CN203521480U - Package structure of flexible organic photoelectric device - Google Patents
Package structure of flexible organic photoelectric device Download PDFInfo
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- CN203521480U CN203521480U CN201320628496.8U CN201320628496U CN203521480U CN 203521480 U CN203521480 U CN 203521480U CN 201320628496 U CN201320628496 U CN 201320628496U CN 203521480 U CN203521480 U CN 203521480U
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- encapsulation
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- optic device
- organic electro
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- 238000005538 encapsulation Methods 0.000 claims description 69
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 26
- 229910052760 oxygen Inorganic materials 0.000 claims description 26
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- 229920005570 flexible polymer Polymers 0.000 claims description 4
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- 239000000463 material Substances 0.000 description 12
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- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 description 1
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- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
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- Electroluminescent Light Sources (AREA)
Abstract
The utility model discloses a package structure of a flexible organic photoelectric device. The structure includes a flexible substrate, a flexible cover plate and an organic photoelectric device arranged between the flexible substrate and the flexible cover plate. A package part used for packaging the organic photoelectric device is arranged between the flexible substrate and the flexible cover plate. The package part includes a first package part and a second package part. The first package part is arranged in an external-side marginal area of the organic photoelectric device and fixes the flexible substrate and the flexible cover plate in an adhesive manner. The first package part includes dry nanoparticles. The second package part is arranged between the flexible cover plate and the organic photoelectric device, which are fixed in an adhesive manner through the second package part. Through arrangement of the first package part with the dry nanoparticles at the marginal areas of the flexible substrate and the flexible cover plate and a water absorption function of the dry nanoparticles in the first package part, flexibility of the organic photoelectric device is maintained, light extraction and perspective are ensured, water vapor invasion is prevented and an objective of better package is achieved.
Description
Technical field
The utility model relates to the encapsulation technology field belonging in flexible optoelectronic category, more particularly, the encapsulating structure that relates to a kind of flexible organic electro-optic device, includes the packaged type of OLED (OLED), organic solar batteries (OPV), organic semiconductor sensor.
Background technology
Organic electro-optic device, as OLED, OPV etc. are because the potentiality of high-performance, low-cost preparation and the characteristic that can be applied to flexible base, board receive much concern., these devices all inevitably will adopt water and very responsive organic material and the active metal of oxygen, and therefore, it is that encapsulation technology is required to the highest field that organic optoelectronic is learned.For flexible OLED and OPV etc., due to traditional, add a cover encapsulation and cannot adopt, the general mode that adopts thin-film package deposits the film that one or more layers intercepts water oxygen, the flexible that keeps substrate when realizing very high water oxygen barrier properties above device.But just because of this, the related film thickness of thin-film package is very thin, with current organic and inorganic alternate thin films, is encapsulated as example, and its gross thickness is only less than 5 microns, and the inorganic thin film gross thickness that wherein plays the effect of exclusion of water oxygen is less than 0.5 micron.The ultra-thin problem of bringing is that this technology is very responsive to the molecule of preparing in environment, as long as have a number micron big or small particle in a slice screen or solar modules, can cause whole screen body or the actual inefficacy of module.And in thin-film package manufacture process, no matter be external environment or preparation technology, all may there is the impact of particle, this is difficult to control and cannot stop.As a kind of encapsulation technology, need to both take into account the requirement of flexibility, keep again the ripe conventional package good tolerance to particle.
Chinese patent literature CN103035849 discloses a kind of OLED encapsulating structure, comprising: first substrate; Organic illuminating element, is arranged on first substrate; Second substrate, is oppositely arranged and jointly defines a viewing area with first substrate; And metallic packaging layer, comprise the first encapsulation and the second encapsulation, be arranged at respectively the relative both sides between first substrate and second substrate.First substrate, the first encapsulation, second substrate and the second encapsulation form an enclosure space, to seal this viewing area.In above-mentioned patent documentation, in metallic packaging layer, add metal nanoparticle instead of glass frit to coat this encapsulating structure, its objective is with metal nanoparticle replaces Frit to encapsulate for welding, to adapt to the characteristic of CF non-refractory, it cannot be for the encapsulation to flexible organic electro-optic device, metal nanoparticle in above-mentioned patent documentation does not possess water sorption completely simultaneously, and can not be for enhanced light scattering, increase visual angle.
