CN203412768U - Novel vacuum wafer coiled pipe cooler - Google Patents
Novel vacuum wafer coiled pipe cooler Download PDFInfo
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- CN203412768U CN203412768U CN201320330726.2U CN201320330726U CN203412768U CN 203412768 U CN203412768 U CN 203412768U CN 201320330726 U CN201320330726 U CN 201320330726U CN 203412768 U CN203412768 U CN 203412768U
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- spiral cooling
- cooling coil
- wafer type
- coiled pipe
- internal
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Abstract
The utility model discloses a novel vacuum wafer coiled pipe cooler. An internal spiral cooling coiled pipe is arranged close to the center of a wafer flange; an external spiral cooling coiled pipe is arranged outside the inner spiral cooling coiled pipe; the internal spiral cooling coiled pipe and the external spiral cooling coiled pipe are connected through a connecting pipe; a gland is arranged at the tops of the internal spiral cooling coiled pipe and the external spiral cooling coiled pipe, and is fixed through setting screws; one end of each setting screw is positioned at the bottom of the inner cavity of the wafer flange; the other end of the setting screw is fixed with the corresponding gland through an adjusting nut; a coolant inlet and a coolant outlet are respectively formed in two sides of the wafer flange, and are respectively communicated with the internal spiral cooling coiled pipe and the external spiral cooling coiled pipe to form a cooling circuit. Through the design of the novel vacuum wafer type coiled pipe cooler, the problem that a roots vacuum pump is not in operation for a long time under relatively high differential pressure is solved, under the condition of ensuring the vacuum degree requirement, the stability is improved, and relatively high differential pressure can be born, and under the same working condition, the temperature of an exhaust port is reduced.
Description
Technical field
The utility model relates to the technical field of vacuum wafer type serpentine cooler, a kind of a kind of cooling unit that reduces the heat of compression in Roots pump exhaust side pump chamber that is widely used in specifically, also can be arranged on any exhaust equipment outlet, reduce the cooling unit of delivery temperature, or be arranged in conveyance conduit or gas pipeline, reduce the use of temperature of charge.This structure to be to meet deep-etching, the Application in Chemical Engineering operating mode that flammable explosive gas etc. are severe.Be particularly related to the mechanical connecting structure of its cooler.
Background technique
There are two very formidable deficiencys in Roots pump at present in operation, because Roots pump can not use separately as vacuum pump, need to be equipped with preevacuation pump, fore vacuum pump intake needs to discharge in time the tolerance of Roots pump relief opening, otherwise can cause gas in the accumulation of Roots pump relief opening, form the relief opening of Roots pump and the pressure reduction of suction port.When pressure reduction is excessive, when the rotor of Roots pump carries out gas compression in exhaust side, need larger acting, according to gas compression thermal equilibrium, gas compression acting is larger, and the heat of generation is also just larger.If these heats can not be removed in time or dispel the heat away, heat is delivered to the rotor in lobe pump body, the pump housing, and axle, on end cap, and these metal partss are heated and can expand.When temperature in lobe pump body is more and more higher, the expansion meeting of these metal partss is larger, surpass rotor and the pump housing or and Roots pump end cap between gap and there is metal bump, until rotor is stuck, cause lobe pump body damage.
If roots pump rotor and the pump housing or and Roots pump end cap between excesssive gap, the pressure reduction at two ends makes the loss that Roots pump entrance degree of vacuum will be very large.If visible Roots pump entrance reaches very high degree of vacuum, need roots pump rotor and the pump housing or and end cap between gap needs very little, but gap is too small, to be but easy to form pressure reduction excessive, the heat of compression can not be removed in time and cause rotor and the pump housing, end cap is stuck.Concerning some harsh Environmental Conditions, pump housing surface temperature is too high also can cause dangerous hidden danger simultaneously, so remove in time Roots pump gas compression heat, is to improve Roots pump performance and use safe core crucial.
If can not remove in time the heat of compression simultaneously, this heat accumulative total causes cavity temperature in lobe pump body to raise, can pass to end cap, and be further delivered to the part of end caps, make these parts comprise bearing, Sealing and lubricant oil will be located at high temperature operation, once excess Temperature will have a strong impact on working life of this part.If can remove rapidly the heat of compression of Roots pump, not only can guarantee under the requirement of degree of vacuum, improve the operation pressure reduction of Roots pump, and while moving, remove fast the heat of compression under equal operating mode, can guarantee that heat does not accumulate in this pump chamber, reduced the temperature of relief opening, also the exhaust volume (temperature is higher, becomes large with equal pressure lower volume) that has reduced relief opening, is more conducive to the air displacement that fore pump absorptivity meets Vacuum Roots pump.
