inserted by contact pin 43 is forced together.
Fig. 3 illustrates the graphics that has the jockey 10 of integrated connector 30 and housing 20 according to of the present utility model.Housing 20 single-piece ground are rectangular parallelepiped shape and are configured with the top of dome shape protrusion and are configured with rounding in opposed wide side.Encapsulant molding 40 single-piece ground consist of the split 41 of two mutual corresponding joints.
The sealing seamed edge 440 of the split 41 engaging is parallel to longitudinal side of housing 20.Two splits 41 connect by flexible contact pin 42, and these contact pin 42 lateral arrangement are on the upside of encapsulant molding 40.Thus, jockey 10 can insert in housing 20 no problemly, because contact pin 42 is arranged on housing 20 by its location.
Fig. 4 illustrates according to the profile of the jockey with housing 20 10 of Fig. 3.Encapsulant molding 40 illustrates under the state engaging together with the connector 30 inserting.Housing 20 has recess 21, and encapsulant molding 40 inserts in this recess 21.Recess 21 has two bearings 22, is placed with the backstop seamed edge 44 of split 41 on these two bearings 22.Thin slice 410 is extraly towards housing 20 sealings.
Reference numerals list
1 power semiconductor arrangement
10 jockeys
20 housings
21 second recesses
22 bearings
30 connectors
31 30 lead-in wire
32 30 contact device
321 positioners
322 other positioners
323 coupler
40 encapsulant moldings
41 splits
410 first thin slices
420 second thin slices
430 first recesses
440 sealing seamed edges
42 flexible contact pin
43 other contact pin
44 backstop seamed edges
45 lock protruding nose
46 engaging recessed parts
Claims (10)
1. one kind for having the jockey of the power semiconductor arrangement of housing, wherein, described jockey (10) has encapsulant molding (40) and at least one connector (30), described connector (30) has the lead-in wire (31) with the contact device (32) connecting, wherein, described contact device (32) is configured with positioner (321), and wherein, described encapsulant molding (40)
Be configured with at least two splits (41) that can engage of correspondence mutually single-piece or multi-piece type,
For described jockey (10) is sealed on its outside and has the first thin slice (410) with respect to second recess (21) of attaching troops to a unit in the housing in described power semiconductor arrangement (1) (20),
Have the second thin slice (420) on the corresponding inner side that is arranged in described split (41), wherein, second thin slice (420) of described split (41) is intermeshing under the state engaging, and
There is at least one for holding first recess (430) of described lead-in wire (31) and described contact device (32).
2. jockey according to claim 1, wherein, described connector (30) is configured to transmitting optical signal or the signal of telecommunication.
3. jockey according to claim 1 and 2, wherein, portion's section of described encapsulant molding (40) coated described connector (30) under the state engaging.
4. according to the jockey described in any one in claim 1-2, wherein, every two splits (41) interconnect by contact pin (42) that can be crooked.
5. according to the jockey described in any one in claim 1-2, wherein, described encapsulant molding (40) consists of elastomeric material.
6. according to the jockey described in any one in claim 1-2, wherein, described encapsulant molding (40) consists of electrical insulating material.
7. according to the jockey described in any one in claim 1-2, wherein, described encapsulant molding (40) has the other contact pin (43) being arranged in described split (41).
8. according to the jockey described in any one in claim 1-2, wherein, split (41) has protruding nose, especially locks protruding nose (45), and corresponding split (41) has the recess (46) of attaching troops to a unit.
9. according to the jockey described in any one in claim 1-2, wherein, described encapsulant molding (40) has backstop seamed edge (44), and described backstop seamed edge (44) is configured to backstop on the bearing (22) of described housing (20).
10. power semiconductor arrangement, wherein, described power semiconductor arrangement (1) has housing (20) and according to the jockey (10) described in any one in claim 1-9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012212430.6 | 2012-07-16 | ||
| DE102012212430.6A DE102012212430B4 (en) | 2012-07-16 | 2012-07-16 | Connecting device for power semiconductor device with dense connector, power semiconductor device with such a connection device and method for forming a connection with such a connection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203521749U true CN203521749U (en) | 2014-04-02 |
Family
ID=48470761
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310297999.6A Pending CN103545654A (en) | 2012-07-16 | 2013-07-16 | Connection device for power semiconductor device with a sealed connector |
| CN201320423136.4U Expired - Lifetime CN203521749U (en) | 2012-07-16 | 2013-07-16 | Connection device for power semiconductor device with a shell and power semiconductor device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310297999.6A Pending CN103545654A (en) | 2012-07-16 | 2013-07-16 | Connection device for power semiconductor device with a sealed connector |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP2688151A1 (en) |
| CN (2) | CN103545654A (en) |
| DE (1) | DE102012212430B4 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545654A (en) * | 2012-07-16 | 2014-01-29 | 赛米控电子股份有限公司 | Connection device for power semiconductor device with a sealed connector |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203871531U (en) * | 2014-06-05 | 2014-10-08 | 泰科电子(上海)有限公司 | Electronic component installation carrying tool and connector |
| EP3057183B1 (en) * | 2015-02-12 | 2019-09-11 | Aptiv Technologies Limited | Sealed connector |
| DE102016211372B4 (en) | 2016-06-24 | 2018-06-07 | Robert Bosch Gmbh | Harness connector, method for producing a fluid-tight harness connector and auxiliary element for insertion into a harness connector |
| JP2020149938A (en) | 2019-03-15 | 2020-09-17 | 矢崎総業株式会社 | Electric wire cover |
| DE102019213879A1 (en) * | 2019-09-11 | 2020-07-16 | Zf Friedrichshafen Ag | electric wire |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3292275B2 (en) * | 1995-09-21 | 2002-06-17 | 住友電装株式会社 | Waterproof seal for connector |
| US6955558B1 (en) * | 2004-04-26 | 2005-10-18 | Andrew Corporation | Cable and apparatus interface security device |
| JP2006147248A (en) | 2004-11-17 | 2006-06-08 | Auto Network Gijutsu Kenkyusho:Kk | Waterproof connector |
| JP2009117265A (en) * | 2007-11-09 | 2009-05-28 | Tokai Rika Co Ltd | Waterproof plug for connector, and waterproof connector equipped with the same |
| JP5227599B2 (en) * | 2008-02-06 | 2013-07-03 | 矢崎総業株式会社 | connector |
| ITPD20080197A1 (en) * | 2008-06-30 | 2010-01-01 | Inarca Spa | ELECTRIC CONNECTOR, TWO OR MORE WAYS, SEALED SEASON |
| CN201789149U (en) * | 2010-08-10 | 2011-04-06 | 泰科电子(上海)有限公司 | Sealing device for sealing connecting piece |
| DE102012212430B4 (en) * | 2012-07-16 | 2017-08-03 | Semikron Elektronik Gmbh & Co. Kg | Connecting device for power semiconductor device with dense connector, power semiconductor device with such a connection device and method for forming a connection with such a connection device |
-
2012
- 2012-07-16 DE DE102012212430.6A patent/DE102012212430B4/en active Active
-
2013
- 2013-05-17 EP EP13168153.8A patent/EP2688151A1/en not_active Withdrawn
- 2013-07-16 CN CN201310297999.6A patent/CN103545654A/en active Pending
- 2013-07-16 CN CN201320423136.4U patent/CN203521749U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545654A (en) * | 2012-07-16 | 2014-01-29 | 赛米控电子股份有限公司 | Connection device for power semiconductor device with a sealed connector |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102012212430A1 (en) | 2014-02-20 |
| CN103545654A (en) | 2014-01-29 |
| DE102012212430B4 (en) | 2017-08-03 |
| EP2688151A1 (en) | 2014-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140402 |
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| CX01 | Expiry of patent term |