CN203467114U - Heat-dissipation device for levitation controller of medium-low-speed magnetically-levitated train - Google Patents
Heat-dissipation device for levitation controller of medium-low-speed magnetically-levitated train Download PDFInfo
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- CN203467114U CN203467114U CN201320607763.3U CN201320607763U CN203467114U CN 203467114 U CN203467114 U CN 203467114U CN 201320607763 U CN201320607763 U CN 201320607763U CN 203467114 U CN203467114 U CN 203467114U
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Abstract
The utility model relates to a heat-dissipation device for a levitation controller of a medium-low-speed magnetically-levitated train. The heat-dissipation device comprises a housing which is installed outside the train levitation controller. The housing is provided with semiconductor cooling fins, wherein each semiconductor cooling fin comprises a heat-dissipation end installed outside the housing and a refrigeration end installed inside the housing. The semiconductor cooling fins which are good in heat-dissipation effect and are suitable for dissipating heat in smaller space are utilized to dissipate heat of the train levitation controller so as to overcome the defect of poor heat dissipation effect in the technical filed of train levitation controller heat dissipation and cooling, with the heat dissipation efficiency being improved by more than 80%. The power-constant semiconductor cooling fins are targetedly utilized to dissipate heat of the train levitation controller correspondingly, so that timely cooling is guaranteed, the components are guaranteed to work normally in normal temperature working environment, and the danger of train stopping due to the component damage which is caused by the high temperature is greatly avoided.
Description
Technical field
The utility model relates to a kind of MagLev trainset train suspension controller heat abstractor, belongs to the technical field of train suspension controller radiating and cooling.
Background technology
Along with the integrated and control theory of electronic component and the development of rotor dynamics, through years of researches work, both at home and abroad the research of this technology is all made great progress.No matter but be in theoretical or the process in commercialization, all there is a lot of difficult problems in this technology, wherein the technical barrier of magnetic suspension train is the control system of suspension and propelling and a set of complexity, and its realization need to be used the high-tech achievement of the aspects such as electronic technology, electromagnetic device, linear electric motors, mechanical structure, computer, material and network analysis.What need tackling key problem is the technology of composition system and realizes through engineering approaches.
Along with the application of magnetic suspension in transport train field, accurate installation, the safe operation of the magnetic suspension controller that wherein carried on magnetic suspension train becomes prior art technical problem in urgent need to be improved: the heat dissipation problem of especially described magnetic suspension controller.In prior art, do not prevent in magnetic suspension controller that accurate semiconductor components and devices is in dustfree environment work, therefore how at magnetic suspension controller, to adopt dustless totally-enclosed cover body to seal it, but this mounting means is burying huge safety in production hidden danger: its radiating effect is bad, easily make the element local overheating in magnetic suspension controller, cause malfunctioning, puncture or cause fire.For this deficiency; existing often by the structures such as fan, radiating fin being set on described magnetic suspension controller shell to increase the integral heat sink to magnetic suspension controller; for example; Chinese patent CN102005989A discloses a kind of suspension controller of magnetic suspension train; comprise the electric devices such as casing and IGBT; its casing is that aluminum casting forms, and radiating fin is arranged at bottom; Its main circuit input protection fuse and control circuit input protection fuse are arranged on insulation board, form insulation board assembly; Its support capacitor and binding post are arranged on aluminium matter mounting panel, form mounting panel assembly; Its current sensor, voltage sensor circuit board, output filtering reactor, charging resistor and discharge resistance are arranged on the bottom surface of " L " type mounting panel, charging contactor and main contactor are arranged on the side of " L " type mounting panel, form " L " type mounting panel assembly.The heating electric devices such as IGBT of the present utility model are arranged on box house bottom surface, and its heat can be dissipated by casing.When in this patent, institute's record casing is as radiator, specially in the bottom of casing, radiating fin is set, saved like this radiator configuring for IGBT specially, casing is radiator, but when practical application, only by casing, dispel the heat, the heat of its controller internal circuit is difficult to row in time and falls apart, greatly reduce the working life of components and parts, affect the normal operation of controller.