Summary of the invention
The purpose of this utility model is to provide a kind of novel evacuated wafer type serpentine cooler, utilize wafer type flange to be directly directly connected with Roots pump relief opening, install, dismounting and convenient, make spiral cooling coil can more go deep into the exhaust side inner chamber of Roots pump, but can not collide with the range of operation of Roots's fan blade.Inside and outside two-layer special spiral coil makes to realize maximized surface area under less cavity volume, i.e. maximum heat exchange area, and the drag losses that the geometrization shape of spiral causes overcurrent gas simultaneously reaches minimum.
To achieve these goals, the technical solution of the utility model is: a kind of novel evacuated wafer type serpentine cooler, it comprises wafer type flange, it is characterized in that: described wafer type flange is provided with internal spiral cooling coil near centre bit, internal spiral cooling coil outside is provided with external spiral cooling coil, between internal spiral cooling coil and external spiral cooling coil, by internal and external screw cooling coil connecting tube, connect, internal spiral cooling coil and external spiral cooling coil top are provided with gland, gland is fixed by setting screw rod, one end of setting screw rod is positioned at wafer type flange intracavity bottom, the other end of setting screw rod is fixed by adjusting nut and gland, wafer type flange intracavity bottom is dual torus and is distributed with some setting screw rods, the setting screw rod of inner ring is for internal spiral cooling coil sizing, the setting screw rod of outer ring is for external spiral cooling coil sizing, place, wafer type flange both sides offers respectively cooling liquid inlet and cooling liquid outlet, this offers respectively cooling liquid inlet and cooling liquid outlet is all communicated with internal spiral cooling coil and external spiral cooling coil, and form cooling circuit.
?the utility model discloses a kind of novel evacuated wafer type serpentine cooler, the design of this novel evacuated wafer type serpentine cooler not only solved Roots pump long-standing cannot be under higher pressure reduction long-play, under the requirement that guarantees degree of vacuum, improved its stability and born higher pressure reduction, and reduced relief opening temperature under equal operating mode, reduced power consumption, the working life of prolongation part.
Accompanying drawing explanation
Fig. 1 is vacuum wafer type serpentine cooler stereogram.
Fig. 2 is wafer type flange plan view.
Fig. 3 is wafer type flange sectional side view.
Fig. 4 is internal spiral cooling coil and external spiral cooling coil coupled condition plan view.
Fig. 5 is internal spiral cooling coil and external spiral cooling coil coupled condition side view.
Fig. 6 is gland structure schematic diagram.
Fig. 7 is vacuum wafer type serpentine cooler structural representation.
Fig. 8 is vacuum wafer type serpentine cooler plan view.
Embodiment
With reference to the accompanying drawings, the utility model is further described.
Following examples can make those skilled in the art more clearly understand and how put into practice the utility model.Although should be appreciated that in conjunction with its preferred specific embodiments and described the utility model, these embodiments are intended setting forth, rather than limit scope of the present utility model.
The utility model is a kind of novel evacuated wafer type serpentine cooler, it comprises wafer type flange 1, it is different from prior art and is: described wafer type flange 1 is provided with internal spiral cooling coil 2 near centre bit, internal spiral cooling coil 2 outsides are provided with external spiral cooling coil 3, between internal spiral cooling coil 2 and external spiral cooling coil 3, by internal and external screw cooling coil connecting tube 4, connect, coil pipe in wafer type flange 1 adopts internal and external screw form, make the length of cooling liquid coil pipe reach maximization, not only increased coil surface area (being heat exchange area), to the resistance of overcurrent gas, be reduced to minimum simultaneously.
