CN203407015U - Condenser microphone - Google Patents
Condenser microphone Download PDFInfo
- Publication number
- CN203407015U CN203407015U CN201320387399.4U CN201320387399U CN203407015U CN 203407015 U CN203407015 U CN 203407015U CN 201320387399 U CN201320387399 U CN 201320387399U CN 203407015 U CN203407015 U CN 203407015U
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- China
- Prior art keywords
- upper cover
- high temperature
- viscosity
- pad pasting
- microphone
- Prior art date
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- Expired - Fee Related
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Abstract
The utility model provides a condenser microphone. The condenser microphone comprises an upper cover, a bottom plate, and a side wall for connecting the upper cover and the bottom, an acoustical-electrical energy conversion chip which is mounted in a housing cavity, a sound inlet arranged on the upper cover, a high-temperature film adhered on the upper cover and which is composed of an adhering part fixed with the upper cover and a non-adhering part connected with the adhering part, and the non-adhering part covers the sound inlet. The debris can be prevented from entering into the housing cavity of the microphone, the air in the housing cavity is effectively exhausted, the MEMS Die diaphragm is prevented from being broken due to increased temperature and over high air pressure during the solder-reflow process, and furthermore the failure of the microphone is prevented.
Description
[technical field]
The utility model relates to a kind of microphone, specifically refers to a kind of Electret Condencer Microphone.
[background technology]
Development along with wireless telecommunications, Global Mobile Phone Users is more and more, user is not only satisfied with call to the requirement of mobile phone, and want to provide high-quality communication effect, especially at present the development of Technology of Mobile Multimedia, the speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly affects speech quality.
And the microphone of applying at present more and better performances is microelectromechanical-systems microphone (Micro-Electro-Mechanical-System Microphone, be called for short MEMS), its principle is to adopt capacity effect to realize, simplified summary is exactly that the distance at the two poles of the earth of electric capacity changes, and causes capacitance to change, thereby generation current, and why the distance at the two poles of the earth changes, be that the driving due to extraneous sound wave makes so, and then can realize and sound is converted into the signal of telecommunication transmits.
Relevant MEMS microphone, comprises upper cover, base plate, and MEMS chip and control chip are installed on base plate.In the appropriate location of upper cover, offer tone-entering hole for accepting and transmitting sound wave to MEMS chip.MEMS chip comprises mutually insulated vibrating diaphragm and backboard in a distance, and vibrating diaphragm and backboard form the two poles of the earth of electric capacity, vibrating diaphragm backboard vibration relatively.
MEMS chip is very little, also very accurate, in order to prevent when MEMS microphone is welded; scolding tin, dust, even air blast enters MEMS chip, and the vibrating diaphragm that causes MEMS chip is damaged and lost efficacy; conventionally can be at the upper high temperature pad pasting that has been sticked that covers, the pad pasting of taking off while finally completing to be assembled.Yet Mike's sound of the wind hole of this structure is sealed completely by high temperature pad pasting, when crossing Reflow Soldering, due to stable, heat up rapidly, gas expansion, so the gas in microphone cavity cannot discharge rapidly, easily causes MEMS Die rupture of diaphragm, microphone lost efficacy.
The utility model is to provide a kind of MEMS microphone of improvement to improve the problems referred to above.
[utility model content]
The purpose of this utility model is to provide a kind of and lost efficacy while preventing from welding, and improves the Electret Condencer Microphone of reliability.
The utility model solves the problems of the technologies described above by the following technical programs:
A kind of Electret Condencer Microphone, comprise upper cover, base plate, and the sidewall that connects upper cover and base plate, acoustic-electric transducing chip is installed in host cavity, on cover and be provided with tone-entering hole, on cover the high temperature pad pasting that has been sticked, described high temperature pad pasting comprises for the viscosity portion fixing with upper cover and the non-sticky portion being connected with viscosity portion, described non-sticky portion is covered on tone-entering hole.
Preferably, described viscosity portion comprises by separated the first viscosity portion of non-sticky portion and the second viscosity portion.
Preferably, described high temperature pad pasting is also provided with from viscosity portion edge extended warpage portion, and the relative upper cover of warpage portion is upward to extension.
Preferably, described warpage portion does not have viscosity.
Preferably, high temperature pad pasting is wherein a kind of of the green high temperature pad pasting of Furtulon high temperature pad pasting, high-temperature masking paper self-adhesive tape, PET, high temperature double faced adhesive tape.
Preferably, described viscosity portion has viscous layer, and described non-sticky portion does not have viscous layer.
Preferably, described warpage portion does not have viscous layer.
Compared with prior art, on of the present utility model, cover the high temperature pad pasting that is coated with incomplete sealing, can be when preventing that foreign material from entering microphone host cavity, effectively will accommodate intracavity gas discharges, while preventing Reflow Soldering, temperature raise, the too high rupture of diaphragm that causes MEMS Die of air pressure, and then cause microphone to lose efficacy.
[accompanying drawing explanation]
Fig. 1 is the schematic diagram of the utility model MEMS microphone;
Fig. 2 is the vertical view of the utility model MEMS microphone.
[embodiment]
Below in conjunction with accompanying drawing, describe concrete structure of the present utility model in detail.
Please refer to the drawing 2, the utility model Electret Condencer Microphone 10 on electronic equipment to accept external acoustic waves and sound wave be converted to the signal of telecommunication, in the present embodiment, the utility model Electret Condencer Microphone is MEMS(Micro-Electro-Mechanical-System Microphone) microphone.
Electret Condencer Microphone 10 mainly comprises upper cover 11, base plate 12, and connect upper cover 11 and base plate 12 and will separate the sidewall 13 that forms host cavity 130 between the two, acoustic-electric transducing chip 14 is installed in host cavity 130, in order to change better voice signal, control chip 15 can be installed, between control chip 15 and acoustic-electric transducing chip 14, be electrically connected to.Acoustic-electric transducing chip 14 comprises vibrating diaphragm and backboard.
In order to accept external acoustic waves, upper cover 11 is provided with tone-entering hole 110, can be delivered on the vibrating diaphragm of acoustic-electric transducing chip 14 after external acoustic waves enters tone-entering hole 110, causes that vibrating diaphragm moves, and causes the distance between vibrating diaphragm and backboard to change, and capacitance changes and forms electric current.
As depicted in figs. 1 and 2, be provided with high temperature pad pasting 20 on upper cover 11, this high temperature pad pasting 20 comprises viscosity portion 21 and the non-sticky portion 23 being attached thereto.High temperature pad pasting is fixed with upper cover 11 by viscosity portion 21.Non-sticky portion 23 is covered on tone-entering hole 110, viscosity portion 21 comprises by separated the first viscosity portion 211 of non-sticky portion 23 and the second viscosity portion 212, be that non-sticky portion 23 both sides are equipped with viscosity portion, by the first viscosity portion 211 and the second viscosity portion 212, realized the fixing of whole high temperature pad pasting 20, non-sticky portion 23 has been covered on tone-entering hole 110 and with the upper cover 11 that forms tone-entering hole 110 and fits tightly.Because non-sticky portion 23 does not have viscosity, therefore blocking of pore do not belonged to sealing completely, under normal circumstances, seamless between non-sticky portion 23 and upper cover 11, when having served as Reflow Soldering and having caused temperature rising gas expansion, because non-sticky portion 23 has certain elasticity, the air jack-up that can be expanded in microphone cavity, there is certain gap with upper cover, and then form the path of an air-flow, like this, gas just can be discharged by non-sticky portion, as shown in Figure 2, A is the track that air-flow is discharged.Like this, just can play the air pressure regulating in microphone cavity 130, prevent the effect of the rupture of diaphragm of MEMS Die.Certainly, this is only preferably embodiment of the utility model, in selectable other execution modes, also can only have a viscosity portion is connected with non-sticky portion, as long as can realize the fixing of high temperature pad pasting, can allow non-sticky portion be fitted in and cover, can implement.
More excellent, high temperature pad pasting 20 comprises the 21 edge extended warpage portions 22 from viscosity portion, the relative upper cover of warpage portion 22 is upward to extension.Here, warpage portion can be extended from the first viscosity portion 211, can be also extended from the second viscosity portion 212.Warpage portion 22 can think viscosity, also can be for inviscid.In the present embodiment, warpage portion 22 is inviscid.After welding process finishes, user can remove high temperature pad pasting 20 by warpage portion 22 from upper cover.