Practice shows, this heat dissipating method can only meet the needs of short distance train, yet when the magnetic suspension controller operating time is long, its radiating effect declines greatly.
Because described magnetic suspension controller mainly comprises two parts circuit module, wherein comprise its heat radiation of circuit module of IGBT greatly, as two circuit module is placed in a shell, certainly will affect safety in production and the use of whole magnetic suspension controller.
Utility model content
For the deficiencies in the prior art, the utility model provides a kind of MagLev trainset train suspension controller heat abstractor.
The technical solution of the utility model is as follows:
A kind of MagLev trainset train suspension controller heat abstractor, comprise the shell that is arranged on train suspension controller outside, semiconductor heat-dissipating sheet is installed on described shell, and described semiconductor heat-dissipating sheet comprises the radiating end that is arranged on housing exterior and the refrigeration end that is arranged on enclosure.The advantage of design is herein, for the not good defect of radiating effect in the technical field of train suspension controller radiating and cooling, the semiconductor heat-dissipating sheet that the utility model adopts strong refrigeration cool-down, be applicable to less space heat elimination dispels the heat to train suspension controller, and its radiating efficiency improves more than 80%.
Preferred according to the utility model, described enclosure is provided with thermal insulation board, described shell is divided into governor circuit district and drive circuit area, governor circuit in described train suspension controller is arranged in governor circuit district, drive circuit in described train suspension controller is arranged in drive circuit area, governor circuit district and drive circuit area at described shell are respectively arranged with semiconductor heat-dissipating sheet, and described semiconductor heat-dissipating sheet comprises the radiating end that is arranged on housing exterior and the refrigeration end that is arranged on enclosure; The advantage of design is herein, includes the circuit module of different degree of heat radiation, and then be divided into different regions according to train suspension controller, and corresponding heat radiation, avoids transfer of heat, improves radiating effect.
Preferred according to the utility model, in the radiating end arranged outside of described semiconductor heat-dissipating sheet, there is the first fan of heat transmission; The second fan that has heat absorption use in the refrigeration end arranged outside of described semiconductor heat-dissipating sheet; The model of the semiconductor heat-dissipating sheet arranging in governor circuit district is TEC1-12708, and the model of the semiconductor heat-dissipating sheet arranging in drive circuit area is TEC1-12705.The advantage of design is herein, adopts the radiating end forced heat radiation of double radiating conductor film of the first fan of heat transmission, accelerates radiating effect; Adopt the second fan of heat absorption use to accelerate flow-disturbing to the air-flow of enclosure interior, accelerate hot-air convection to the refrigeration end realization heat radiation of semiconductor heat-dissipating sheet; The utility model also adopts the semiconductor heat-dissipating sheet of different model to carry out correspondence heat radiation for governor circuit district and drive circuit area, reaches heat radiation value the highest.The utility model adopts the semiconductor heat-dissipating sheet of constant power to carry out correspondence heat radiation to train suspension controller targetedly, guarantee that heat radiation in time, guarantee to work in element normal temperature operational environment, greatly avoided the danger that causes component wear to be stopped due to high temperature.
Preferred according to the utility model, described thermal insulation board is vacuum insulation panel.Described vacuum insulation panel (VIP plate) is the abbreviation of English Vacuum Insulation Panel; a kind of in vacuum thermal insulating material; to be composited by filling core and vacuum protection top layer; the heat transmission that it avoids cross-ventilation to cause effectively; therefore conductive coefficient can significantly reduce, and is less than 0.035w/ (m
2.k), and not containing any OD material, have environmental protection and energy-efficient characteristic, is state-of-the-art thermal insulation material in the world at present.
Preferred according to the utility model, described vacuum insulation panel comprises vacuum protection top layer, in described vacuum protection top layer, is filled with glass layer, asbestos layer and rock wool layer; The thickness on described vacuum protection top layer: 1-2cm, the thickness of the thickness of described glass layer: 0.5-1cm, described asbestos layer is the thickness of 0.5-1cm, described rock wool layer: 0.3-1cm.The advantage of design, adopts compound multilayer insulation to form vacuum insulation panel herein, blocks the heat flow of governor circuit district and drive circuit area completely, utilizes targetedly semiconductor heat-dissipating sheet to carry out efficiently radiates heat to different circuit regions.
Preferred according to the utility model, the size of described shell: long: 40-60cm, wide: 30-40cm, height: 30-40cm; Below the two ends of described shell are provided with ， radiating area, radiating area, be provided with convective region, in described convective region, be provided with radiator fan, its wind direction blows from bottom to top; In the inside of shell, and be provided with IGBT on the position corresponding with described radiating area, insulated gate bipolar transistor, is provided with thermal insulation board in the surrounding of described IGBT and on perpendicular to shell one end sidewall.The advantage of design is herein, according to the shell of the design fixed dimension of suspension controller, realize effective convection current of internal heat air, simultaneously to heat dissipation element IGBT adequate closure, unidirectionally by radiating area, dispel the heat, effectively avoided IGBT portion's heat radiation in the enclosure, only the radiating area, two ends by shell sheds in time.
Preferred according to the utility model, in described radiating area, be provided with radiating fin, the distance of described adjacent radiating fin is: 0.5-0.8cm, the height of described radiating fin is: 3-4cm.The advantage herein designing, size dimension correspondence for train suspension controller described in the utility model has designed shell and radiating fin, known through a large amount of experiments, after its conjunction with semiconductors fin of the radiating fin of this dimensional structure, its radiating effect is optimum.
Preferred according to the utility model, in described radiating area, be provided with semi-cylindrical hill, its radius is 1-2cm, the spacing distance of described adjacent semi-cylindrical hill is 0.5-1cm.The advantage of design is herein, by increasing the surface area of described shell, increases the heat radiation degree of shell.
Preferred according to the utility model, the material of described shell is magnadure or carbon fiber, when the material of described shell is carbon fiber, is provided with bottom line ground connection on described shell.
Preferred according to the utility model, on described shell, be provided with sunk area, described sunk area is divided into governor circuit district and drive circuit area by described shell, the model of the semiconductor heat-dissipating sheet arranging in governor circuit district is TEC1-12708, and the model of the semiconductor heat-dissipating sheet arranging in drive circuit area is TEC1-12705.The advantage of design is herein, by shell outer setting sunk area, for difference heat radiation situation, carries out outside emergency treatment, without opening shell, can realize real-time efficiently radiates heat processing, avoids security incident to occur.
Preferred according to the utility model, thermal insulation board or diversion fan are installed in described sunk area.The advantage of design is herein, heat radiation for governor circuit in train suspension controller and drive circuit is different, the circuit of whole controller is separated, dispel the heat targetedly: in the time of the normal heat radiation of described heat dissipating plate for semiconductor, described thermal insulation board is arranged in described sunk area, to described governor circuit and drive circuit are separated outside housing; When semiconductor heat-dissipating sheet breaks down, described diversion fan is arranged in described sunk area, to dispel the heat as early as possible, increase the fault radiating effect in period.
Advantage of the present utility model is:
1, the utility model is for the not good defect of radiating effect in the technical field of train suspension controller radiating and cooling, the utility model adopts radiating effect semiconductor heat-dissipating sheet higher, that be applicable to less space heat elimination to dispel the heat to train suspension controller, and its radiating efficiency improves more than 80%.
2, the utility model adopts the semiconductor heat-dissipating sheet of constant power to carry out correspondence heat radiation to train suspension controller targetedly, guarantee that heat radiation in time, guarantee to work in element normal temperature operational environment, greatly avoided the danger that causes component wear to be stopped due to high temperature.
3, the utility model includes the circuit module of different degree of heat radiation according to train suspension controller, and then is divided into different regions, and corresponding heat radiation, avoids transfer of heat, improves radiating effect.
4, the utility model adopts compound multilayer insulation to form vacuum insulation panel, blocks the heat flow of governor circuit district and drive circuit area completely, utilizes targetedly semiconductor heat-dissipating sheet to carry out efficiently radiates heat to different circuit regions.
5, the size dimension correspondence for train suspension controller described in the utility model has designed shell and radiating fin, known through a large amount of experiments, and after its conjunction with semiconductors fin of the radiating fin of this dimensional structure, its radiating effect is optimum.
