CN203466232U - Lead storage battery - Google Patents
Lead storage battery Download PDFInfo
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- CN203466232U CN203466232U CN201320615491.1U CN201320615491U CN203466232U CN 203466232 U CN203466232 U CN 203466232U CN 201320615491 U CN201320615491 U CN 201320615491U CN 203466232 U CN203466232 U CN 203466232U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model provides a lead storage battery. The lead storage battery is provided with an electrical tank, a middle cover (5), a pole plate group and an end pole pillar (4), wherein the end pole pillar (4) is inserted into a pipe-shaped lead sleeve (6) which is imbedded into the middle cover (5) in advance in a penetrating manner, and the end pole pillar (4) and the pipe-shaped lead sleeve (6) are welded into a whole; at least one part of the upper surface of the middle cover (5), the upper end surface of the end pole pillar (4) and the upper end surface of the lead sleeve (6) are aligned into a plane, the end pole pillar (4) and an electrode terminal (7) are welded into a whole, a resin layer (9) is formed on at least one part of the plane in a manner of covering a gap (8) existing in an interface between the lead sleeve (6) and the middle cover (5), and the thickness of the resin layer (9) on the plane is 1.0-3.0mm. The lead storage battery provided by the utility model has the advantages that an acid climbing phenomenon in the gap (8) is effectively avoided, the liquid leakage prevention property is good, and the vibration resistance and capacity characteristic are good.
Description
Technical field
The utility model relates to lead accumulator, specifically, relates to vibration resistance and leakproof fluidity is good, capacity characteristic is good lead accumulator.
Background technology
Lead accumulator is not only for starting power supply, mains lighting supply and the stand-by power supply of vehicle, also be widely used in main power source purposes, be used as the electrical source of power of independent power supply such as electric automobile, electri forklift, electric pallet truck, electric motor coach, electric bicycle, battery-operated motor cycle, Segway Human Transporter, small-sized electric vehicle using motor, golf cart, electric locomotive etc. for charging/discharging apparatus, the apparatus for storing electrical energy such as battery for solar energy.In these purposes, lead accumulator electric current when starting is large, and in use, vehicle is in road, countryside operation, jolt very many, the vibration that two electrode terminal positions are subject to greatly and very frequent, so need to consider the vibration resistance at electrode terminal position and the liquid-leakage preventing characteristic of lead accumulator of lead accumulator.Meanwhile, also require to reduce the maintaining of lead accumulator, and require lead accumulator to there is longer useful life and higher capacity.
In view of the structure of the coupling part of middle cover, pole and electrode terminal and vibration resistance that performance affects lead accumulator greatly and leakproof fluidity etc., so various research is being carried out in this coupling part always.
Japanese Patent Laid-Open 2010-177089 discloses a kind of lead accumulator, and it can not damage the adhesive strength that improves adhering part in the situation that attractive in appearance.This lead accumulator has the lid being formed by acrylic resin of difficult cementability etc., to with plumbous cover, keep the portion of terminal perforation that pole forms to be arranged in the outer rib of this lid, between this portion of terminal and outer rib, with adhesive, fill and be cured, wherein the inner peripheral surface of outer rib and the distance that is arranged between the protuberance of upper end of plumbous cover are set as to 3.0mm～5.0mm, so that in the filling by adhesive with solidify to carry out can carry out equably flame treatment or the Corona discharge Treatment of the inner peripheral surface enforcement of outer rib before terminal sealing, thereby do not damaging the adhesive strength that improves adhering part in the situation that attractive in appearance.The longitudinal section of the hermetically-sealed construction of the portion of terminal of above-mentioned lead accumulator has listed as Fig. 4 in this application.
In China utility model CN202259476U, a kind of lead-acid storage battery terminal sealing structure is disclosed, it comprises upper cover, lead bushing and the primer guard ring being connected by screw thread with above-mentioned upper cover, wherein cover on above-mentioned and be provided with the annular boss that is positioned at the outside of above-mentioned screw thread and exceeds the upper surface of above-mentioned upper cover, top at this boss is provided with groove, in this groove, packs O-ring seals into.Above-mentioned boss exceeds 1.5～2.5mm than the upper surface of above-mentioned upper cover, at the corresponding site of above-mentioned primer guard ring, is also provided with groove.By above-mentioned terminal sealing structure, can stop that the acid solution in production process leaks into screw connection point.Above-mentioned terminal sealing structure schematic diagram has listed as Fig. 5 in this application.
But the structure in the lead accumulator of these prior aries, the coupling part of middle cover, pole and electrode terminal being sealed is when being subject to battery vibration or battery and being sidelong, easily destroyed, thereby cannot guarantee not occur leakage.And these structures also can be sacrificed the characteristic of the aspects such as the volumetric properties of battery and useful life.
Utility model content
The utility model completes in view of existing the problems referred to above in prior art, its object be to provide vibration resistance and leakproof fluidity good, and the good lead accumulator of capacity characteristic.
The utility model is by the hermetically-sealed construction that is connected and fixed structure and lead accumulator of the middle cover of lead accumulator, end pole and electrode terminal is carried out to particular design, thereby solved the problems referred to above.
That is, the utility model relates to following content.
(1), a kind of lead accumulator, it is characterized in that, it has electric groove, middle cover, pole plate group and end pole, the mode that above-mentioned end pole is inserted into run through imbed in advance in the tubular plumbous cover in above-mentioned middle cover and above-mentioned end pole and above-mentioned tubular plumbous cover integrally welded, at least a portion of the upper surface of above-mentioned middle cover, the upper surface of the upper surface of above-mentioned end pole and above-mentioned plumbous cover is aligned to a plane, above-mentioned end pole and electrode terminal are integrally welded, the mode in the gap existing with the interface covering between above-mentioned plumbous cover and above-mentioned middle cover at least a portion of above-mentioned plane is formed with resin bed, the thickness of above-mentioned resin bed in above-mentioned plane is 1.0～3.0mm.
(2), according to the lead accumulator above-mentioned (1) Suo Shu, it is characterized in that, the above-mentioned thickness of above-mentioned resin bed is 1.5～2.5mm.
(3), according to the lead accumulator above-mentioned (1) or (2) Suo Shu, it is characterized in that, above-mentioned resin bed forms after integrally welded at above-mentioned end pole and above-mentioned electrode terminal.
(4), according to the lead accumulator above-mentioned (1) or (2) Suo Shu, it is characterized in that, above-mentioned resin bed is formed on by above-mentioned plane, above-mentioned electrode terminal, above-mentioned gap and is configured in the space that the enclosing structure on the upper surface of above-mentioned middle cover surrounds.
(5), according to the lead accumulator above-mentioned (4) Suo Shu, it is characterized in that, the height of above-mentioned enclosing structure is not less than the thickness of above-mentioned resin bed.
(6), according to the lead accumulator above-mentioned (4) Suo Shu, it is characterized in that, above-mentioned enclosing structure is the rib being arranged on the upper surface of above-mentioned middle cover.
(7), according to the lead accumulator above-mentioned (4) Suo Shu, it is characterized in that, above-mentioned enclosing structure is by poor formation of section of the upper surface of above-mentioned middle cover itself.
(8), according to the lead accumulator above-mentioned (4) Suo Shu, it is characterized in that, rounded or square and be distributed in continuously or intermittently on the upper surface of above-mentioned middle cover centered by the part that above-mentioned enclosing structure intersects by the upper surface of above-mentioned end pole and above-mentioned middle cover.
(9), according to the lead accumulator above-mentioned (1) or (2) Suo Shu, it is characterized in that, above-mentioned resin bed is light-cured resin adhesive phase, hot-melt adhesive layer or epoxy resin layer.
(10), according to the lead accumulator above-mentioned (1) or (2) Suo Shu, it is characterized in that, above-mentioned resin bed is fluid sealant bonding die.
(11), according to the lead accumulator above-mentioned (10) Suo Shu, it is characterized in that the adhesive phase that above-mentioned fluid sealant bonding die comprises substrate and forms on this substrate.
(12), according to the lead accumulator above-mentioned (11) Suo Shu, it is characterized in that, aforesaid substrate is polypropylene, polyethylene, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-butadiene-styrene copolymer or PETG sheet material.
(13), according to the lead accumulator above-mentioned (11) Suo Shu, it is characterized in that, above-mentioned adhesive phase is made by acrylate.
(14), according to the lead accumulator above-mentioned (11) Suo Shu, it is characterized in that, the ratio of the thickness of aforesaid substrate and above-mentioned adhesive phase is 6:1～9:1.
(15), according to the lead accumulator above-mentioned (11) Suo Shu, it is characterized in that, the thickness of aforesaid substrate is 0.8～2.7mm.
The effect of utility model
According to the utility model, at least a portion of upper surface by above-mentioned middle cover is, the upper surface of the upper surface of above-mentioned end pole and above-mentioned plumbous cover is aligned to a plane, the mode in the gap existing with the interface covering between above-mentioned plumbous cover and above-mentioned middle cover at least a portion of above-mentioned plane is formed with resin bed, the thickness of above-mentioned resin bed in above-mentioned plane is 1.0～3.0mm, can effectively avoid thus occurring climbing sour phenomenon at place, above-mentioned gap, make leakproof fluidity good, and the vibration resistance of lead accumulator and capacity characteristic good.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of lead accumulator of the present utility model.
Fig. 2 is the schematic diagram of an execution mode of enclosing structure on the upper surface of the middle cover in lead accumulator of the present utility model and resin bed configuration.
Fig. 3 is the schematic diagram of another execution mode of enclosing structure on the upper surface of middle cover of lead accumulator of the present utility model and resin bed configuration.
Fig. 4 is the schematic diagram of the lead accumulator of Comparative Example F-2.
Fig. 5 is the schematic diagram of the lead accumulator of Comparative Example F-3.
Embodiment
Below, with reference to accompanying drawing, the utility model is described.In the accompanying drawings, for the purpose of simplifying the description, to thering are the constitutive requirements of identical in fact function, by same reference symbol, represent.In addition, the utility model is not limited to following execution mode.
Fig. 1 is the schematic diagram of lead accumulator of the present utility model.As shown in Figure 1, above-mentioned lead accumulator has electric groove, middle cover, pole plate group and end pole, the mode that above-mentioned end pole is inserted into run through imbed in advance in the tubular plumbous cover in above-mentioned middle cover and above-mentioned end pole and above-mentioned tubular plumbous cover integrally welded, at least a portion of the upper surface of above-mentioned middle cover, the upper surface of the upper surface of above-mentioned end pole and above-mentioned plumbous cover is aligned to a plane, above-mentioned end pole and electrode terminal are integrally welded, the mode in the gap existing with the interface covering between above-mentioned plumbous cover and above-mentioned middle cover at least a portion of above-mentioned plane is formed with resin bed, the thickness of above-mentioned resin bed in above-mentioned plane is 1.0～3.0mm.
In above-mentioned lead accumulator, one end of above-mentioned end pole is inserted in above-mentioned tubular plumbous cover, the other end of above-mentioned end pole and pole plate group's bus-bar and lug carry out side welding and form welding body, in the above-mentioned tubular plumbous accommodation section of overlapping on the lower surface that is normally embedded in advance above-mentioned middle cover.
In the utility model, by the hermetically-sealed construction that is connected and fixed structure and lead accumulator of the middle cover of lead accumulator, end pole and electrode terminal is carried out to particular design, thereby effectively avoid occurring climbing sour phenomenon at place, above-mentioned gap, leakproof fluidity is good, and make the vibration resistance of lead accumulator and capacity characteristic good.
In above-mentioned lead accumulator, the above-mentioned gap existing in above-mentioned plumbous cover and interface between above-mentioned middle cover is mainly to be produced by following reason: when above-mentioned end pole and above-mentioned plumbous overlapping when integrally welded can be generated heat, thereby the interface (border) that causes above-mentioned plumbous cover to contact with above-mentioned middle cover is heated, and after cooling, on this interface (border), locates just to have produced gap.In addition, at above-mentioned end pole and above-mentioned electrode terminal, can generate heat when integrally welded, and at this moment at least a portion of the upper surface of above-mentioned plumbous cover also may be welded and generate heat with above-mentioned electrode terminal, thereby the interface (border) that causes above-mentioned plumbous cover to contact with above-mentioned middle cover is heated, and after cooling, on this interface (border), locates also may produce gap.Moreover lead accumulator above-mentioned lead when energising and use overlaps and above-mentioned end pole also can generate heat, thereby cause the interface between above-mentioned plumbous cover and above-mentioned middle cover to be heated, and also may produce gap after cooling in this interface.The width in above-mentioned gap is less than 0.1mm conventionally.
For the above-mentioned gap that the interface between above-mentioned plumbous cover and above-mentioned middle cover is existed covers, need at least in the upper surface of above-mentioned middle cover and the upper surface of above-mentioned plumbous cover at least a portion separately, to form above-mentioned resin bed.That is to say, the mode in the so-called gap existing with the interface covering between above-mentioned plumbous cover and above-mentioned middle cover at least a portion of above-mentioned plane is formed with resin bed, refers at least and to cover the mode in above-mentioned gap, be formed with above-mentioned resin bed in the upper surface of middle cover and the upper surface of plumbous cover at least a portion separately.
The thickness of above-mentioned resin bed in above-mentioned plane be set as 1.0～3.0mm be because: when above-mentioned thickness is during lower than 1.0mm, resin bed is excessively thin, easily there is inhomogeneous part or have local defect in resin bed, thereby easily occurs the phenomenon of vibration resistance and leakproof fluidity variation.When above-mentioned thickness is during higher than 3.0mm, resin bed is blocked up, pliability variation, and vibration resistance variation, thus when battery is subject to extraneous vibration or in transportation, resin bed easily breaks, and easily there is the phenomenon of vibration resistance and leakproof fluidity variation in result.And, because the lead accumulator of regulation model and the size of electrode terminal are all specific, when above-mentioned resin bed be the thickness apparently higher than 3.0mm, will inevitably cause the height minimizing of pole plate, thereby have influence on battery capacity.The above-mentioned thickness of above-mentioned resin bed is preferably 1.5～2.5mm.
As mentioned above, due to above-mentioned gap mainly above-mentioned end pole and above-mentioned plumbous cover integrally welded after and above-mentioned end pole integrally welded with above-mentioned electrode terminal after formation, so above-mentioned resin bed above-mentioned end pole and above-mentioned electrode terminal integrally welded after formation.
In addition, it should be noted that, the upper surface that the welding of above-mentioned end pole and above-mentioned electrode terminal also can be by above-mentioned plumbous cover and above-mentioned electrode terminal weld together and indirectly carry out or above-mentioned end pole and the above-mentioned plumbous upper surface overlapping all weld together with above-mentioned electrode terminal.
Above-mentioned resin bed is preferably formed in by the upper surface of the upper surface of at least a portion of the upper surface of above-mentioned middle cover, above-mentioned end pole, above-mentioned plumbous cover (as mentioned above, above-mentioned three aligns and forms above-mentioned plane), above-mentioned electrode terminal, above-mentioned gap and is configured in the space that the enclosing structure on the upper surface of above-mentioned middle cover surrounds.Above-mentioned resin bed is thin rete, for tabular, its width is the width that is at least enough to cover above-mentioned gap, and can to above-mentioned width, regulate according to the requirement of tolerance vibration and leakproof fluidity, thereby make above-mentioned resin bed can fill up above-mentioned space, also can not fill up above-mentioned space, Here it is refers to be formed with resin bed at least a portion of above-mentioned plane.
Above-mentioned enclosing structure is exactly the structure forming centered by the part that intersects of the upper surface by above-mentioned end pole and above-mentioned middle cover, for example, can be around above-mentioned Central Symmetry ground or asymmetricly and continuously or the structure forming intermittently.The distance at above-mentioned enclosing structure and above-mentioned center decides according to the size of end pole, plumbous cover and/or electrode terminal, is generally 10～25mm.
Above-mentioned enclosing structure can be for being arranged on the rib on the upper surface of middle cover.The shape such as rounded or square and being distributed in continuously or intermittently on the upper surface of above-mentioned middle cover centered by the part that this rib normally intersects by the upper surface of above-mentioned end pole and above-mentioned middle cover.
Above-mentioned enclosing structure also can be by the section of the upper surface of middle cover itself poor formation.What namely make the upper surface of middle cover or whole middle cover locates to make the poor shape of the section of having in a distance with above-mentioned center, and this section of difference itself just becomes above-mentioned enclosing structure.The shape such as rounded or square and being distributed in continuously or intermittently on the upper surface of above-mentioned middle cover centered by the part that this section of difference normally intersects by the upper surface of above-mentioned end pole and above-mentioned middle cover.
The effect of above-mentioned enclosing structure is exactly that the setting position of above-mentioned resin bed is retrained, so the height of above-mentioned enclosing structure can not be lower than the thickness of above-mentioned resin bed.As mentioned above, because the thickness of above-mentioned resin bed is 1.0～3.0mm, so the height of above-mentioned enclosing structure is suitably 3.0～5.0mm.
Above-mentioned resin bed is preferably light-cured resin adhesive phase or hot-melt adhesive layer, this is because their curing time is short and curing cost is low, and other common adhesive such as epobond epoxyn etc. are more difficult, solidify, in order to be cured, need to increase production line or drying oven etc. is set, and solidifying and need to take a long time, easily there is drippage or flow in adhesive in curing process, it is inhomogeneous that thickness easily becomes, thereby affect sealing effectiveness and adhesive effect.
Light-cured resin adhesive or hot-melt adhesive can not need to use drying oven, irradiation machine or thermal radiation machine are set in the gap of production line and can realize at short notice curing.And, because curing time is short, so can suppress adhesive, there is drippage or flow, can make equably rete.
Light-cured resin adhesive applicable in the utility model is not particularly limited, as long as can be not to be cured person at short notice by light such as irradiation ultraviolet radiations, for example, it can be the adhesive that acrylic ester monomer oligomer adhesive or cationic curing class are main and epoxy resin is used in combination.
Light-cured resin adhesive is generally liquid, and it is, by illuminated light, photochemical reaction occurs, thus from liquid become curing.Therefore, in order to form resin bed of the present utility model, first liquid light-cured resin adhesive is coated with and is located at least a portion by the upper surface of above-mentioned middle cover, the upper surface of above-mentioned end pole, the upper surface of above-mentioned plumbous cover (as mentioned above, above-mentioned three aligns and forms above-mentioned plane), above-mentioned electrode terminal, above-mentioned gap and being configured in the space that the enclosing structure on the upper surface of above-mentioned middle cover surrounds, pass through the natural flow of light-cured resin adhesive self and be evenly distributed in above-mentioned space, then use irradiation machine to above-mentioned space internal radiation light, above-mentioned light-cured resin adhesive is solidified to form resin bed.
Hot-melt adhesive applicable in the utility model is not particularly limited, as long as can be not to be cured person at short notice by heat such as irradiation energy lines, this hot-melt adhesive for example can list: TPO and improved polyalkene class hot-melt adhesive; Ethene and copolymer analog hot-melt adhesive thereof, for example EVA type hot-melt adhesive; Polyamide-based hot-melt adhesive; Polyesters hot-melt adhesive; Styrene and block copolymer class hot melt hot-melt adhesive thereof; Polyurethanes hot-melt adhesive.
Hot-melt adhesive is also commonly called as PUR, is solid at normal temperatures, by heating and melting, becomes liquid, then by cooling curing, realizes bonding.In order to form resin bed of the present utility model, first the hot-melt adhesive of the solid shape of preliminary dimension and shape is placed on at least a portion by the upper surface of above-mentioned middle cover, the upper surface of above-mentioned end pole, the upper surface of above-mentioned plumbous cover (as mentioned above, above-mentioned three aligns and forms above-mentioned plane), above-mentioned electrode terminal, above-mentioned gap and being configured in the space that the enclosing structure on the upper surface of above-mentioned middle cover surrounds, then use thermal radiation machine to above-mentioned space internal radiation thermal energy line, above-mentioned adhesive melted by heating and become liquid, then by cooling curing, form resin bed.
In lead accumulator of the present utility model, above-mentioned resin bed can be also by the adhesive resin beyond light-cured resin adhesive or hot-melt adhesive for example epoxy resin form.But these resin beds need to adopt special-purpose drying oven or curing oven just can complete dry within the longer time and solidify, and in dry and curing process, likely there is drippage or flow, thereby likely can not make equably rete.
In addition, the size that need to consider gap is selected the adhesive of suitable viscosity, so that above-mentioned adhesive, when above-mentioned gap sealing is good, can not flow in above-mentioned gap too much.
In lead accumulator of the present utility model, above-mentioned resin bed can be also fluid sealant bonding die.The adhesive phase that above-mentioned fluid sealant bonding die conventionally comprises substrate and forms on this substrate.Aforesaid substrate is polypropylene (PP), polyethylene (PE), acrylonitrile-butadiene-styrene copolymer (ABS), acrylonitrile-butadiene-styrene copolymer (AS) or PETG (PET) sheet material preferably.Above-mentioned adhesive phase is preferably made by acrylate.
The ratio of the aforesaid substrate in above-mentioned sealing adhesive sheet and the thickness of above-mentioned adhesive phase is approximately 6:1～9:1, is preferably 6.5:1～7.5:1 left and right.The thickness of aforesaid substrate is generally 0.8～2.7mm.
Above-mentioned fluid sealant bonding die normally by directly pasting by least a portion of the upper surface of above-mentioned middle cover, the upper surface of the upper surface of above-mentioned end pole, above-mentioned plumbous cover (as mentioned above, above-mentioned three aligns and forms above-mentioned plane), above-mentioned electrode terminal, above-mentioned gap and be configured in the space that the enclosing structure on the upper surface of above-mentioned middle cover surrounds.Above-mentioned adhesive phase in above-mentioned sealing adhesive sheet can be thermoplastic, can be also heat cured, but preferably heat cured, to can guarantee sealing and adhesive effect.Thermosetting adhesive layer is cured conventionally in the following way: after in fluid sealant bonding die pastes above-mentioned space, above-mentioned thermosetting adhesive layer solidifies voluntarily, or before stickup, above-mentioned adhesive phase is sprayed curing agent and/or heats pressurization, then, after fluid sealant bonding die being pasted in above-mentioned space, above-mentioned thermosetting adhesive layer occurs to solidify.
In lead accumulator of the present utility model, the mode of the enclosing structure on the upper surface of middle cover and resin bed configuration can be following several situations: (1) above-mentioned enclosing structure is the above-mentioned rib being arranged on the upper surface of middle cover, and above-mentioned resin bed is for example epoxy resin layer of light-cured resin adhesive phase, hot-melt adhesive layer or other resin bed; (2) above-mentioned enclosing structure is the above-mentioned rib being arranged on the upper surface of middle cover, and above-mentioned resin bed is above-mentioned fluid sealant bonding die; (3) above-mentioned enclosing structure is that above-mentioned resin bed is for example epoxy resin layer of light-cured resin adhesive phase, hot-melt adhesive layer or other resin bed by poor formation of section of the upper surface of middle cover itself; (4) above-mentioned enclosing structure is that above-mentioned resin bed is above-mentioned fluid sealant bonding die by poor formation of section of the upper surface of middle cover itself.
When above-mentioned enclosing structure is rib and while being section difference, in the situation that other condition is all identical, the effect of gained there is no difference.
Fig. 2 is the schematic diagram of an execution mode of enclosing structure on the upper surface of the middle cover in lead accumulator of the present utility model and resin bed configuration.
Fig. 3 is the schematic diagram of another execution mode of enclosing structure on the upper surface of middle cover of lead accumulator of the present utility model and resin bed configuration.
Based on each inscape in above-mentioned lead accumulator is selected, the utility model is implemented, obtained following execution mode.
(execution mode 1)
The lead accumulator of present embodiment as shown in Figures 2 and 3, end pole 4 mode that is inserted into run through is imbedded in the tubular plumbous cover 6 in the accommodation section 3 on the lower surface of middle cover 5 in advance and above-mentioned end pole 4 and above-mentioned tubular plumbous cover 6 are welded into one, at least a portion of the upper surface of above-mentioned middle cover 5, the upper surface 6 of the upper surface of above-mentioned end pole 4 and above-mentioned plumbous cover is aligned to a plane, above-mentioned end pole 5 is welded into one with electrode terminal 7, the mode in the gap 8 that at least formation exists with the interface covering between above-mentioned plumbous cover 6 and above-mentioned middle cover 5 in the upper surface of above-mentioned middle cover and the upper surface of above-mentioned plumbous cover at least a portion is separately formed with resin bed 9, the thickness of above-mentioned resin bed in above-mentioned plane is 1.0～3.0mm.The above-mentioned thickness of above-mentioned resin bed is preferably 1.3～2.5mm
Because above-mentioned gap mainly forms after above-mentioned end pole 4 and above-mentioned plumbous cover 6 welding and after above-mentioned end pole 4 and above-mentioned electrode terminal 7 welding, so above-mentioned resin bed 9 formation after above-mentioned end pole 4 and above-mentioned electrode terminal 7 welding.In addition, above-mentioned end pole 4 can be welded together indirectly and carry out with above-mentioned electrode terminal by the upper surface of above-mentioned plumbous cover with the welding of above-mentioned electrode terminal 7, also can above-mentioned end pole 4 and above-mentioned plumbous 6 the upper surface of overlapping all weld together with above-mentioned electrode terminal 7.
Above-mentioned resin bed 9 is formed on by least a portion of the upper surface of above-mentioned middle cover 5, the upper surface of the upper surface of above-mentioned end pole 4, above-mentioned plumbous cover 6 (as mentioned above, above-mentioned three aligns and forms above-mentioned plane), above-mentioned electrode terminal 7, above-mentioned gap 8 and be configured in the space that the enclosing structure 10 on the upper surface of above-mentioned middle cover 5 surrounds.Above-mentioned resin bed is thin rete, for tabular, its width is the width that is at least enough to cover above-mentioned gap, and can to above-mentioned width, regulate according to the requirement of tolerance vibration and leakproof fluidity, at this moment at least a portion of above-mentioned plane, is formed with resin bed.Above-mentioned resin bed can fill up above-mentioned space.The width in above-mentioned gap 8 is less than 0.1mm conventionally.
Above-mentioned enclosing structure 10 is exactly the structure forming centered by the part that intersects of the upper surface by above-mentioned end pole 4 and above-mentioned middle cover 5, for example, can be around above-mentioned Central Symmetry ground or asymmetricly and continuously or the structure forming intermittently.Above-mentioned enclosing structure 10 decides according to the size of end pole 4, plumbous cover 6 and/or electrode terminal 7 with the distance at above-mentioned center, is generally 10～25mm.
Above-mentioned enclosing structure 10 can be for being arranged on rib on the upper surface of middle cover or by poor formation of section of the upper surface of middle cover itself.The shape such as rounded or square and being distributed in continuously or intermittently on the upper surface of above-mentioned middle cover centered by the poor part normally intersecting by the upper surface of above-mentioned end pole and above-mentioned middle cover of this rib or section.
When above-mentioned enclosing structure is rib and while being section difference, in the situation that other condition is all identical, the effect of gained there is no difference.
Above-mentioned resin bed is hot-melt adhesive layer.Above-mentioned hot-melt adhesive is not particularly limited, as long as can be not to be cured person at short notice by heat such as irradiation energy lines, this hot-melt adhesive for example can list: TPO and improved polyalkene class hot-melt adhesive; Ethene and copolymer analog hot-melt adhesive thereof, for example EVA type hot-melt adhesive; Polyamide-based hot-melt adhesive; Polyesters hot-melt adhesive; Styrene and block copolymer class hot melt hot-melt adhesive thereof; Polyurethanes hot-melt adhesive.
(execution mode 2)
The difference of the lead accumulator of the lead accumulator of execution mode 2 and execution mode 1 is only, above-mentioned resin bed is not hot-melt adhesive layer, but light-cured resin adhesive phase.Above-mentioned light-cured resin adhesive is not particularly limited, for example, can be the adhesive that acrylic ester monomer oligomer adhesive or cationic curing class are main and epoxy resin is used in combination.
According to the final technique effect that will reach, other inscape can be chosen aptly from detailed description above.
(execution mode 3)
The difference of the lead accumulator of the lead accumulator of execution mode 3 and execution mode 1 is only, above-mentioned resin bed is not light-cured resin adhesive phase, but by the adhesive resin layer beyond light-cured resin adhesive or hot-melt adhesive for example epoxy resin layer form.
According to the final technique effect that will reach, other inscape can be chosen aptly from detailed description above.
(execution mode 4)
The difference of the lead accumulator of the lead accumulator of execution mode 4 and execution mode 1 is only, above-mentioned resin bed is not light-cured resin adhesive phase or hot-melt adhesive layer but fluid sealant bonding die.The adhesive phase that above-mentioned fluid sealant bonding die preferably comprises substrate and forms on this substrate, the adhesive phase that aforesaid substrate comprises substrate and forms on this substrate.Aforesaid substrate is polypropylene (PP), polyethylene (PE), acrylonitrile-butadiene-styrene copolymer (ABS), acrylonitrile-butadiene-styrene copolymer (AS) or PETG (PET) sheet material preferably.Above-mentioned adhesive phase is preferably made by acrylate.