Chinese patent literature CN1536936A discloses a kind of organic electroluminescent element and method for packing thereof of nano combined glue material, during encapsulation, organic electroluminescent element is placed on substrate, and be coated with the second packaging plastic at the inner ring of cap, in the outer ring of this cap, be coated with the first packaging plastic, by mode this first packaging plastic of dry sclerosis and second packaging plastic of heat energy or ultraviolet curing, so that in conjunction with this cap and substrate, in this patent documentation, be provided with two-layer packaging plastic, fill out respectively with dense material and nanometer hygroscopic material, it is mainly used in conventional package, can not be for flexible package, there will not be favourable technique effect on optics such as improving light taking-up and visual angle simultaneously.
Utility model content
In order to solve the problem of prior art, keep organic light-emitting device flexible, guarantee that light takes out and visual angle, prevent steam invasion, reach good encapsulation object, the utility model provides a kind of encapsulating structure of flexible organic electro-optic device.
Described technical scheme is as follows:
A kind of encapsulating structure of flexible organic electro-optic device, comprise flexible substrate, flexible cover plate and organic electro-optic device, described organic electro-optic device is arranged between described flexible substrate and flexible cover plate, between described flexible substrate and described flexible cover plate, be provided with for encapsulating the encapsulation of described organic electro-optic device, described encapsulating structure comprises the first encapsulation and the second encapsulation, described the first encapsulation is arranged at the outer ledge region of described organic electro-optic device, and described flexible substrate and flexible cover plate bonding is fixing, in described the first encapsulation, contain and use nanometer dried particles, described the second encapsulation is arranged between described flexible cover plate and described organic electro-optic device, and by described the second encapsulation, the two bonding is fixing.
Described the first encapsulation and the second encapsulation are organic gel encapsulation.
On the opposite flank of described flexible substrate and described flexible cover plate, be coated with respectively at least one deck water oxygen barrier layer, described the first encapsulation be arranged at two described between water oxygen barrier layer, and form and be tightly connected with water oxygen barrier layer described in two, described the second encapsulation is arranged at described organic electro-optic device and coats between the water oxygen barrier layer on described flexible cover plate.
Described water oxygen barrier layer is inorganic water oxygen barrier layer, and its thickness is 20nm～10 μ m.
The first described encapsulation thickness is 50～1000 μ m.
In described the first encapsulation, the particle diameter of contained nanometer dried particles is 5～100nm.
Described flexible cover plate and flexible substrate are flexible polymer foil.
The beneficial effect that the technical scheme that the utility model provides is brought is:
(1) by the fringe region at flexible substrate and flexible cover plate, one the first encapsulation with nanometer dried particles is set, the first encapsulation, upper and lower two substrates seal organic electro-optic device, by the second encapsulation is set above organic electro-optic device, organic electro-optic device is fixed on to flexible substrate and flexible cover plate.Owing to containing nanometer dried particles in the first encapsulation, nano particle has played the effect of water absorbing agent, the thin-film package that no longer needs multilayer, simultaneously, because the thickness of organic gel encapsulation is far away higher than the gross thickness of thin-film package, make become possibility the adding of nanometer dried particles of q.s, guaranteed package quality.
(2) the second encapsulation being positioned at directly over organic luminescent device is not added nanometer dried particles, therefore do not affect light and extract, and the light of edge wide-angle is due to the scattering of nanometer dried particles, can increase on the contrary light and extracts and improve visual angle.
(3) the utility model is respectively coated with one or more layers inorganic water oxygen barrier layer on the two relative side of flexible substrate and flexible cover plate, can well stop by the water oxygen of polymer foil and invade organic luminescent device.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is encapsulating structure sectional view provided by the utility model.
