CN203380147U - Cleaning device and detection machine table - Google Patents
Cleaning device and detection machine table Download PDFInfo
- Publication number
- CN203380147U CN203380147U CN201320456572.1U CN201320456572U CN203380147U CN 203380147 U CN203380147 U CN 203380147U CN 201320456572 U CN201320456572 U CN 201320456572U CN 203380147 U CN203380147 U CN 203380147U
- Authority
- CN
- China
- Prior art keywords
- cleaning device
- cleaning rod
- cleaning
- rod
- alignment tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a cleaning device and a detection machine table. The cleaning device comprises a cleaning rod, an air pipe and a fixed arm. One end of the air pipe is arranged in the cleaning rod, the other end of the air pipe is connected with an air supply unit, the cleaning rod is connected with the fixed arm, a through hole is formed in the cleaning rod, and the detection machine table comprises the cleaning device. When a semiconductor wafer is placed on an alignment table for alignment, the cleaning device is used for blowing air to the surface of the semiconductor wafer for cleaning, and therefore particles on the surface of the semiconductor wafer are reduced, and accuracy of a detection result is improved. Due to the fact that the semiconductor wafer is cleaned when the wafer is placed on the alignment table for alignment, extra cleaning time is not needed, detection time is shortened, and production efficiency is improved.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of cleaning device and detects board.
Background technology
In the semiconductor crystal wafer manufacture process, need to after different process, to semiconductor crystal wafer, be detected, for example detect and whether have particle contamination.Because particle contamination is very big on the yield impact of semiconductor crystal wafer, if particle contamination is serious, probably directly cause scrapping of semiconductor crystal wafer, therefore accurately and timely check that for producing qualified semiconductor crystal wafer vital effect is arranged.
In prior art, usually use detection board (Inspection Tool) to carry out the particle contamination detection to semiconductor crystal wafer, there is too granose pollution if detect semiconductor crystal wafer, need semiconductor crystal wafer is carried out to corresponding remedial measure, and find the reason of particle contamination, corresponding processing step is improved.Yet, the surface particles (Surface particle) that semiconductor crystal wafer tends to be brought by external environment or board etc. in the processes such as transmission, placement is polluted, surface particles is not to be produced by processing step, while after to a certain processing step, carrying out particle detection, thereby these particles that produced by the external world just can change the result impact judgement whether qualified to processing step of detection.
Please refer to Fig. 1, while usually carrying out particle detection, semiconductor crystal wafer 20 is sent to while detecting board 10, first on alignment tool 30 surfaces, places and is aimed at, and is resent to afterwards and detects board 10 inside, and it is detected.As above making referrals to; because surface particles can impact testing result; in prior art in order to address the above problem; can after detecting for the first time, be cleared up the surface of described semiconductor crystal wafer 20 by artificial use air gun semiconductor crystal wafer 20; after removing described surface particles, by described detection board 10, detected for the second time again, to obtain testing result more accurately.
Yet, manually described semiconductor crystal wafer is cleared up to process and extremely expend time in, affect production capacity, do not meet the requirement of manufacturing enterprise.So, how to solve and remove described semiconductor wafer surface particle and comparison timesaving problem, become those skilled in the art and be badly in need of the technical problem solved.
The utility model content
The purpose of this utility model is to provide a kind of cleaning device and detects board, for clearing up the surface particles of semiconductor crystal wafer, makes testing result more.
To achieve these goals, the utility model proposes a kind of cleaning device, for clearing up the surface particles of semiconductor crystal wafer, it is characterized in that, comprising:
Cleaning rod, tracheae and fixed arm; One end of described tracheae is arranged in described cleaning rod; The other end of described tracheae connects air supply unit; Described cleaning rod is connected with described fixed arm; Described cleaning rod is provided with through hole.
Further, in described cleaning device, described cleaning rod is hollow or is provided with some apertures.
Further, in described cleaning device, the material of described cleaning rod is safety glass.
Further, in described cleaning device, described cleaning rod is cuboid or cylinder.
Further, in described cleaning device, the length range of described cleaning rod is 240mm～300mm.
Further, in described cleaning device, the material of described fixed arm is aluminium.
The utility model also proposes a kind of detection board, and described detection board comprises:
Detection chambers, cleaning device and alignment tool; Described alignment tool is fixed in described detection chambers, and described cleaning device is fixed on described alignment tool, and wherein, described cleaning device is used as described above any one, and described cleaning rod is provided with a side of through hole to described alignment tool.
Further, in described detection board, described cleaning rod is 3cm～10cm from the distance range on alignment tool surface.
Compared with prior art, the beneficial effects of the utility model are mainly reflected in: when semiconductor crystal wafer is placed on alignment tool, carry out on time, use cleaning device to carry out the air-blowing cleaning to described semiconductor wafer surface, thereby reduce at the semiconductor wafer surface particle, increase the accuracy of testing result, and due to be at alignment tool to just semiconductor crystal wafer being cleared up on time, can additionally not take clearance time, shorten the time of detecting, improved production efficiency.
