CN203399410U - Power inductive piece of rigid-flexible printed circuit board - Google Patents
Power inductive piece of rigid-flexible printed circuit board Download PDFInfo
- Publication number
- CN203399410U CN203399410U CN201320212226.9U CN201320212226U CN203399410U CN 203399410 U CN203399410 U CN 203399410U CN 201320212226 U CN201320212226 U CN 201320212226U CN 203399410 U CN203399410 U CN 203399410U
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- printed circuit
- circuit board
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- laminate
- flexible printed
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Abstract
A power inductive piece of a rigid-flexible printed circuit board is characterized in that: included are the printed circuit board and a coil wound on the printed circuit board, wherein circuit connection is realized between the coil and the printed circuit board through via holes, and leading-out pad contacts are arranged at the two ends of the coil respectively for achieving connection with external equipment. The rigid-flexible printed circuit board adopts a multiple layer board structure and realizes the electro-magnetic induction function by a via hole connection mode, so that the rigid-flexible printed circuit board is advantaged by small size, light weight, small thickness, and long service life; the rigid-flexible printed circuit board can be directly installed inside an SIM card, an SD card , or other intelligent cards; the magnetic line induction direction is transferred; the inconvenience brought by installation operation is reduced; and the defects of battery source interferences, insufficient penetration power, and low environment adaptability existed in a mobile payment antenna under a work frequency of 13.56 MHz are effectively solved.
Description
Technical field
The utility model relates to wireless communication technique, relates in particular to a kind of power inductance sheet of hard and soft printed circuit board.
Technical background
Near field communication (NFC) NFC (Near Field Communication) is developed by non-contact radio-frequency identification (RFID) and the Technology Integration that interconnects, and NFC is mainly used in gate inhibition, public transport, mobile-phone payment, electronic bill, to fields such as message reference in equation communication and movement, contact type intelligent card and smart card readers.In NFC electric terminal, the performance of power inductance sheet is determining the performance of near-field communication distance and NFC electric terminal complete machine.In order to guarantee operating distance and every vehicles that have railway guidance and carrying of near-field communication, as railway, subway, other performance requirement of light rail, the power inductance sheet of current NFC terminal adopts multiturn planar coil antenna to be wound on the structure on printed circuit board (PCB) conventionally.Yet, in order to reach the operating distance of present card reading antennas, need to be by the size design of aerial coil to relatively large.Do not meet the development trend of miniaturization electronic product.
Because of existing wireless telecommunications induction, to pay antenna installation dimension large, unsuitable I&M during use, and perishable during operation, the defect such as product useful life is short.
Utility model content
The purpose of this utility model is to provide a kind of and has that volume is little, lightweight, thin thickness, long service life, can be directly installed on the smartcard internal such as SIM or SD, reduce the inconvenience that fitting operation brings, and realize close range wireless communication function, improve the defect that mobile payment induction antenna exists completely.
To achieve these goals, the utility model provides a kind of power inductance sheet of hard and soft printed circuit board, it is characterized in that: comprise a printed circuit board and be wrapped in the coil on printed circuit board, between coil and printed circuit board, by via, realize circuit and be connected, the two ends of described coil are respectively equipped with draws pad contact and is connected with external equipment.
Wherein, preferred version is: described printed circuit board comprises the first laminate, the second laminate and central core, wherein the first laminate, the second laminate are distributed in respectively the levels of central core, and described ground floor, the second laminate are coated in respectively FR-4 layer, metallic copper conductor layer, the coverlay of the upper and lower surface of central core successively.
Wherein, preferred version is: described central core is that the center-filled of BT resin has a ferrite.
Wherein, preferred version is: the thickness of described FR-4 layer, metallic copper conductor layer, coverlay is respectively: 75 microns, 50 microns, 0.0275mm.
Wherein, preferred version is: between described metallic copper conductor layer and coverlay, comprise one gold medal/nickel dam, thickness is 3-5 micron.
Wherein, preferred version is: described coverlay is polyimide film.
Advantage of the present utility model is: because the utility model adopts Multilayer Structure and by via connected mode, realizes function of electromagnetic induction.This product has advantages of that volume is little, lightweight, thin thickness, long service life, and can be directly installed on the smartcard internal such as SIM or SD, reduces the inconvenience that fitting operation brings, and improves the defect that mobile payment induction antenna exists completely.
Accompanying drawing explanation
Fig. 1 a is the front elevation of the power inductance sheet of a kind of hard and soft printed circuit board of the utility model.
Fig. 1 b is the reverse side figure of the power inductance sheet of a kind of hard and soft printed circuit board of the utility model.
Fig. 2 is the structural representation of printed circuit board 10 of the power inductance sheet of a kind of hard and soft printed circuit board of the utility model.
Fig. 3 a-3b is the manufacturing process of printed circuit board 10 of the power inductance sheet of a kind of hard and soft printed circuit board of the utility model.
Embodiment
Below in conjunction with accompanying drawing, describe embodiment of the present utility model in detail.
Fig. 1 a, Fig. 1 b are the schematic diagram of structure of the power inductance sheet of the hard and soft printed circuit board of the utility model, as shown in Figure 1 a, 1 b: the power inductance sheet 1 of hard and soft printed circuit board comprises a printed circuit board 10 and is wrapped in the coil 20 on printed circuit board 10, between coil 20 and printed circuit board 10, switch on and be connected, described coil 20 two ends are respectively equipped with draws solder joint 30 and is connected with external equipment.
Wherein, described printed circuit board 10 is double layer printed circuit plate, as shown in Figure 2: wherein said printed circuit board 10 comprises the first laminate 11, the second laminate 12 and central core 13, wherein the first laminate 11, the second laminate 12 are distributed in respectively the levels of central core 13.
