CN203491245U - SMD diode with cooling plate - Google Patents
SMD diode with cooling plate Download PDFInfo
- Publication number
- CN203491245U CN203491245U CN201320542919.4U CN201320542919U CN203491245U CN 203491245 U CN203491245 U CN 203491245U CN 201320542919 U CN201320542919 U CN 201320542919U CN 203491245 U CN203491245 U CN 203491245U
- Authority
- CN
- China
- Prior art keywords
- plastic
- tablet
- chip
- material sheet
- package body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Packages (AREA)
Abstract
The utility model relates to a diode, especially an SMD diode with a cooling plate. The diode comprises an upper material sheet, a chip, a lower material sheet, and a plastic-package body. The upper material body consists of an upper pin, a bent segment, an isosceles-trapezoid segment, and a connecting segment of a to-be-packaged chip. The chip is welded between the upper and lower material sheets through welding flux. The exterior of the chip is packaged by the plastic-package body. The SMD diode is characterized in that the lower end face of the plastic-package body is aligned with the lower end face of the lower material sheet. Through employing the above structure, the lower end face of the plastic-package body can be enabled to be aligned with the lower end face of the lower material sheet, thereby enabling the lower end face of the lower material sheet to be exposed from the plastic-package body, and improving the cooling effect, compared with a conventional structure, of a product. The lower material sheet employs a planar structure, thereby effectively reducing the overall height of the product, and further reducing the size of the product. A projection disposed at the isosceles-trapezoid segment increases the contact area of the upper material sheet with the plastic-package body, thereby increasing a binding force between the upper material sheet and the plastic-package body, and reducing the tendency of movement caused by the forces in lateral and longitudinal directions.
Description
Technical field
The utility model relates to a kind of diode, especially a kind of stamp-mounting-paper diode with heating panel.
Background technology
Electron trade is increasingly competitive, also more and more higher to Electronic Packaging component reliability requirement in the industry.In order to obtain client's approval and to occupy the sufficient market share, Electronic Packaging enterprise, all in effort, has paid a large amount of funds and many technical supports.Perfect, light, thin, the little important symbol of weighing electronic system product that becomes of employing and development along with microelectronic circuit, surface mounting technology (SMT).And to make electronics miniaturization, first will consider the miniaturization of electronic component.Chip, miniaturization are the main directions that electronic component developed in recent years, say to a certain degree, and chip type, miniaturization have become one of important symbol of weighing electronic component technology development level.
Current stamp-mounting-paper diode is on the market when producing, and maturity and customers' approval degree due to product adopt early stage version always, do not do any improvement.This kind of structure is specially: comprise chip and upper and lower tablet, upper and lower tablet is bent into highly different Z-shaped, and chip is welded between the Z-shaped top margin of upper and lower tablet by scolder, and encapsulates by black glue body.Shortcoming is: (1) is Z-shaped because upper and lower tablet is, and makes to encapsulate rear whole height higher, reaches 1.15mm; (2) SMC encapsulation technology generally adopts the direct press plastic packaging of weldment at present, while being unfavorable for diode operation, dispels the heat, and especially, in high-frequency circuit, heat generation is more, and the diode junction temperature easily making exceeds standard and lost efficacy.
Utility model content
The utility model provides a kind of stamp-mounting-paper diode with heating panel, solved the problem that existing stamp-mounting-paper diode whole height is higher, volume is larger, and SMC encapsulation technology generally adopts the direct press plastic packaging of weldment at present, while being unfavorable for diode operation, dispel the heat, especially in high-frequency circuit, heat generation is more, and the diode junction temperature easily making exceeds standard and the problems such as inefficacy.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is:
A kind of stamp-mounting-paper diode with heating panel, comprise tablet, chip, lower tablet and plastic-sealed body, described upper tablet is by upper pin, bending section, isosceles trapezoid section and form with the linkage section of chip to be packaged, described chip is welded between tablet upper tablet and lower by scolder, described chip covering is equipped with plastic-sealed body, and the lower surface of described plastic-sealed body flushes with lower tablet lower surface.
Further, a kind of preferred version of the present utility model: described lower tablet is planar structure, comprises lower pin and square plate, the lower surface of described square plate flushes with the lower surface of described plastic-sealed body, and described lower pin and described square plate are structure as a whole.
Further, a kind of preferred version of the present utility model: the both sides of described isosceles trapezoid section are provided with two projections.