In figure:
101-flexible cover plate, 102-flexible substrate, the inorganic water oxygen barrier layer of 103-, 104-organic electro-optic device, 105-the first encapsulation; 106-the second encapsulation.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, the utility model execution mode is described in further detail.
Fig. 1 is the schematic diagram of flexible package structure provided by the utility model, it comprises flexible substrate 102, flexible cover plate 101 and organic electro-optic device 104, organic electro-optic device 104 is arranged between flexible substrate 102 and flexible cover plate 101, between flexible substrate 102 and described flexible cover plate 101, be provided with for encapsulating the encapsulation of organic electro-optic device 104, encapsulation comprises the first encapsulation 105 and the second encapsulation 106, the first encapsulation 105 is arranged at the outer ledge region of organic electro-optic device 104, and flexible substrate 102 and flexible cover plate 101 bondings is fixing, in the first encapsulation 105, contain and use nanometer dried particles, the second encapsulation 106 is arranged between flexible cover plate 101 and organic electro-optic device 104, and by the second encapsulation 106, the two bonding is fixing.The first encapsulation 105 and the second encapsulation 106 are wherein organic gel encapsulation.For water resistance is provided, on the opposite flank of flexible substrate 102 and flexible cover plate 101, be coated with respectively at least one deck water oxygen barrier layer 103, the first encapsulation 105 is arranged between two water oxygen barrier layers 103, and form and be tightly connected with two water oxygen barrier layers 103, the second encapsulation 106 is arranged at organic electro-optic device 104 and coats between the water oxygen barrier layer 103 on flexible cover plate 101.
Flexible substrate 102 is wherein flexible polymer foil, and its material can be but be not limited to polyimides (PI), PETG (PET), PEN (PEN), polyether sulfone (PES), polyethers ether alcohol (PEEK), poly-cycloolefin (PCO) etc.As encapsulation on the other hand, flexible cover plate 101 is also flexible polymer foil, and its material can be but be not limited to polyimides (PI), PETG (PET), PEN (PEN), polyether sulfone (PES), polyethers ether alcohol (PEEK), poly-cycloolefin (PCO) etc.In flexible substrate 102 one side relative with organic electro-optic device 104 with flexible cover plate 101, all deposit one or more layers inorganic water oxygen barrier layer 103, stop by the water oxygen of polymer foil and invade device, its thickness range is 20nm～10 μ m, material can for but be not limited to aluminium oxide, silica, titanium dioxide, zirconia, silicon nitride, titanium nitride, amorphous carbon etc., depositional mode can for but be not limited to sputter, plasma auxiliary chemical vapor deposition (PECVD), ald (ALD), vacuum evaporation, electrochemical deposition etc.
The utility model uses the glue with nanometer dried particles to apply the whole substrate with organic electro-optic device, and the thickness of glue is 50～1000 μ m, covers organic electro-optic device completely, and connects flexible substrate 102 and flexible cover plate 101.These nanometer dried particles are because skin effect can play the effect that absorbs hydrone, thereby can be used as drier; Meanwhile, because the thickness of glue is far longer than the thickness of thin-film package, encapsulate insensitively to molecule, and can comprise sufficient nanometer dried particles and absorb moisture, avoid steam to invade device.With being characterized as of the first encapsulation 105 of nanometer dried particles: the material of nano particle can for but be not limited to one or more of aluminium oxide, zirconia, titanium dioxide, zinc oxide, calcium oxide, barium monoxide, strontium oxide strontia, magnesium oxide etc., particle diameter is 5～100nm, and the content in glue is 1～50%wt.Glue base material is ultra-violet curing, heat curing-type or pressure-sensitive polymer, its material can for but be not limited to single polymers or the copolymer of polysilane resins, polyacrylate, polymethacrylates, poly epoxy resin, polyurethane, Parylene etc.The method of its formation can for but be not limited to spin coating, silk screen printing, inkjet printing, coating of monomer solution etc., then impose temperature, ultraviolet light etc. and make its polymerization.Requirement as the case may be, can design the arrangement mode of nanometer dried particles and position, and the utility model is not restricted this.