In the specific implementation, internal spiral cooling coil 2 and external spiral cooling coil 3 tops are provided with gland 5, gland 5 is fixing by setting screw rod 6, one end of setting screw rod 6 is positioned at wafer type flange 1 intracavity bottom, the other end of setting screw rod 6 is fixing with gland 5 by adjusting nut 7, wafer type flange 1 intracavity bottom is dual torus and is distributed with some setting screw rods 6, the setting screw rod 6 of inner ring is for internally spiral cooling coil 2 sizings, the setting screw rod 6 of outer ring is for externally spiral cooling coil 3 sizings, described wafer type flange 1 intracavity bottom is dual torus and is distributed with some tapped holes, for fixing above-mentioned setting screw rod 6 one end, above-mentioned tapped hole is also dual torus and distributes, be used for coordinating setting screw rod 6.Above-mentioned wafer type flange 1 place, both sides offers respectively cooling liquid inlet 101 and cooling liquid outlet 102, and this offers respectively cooling liquid inlet 101 and cooling liquid outlet 102 is all communicated with internal spiral cooling coil 2 and external spiral cooling coil 3, and forms cooling circuit.
In the specific implementation, above-mentioned internal spiral cooling coil 2 and external spiral cooling coil 3 utilize the setting screw rod on chassis, not only can guarantee internal spiral cooling coil 2 and external spiral cooling coil 3 when being wound around and the concentric of wafer type flange, and easy for installation, not yielding.Guarantee the adjustment of join strength and the height of gland simultaneously.Moreover setting screw rod can also be for stationary gland, utilize adjusting nut to adjust the final spacing of gland and wafer type flange, guarantee cooler surface of contact maximum in going deep into Roots pump inner chamber, but can not collide with Roots's fan blade.
In the specific implementation, the described wafer type flange 1 intracavity bottom place of keeping to the side formation is static outward encircles 9 admittedly, base circle pipe for external spiral cooling coil 3 is fixed, described wafer type flange 1 intracavity bottom forms and interiorly staticly admittedly encircles 10 near center, for the internal base circle pipe of spiral cooling coil 2, is fixed.
In the specific implementation, described gland 5 places are provided with activity and admittedly encircle 8, the best position of internal spiral cooling coil 2 and external spiral cooling coil 3, and fixed.Prevent that overcurrent gas causes distortion to its impact or because deformation force is excessive, in the connecting head weld generation of wafer type flange, tears finedraw when operation, cause cooling liquid to leak.
In the specific implementation, the elastic metallic coil pipe that described internal spiral cooling coil 2 and external spiral cooling coil 3 are fold, or the corrugated metal coil pipe that has crooked character, or by two or a plurality of pipeline weldings connect, a complete coil pipe that spirals continuously and make.But best is to use with the flexibility (metal) of fold to manage, because adopt this class pipe, the performance that can have larger bending to be wound around, making internal and external screw shape is more simple and accurate.Owing to there is fold, the common weldless tube of surface area ratio of pipeline to be increased more than 3 times simultaneously, make the heat exchange area of cooler increase several times, can also cushion the stress influence that overcurrent gas and high temperature cause metallic material.
In the specific implementation, described internal spiral cooling coil 2 and external spiral cooling coil 3 are stainless steel or brass material.The general copper pipe that adopts, can avoid chlorion in water to corrosive pipeline, but adopt stainless steel pipeline for higher temperatures gas, can guarantee pipeline strength at high temperature.For the sour gas of some deep-etchings, can adopt special alloy pipe, but this does not affect its cooling performance.
The vacuum wafer type spiral coil cooler that this patent is recorded has novel inside and outside integrative spiral coil pipeline, and its structure is different from prior art and is: existing coiled pipe cooler all can not directly be used in the inner chamber of Roots pump exhaust side for the function of cooled compressed heat.General Placement is all that two end flange connect, and chuck coil pipe type, is equal to shell-and-tube heat exchanger, most laboratories etc. that are used for.First this new-type wafer type spiral coil cooler is used in Roots pump exhaust side inner chamber, and rapid moving, except the heat of compression, reduces thermal stress and the power of Roots pump.This new-type wafer type spiral coil cooler can use in any one blower fan relief opening or pipeline simultaneously, reduces outlet temperature.
For new-type wafer type spiral coil cooler, except making water as cooling liquid, can also use other cooling liquid, propylene glycol for example, chilled brine and cold gasoline etc. can meet the demands.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that the concrete enforcement of the utility model is confined to above-mentioned these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection domain of the present utility model.
Claims (6)
1. a novel evacuated wafer type serpentine cooler, it comprises wafer type flange (1), it is characterized in that: described wafer type flange (1) is provided with internal spiral cooling coil (2) near centre bit, internal spiral cooling coil (2) outside is provided with external spiral cooling coil (3), between internal spiral cooling coil (2) and external spiral cooling coil (3), by internal and external screw cooling coil connecting tube (4), connect, internal spiral cooling coil (2) and external spiral cooling coil (3) top are provided with gland (5), gland (5) is fixing by setting screw rod (6), one end of setting screw rod (6) is positioned at wafer type flange (1) intracavity bottom, the other end of setting screw rod (6) is fixing by adjusting nut (7) and gland (5), wafer type flange (1) intracavity bottom is dual torus and is distributed with some setting screw rods (6), the setting screw rod (6) of inner ring is for internally spiral cooling coil (2) sizing, the setting screw rod (6) of outer ring is for externally spiral cooling coil (3) sizing, place, wafer type flange (1) both sides offers respectively cooling liquid inlet (101) and cooling liquid outlet (102), this offers respectively cooling liquid inlet (101) and cooling liquid outlet (102) is all communicated with internal spiral cooling coil (2) and external spiral cooling coil (3), and form cooling circuit.
2. a kind of novel evacuated wafer type serpentine cooler according to claim 1, it is characterized in that: described wafer type flange (1) the intracavity bottom place of keeping to the side forms outer static solid ring (9), base circle pipe for external spiral cooling coil (3) is fixed, described wafer type flange (1) intracavity bottom forms interior static solid ring (10) near center, for the internal base circle pipe of spiral cooling coil (2), is fixed.
3. a kind of novel evacuated wafer type serpentine cooler according to claim 1, it is characterized in that: described gland (5) locates to be provided with movable solid ring (8), the best position of internal spiral cooling coil (2) and external spiral cooling coil (3), and fixed.
4. a kind of novel evacuated wafer type serpentine cooler according to claim 1, is characterized in that: described wafer type flange (1) intracavity bottom is dual torus and is distributed with some tapped holes, for fixing above-mentioned setting screw rod (6) one end.
5. a kind of novel evacuated wafer type serpentine cooler according to claim 1, it is characterized in that: described internal spiral cooling coil (2) and external spiral cooling coil (3) are the elastic metallic coil pipe of fold, or the corrugated metal coil pipe that has crooked character, or by two or a plurality of pipeline weldings connect, a complete coil pipe that spirals continuously and make.
6. a kind of novel evacuated wafer type serpentine cooler according to claim 1, is characterized in that: described internal spiral cooling coil (2) and external spiral cooling coil (3) are stainless steel or brass material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320330726.2U CN203412768U (en) | 2013-06-08 | 2013-06-08 | Novel vacuum wafer coiled pipe cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320330726.2U CN203412768U (en) | 2013-06-08 | 2013-06-08 | Novel vacuum wafer coiled pipe cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203412768U true CN203412768U (en) | 2014-01-29 |
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ID=49975659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320330726.2U Withdrawn - After Issue CN203412768U (en) | 2013-06-08 | 2013-06-08 | Novel vacuum wafer coiled pipe cooler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203412768U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103511280A (en) * | 2013-06-08 | 2014-01-15 | 苏州伊莱茨流体装备有限公司 | Novel vacuum opposite-clamping coiled pipe cooler |
| CN107744207A (en) * | 2017-11-10 | 2018-03-02 | 东莞市联洲知识产权运营管理有限公司 | A kind of tool for being applied to volume eaves cap cooling and shaping |
-
2013
- 2013-06-08 CN CN201320330726.2U patent/CN203412768U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103511280A (en) * | 2013-06-08 | 2014-01-15 | 苏州伊莱茨流体装备有限公司 | Novel vacuum opposite-clamping coiled pipe cooler |
| CN103511280B (en) * | 2013-06-08 | 2017-04-05 | 苏州伊莱茨流体装备有限公司 | A kind of novel evacuated wafer type coiled pipe cooler |
| CN107744207A (en) * | 2017-11-10 | 2018-03-02 | 东莞市联洲知识产权运营管理有限公司 | A kind of tool for being applied to volume eaves cap cooling and shaping |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Taicang City, Suzhou City, Jiangsu Province, and 215411 Metro Jianxiong Road No. 1 Patentee after: Yi Laici fluid Equipment Limited, Suzhou Patentee after: ELIVAC COMPANY, LTD. Patentee after: Xiao Ran Address before: Taicang City, Suzhou City, Jiangsu Province, and 215411 Metro Jianxiong Road No. 1 Patentee before: Yi Laici fluid Equipment Limited, Suzhou Patentee before: ELIVAC (Shanghai) Co., Ltd. Patentee before: Xiao Ran |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140129 Effective date of abandoning: 20170405 |