CN203406311U - 一种硅光电二极管 - Google Patents

一种硅光电二极管 Download PDF

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Publication number
CN203406311U
CN203406311U CN201320511500.2U CN201320511500U CN203406311U CN 203406311 U CN203406311 U CN 203406311U CN 201320511500 U CN201320511500 U CN 201320511500U CN 203406311 U CN203406311 U CN 203406311U
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崔峰敏
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OD TECH SEMICONDUCTORS (NANJING) Co Ltd
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OD TECH SEMICONDUCTORS (NANJING) Co Ltd
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Abstract

一种硅光电二极管,低掺杂的正方体N型硅晶片上设有高掺杂的P型硅层,形成P+N结,所述高掺杂的P型硅层为圆角长方体,所述低掺杂的正方体N型硅晶片的外周设有高掺杂的N型硅环,高掺杂的N型硅环和高掺杂的P型硅层之间隔着低掺杂的N型硅层,所述高掺杂的P型硅层厚度为200±5μm,P型硅层上表面设有氮化硅膜,在P型硅层中心部位的氮化硅膜上开有圆形接触孔,接触孔内贴附有金属AL作为阳极,N型硅晶片的背面积淀金属Au膜作为阴极;所述低掺杂的正方体N型(N-)硅晶片边长为0.61mm,厚度为275-285μm,电阻率为1200-4000Ω·cm。本实用新型的反向击穿电压高于30V,暗电流小于5nA。

Description

一种硅光电二极管
技术领域
本实用新型涉及一种硅光电二极管。
背景技术
光电二极管是一种将光能转换为电能的半导体器件,光电二极管在反向电压作用下工作,在光照时产生光电流。当无光照时,和普通二极管一样,其反向电流很小,称为暗电流;有光照时,反向电流迅速增大到几十微安,称为亮电流。光的强度越大,反向电流也越大。 影响反向击穿电压的因素有杂质浓度、半导体薄层厚度,反向击穿电压还与PN结点形状、表面状况及材料结构等诸多因素有关。
发明内容
本实用新型的目的在于,提供一种反向击穿电压高于30V,暗电流小于5nA的硅光电二极管。
实现本实用新型的技术方案是:一种硅光电二极管,低掺杂的正方体N型(N-)硅晶片上设有高掺杂的P型(P+)硅层,形成P+N结,所述高掺杂的P型(P+)硅层为圆角长方体,所述低掺杂的正方体N型(N-)硅晶片的外周设有高掺杂的N型(N+)硅环,高掺杂的N型(N+)硅环和高掺杂的P型(P+)硅层之间隔着低掺杂的N型(N-)硅层,所述高掺杂的P型(P+)硅层厚度为200±5μm ,P型(P+)硅层上表面设有氮化硅膜,在P型(P+)硅层中心部位的氮化硅膜上开有圆形接触孔,接触孔内贴附有金属AL作为阳极, N型(N-)硅晶片的背面积淀金属Au膜作为阴极;所述低掺杂的正方体N型(N-)硅晶片边长为0.61mm,厚度为275-285μm,电阻率为1200-4000Ω·cm。
作为本实用新型的进一步改进,所述金属AL的厚度为1.8-2.2㎛,所述金属Au膜的厚度为0.1㎛,优化硅光电二极管芯片的接触性能。
作为本实用新型的进一步改进,所述N型(N+)硅环和 P型(P+)硅层之间的N型(N-)硅层四角为圆角,减小暗电流。
本实用新型采用低掺杂高电阻率的长方体N型(N-)硅晶片作为基片,提高反向击穿电压。采用高掺杂的N型(N+)保护环,减小暗电流。
附图说明
图1是本实用新型实施例1硅光电二极管正面结构示意图;
图2是本实用新型实施例1硅光电二极管侧面剖视图。
具体实施方式
下面结合实施例和附图做进一步说明。
实施例1
如图1和图2所示,一种硅光电二极管10,在电阻率为1200-4000Ω·cm,厚度为275-285μm,长宽为0.68mm×0.68mm的低掺杂N型正方形晶片1上,设有厚度为200±5μm的圆角正方体的高掺杂的P型(P+)硅层2,低掺杂N型长方形晶片1的周边还设有厚度为200±5μm的高掺杂的N型(N+)硅环3,高掺杂的N型(N+)硅环和高掺杂P型(P+)硅层之间隔着N型(N-)硅层4。
硅晶片上表面设有氮化硅硅膜5。P型(P+)硅层上表面中心部位的氮化硅膜上的开有圆形接触孔6,接触孔内贴附有金属AL膜作为阳极7, 金属AL膜厚度为1.8-2.2㎛,N型(N-)硅晶片的背面积淀金属Au膜作为阴极8,金属Au膜厚度为0.1μm。
本实施例的硅光电二极管反向击穿电压高于30V,暗电流小于5nA

Claims (2)

1.一种硅光电二极管,低掺杂的正方体N型硅晶片上设有高掺杂的P型硅层,形成P+N结,所述高掺杂的P型硅层为圆角长方体,所述低掺杂的正方体N型硅晶片的外周设有高掺杂的N型硅环,高掺杂的N型硅环和高掺杂的P型硅层之间隔着低掺杂的N型硅层,其特征是,所述高掺杂的P型硅层厚度为200±5μm ,P型硅层上表面设有氮化硅膜,在P型硅层中心部位的氮化硅膜上开有圆形接触孔,接触孔内贴附有金属AL作为阳极,N型硅晶片的背面积淀金属Au膜作为阴极;所述低掺杂的正方体N型硅晶片边长为0.61mm,厚度为275-285μm,电阻率为1200-4000Ω·cm。
2.根据权利要求1所述的硅光电二极管,其特征是,所述金属AL的厚度为2㎛,所述金属Au膜的厚度为0.1㎛。
CN201320511500.2U 2013-08-20 2013-08-20 一种硅光电二极管 Expired - Fee Related CN203406311U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112071923A (zh) * 2020-09-17 2020-12-11 京东方科技集团股份有限公司 摄像系统、光探测器及光电二极管

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112071923A (zh) * 2020-09-17 2020-12-11 京东方科技集团股份有限公司 摄像系统、光探测器及光电二极管

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