Wherein, described central core 13 is for the center-filled of resin has a ferrite, and its thickness is 0.27mm, and this central core 13 is realized the effect of electromagnetic induction by ferrite.Wherein base material is BT resin base material.
Wherein, 11 of described the first laminates are coated in FR-4 (epoxy glass fabric insulation board) layer of the upper surface of central core 13 successively, thickness: 75 microns, metallic copper conductor layer, and its thickness is: 50 microns; Gold/nickel dam on metallic copper conductor layer; thickness is the coverlay on 3-5 micron and one gold medal/nickel dam; its thickness is 0.0275mm, wherein, by FR-4 layer, described central core 13 and metallic copper conductor layer is separated; metallic copper conductor layer plays conducting function layer; gold/nickel dam is for being welded to connect layer, and described coverlay gets up described metallic copper wire-protecting, plays anti-welding insulating effect; wherein, described coverlay is polyimide film.
In like manner the second laminate 12 is consistent with the structure of the first laminate 11, the FR-4 layer of the lower surface of central core 13 successively, thickness: 75 microns; Metallic copper conductor layer on FR-4 layer, its thickness is: 50 microns; Gold/nickel dam on metallic copper conductor layer, thickness is the coverlay on 3-5 micron and one gold medal/nickel dam, its thickness is 0.0275mm.
Fig. 3 a-3b is the manufacturing process of the utility model printed circuit board 10, as shown in Figure 3 a: first in the Wa Yi hole, center 131 of the BT of central core 13 resin, described ferrite is filled in the centre bore 131 of described BT resin, thereby forms the effect that realizes electromagnetic induction by ferrite; Then in the levels of central core 13, distinguish the first laminate 11, the second laminate 12 on cloth respectively, described the first laminate 11 is consistent with the structure of the second laminate 12.
As shown in Figure 3 b, the manufacture method of the first laminate 11 is: the FR-4 layer of 75 microns of cloth last layers first on the BT of central core 13 resin bed, it at described FR-4 layer cloth last layer thickness, is then the metallic copper conductor layer of 50 microns, then on described metallic copper conductor layer, brush gold/nickel dam that a layer thickness is 3-5 micron, finally on described one gold medal/nickel dam, brush the coverlay that a layer thickness is 0.0275mm, prevent that non-weld zone from exposing.
In like manner, the second laminate 12 is consistent with the preparation method of the first laminate 11, at this, is not repeated.
The preparation technology who is the power inductance sheet of the hard and soft printed circuit board of the utility model as Fig. 4 a-4b is: will on the above-mentioned printed circuit board making 10, have the via hole 40 of arrangement, by described via hole 40 winding arounds 20, described coil 20 is realized circuit coiling by via hole 40 and is connected, and forms electromagnetic induction element.
Wherein, the gold/nickel dam in the utility model can omit, can be by metallic copper conductor layer directly as solder joint articulamentum, realize and the circuit of other couplings of outside is connected, for example, impedance circuit or put dot circuit.
The utility model has the advantage of: the connected mode because the utility model adopts Multilayer Structure and adopts via, realizes electromagnetic induction effect.And have advantages of that volume is little, lightweight, thin thickness, long service life, and can be directly installed on the smartcard internal such as SIM or SD, reduce the inconvenience that fitting operation brings, improve induction completely and pay the defect that antenna exists.
As described above, be only the utility model most preferred embodiment, and not for limiting scope of the present utility model, all equivalences of doing according to the utility model claim change or modify, and are all the utility model and contain.
Claims (6)
1. the power inductance sheet of a hard and soft printed circuit board, it is characterized in that: comprise a printed circuit board and be wrapped in the coil on printed circuit board, between coil and printed circuit board, by through hole, realize circuit and be connected, the two ends of described coil are respectively equipped with draws pad contact and is connected with external equipment.
2. the power inductance sheet of hard and soft printed circuit board as claimed in claim 1, it is characterized in that: described printed circuit board comprises the first laminate, the second laminate and central core, wherein the first laminate, the second laminate are distributed in respectively the levels of central core, and described ground floor, the second laminate are coated in respectively FR-4 layer, metallic copper conductor layer, the coverlay of the upper and lower surface of central core successively.
3. the power inductance sheet of hard and soft printed circuit board as claimed in claim 2, is characterized in that: described central core is that the center-filled of BT resin has a ferrite.
4. the power inductance sheet of hard and soft printed circuit board as claimed in claim 2, is characterized in that: the thickness of described FR-4 layer, metallic copper conductor layer, coverlay is respectively: 75 microns, 50 microns, 0.0275mm.
5. the power inductance sheet of hard and soft printed circuit board as claimed in claim 4, is characterized in that: between described metallic copper conductor layer and coverlay, comprise one gold medal/nickel dam, thickness is about 3-5 micron.
6. the power inductance sheet of hard and soft printed circuit board as described in claim 4 or 5, is characterized in that: described coverlay is polyimide film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320212226.9U CN203399410U (en) | 2013-04-22 | 2013-04-22 | Power inductive piece of rigid-flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320212226.9U CN203399410U (en) | 2013-04-22 | 2013-04-22 | Power inductive piece of rigid-flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203399410U true CN203399410U (en) | 2014-01-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320212226.9U Expired - Fee Related CN203399410U (en) | 2013-04-22 | 2013-04-22 | Power inductive piece of rigid-flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203399410U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260354A (en) * | 2013-04-22 | 2013-08-21 | 深圳市实佳电子有限公司 | Power inductive chip of rigid and soft printed circuit board and preparation method thereof |
-
2013
- 2013-04-22 CN CN201320212226.9U patent/CN203399410U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260354A (en) * | 2013-04-22 | 2013-08-21 | 深圳市实佳电子有限公司 | Power inductive chip of rigid and soft printed circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140115 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |