CN203509831U - Fixture of edge grinding machine for quartz wafer - Google Patents
Fixture of edge grinding machine for quartz wafer Download PDFInfo
- Publication number
- CN203509831U CN203509831U CN201320640005.1U CN201320640005U CN203509831U CN 203509831 U CN203509831 U CN 203509831U CN 201320640005 U CN201320640005 U CN 201320640005U CN 203509831 U CN203509831 U CN 203509831U
- Authority
- CN
- China
- Prior art keywords
- quartz wafer
- suction unit
- negative pressure
- cylinder
- generating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Abstract
The utility model discloses a fixture of an edge grinding machine for quartz wafer. The fixture comprises a base on which a guide rail is fixed; the two ends of the guide rail are movably connected with sliding blocks respectively; a locating detent is installed at the top of each sliding block, and the two locating detents are set oppositely; the two sliding blocks are driven by a cylinder; a suction machine is fixedly set between two locating detents; the suction machine is provided with a negative pressure generating device; the negative pressure generating device is connected to a negative pressure sensor; the negative pressure sensor is connected to the cylinder through signal lines; the suction machine is provided with a position sensor; the position sensor is connected to the negative pressure generating device. The fixture can realize the function of automatically locating the clamping of the quartz wafer in fully automatic high-speed edge grinding machine.
Description
Technical field
The utility model relates to a kind of process equipment of quartz wafer, is specifically related to a kind of fixture for quartz wafer edge finishing machine.
Background technology
Fully automatic high-speed edge polisher needs by fixture, quartz wafer to be gripped in the course of the work.Because edge polisher runs up in the course of the work, require its fixture reliablely and stablely to wafer, to position operation.But the positioning precision of the fixture of existing edge polisher is low, when quartz wafer is carried out to edging, owing to can not accurately locating, cause the edging precision of wafer low, product percent of pass decreases.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of fixture for quartz wafer edge finishing machine, and it can improve the positioning precision of fixture.
For solving the problems of the technologies described above, the utility model for the technical solution of the fixture of quartz wafer edge finishing machine is:
Comprise base, on base, be fixedly installed guide rail; The two ends of guide rail are connected with respectively slide block; The top of each slide block is fixedly installed locating detent, and two locating detents are oppositely arranged; Two slide blocks are realized driving by cylinder; Between two locating detents, be fixedly installed suction unit; Suction unit is provided with negative pressure generating device; Negative pressure generating device connects a B/P EGR Back Pressure Transducer EGR; B/P EGR Back Pressure Transducer EGR connects cylinder by holding wire; Suction unit is provided with a position sensor; Position sensor connects negative pressure generating device.
The upper surface of described suction unit is coated with sulfuration hydrogenated nitrile-butadiene rubber layer.
By manipulator, capture quartz wafer and quartz wafer is placed in described suction unit; The negative pressure generating device of suction unit produces a negative pressure and holds the quartz wafer in suction unit; B/P EGR Back Pressure Transducer EGR detects after negative pressure signal, and to cylinder transmitted signal, cylinder band movable slider moves to suction unit direction along guide rail, promotes quartz wafer and move under the acting in conjunction of two locating detents, and quartz wafer is pushed to operating position; After quartz wafer moves into place, position sensor detects the position signalling of quartz wafer, and to the negative pressure generating device transmitted signal of suction unit, suction unit produces another larger negative-pressure sucking, fixes the quartz wafer in suction unit; B/P EGR Back Pressure Transducer EGR detects after negative pressure signal, and to cylinder transmitted signal, cylinder oppositely moves, and two locating detents unclamp the clamping to quartz wafer.
The technique effect that the utility model can reach is:
The utility model can reach 0.05mm with interior positioning precision, realizes the automatic positioning action of quartz wafer.
The utility model can be realized the automatic positioning and clamping function of quartz wafer on fully automatic high-speed edge polisher.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
Fig. 1 is that the utility model is for the schematic diagram of the fixture of quartz wafer edge finishing machine.
Description of reference numerals in figure:
1 is locating detent, and 2 is guide rail,
3 is suction unit, and 4 is cylinder,
5 is position sensor, and 6 is B/P EGR Back Pressure Transducer EGR,
7 is base, and 8 is air inlet platform,
9 is slide block.
The specific embodiment
As shown in Figure 1, the utility model, for the fixture of quartz wafer edge finishing machine, comprises base 7, is fixedly installed guide rail 2 on base 7; The two ends of guide rail 2 are flexibly connected two slide blocks 9; The top of each slide block 9 is fixedly installed 1, two locating detent 1 of locating detent and is oppositely arranged; Two slide blocks 9 are realized and being driven by cylinder 4;
The middle part of guide rail 2 is fixedly installed air inlet platform 8, is fixedly installed suction unit 3 on air inlet platform 8; Suction unit 3 is between two locating detents 1;
Suction unit 3 is provided with negative pressure generating device; Negative pressure generating device connects a B/P EGR Back Pressure Transducer EGR 6; B/P EGR Back Pressure Transducer EGR 6 connects cylinder 4 by holding wire;
Suction unit 3 is provided with a position sensor 5; Position sensor 5 connects negative pressure generating device.
