CN203392174U - Packaging structure of flexible circuit boards - Google Patents
Packaging structure of flexible circuit boards Download PDFInfo
- Publication number
- CN203392174U CN203392174U CN201320373903.5U CN201320373903U CN203392174U CN 203392174 U CN203392174 U CN 203392174U CN 201320373903 U CN201320373903 U CN 201320373903U CN 203392174 U CN203392174 U CN 203392174U
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- packaging structure
- flexible circuit
- flexible pcb
- utility
- model
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Abstract
The utility model provides a packaging structure of flexible circuit boards. The packaging structure comprises a plurality of single flexible circuit board pieces and also comprises a layer of microviscous film, wherein the single flexible circuit board pieces are bonded on the microviscous film. The packaging structure provided by the utility model has the beneficial effects that the single flexible circuit board pieces can be put in a plastic absorbing box without the need of a large quantity of staffs, so that the packaging efficiency is high; due to no need of using the plastic absorbing box, the packaging cost is lower; the problem of wrong counting in manual operation is solved.
Description
Technical field
The utility model relates to flexible PCB packing technique.
Background technology
Existing flexible PCB all adopts vacuum formed box to pack, during production, FPC (FPC) need be die-cut into single-piece, then by manually single-piece FPC being placed in vacuum formed box as shown in Figure 1, finally the vacuum formed box that flexible PCB is housed is carried out to packed packing.
The problem that existing flexible PCB vacuum formed box manner of packing causes is:
1, need to arrange a large amount of personnel that single-piece flexible circuit board is put in vacuum formed box, packaging efficiency is low;
2,, because needs are used vacuum formed box, this is higher to produce life;
While 3, arranging manually to count, the situation due to the wrong number of manual operation meeting existence point, can cause customer complaint.
Utility model content
For this reason, the utility model, for overcoming above-mentioned the deficiencies in the prior art, provides a kind of flexible PCB packaging structure.
The utility model is realized the technical scheme that goal of the invention adopts, and a kind of flexible PCB packaging structure, comprises a plurality of flexible PCB single-pieces, also comprises the micro-mucous membrane of one deck, and described a plurality of flexible PCB single-pieces stick on described micro-mucous membrane.
Preferably, flexible PCB packaging structure also comprises layer protecting film, and described protective film is overlying on described a plurality of flexible PCB single-piece.
The beneficial effects of the utility model are: do not need to arrange a large amount of personnel that single-piece flexible circuit board is put in vacuum formed box, packaging efficiency is high; Owing to not needing to use vacuum formed box, this is lower to pack life; The Problem-Error of counting having existed while having avoided manual operation.
Accompanying drawing explanation
Fig. 1 is the constructional drawing of vacuum formed box.
The constructional drawing of Fig. 2 embodiment flexible PCB packaging structure
The specific embodiment
Below, by reference to the accompanying drawings the utility model is described in detail.
With reference to accompanying drawing 2; Fig. 2 is the constructional drawing of the present embodiment flexible PCB packaging structure; a kind of flexible PCB packaging structure; comprise a plurality of flexible PCB single-pieces 1, micro-mucous membrane 2 and protective film 3; a plurality of flexible PCB single-pieces 1 stick on micro-mucous membrane 2, and protective film 3 is overlying on a plurality of flexible PCB single-pieces 1.
The present embodiment is in packaging process, first on whole board flexible circuit panel products, increase one-step punching location, FPC subregion is carried out die-cut, the more micro-mucous membrane of the one deck of fitting, utilizes again forming technique to get rid of waste material and a plurality of flexible PCB single-pieces 1 is adhered fixed on micro-mucous membrane simultaneously.Die-cut employing face goes out mode; once can be die-cut a plurality of; stick the rear a plurality of FPC single-pieces 1 of micro-mucous membrane 2 and still become whole board status, FPC single-piece is stayed on micro-mucous membrane 2 by layout mode, then 3 pairs of FPC single-pieces 1 of compound layer protecting film are protected.
The beneficial effects of the utility model are: do not need to arrange a large amount of personnel that single-piece flexible circuit board is put in vacuum formed box, packaging efficiency is high; Owing to not needing to use vacuum formed box, this is lower to pack life; The Problem-Error of counting having existed while having avoided manual operation.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (2)
1. a flexible PCB packaging structure, comprises a plurality of flexible PCB single-pieces, it is characterized in that: also comprise the micro-mucous membrane of one deck, described a plurality of flexible PCB single-pieces stick on described micro-mucous membrane.
2. flexible PCB packaging structure according to claim 1, is characterized in that: also comprise layer protecting film, described protective film is overlying on described a plurality of flexible PCB single-piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320373903.5U CN203392174U (en) | 2013-06-27 | 2013-06-27 | Packaging structure of flexible circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320373903.5U CN203392174U (en) | 2013-06-27 | 2013-06-27 | Packaging structure of flexible circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203392174U true CN203392174U (en) | 2014-01-15 |
Family
ID=49903723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320373903.5U Expired - Lifetime CN203392174U (en) | 2013-06-27 | 2013-06-27 | Packaging structure of flexible circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203392174U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105644829A (en) * | 2016-02-24 | 2016-06-08 | 深圳市景旺电子股份有限公司 | Packaging method for small-size PCBs |
| CN114229084A (en) * | 2021-11-26 | 2022-03-25 | 珠海和正柔性线路板有限公司 | Whole circuit board packaging process |
-
2013
- 2013-06-27 CN CN201320373903.5U patent/CN203392174U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105644829A (en) * | 2016-02-24 | 2016-06-08 | 深圳市景旺电子股份有限公司 | Packaging method for small-size PCBs |
| CN114229084A (en) * | 2021-11-26 | 2022-03-25 | 珠海和正柔性线路板有限公司 | Whole circuit board packaging process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140115 |
|
| CX01 | Expiry of patent term |