The ratio of the aforesaid substrate in above-mentioned sealing adhesive sheet and the thickness of above-mentioned adhesive phase is approximately 6:1～9:1, is preferably 6.5:1～7.5:1 left and right.The thickness of aforesaid substrate is generally 0.8～2.7mm.
According to the final technique effect that will reach, other inscape can be chosen aptly from detailed description above.
Below, based on embodiment, the utility model is specifically described, but these embodiment are just illustrations of the present utility model, the utility model is not limited to these embodiment.
(embodiment A-2～A-6)
Embodiment A-2～A-6 is the object lesson of execution mode 1.Wherein, enclosing structure on the upper surface of the middle cover 5 in lead accumulator and the configuration status of resin bed 9 are as shown in Figure 2, wherein above-mentioned enclosing structure is the rib 10 being arranged on the upper surface of middle cover 5, above-mentioned resin bed 9 is hot-melt adhesive layer, this hot-melt adhesive is for example the improved polyalkene class hot-melt adhesive that Japanese Toagosei Co., Ltd produces, commodity are called Aronmelt, and the trade mark is PPET-2110.There is gap 8 in the interface between above-mentioned plumbous cover 6 and above-mentioned middle cover 5.Above-mentioned resin bed 9 is formed on by upper surface, above-mentioned electrode terminal 7, the above-mentioned gap 8 of the upper surface of above-mentioned middle cover 5, above-mentioned plumbous cover 6 and is configured in the space that the rib 10 on the upper surface of above-mentioned middle cover surrounds.In above-mentioned space, the upper surface of above-mentioned end pole 4, the upper surface of above-mentioned plumbous cover 6 and the upper surface of above-mentioned middle cover 5 are aligned to a plane.The mode in the above-mentioned gap 8 existing with the interface covering between above-mentioned plumbous cover and above-mentioned middle cover in above-mentioned plane is formed with resin bed 9.Above-mentioned resin bed 9 fills up above-mentioned space.The thickness of above-mentioned resin bed in above-mentioned plane is uniform.Embodiment A-2～A-6 difference each other is only that the above-mentioned thickness of above-mentioned resin bed is set as respectively certain numerical value between 1.0～3.0mm.The numerical value of the parameter of each inscape and the vibration resistance of resulting lead accumulator and leakproof fluidity, battery capacity is referring to the value shown in aftermentioned table 1.
Below assay method and the condition determination of the vibration resistance of lead accumulator and leakproof fluidity, battery capacity are described.
(1) assay method of vibration resistance and leakproof fluidity
First, battery is placed on special vibration rig, by following condition, starts to shake
Dynamic test;
Condition determination: 1. supplement full battery, the upright placement of battery
2. direction of vibration: horizontal & vertical amplitude: 4mm
3. vibration frequency: 16.7HZ time: 1 hour
Then, battery is inverted to (180 °), is placed on the paper material with certain electrolyte absorbability and (measures in advance the weight of paper a); Battery is carried out to 0.1CA constant-current charge 12 hours; Whether observe battery terminal place and steam vent place has leakage (paper material has sharp trace) and measures the paper weight b absorbing after liquid;
By the size of b-a value, judge the quality of leakproof fluidity, numerical value show more greatly vibration resistance and leakproof fluidity poorer, otherwise show vibration resistance and leakproof fluidity better.
(2) assay method of battery capacity
The rated capacity of battery is 65Ah, and rated voltage is 12V.The new product battery of manufacturing in 30 days is carried out to voltage, internal resistance and gravimetry, environment be under 25 ℃ ± 2 ℃ conditions with the current discharge of 16.25A to 10.5V, record discharge time (unit be hour, note by abridging as h), calculate thus the capacity of battery.
(Comparative examples A-1, A-7)
The difference of Comparative examples A-1, A-7 and embodiment A-2～A-6 is only that the above-mentioned thickness of above-mentioned resin bed is set as respectively 0.8mm, 3.3mm.The numerical value of the vibration resistance of resulting lead accumulator and leakproof fluidity, battery capacity is referring to the value shown in aftermentioned table 1.
From embodiment A-2～A-6 and Comparative examples A-1, A-7, compared, when scope that the above-mentioned thickness of above-mentioned resin bed is 1.0～3.0mm, the vibration resistance of lead accumulator and leakproof fluidity is good, capacity characteristic is good.But, when the above-mentioned thickness of above-mentioned resin bed is during lower than 1.0mm with higher than 3.0mm, the vibration resistance of lead accumulator and the obvious variation of leakproof fluidity, its reason it is believed that and is: when the above-mentioned thickness of above-mentioned resin bed is during lower than 1.0mm, resin bed is excessively thin, easily there is inhomogeneous part or have local defect in resin bed, thereby easily occurs the phenomenon of leakage; When the above-mentioned thickness of above-mentioned resin bed is during higher than 3.0mm, it is blocked up that resin bed becomes, pliability variation, and vibration resistance variation, just easily there is the phenomenon of leakage in result.
(Embodiment B-4)
Embodiment B-4th, an object lesson of execution mode 2, the difference of itself and embodiment A-4 is only that above-mentioned resin bed is not hot-melt adhesive layer, but light-cured resin adhesive phase, this light-cured resin adhesive is for example the BU-810 that Japanese Toagosei Co., Ltd produces.
From Embodiment B-4 and embodiment A-4, compared, in the utility model, adopt the resin bed being formed by hot-melt adhesive layer all can realize substantially the same effect with the resin bed being formed by light-cured resin adhesive phase.
(Embodiment C-4)
Embodiment C-4th, an object lesson of execution mode 3, the difference of itself and embodiment A-4, B-4 is only that above-mentioned resin bed is not hot-melt adhesive layer or light-cured resin adhesive phase, but epoxy resin layer, the product that this epoxy resin is for example produced for Japanese Nagasechemtex company: host is XNR3114, and curing agent is XNH3114.Adopt special-purpose drying oven or curing oven within the longer time, to complete curing.