6, the utility model, by shell outer setting sunk area, carries out outside emergency treatment for difference heat radiation situation, without opening shell, can realize real-time efficiently radiates heat processing, avoids security incident to occur.
Accompanying drawing explanation:
Fig. 1 is the structural representation of the utility model embodiment 1;
Fig. 2 is the structural representation of thermal insulation board described in the utility model;
Fig. 3 is the structural representation of the utility model embodiment 2;
Fig. 4 is the structural representation of the utility model embodiment 3;
Fig. 5 is the structural representation of the utility model embodiment 7;
Fig. 6 is the structural representation of diversion fan;
Fig. 7 is that diversion fan is arranged on the partial schematic diagram in sunk area;
Shell in the drawings, 1; 2, the radiating end of semiconductor heat-dissipating sheet; 3, fastening bolt; 4, thermal insulation board; 5, vacuum protection top layer, 6, glass layer; 7, asbestos layer; 8, rock wool layer; 9, radiating area; 10, convective region; 11, radiator fan; 12, radiating fin; 13, fixing diversion fan support; 14, sunk area; 15, diversion fan; 16, the flabellum of diversion fan; 17, the motor of diversion fan; 18, the first fan.
Embodiment
Below in conjunction with embodiment and Figure of description, the utility model is described in detail, but is not limited to this.
As shown in Figure 1.
A kind of MagLev trainset train suspension controller heat abstractor, comprise the shell 1 that is arranged on train suspension controller outside, semiconductor heat-dissipating sheet is installed on described shell 1, and described semiconductor heat-dissipating sheet comprises the radiating end 2 that is arranged on housing exterior and the refrigeration end that is arranged on enclosure.The first fan 18 that has heat transmission in radiating end 2 arranged outside of described semiconductor heat-dissipating sheet.
As shown in Figure 2,3.
A kind of MagLev trainset train suspension controller heat abstractor as described in Example 1, its difference is, described shell 1 inside is provided with thermal insulation board 4, described shell 1 is divided into governor circuit district and drive circuit area, governor circuit in described train suspension controller is arranged in governor circuit district, drive circuit in described train suspension controller is arranged in drive circuit area, governor circuit district and drive circuit area at described shell 1 are respectively arranged with semiconductor heat-dissipating sheet, described semiconductor heat-dissipating sheet comprises the radiating end that is arranged on housing exterior and the refrigeration end that is arranged on enclosure, the first fan 18 that has heat transmission in radiating end 2 arranged outside of described semiconductor heat-dissipating sheet, the second fan that has heat absorption use in the refrigeration end arranged outside of described semiconductor heat-dissipating sheet, the model of the semiconductor heat-dissipating sheet arranging in governor circuit district is TEC1-12705, and the model of the semiconductor heat-dissipating sheet arranging in drive circuit area is TEC1-12708.
Described thermal insulation board 4 is vacuum insulation panel.Described vacuum insulation panel comprises vacuum protection top layer 5, is filled with glass layer 6, asbestos layer 7 and rock wool layer 8 in described vacuum protection top layer 5; The thickness on described vacuum protection top layer: 1-2cm, the thickness of the thickness of described glass layer: 0.5-1cm, described asbestos layer is the thickness of 0.5-1cm, described rock wool layer: 0.3-1cm.The size of described shell 1: long: 40-60cm, wide: 30-40cm, height: 30-40cm; At the two ends of described shell 1, be provided with radiating area 9, be provided with convective region 10 below radiating area 9, in described convective region 10, be provided with radiator fan 11, its wind direction blows from bottom to top; In the inside of shell 1, and be provided with IGBT on the position corresponding with described radiating area, insulated gate bipolar transistor, is provided with thermal insulation board in the surrounding of described IGBT and on perpendicular to shell one end sidewall.
A MagLev trainset train suspension controller heat abstractor as described in Example 2, its difference is, in described radiating area 9, is provided with radiating fin 12, the distance of described adjacent radiating fin 12 is: 0.5-0.8cm, the height of described radiating fin is: 1-2cm.
A MagLev trainset train suspension controller heat abstractor as described in Example 2, its difference is, in described radiating area, is provided with semi-cylindrical hill, and its radius is 1-2cm, and the distance of described adjacent semi-cylindrical hill is 0.5-1cm.
Embodiment 5,
A MagLev trainset train suspension controller heat abstractor as described in Example 1, its difference is, the material of described shell is magnadure.
Embodiment 6,
A MagLev trainset train suspension controller heat abstractor as described in Example 1, its difference is, the material of described shell is carbon fiber, is provided with bottom line ground connection on described shell.
Embodiment 7,
A kind of MagLev trainset train suspension controller heat abstractor as described in Example 1, its difference is, on described shell, be provided with sunk area, described sunk area is divided into governor circuit district and drive circuit area by described shell, the model of the semiconductor heat-dissipating sheet arranging in governor circuit district is TEC1-12705, and the model of the semiconductor heat-dissipating sheet arranging in drive circuit area is TEC1-12708.
Thermal insulation board or diversion fan are installed in described sunk area.The advantage of design is herein, heat radiation for governor circuit in train suspension controller and drive circuit is different, the circuit of whole controller is separated, dispel the heat targetedly: in the time of the normal heat radiation of described heat dissipating plate for semiconductor, described thermal insulation board is arranged in described sunk area, to described governor circuit and drive circuit are separated outside housing; When semiconductor heat-dissipating sheet breaks down, described diversion fan is arranged in described sunk area, to dispel the heat as early as possible, increase the fault radiating effect in period.
A method of work for MagLev trainset train suspension controller heat abstractor as described in embodiment 1-8, comprises that step is as follows:
(1) install: the shell 1 that inside is provided with to semiconductor heat-dissipating sheet is arranged on described train suspension controller;
(2) power-on, when interior temperature >=50 of described shell 1 ℃, semiconductor heat-dissipating sheet unlatching work, otherwise semiconductor heat-dissipating sheet quits work.
In described step (2), described in the heat that sheds along the radiating area arranging on shell 1, dispel the heat; When needs further dispel the heat to shell 1, open the radiator fan 11 that convective region arranges, forced heat radiation is carried out in radiating area 9.
In step (1), in described shell, thermal insulation board is installed, described shell is divided into governor circuit district and drive circuit area, and the governor circuit in described train suspension controller is arranged in governor circuit district, and the drive circuit in described train suspension controller is arranged in drive circuit area.
While being provided with sunk area on described shell, in described step (1), described sunk area is divided into governor circuit district and drive circuit area by described shell; Thermal insulation board or diversion fan are installed in described sunk area: in the normal heat radiation of described heat dissipating plate for semiconductor, described thermal insulation board is arranged in described sunk area, to described governor circuit and drive circuit are separated outside housing; When semiconductor heat-dissipating sheet breaks down, described diversion fan is arranged in described sunk area, to dispel the heat as early as possible, increase the fault radiating effect in period.
Claims (8)
1. a MagLev trainset train suspension controller heat abstractor, comprise the shell that is arranged on train suspension controller outside, it is characterized in that, semiconductor heat-dissipating sheet is installed on described shell, and described semiconductor heat-dissipating sheet comprises the radiating end that is arranged on housing exterior and the refrigeration end that is arranged on enclosure.
2. a kind of MagLev trainset train suspension controller heat abstractor according to claim 1, it is characterized in that, described enclosure is provided with thermal insulation board, described shell is divided into governor circuit district and drive circuit area, governor circuit in described train suspension controller is arranged in governor circuit district, drive circuit in described train suspension controller is arranged in drive circuit area, governor circuit district and drive circuit area at described shell are respectively arranged with semiconductor heat-dissipating sheet, described semiconductor heat-dissipating sheet comprises the radiating end that is arranged on housing exterior and the refrigeration end that is arranged on enclosure.
3. a kind of MagLev trainset train suspension controller heat abstractor according to claim 1, is characterized in that in the radiating end arranged outside of described semiconductor heat-dissipating sheet, there is the first fan of heat transmission; The second fan that has heat absorption use in the refrigeration end arranged outside of described semiconductor heat-dissipating sheet; The model of the semiconductor heat-dissipating sheet arranging in governor circuit district is TEC1-12708, and the model of the semiconductor heat-dissipating sheet arranging in drive circuit area is TEC1-12705.