Further, a kind of preferred version of the present utility model: the length of described projection is 0.06-0.09mm.
Further, a kind of preferred version of the present utility model: described upper tablet and described lower tablet are copper sheet.
The beneficial effects of the utility model:
Adopt structure of the present utility model, the lower surface of the plastic-sealed body of encapsulation can be flushed with lower tablet lower surface, make the lower surface of lower tablet all expose plastic-sealed body, compare the radiating effect that original structure has improved product.
Lower tablet adopts planar structure, can effectively reduce the whole height of product, and then reduces the volume of product.
On the projection of isosceles trapezoid section setting has increased, the contact area of tablet and plastic-sealed body, has improved adhesion between the two, also can reduce horizontal and vertical stressed mobile trend simultaneously.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation sketch of an embodiment of the present utility model;
Fig. 2 is that the A-A of Fig. 1 is to structural representation sketch.
In figure, 10 is upper tablet, and 11 is upper pin, and 12 is bending section, and 13 is isosceles trapezoid section, and 14 is linkage section, and 15 is projection, and 20 is chip, and 30 is lower tablet, and 31 is square plate, and 32 is lower pin, and 40 is plastic-sealed body.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
As illustrated in fig. 1 and 2, a kind of stamp-mounting-paper diode with heating panel, comprise tablet 10, chip 20, lower tablet 30 and plastic-sealed body 40, described upper tablet 10 is by upper pin 3211, bending section 12, isosceles trapezoid section 13 and form with the linkage section 14 of chip 20 to be packaged, described chip 20 is welded between tablet 30 upper tablet 10 and lower by scolder, described chip 20 coverings are equipped with plastic-sealed body 40, and the lower surface of described plastic-sealed body 40 flushes with lower tablet 30 lower surfaces.
Preferably: lower tablet 30 is planar structure, comprises lower pin 32 and square plate 31, and the lower surface of described square plate 31 flushes with the lower surface of described plastic-sealed body 40, described lower pin 32 is structure as a whole with described square plate 31.Lower tablet 30 is planar structure, can effectively reduce the whole height of product, and then reduces the volume of product.
Preferably: the both sides of described isosceles trapezoid section 13 are provided with two projections 15.The projection 15 arranging has increased the contact area of upper tablet 10 and plastic-sealed body 40, has improved adhesion between the two, also can reduce horizontal and vertical stressed mobile trend simultaneously.
Preferably: described protruding 15 length is 0.06-0.09mm.The projection 15 of the length of projection 15 in described size range has good stiffening effect.
Preferably: described upper tablet 10 and described lower tablet 30 are copper sheet.Adopt copper sheet can strengthen the conduction property of diode.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (5)
1. the stamp-mounting-paper diode with heating panel, comprise tablet, chip, lower tablet and plastic-sealed body, described upper tablet is by upper pin, bending section, isosceles trapezoid section and form with the linkage section of chip to be packaged, described chip is welded between tablet upper tablet and lower by scolder, described chip covering is equipped with plastic-sealed body, it is characterized in that: the lower surface of described plastic-sealed body flushes with lower tablet lower surface.
2. the stamp-mounting-paper diode with heating panel according to claim 1, it is characterized in that: described lower tablet is planar structure, comprise lower pin and square plate, the lower surface of described square plate flushes with the lower surface of described plastic-sealed body, and described lower pin and described square plate are structure as a whole.
3. the stamp-mounting-paper diode with heating panel according to claim 1, is characterized in that: the both sides of described isosceles trapezoid section are provided with two projections.
4. the stamp-mounting-paper diode with heating panel according to claim 3, is characterized in that: the length of described projection is 0.06-0.09mm.
5. according to the stamp-mounting-paper diode with heating panel described in claim 1-4 any one, it is characterized in that: described upper tablet and described lower tablet are copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320542919.4U CN203491245U (en) | 2013-09-02 | 2013-09-02 | SMD diode with cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320542919.4U CN203491245U (en) | 2013-09-02 | 2013-09-02 | SMD diode with cooling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203491245U true CN203491245U (en) | 2014-03-19 |
Family
ID=50262055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320542919.4U Expired - Fee Related CN203491245U (en) | 2013-09-02 | 2013-09-02 | SMD diode with cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203491245U (en) |
-
2013
- 2013-09-02 CN CN201320542919.4U patent/CN203491245U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140319 Termination date: 20140902 |
|
| EXPY | Termination of patent right or utility model |