Embodiment
As shown in Figure 1, flexible substrate 102 wherein and flexible cover plate 101 its materials are preferably PEN, in the one side relative with OLED luminescent device 104, adopt ALD mode to form water oxygen barrier layer 103, and material is aluminium oxide, and thickness is preferably 80nm.With the glue application of nanometer dried particles, between flexible substrate 102 and flexible cover plate 101, integral-filled, its thickness is 500 μ m.Wherein glue is divided into two parts: submarginal the first encapsulation 105 and the second middle encapsulation 106, its glue base material is consistent, be the epoxy resin of ultra-violet curing, but the first encapsulation 105 of the edge that keeps to the side is distributed with aluminium oxide and titania nanoparticles, its particle diameter is 50nm, and content during allotment in glue is respectively 20%wt and 15%wt.The preparation method of glue is preferably inkjet printing-ultra-violet curing, the glue that is wherein positioned at the first encapsulation 105 of marginal portion is the mixture of epoxy monomer solution and nano particle, and the second encapsulation 106 of mid portion is only epoxy monomer solution, with different spray nozzles, print simultaneously, make glue consistency of thickness, then the flexible substrate of fitting 102 and flexible cover plate 101, then use ultraviolet light polymerization, complete encapsulation.The advantage of this embodiment is, as display, need to consider that light is fully extracted into encapsulating structure outside, if and nanometer dried particles is directly above organic luminescent device, may form scattering of light, reduce the contrast of display, this embodiment has avoided imposing nano particle above organic luminescent device, guarantee light taking-up, and can make full use of the water absorption character of nano particle, prevented steam invasion.And the display that adopts the utility model to encapsulate, owing to not being subject to the limitation of frame glue width, can realizing narrow frame and show.It is pointed out that technical staff is to the position of nano particle and any change of arranging and carrying out, all in protection range of the present utility model.
Above-mentioned the utility model embodiment sequence number, just to describing, does not represent the quality of embodiment.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (7)
1. the encapsulating structure of a flexible organic electro-optic device, comprise flexible cover plate (101), flexible substrate (102) and organic electro-optic device (104), described organic electro-optic device (104) is arranged between described flexible substrate (102) and flexible cover plate (101), between described flexible substrate (102) and described flexible cover plate (101), be provided with for encapsulating the encapsulation of described organic electro-optic device (104), it is characterized in that, described encapsulation comprises the first encapsulation (105) and the second encapsulation (106), described the first encapsulation (105) is arranged at the outer ledge region of described organic electro-optic device (104), and described flexible substrate (102) and flexible cover plate (101) bonding is fixing, in described the first encapsulation (105), contain and use nanometer dried particles, described the second encapsulation (106) is arranged between described flexible cover plate (101) and described organic electro-optic device (104), and by described the second encapsulation (106), the two bonding is fixing.
2. the encapsulating structure of flexible organic electro-optic device according to claim 1, is characterized in that, described the first encapsulation (105) and the second encapsulation (106) are organic gel encapsulation.
3. the encapsulating structure of flexible organic electro-optic device according to claim 1, it is characterized in that, on the opposite flank of described flexible substrate (102) and described flexible cover plate (101), be coated with respectively at least one deck water oxygen barrier layer (103), described the first encapsulation (105) be arranged at two described between water oxygen barrier layer (103), and form and be tightly connected with water oxygen barrier layer (103) described in two, described the second encapsulation (106) is arranged at described organic electro-optic device (104) and coats between the water oxygen barrier layer (103) on described flexible cover plate (101).
4. the encapsulating structure of flexible organic electro-optic device according to claim 3, is characterized in that, described water oxygen barrier layer (103) is inorganic water oxygen barrier layer, and its thickness is 20nm～10 μ m.
5. according to the encapsulating structure of the arbitrary described flexible organic electro-optic device of claim 1-4, it is characterized in that, described the first encapsulation (105) thickness is 50～1000 μ m.
6. the encapsulating structure of flexible organic electro-optic device according to claim 5, is characterized in that, in described the first encapsulation (105), the particle diameter of contained nanometer dried particles is 5～100nm.
7. the encapsulating structure of flexible organic electro-optic device according to claim 6, is characterized in that, described flexible cover plate (101) and flexible substrate (102) are flexible polymer foil.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320628496.8U CN203521480U (en) | 2013-10-12 | 2013-10-12 | Package structure of flexible organic photoelectric device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320628496.8U CN203521480U (en) | 2013-10-12 | 2013-10-12 | Package structure of flexible organic photoelectric device |
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| CN203521480U true CN203521480U (en) | 2014-04-02 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098088A (en) * | 2014-05-05 | 2015-11-25 | Tcl集团股份有限公司 | Flexible display and thin film packaging method thereof |
| CN105590944A (en) * | 2014-10-24 | 2016-05-18 | 上海和辉光电有限公司 | OLED flexible display device |
| CN106505139A (en) * | 2016-09-18 | 2017-03-15 | 深圳市核高基科技有限公司 | Micro-display device encapsulating structure and technique |
| CN106876605A (en) * | 2017-02-17 | 2017-06-20 | 京东方科技集团股份有限公司 | A kind of packaging part, method for packing and display device |
| CN107394054A (en) * | 2017-05-22 | 2017-11-24 | 茆胜 | The comprehensive encapsulating structure of flexible OLED and method for packing |
| WO2019052073A1 (en) * | 2017-09-12 | 2019-03-21 | 武汉华星光电半导体显示技术有限公司 | Flexible material and preparation method therefor, and flexible cover plate and preparation method therefor |
| WO2019127702A1 (en) * | 2017-12-29 | 2019-07-04 | 深圳市华星光电半导体显示技术有限公司 | Oled panel and manufacturing method therefor |
| US10431770B2 (en) | 2017-12-29 | 2019-10-01 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | OLED panel with a ring shape resin encapsulation material |
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2013
- 2013-10-12 CN CN201320628496.8U patent/CN203521480U/en not_active Expired - Lifetime
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098088A (en) * | 2014-05-05 | 2015-11-25 | Tcl集团股份有限公司 | Flexible display and thin film packaging method thereof |
| CN105590944A (en) * | 2014-10-24 | 2016-05-18 | 上海和辉光电有限公司 | OLED flexible display device |
| CN106505139A (en) * | 2016-09-18 | 2017-03-15 | 深圳市核高基科技有限公司 | Micro-display device encapsulating structure and technique |
| CN106876605A (en) * | 2017-02-17 | 2017-06-20 | 京东方科技集团股份有限公司 | A kind of packaging part, method for packing and display device |
| CN106876605B (en) * | 2017-02-17 | 2018-05-01 | 京东方科技集团股份有限公司 | A kind of packaging part, method for packing and display device |
| CN107394054A (en) * | 2017-05-22 | 2017-11-24 | 茆胜 | The comprehensive encapsulating structure of flexible OLED and method for packing |
| WO2019052073A1 (en) * | 2017-09-12 | 2019-03-21 | 武汉华星光电半导体显示技术有限公司 | Flexible material and preparation method therefor, and flexible cover plate and preparation method therefor |
| US10665824B2 (en) | 2017-09-12 | 2020-05-26 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flexible material and preparation method thereof, flexible cover plate and preparation method thereof |
| WO2019127702A1 (en) * | 2017-12-29 | 2019-07-04 | 深圳市华星光电半导体显示技术有限公司 | Oled panel and manufacturing method therefor |
| US10431770B2 (en) | 2017-12-29 | 2019-10-01 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | OLED panel with a ring shape resin encapsulation material |
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