From Embodiment C-4, compared with embodiment A-4, B-4, resin bed in the utility model adopts for example epoxy resin layer of light-cured resin adhesive phase or hot-melt adhesive layer adhesive resin layer in addition, also can realize good vibration resistance and leakproof fluidity and battery capacity simultaneously.But these resin beds need to adopt special-purpose drying oven or curing oven just can complete dry within the longer time and solidify.
(embodiment D-2～D-6)
Embodiment D-2～D-6 is the object lesson of execution mode 4, what the difference of itself and embodiment A-4 was only that above-mentioned resin bed adopts is fluid sealant bonding die, and sealing sheet adhesive comprises on polyethylene (PE) sheet material and the acrylate resin adhesiver layer forming on this PE sheet material.The thickness of above-mentioned fluid sealant bonding die is set to respectively certain numerical value between 1.0～3.0mm, and the ratio of the thickness of above-mentioned PE sheet material and aforesaid propylene acid ester resin adhesive phase is 7:1.Above-mentioned light-cured resin adhesive is for example the BU-810 that Japanese Toagosei Co., Ltd produces.
(embodiment E-4)
The difference of embodiment E-4 and embodiment D-4 is only that the substrate of above-mentioned fluid sealant bonding die is not polyethylene (PE) sheet material but polypropylene (PP) sheet material.
(Comparative Example D-1, D-7)
The difference of Comparative Example D-1, D-7 and embodiment A-2～A-6 is only that the thickness of above-mentioned fluid sealant bonding die is set as respectively 0.8mm, 3.3mm.
From the resulting result of embodiment D-2～D-6 and embodiment E-4, when the thickness of above-mentioned fluid sealant bonding die is 1.0～3.0mm, the vibration resistance of lead accumulator and leakproof fluidity is good, capacity characteristic is good.But, embodiment D-4 compares with the resulting result in embodiment A-4, the vibration resistance of lead accumulator and leakproof fluidity decrease, and this is because fluid sealant bonding die can not flow into and be filled in above-mentioned gap as liquid adhesive, thereby likely abundant not to the sealing in above-mentioned gap.
From Comparative Example D-1, the resulting result of D-7, when the thickness of above-mentioned fluid sealant bonding die is during lower than 1.0mm with higher than 3.0mm, the vibration resistance of lead accumulator and the obvious variation of leakproof fluidity, its reason it is believed that and is: when the thickness of above-mentioned fluid sealant bonding die is during lower than 1.0mm, sealing sheet adhesive is excessively thin, be difficult to sealing sheet adhesive entirely to stick on above-mentioned gap, thereby easily have inhomogeneous part or have local defect, therefore easily occur the phenomenon of leakage; When the thickness of above-mentioned fluid sealant bonding die is during higher than 3.0mm, sealing sheet adhesive is blocked up, and when battery is subject to extraneous vibration or in transportation, sealing sheet adhesive easily deforms, and the phenomenon of leakage also easily appears in result.
(Comparative Example F-1)
Comparative Example F-1 is only there is no covering resin layer on the gap of locating to exist at above-mentioned plumbous cover and the interface (border) of above-mentioned middle cover with the difference of embodiment A-4, only at the interface (border) of above-mentioned end pole and above-mentioned plumbous cover, locate covering resin layer.
As a result, the leakproof fluidity of resulting lead accumulator is very poor.Its reason is: above-mentioned plumbous cover is not covered by resin bed and exposed with the gap that the interface (border) of above-mentioned middle cover is located to exist, thereby there is no resistance to leakage effect.And at the interface (border) of above-mentioned end pole and above-mentioned plumbous cover, locate originally just substantially not have gap, so even locate covering resin layer on this interface (border), can not play the effect of improving leakproof.
(Comparative Example F-2)
Comparative Example F-2nd, the hermetically-sealed construction of the portion of terminal of disclosed lead accumulator in the Japanese Patent Laid-Open 2010-177089 described in the background technology part based on the application and the experiment carried out, the longitudinal section of the portion of terminal hermetically-sealed construction of above-mentioned lead accumulator is referring to Fig. 4.In this lead accumulator, by keeping the portion of terminal perforation that pole 4 forms to be arranged in the outer rib 10 of lid 5 with plumbous cover 6, between this portion of terminal and outer rib 10, with epobond epoxyn, fill and be cured, obtaining thickness is the epoxy resin layer 9 of 4.0mm.
As a result, the leakproof fluidity of the resulting lead accumulator in Comparative Example F-2 and battery capacity are all poor.Its reason is: the upper surface of pole, the upper surface of plumbous cover and the upper surface of middle cover are not in one plane completely, thereby very thick for sealing needed epoxy resin layer, pliability is poor, vibration resistance is poor, therefore when battery is subject to extraneous vibration or in transportation, resin bed easily breaks, thereby occurs the phenomenon of leakage; And the height of above-mentioned portion of terminal hermetically-sealed construction is very high, this causes the height of battery pole plates to reduce, thereby has affected battery capacity.
(Comparative Example F-3)
Comparative Example F-3rd, the terminal sealing structure of disclosed lead accumulator in the Chinese utility model CN202259476U described in the background technology part based on the application and the experiment carried out, the terminal sealing structure schematic diagram of above-mentioned lead accumulator is referring to Fig. 5.This lead accumulator comprises cell cover 5, lead bushing 6, pole 4 and the primer guard ring 12 being threaded with above-mentioned cell cover 5, thereby pour epobond epoxyn in above-mentioned primer guard ring 12, is formed with the epoxy resin layer 9 that thickness is 2.0mm.
As a result, the leakproof fluidity of the resulting lead accumulator in Comparative Example F-3 and battery capacity are all poor.Its reason is: the upper surface of pole, the upper surface of plumbous cover and the upper surface of middle cover are not in one plane completely, thereby the epoxy resin layer that thickness is 2.0mm is difficult to the gap between lead cover and lid fully to cover, easily there is inhomogeneous part or have local defect, thus occur vibration resistance and leakproof fluidity poor.And the height of above-mentioned terminal sealing structure is very high, this causes the height of battery pole plates to reduce, thereby has affected battery capacity.
Table 1
Industrial applicibility
The utility model provides vibration resistance and leakproof fluidity is good, capacity characteristic is good lead accumulator, this lead accumulator not only can be as power supply, mains lighting supply and the stand-by power supply of starting vehicle, also can be as the electrical source of power of independent power supply such as electric automobile, electri forklift, electric pallet truck, electric motor coach, electric bicycle, battery-operated motor cycle, Segway Human Transporter, small-sized electric vehicle using motor, golf cart, electric locomotive etc. for charging/discharging apparatus, the apparatus for storing electrical energy such as battery for solar energy.
Claims (15)
1. a lead accumulator, it is characterized in that, it has electric groove, middle cover, pole plate group and end pole, the mode that described end pole is inserted into run through imbed in advance in the tubular plumbous cover in described middle cover and described end pole and described tubular plumbous cover integrally welded, at least a portion of the upper surface of described middle cover, the upper surface of the upper surface of described end pole and described plumbous cover is aligned to a plane, described end pole and electrode terminal are integrally welded, the mode in the gap existing with the interface covering between described plumbous cover and described middle cover at least a portion of described plane is formed with resin bed, the thickness of described resin bed in described plane is 1.0～3.0mm.
2. lead accumulator according to claim 1, is characterized in that, the described thickness of described resin bed is 1.5～2.5mm.
3. lead accumulator according to claim 1 and 2, is characterized in that, described resin bed forms after integrally welded at described end pole and described electrode terminal.
4. lead accumulator according to claim 1 and 2, is characterized in that, described resin bed is formed on by described plane, described electrode terminal, described gap and is configured in the space that the enclosing structure on the upper surface of described middle cover surrounds.
5. lead accumulator according to claim 4, is characterized in that, the height of described enclosing structure is not less than the thickness of described resin bed.
6. lead accumulator according to claim 4, is characterized in that, described enclosing structure is the rib being arranged on the upper surface of described middle cover.
7. lead accumulator according to claim 4, is characterized in that, described enclosing structure is by poor formation of section of the upper surface of described middle cover itself.
8. lead accumulator according to claim 4, is characterized in that, rounded or square and be distributed in continuously or intermittently on the upper surface of described middle cover centered by the part that described enclosing structure intersects by the upper surface of described end pole and described middle cover.
9. lead accumulator according to claim 1 and 2, is characterized in that, described resin bed is light-cured resin adhesive phase, hot-melt adhesive layer or epoxy resin layer.
10. lead accumulator according to claim 1 and 2, is characterized in that, described resin bed is fluid sealant bonding die.
11. lead accumulators according to claim 10, is characterized in that, the adhesive phase that described fluid sealant bonding die comprises substrate and forms on this substrate.
12. lead accumulators according to claim 11, is characterized in that, described substrate is polypropylene, polyethylene, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-butadiene-styrene copolymer or PETG sheet material.
13. lead accumulators according to claim 11, is characterized in that, described adhesive phase is made by acrylate.
14. lead accumulators according to claim 11, is characterized in that, the ratio of the thickness of described substrate and described adhesive phase is 6:1～9:1.
15. lead accumulators according to claim 11, is characterized in that, the thickness of described substrate is 0.8～2.7mm.
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| CN201320615491.1U CN203466232U (en) | 2013-09-30 | 2013-09-30 | Lead storage battery |
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| CN201320615491.1U CN203466232U (en) | 2013-09-30 | 2013-09-30 | Lead storage battery |
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| CN104518178A (en) * | 2013-09-30 | 2015-04-15 | 松下蓄电池(沈阳)有限公司 | Lead storage battery |
| WO2016111740A1 (en) * | 2015-01-05 | 2016-07-14 | Johnson Controls Technology Company | Lithium ion battery cell with secondary seal |
| USD773390S1 (en) | 2015-02-27 | 2016-12-06 | Johnson Controls Technology Company | Lithium ion battery cell |
| CN109390506A (en) * | 2018-10-10 | 2019-02-26 | 超威电源有限公司 | The forming method of sealing structure and the sealing structure between a kind of battery multi-cell battery |
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2013
- 2013-09-30 CN CN201320615491.1U patent/CN203466232U/en not_active Expired - Fee Related
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| CN104518178A (en) * | 2013-09-30 | 2015-04-15 | 松下蓄电池(沈阳)有限公司 | Lead storage battery |
| CN104064819A (en) * | 2014-04-15 | 2014-09-24 | 超威电源有限公司 | Photocuring technology for lead-acid storage battery prime coat |
| CN104064819B (en) * | 2014-04-15 | 2016-10-05 | 超威电源有限公司 | A kind of lead-acid accumulator primer ultraviolet curing process |
| WO2016111740A1 (en) * | 2015-01-05 | 2016-07-14 | Johnson Controls Technology Company | Lithium ion battery cell with secondary seal |
| US9634301B2 (en) | 2015-01-05 | 2017-04-25 | Johnson Controls Technology Company | Lithium ion battery cell with secondary seal |
| CN107258026A (en) * | 2015-01-05 | 2017-10-17 | 江森自控科技公司 | Lithium ionic cell unit with secondary seal |
| CN107258026B (en) * | 2015-01-05 | 2020-11-06 | Cps科技控股有限公司 | Lithium ion battery cell with secondary seal |
| USD773390S1 (en) | 2015-02-27 | 2016-12-06 | Johnson Controls Technology Company | Lithium ion battery cell |
| CN109390506A (en) * | 2018-10-10 | 2019-02-26 | 超威电源有限公司 | The forming method of sealing structure and the sealing structure between a kind of battery multi-cell battery |
| CN109390506B (en) * | 2018-10-10 | 2021-06-18 | 超威电源集团有限公司 | Sealing structure between multiple single-cell batteries of battery and forming method of sealing structure |
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