4. a kind of MagLev trainset train suspension controller heat abstractor according to claim 2, is characterized in that, described thermal insulation board is vacuum insulation panel; Described vacuum insulation panel comprises vacuum protection top layer, in described vacuum protection top layer, is filled with glass layer, asbestos layer and rock wool layer; The thickness on described vacuum protection top layer: 1-2cm, the thickness of the thickness of described glass layer: 0.5-1cm, described asbestos layer is the thickness of 0.5-1cm, described rock wool layer: 0.3-1cm.
5. a kind of MagLev trainset train suspension controller heat abstractor according to claim 1, is characterized in that the size of described shell: long: 40-60cm, wide: 30-40cm, height: 30-40cm; Below the two ends of described shell are provided with ， radiating area, radiating area, be provided with convective region, in described convective region, be provided with radiator fan, its wind direction blows from bottom to top; In the inside of shell, and be provided with IGBT on the position corresponding with described radiating area, insulated gate bipolar transistor, is provided with thermal insulation board in the surrounding of described IGBT and on perpendicular to shell one end sidewall.
6. a kind of MagLev trainset train suspension controller heat abstractor according to claim 5, is characterized in that, in described radiating area, be provided with radiating fin, the distance of described adjacent radiating fin is: 0.5-0.8cm, and the height of described radiating fin is: 3-4cm; In described radiating area, be provided with semi-cylindrical hill, its radius is 1-2cm, and the spacing distance of described adjacent semi-cylindrical hill is 0.5-1cm.
7. a kind of MagLev trainset train suspension controller heat abstractor according to claim 1, is characterized in that, the material of described shell is magnadure or carbon fiber, when the material of described shell is carbon fiber, is provided with bottom line ground connection on described shell.
8. a kind of MagLev trainset train suspension controller heat abstractor according to claim 1, it is characterized in that, on described shell, be provided with sunk area, described sunk area is divided into governor circuit district and drive circuit area by described shell, the model of the semiconductor heat-dissipating sheet arranging in governor circuit district is TEC1-12708, and the model of the semiconductor heat-dissipating sheet arranging in drive circuit area is TEC1-12705; Thermal insulation board or diversion fan are installed in described sunk area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320607763.3U CN203467114U (en) | 2013-09-27 | 2013-09-27 | Heat-dissipation device for levitation controller of medium-low-speed magnetically-levitated train |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320607763.3U CN203467114U (en) | 2013-09-27 | 2013-09-27 | Heat-dissipation device for levitation controller of medium-low-speed magnetically-levitated train |
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| Publication Number | Publication Date |
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| CN203467114U true CN203467114U (en) | 2014-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320607763.3U Expired - Lifetime CN203467114U (en) | 2013-09-27 | 2013-09-27 | Heat-dissipation device for levitation controller of medium-low-speed magnetically-levitated train |
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| CN (1) | CN203467114U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533810A (en) * | 2013-09-27 | 2014-01-22 | 山东和顺电气有限公司 | Radiating device of suspension controller of aerotrain with medium-low speed and working method thereof |
| CN105677947A (en) * | 2015-12-31 | 2016-06-15 | 清华大学苏州汽车研究院（吴江） | Method for testing heat dissipation of heat sink of electric vehicle motor controller |
-
2013
- 2013-09-27 CN CN201320607763.3U patent/CN203467114U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533810A (en) * | 2013-09-27 | 2014-01-22 | 山东和顺电气有限公司 | Radiating device of suspension controller of aerotrain with medium-low speed and working method thereof |
| CN103533810B (en) * | 2013-09-27 | 2017-01-25 | 山东和顺电气有限公司 | Radiating device of suspension controller of aerotrain with medium-low speed and working method thereof |
| CN105677947A (en) * | 2015-12-31 | 2016-06-15 | 清华大学苏州汽车研究院（吴江） | Method for testing heat dissipation of heat sink of electric vehicle motor controller |
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