High temperature pad pasting 20 can adopt Furtulon high temperature pad pasting, high-temperature masking paper self-adhesive tape, the green high temperature pad pasting of PET, high temperature double faced adhesive tape etc.Wherein, viscosity portion 21 has viscous layer, and non-sticky portion 23 does not have viscous layer, and warpage portion 22 can toughness layer, also can not have viscous layer.Certainly, viscosity portion, non-sticky portion and warpage portion also can adopt the various material that viscosity is different, as long as can realize incomplete sealing, can make intracavity gas discharge, and can implement.
On of the present utility model, cover the high temperature pad pasting that is coated with incomplete sealing, can be when preventing that foreign material from entering microphone host cavity, effectively will accommodate intracavity gas discharges, while preventing Reflow Soldering, temperature raise, the too high rupture of diaphragm that causes MEMS Die of air pressure, and then cause microphone to lose efficacy.
The foregoing is only better embodiment of the present utility model; protection range of the present utility model is not limited with above-mentioned execution mode; in every case the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or is changed, and all should include in the protection range of recording in claims.
Claims (6)
1. an Electret Condencer Microphone, comprise upper cover, base plate, and the sidewall that connects upper cover and base plate, acoustic-electric transducing chip is installed in host cavity, on cover and be provided with tone-entering hole, on cover the high temperature pad pasting that has been sticked, it is characterized in that: described high temperature pad pasting comprises for the viscosity portion fixing with upper cover and the non-sticky portion being connected with viscosity portion, described non-sticky portion is covered on tone-entering hole.
2. Electret Condencer Microphone according to claim 1, is characterized in that: described viscosity portion comprises by separated the first viscosity portion of non-sticky portion and the second viscosity portion.
3. Electret Condencer Microphone according to claim 2, is characterized in that: described high temperature pad pasting is also provided with from viscosity portion edge extended warpage portion, and the relative upper cover of warpage portion is upward to extension.
4. Electret Condencer Microphone according to claim 3, is characterized in that: described warpage portion does not have viscosity.
5. according to the Electret Condencer Microphone described in claim 1-4 any one, it is characterized in that: high temperature pad pasting is wherein a kind of of the green high temperature pad pasting of Furtulon high temperature pad pasting, high-temperature masking paper self-adhesive tape, PET, high temperature double faced adhesive tape.
6. Electret Condencer Microphone according to claim 5, is characterized in that: described viscosity portion has viscous layer, and described non-sticky portion does not have viscous layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320387399.4U CN203407015U (en) | 2013-07-02 | 2013-07-02 | Condenser microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320387399.4U CN203407015U (en) | 2013-07-02 | 2013-07-02 | Condenser microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203407015U true CN203407015U (en) | 2014-01-22 |
Family
ID=49942933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320387399.4U Expired - Fee Related CN203407015U (en) | 2013-07-02 | 2013-07-02 | Condenser microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203407015U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106412781A (en) * | 2015-02-17 | 2017-02-15 | 美商楼氏电子有限公司 | Use microphone subassembly of boundary belt |
| WO2020062469A1 (en) * | 2018-09-27 | 2020-04-02 | 北京小米移动软件有限公司 | Microphone module and electronic device |
-
2013
- 2013-07-02 CN CN201320387399.4U patent/CN203407015U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106412781A (en) * | 2015-02-17 | 2017-02-15 | 美商楼氏电子有限公司 | Use microphone subassembly of boundary belt |
| WO2020062469A1 (en) * | 2018-09-27 | 2020-04-02 | 北京小米移动软件有限公司 | Microphone module and electronic device |
| US10834490B2 (en) | 2018-09-27 | 2020-11-10 | Beijing Xiaomi Mobile Software Co., Ltd. | Microphone module, electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170428 Address after: Singapore Ang Mo Kio 65 Street No. 10 techpoint Building 1 floor, No. 8 Patentee after: AAC Technologies (Singapore) Co., Ltd. Address before: 518057 Guangdong Province, Shenzhen City Southern District of Nanshan District high tech Zone Three Road No. 6 Shenzhen Yuexing Nanjing University research base A Acoustic Technologies Patentee before: AAC Acoustic Technologies (Shenzhen) Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20210702 |