The upper surface of suction unit 3 is coated with one deck sulfuration hydrogenated nitrile-butadiene rubber.
Operation principle of the present utility model is as follows:
By manipulator, capture quartz wafer and quartz wafer is placed in suction unit 3; The negative pressure generating device of suction unit 3 produces a negative pressure and holds the quartz wafer in suction unit 3, prevents its slip or drops;
The B/P EGR Back Pressure Transducer EGR 6 at suction unit 3 places detects after this negative pressure signal, to cylinder 4 transmitted signals, cylinder 4 band movable sliders 9 move to suction unit direction along guide rail 2, promote quartz wafer and move on two slide blocks 9 under the acting in conjunction of locating detent 1, and quartz wafer is pushed to operating position;
After quartz wafer moves into place, position sensor 5 detects the position signalling of quartz wafer, and to the negative pressure generating device transmitted signal of suction unit 3, suction unit 3 produces another larger negative-pressure sucking, fixes the quartz wafer in suction unit 3; The B/P EGR Back Pressure Transducer EGR 6 at suction unit 3 places detects after this negative pressure signal, and to cylinder 4 transmitted signals, cylinder 4 oppositely moves, and the locating detent 1 on two slide blocks 9 unclamps the clamping to quartz wafer, now can carry out edging processing to quartz wafer.
The utility model is applicable to high speed edge polisher with fixing quartz wafer.
Claims (3)
1. for a fixture for quartz wafer edge finishing machine, it is characterized in that: comprise base, on base, be fixedly installed guide rail; The two ends of guide rail are connected with respectively slide block; The top of each slide block is fixedly installed locating detent, and two locating detents are oppositely arranged; Two slide blocks are realized driving by cylinder;
Between two locating detents, be fixedly installed suction unit;
Suction unit is provided with negative pressure generating device; Negative pressure generating device connects a B/P EGR Back Pressure Transducer EGR; B/P EGR Back Pressure Transducer EGR connects cylinder by holding wire;
Suction unit is provided with a position sensor; Position sensor connects negative pressure generating device.
2. the fixture for quartz wafer edge finishing machine according to claim 1, is characterized in that: the upper surface of described suction unit is coated with sulfuration hydrogenated nitrile-butadiene rubber layer.
3. the fixture for quartz wafer edge finishing machine according to claim 1, is characterized in that: by manipulator, captured quartz wafer and quartz wafer is placed in described suction unit; The negative pressure generating device of suction unit produces a negative pressure and holds the quartz wafer in suction unit;
B/P EGR Back Pressure Transducer EGR detects after negative pressure signal, and to cylinder transmitted signal, cylinder band movable slider moves to suction unit direction along guide rail, promotes quartz wafer and move under the acting in conjunction of two locating detents, and quartz wafer is pushed to operating position;
After quartz wafer moves into place, position sensor detects the position signalling of quartz wafer, and to the negative pressure generating device transmitted signal of suction unit, suction unit produces another larger negative-pressure sucking, fixes the quartz wafer in suction unit; B/P EGR Back Pressure Transducer EGR detects after negative pressure signal, and to cylinder transmitted signal, cylinder oppositely moves, and two locating detents unclamp the clamping to quartz wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320640005.1U CN203509831U (en) | 2013-10-17 | 2013-10-17 | Fixture of edge grinding machine for quartz wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320640005.1U CN203509831U (en) | 2013-10-17 | 2013-10-17 | Fixture of edge grinding machine for quartz wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203509831U true CN203509831U (en) | 2014-04-02 |
Family
ID=50368813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320640005.1U Withdrawn - After Issue CN203509831U (en) | 2013-10-17 | 2013-10-17 | Fixture of edge grinding machine for quartz wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203509831U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103506911A (en) * | 2013-10-17 | 2014-01-15 | 浙江大学台州研究院 | Jig for quartz crystal wafer edge grinding machine |
-
2013
- 2013-10-17 CN CN201320640005.1U patent/CN203509831U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103506911A (en) * | 2013-10-17 | 2014-01-15 | 浙江大学台州研究院 | Jig for quartz crystal wafer edge grinding machine |
| CN103506911B (en) * | 2013-10-17 | 2016-01-13 | 浙江大学台州研究院 | For the fixture of quartz wafer edge finishing machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140402 Effective date of abandoning: 20160113 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |