CN203517712U - Bulb with high heat dissipation performance - Google Patents
Bulb with high heat dissipation performance Download PDFInfo
- Publication number
- CN203517712U CN203517712U CN201320588142.5U CN201320588142U CN203517712U CN 203517712 U CN203517712 U CN 203517712U CN 201320588142 U CN201320588142 U CN 201320588142U CN 203517712 U CN203517712 U CN 203517712U
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- Prior art keywords
- light source
- heat transfer
- bulb
- transfer piece
- source board
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- Expired - Fee Related
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Abstract
A bulb with the high heat dissipation performance comprises a bulb holder body, a bulb shell and a light source plate. The light source plate is arranged on the top of the bulb holder body, and the bulb shell covers the top of the bulb holder body and the light source plate is accommodated in the bulb shell. The bulb further comprises a heat transfer piece, wherein one end of the heat transfer piece is in hot connection with the light source plate, the other end of the heat transfer piece is in hot connection with the inner wall of the bulb shell, and the heat transfer piece is used for transferring heat on the light source plate to the bulb shell. The bulb with the high heat dissipation performance has the advantages of being simple in structure and good in heat dissipation effect.
Description
Technical field
The utility model relates to lighting field, particularly a kind of high heat radiation bulb.
Background technology
LED light source has advantages of that luminous efficiency is high, power saving and the life-span long, so its application is more and more extensive.Because LED light source is when luminous, the temperature of himself can raise gradually, in the continuous firing process of lighting device, if the heat that LED light source produces cannot leave in time, will cause this light source assembly damage and affect service life of lighting device.At present, the LED bulb of prior art is generally dispelled the heat by independent radiating piece, and for example Granted publication day is on April 25th, 2012, and the Chinese utility model patent that the patent No. is 201120307527.0 has disclosed a kind of LED lamp bulb radiating structure.This LED lamp bulb radiating structure comprises bulb rack and rack-mount fin, these fin directly contact with the radiator portion of LED lamp body, make heat can be delivered on fin, fin distributes radially and is provided with a plurality of heat radiation through holes, the bottom surface of Lamp cup part is provided with a plurality of openings that allow fin penetrate, and fin is penetrated fixing by opening.
Although this method can play the effect of heat radiation, but a plurality of fin need to be set, and Lamp cup part will arrange a plurality of openings these fin are installed, this just makes this LED lamp weight heavier, and material cost is high, and when user uses, feel is heavier, and this LED lamp assembling process is loaded down with trivial details, complex manufacturing technology, cannot provide production efficiency, is difficult to realize automated production.
Utility model content
In view of this, be necessary to provide a kind of height simple in structure heat radiation bulb.
A kind of high heat radiation bulb, comprise body, bulb housing and light source board, this light source board is arranged on the top of this body, this bulb housing is located at the top of this body and accommodates this light source board, also comprise heat transfer piece, one end of this heat transfer piece and this light source board are thermally coupled, and the other end is connected with the inner surface heat of this bulb housing, and this heat transfer piece is for being passed to this bulb housing by the heat on light source board.
Compared with prior art, this height heat radiation bulb by arranging heat transfer piece on light source board, and the other end of this heat transfer piece is connected with the inner surface heat of this bulb housing, because this heat transfer piece has good radiating effect, therefore make the heat that LED distributes to be passed in time this bulb housing and to distribute; This heat transfer piece is simple in structure, and volume is frivolous, owing to not needing that a plurality of fin are set as prior art, can realize heat radiation, so this height heat radiation bulb has advantages of simple in structure and good heat dissipation effect.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of the height heat radiation bulb of the utility model the first embodiment.
Fig. 2 is the front view after the assembling of high heat radiation bulb shown in Fig. 1.
Fig. 3 is that high heat radiation bulb shown in Fig. 1 is assembled and removes the front view after bulb housing.
Description of reference numerals:
100 high heat radiation bulb 20 heat transfer pieces
10 bulb housing 30 light source versions
31 LED light source 40 fixed heads
50 bodys
The specific embodiment
Below in conjunction with accompanying drawing and the specific embodiment, the utility model is described in further detail.
Fig. 1 is the three-dimensional exploded view of the height heat radiation bulb 100 of the utility model the first embodiment, this height heat radiation bulb 100 comprises 10,3 heat transfer pieces of bulb housing 20,3 light source boards 30, fixed head 40 and bodys 50, these light source boards 30 are arranged on the top of this body 50 by this fixed head 40, this bulb housing 10 is located at the top of this body 50 and accommodates these light source boards 30, in these light source board 30 sides, is provided with LED light source 31.One end of these heat transfer pieces 20 and each light source board 30 are thermally coupled, and the other end is connected to the inwall of this bulb housing 10 to be connected with the inner surface heat of this bulb housing 10.
Please refer to Fig. 1, these heat transfer pieces 20 are membrane structure, by transparent material, are made as Graphene.Certainly this heat transfer piece 20 also can be made with other thermal expansion materials or heat memory material.The middle part of each heat transfer piece 20 is sticked respectively in the bottom of these light source boards 30, and the other two ends of each heat transfer piece 20 are connected on the inwall of this bulb housing 10 separably.These heat transfer pieces 20 are cut into specific shape, are subject to expanding and opening after the heating of these light source boards 30, are attached to the inner surface of this bulb housing 10 to conduct heat.
Please refer to Fig. 1, these light source boards 30 are intervally arranged around the central shaft equal angles of this body 50, by this fixed head 40, be fixed on this body 50 center of top, the lateral surface of each light source board 30 is provided with LED light source 31, and the lateral surface of each light source board 30 forms obtuse angle angle with the end face of this body 50 respectively.These heat transfer pieces 20 are corresponding with the number of these light source boards 30, and these heat transfer pieces 20 and this bulb housing 10 are made by high conductivity material.On these bulb housing 10 inwalls, the other end that should heat transfer piece 20 is provided with to groove (not shown), in this groove, is provided with heat transfer glue (not shown).This heat transfer glue is for reducing the thermal resistance between these heat transfer pieces 20 and this bulb housing 10 inwalls.
During work, after these heat transfer pieces 20 that are sticked on each light source board 30 are heated, expand and open, be the inner surface that film-form is attached to this bulb housing 10, the given shape being cut into due to these heat transfer pieces 20 can cover the inner surface of this bulb housing 10 by larger area after launching, thereby makes these heat transfer pieces 20 have higher heat transfer efficiency.
In sum, this height heat radiation bulb 100 by these body 50 center of top around the central shaft equal angles light source board 30 that is intervally arranged, and correspondence arranges heat transfer piece 20 one by one on each light source board 30, these heat transfer pieces 20 are after being heated, the inner surface that is attached to this bulb housing 10 is opened in expansion, because these heat transfer pieces 20 are made by transparent graphene film, Graphene is thermal expansion highly heat-conductive material, has good radiating effect.Aspect luminous, because the top at this body 50 is provided with a plurality of light source boards 30, the light that LED light source 31 on these light source boards 30 sends can be distributed in to wide-angle on this bulb housing 10, and transparent graphene film does not affect bright dipping substantially, therefore this height heat radiation bulb 100 not only has good radiating effect, simultaneously can also wide-angle luminous.In addition, the other end of each heat transfer piece 20 is separable to be connected on the inwall of this bulb housing 10, this height heat radiation bulb 100 is had advantages of easy to assembly, needn't spend step to assemble this heat transfer piece 20 and this bulb housing 10 again.
Claims (9)
1. one kind high heat radiation bulb, comprise body, bulb housing and light source board, this light source board is arranged on the bottom of this body, this bulb housing is located at the top of this body and accommodates this light source board, it is characterized in that, also comprise heat transfer piece, one end of this heat transfer piece and this light source board are thermally coupled, the other end is connected with the inner surface heat of this bulb housing, and this heat transfer piece is for being passed to this bulb housing by the heat on light source board.
2. high heat radiation bulb according to claim 1, is characterized in that: this heat transfer piece is made by transparent material.
3. high heat radiation bulb according to claim 1, is characterized in that: comprise a plurality of heat transfer pieces, each heat transfer piece is membrane structure, and the other end of each heat transfer piece is separable to be connected on the inwall of this bulb housing.
4. high heat radiation bulb according to claim 3, is characterized in that: described heat transfer piece is made by thermal expansion material or heat memory material, and described heat transfer piece is subject to opening on the inwall that is connected to this bulb housing after the heating of this light source board.
5. high heat radiation bulb according to claim 4, is characterized in that: this heat transfer piece is made by Graphene.
6. high heat radiation bulb according to claim 1, is characterized in that: on this bulb housing inwall, the other end that should heat transfer piece is provided with to groove, is provided with heat transfer glue in this groove.
7. according to the height heat radiation bulb described in any one in claim 3 to 6, it is characterized in that: comprise three or three above light source board and number heat transfer pieces corresponding with described light source board, described light source board is intervally arranged in this body center of top around the central shaft equal angles of this body, the lateral surface of each light source board is provided with LED light source, and the lateral surface of each light source board forms obtuse angle angle with the end face of this body respectively.
8. high heat radiation bulb according to claim 7, is characterized in that: the middle part of each heat transfer piece is sticked respectively in the bottom of light source board, and two ends are thermally coupled with this bulb housing respectively.
9. high heat radiation bulb according to claim 1, is characterized in that: this heat transfer piece and bulb housing are made by high conductivity material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320588142.5U CN203517712U (en) | 2013-09-23 | 2013-09-23 | Bulb with high heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320588142.5U CN203517712U (en) | 2013-09-23 | 2013-09-23 | Bulb with high heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203517712U true CN203517712U (en) | 2014-04-02 |
Family
ID=50376641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320588142.5U Expired - Fee Related CN203517712U (en) | 2013-09-23 | 2013-09-23 | Bulb with high heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203517712U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103471063A (en) * | 2013-09-23 | 2013-12-25 | 立达信绿色照明股份有限公司 | High heat-dissipating bulb |
| CN106838662A (en) * | 2017-04-01 | 2017-06-13 | 漳州立达信光电子科技有限公司 | A kind of LED light source plate and LED |
-
2013
- 2013-09-23 CN CN201320588142.5U patent/CN203517712U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103471063A (en) * | 2013-09-23 | 2013-12-25 | 立达信绿色照明股份有限公司 | High heat-dissipating bulb |
| CN106838662A (en) * | 2017-04-01 | 2017-06-13 | 漳州立达信光电子科技有限公司 | A kind of LED light source plate and LED |
| CN106838662B (en) * | 2017-04-01 | 2019-12-24 | 漳州立达信光电子科技有限公司 | LED light source board and LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170122 Address after: Xingtai Industrial Park Economic Development Zone, Changtai County, Fujian city of Zhangzhou province 363999 Patentee after: ZHANGZHOU LIDAXIN PHOTOELECTRON TECHNOLOGY CO., LTD. Address before: 363999 Xingda Road, Fujian city of Zhangzhou province Changtai Xingtai County Development Zone Patentee before: Leedarson Green Lighting Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20190923 |