The accompanying drawing explanation
Fig. 1 is that in prior art, semiconductor crystal wafer is placed on the structural representation detected in board;
The structural representation that Fig. 2 is cleaning device in an embodiment;
Fig. 3 is that in an embodiment, semiconductor crystal wafer is placed on the structural representation detected in board.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, cleaning device and the detection board the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
Please refer to Fig. 2, in the present embodiment, propose a kind of cleaning device 200, for clearing up the surface particles of semiconductor crystal wafer, comprising:
In the present embodiment, the material of described cleaning rod 210 is safety glass, described cleaning rod 210 is cuboid or cylinder, the scope of its length L is 240mm～300mm, for example 260mm, because described semiconductor die diameter of a circle is 300mm, in order to clear up better the surface of described semiconductor crystal wafer, select the undersized of cleaning rod 210 length to get final product in described semiconductor die diameter of a circle; The material of described fixed arm 220 is aluminium.
In the present embodiment, also propose a kind of detection board, use cleaning device 200 as described above, as shown in Figure 3, described detection board comprises:
In the present embodiment, described cleaning rod 210 is 3cm～10cm from the distance H scope on described alignment tool 300 surfaces, for example 5cm, highly too low, clean air can't be cleared up the edge of described semiconductor crystal wafer 400, if excessive height, can cause clean air can't clean neatly the surface of described semiconductor crystal wafer 400.
While being transferred in described detection board due to described semiconductor crystal wafer 400, need first on described alignment tool 300, to be aimed at, be generally about 1 minute, now use described cleaning device to be cleared up described semiconductor crystal wafer 400, can remove in described semiconductor crystal wafer 400 surface particles, thereby can be in the not extra time-consuming while, cleaning is in described semiconductor crystal wafer 400 surface particles.
To sum up, in the cleaning device provided at the utility model embodiment and detection board, when being placed on alignment tool, semiconductor crystal wafer carries out on time, use cleaning device to carry out the air-blowing cleaning to described semiconductor wafer surface, thereby reduce at the semiconductor wafer surface particle, increase the accuracy of testing result, and owing to being to just semiconductor crystal wafer being cleared up on time at alignment tool, can additionally not take clearance time, shorten the time of detecting, improve production efficiency.
Above are only preferred embodiment of the present utility model, the utility model is not played to any restriction.Any person of ordinary skill in the field; in the scope that does not break away from the technical solution of the utility model; the technical scheme that the utility model is disclosed and technology contents are made any type of changes such as replacement or modification that are equal to; all belong to the content that does not break away from the technical solution of the utility model, within still belonging to protection domain of the present utility model.
Claims (8)
1. a cleaning device, for clearing up the surface particles of semiconductor crystal wafer, is characterized in that, comprising:
Cleaning rod, tracheae and fixed arm; One end of described tracheae is arranged in described cleaning rod; The other end of described tracheae connects an air supply unit; Described cleaning rod is connected with described fixed arm; Described cleaning rod is provided with through hole.
2. cleaning device as claimed in claim 1, is characterized in that, described cleaning rod is hollow or is provided with some apertures.
3. cleaning device as claimed in claim 2, is characterized in that, the material of described cleaning rod is safety glass.
4. cleaning device as claimed in claim 3, is characterized in that, described cleaning rod is cuboid or cylinder.
5. cleaning device as claimed in claim 4, is characterized in that, the length range of described cleaning rod is 240mm～300mm.
6. cleaning device as claimed in claim 1, is characterized in that, the material of described fixed arm is aluminium.
7. one kind is detected board, it is characterized in that, described detection board comprises:
Detection chambers, cleaning device and alignment tool; Described alignment tool is fixed in described detection chambers, and described cleaning device is fixed on described alignment tool, and wherein, described cleaning device is as any one cleaning device in claim 1 to 6, and described cleaning rod is provided with a side of through hole to described alignment tool.
8. detection board as claimed in claim 7, is characterized in that, described cleaning rod is 3cm～10cm from the distance range on alignment tool surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320456572.1U CN203380147U (en) | 2013-07-29 | 2013-07-29 | Cleaning device and detection machine table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320456572.1U CN203380147U (en) | 2013-07-29 | 2013-07-29 | Cleaning device and detection machine table |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203380147U true CN203380147U (en) | 2014-01-08 |
Family
ID=49868676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320456572.1U Expired - Lifetime CN203380147U (en) | 2013-07-29 | 2013-07-29 | Cleaning device and detection machine table |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203380147U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106040668A (en) * | 2016-05-27 | 2016-10-26 | 京东方科技集团股份有限公司 | Dedusting device used for display screen, dedusting method and corresponding display device |
| CN110314897A (en) * | 2018-03-30 | 2019-10-11 | 长鑫存储技术有限公司 | Wafer stack-aligned measuring equipment and its method for measurement |
-
2013
- 2013-07-29 CN CN201320456572.1U patent/CN203380147U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106040668A (en) * | 2016-05-27 | 2016-10-26 | 京东方科技集团股份有限公司 | Dedusting device used for display screen, dedusting method and corresponding display device |
| US10722924B2 (en) | 2016-05-27 | 2020-07-28 | Boe Technology Group Co., Ltd. | Dust removal device for a display screen, dust removal method and corresponding display device |
| CN110314897A (en) * | 2018-03-30 | 2019-10-11 | 长鑫存储技术有限公司 | Wafer stack-aligned measuring equipment and its method for measurement |
| CN110314897B (en) * | 2018-03-30 | 2023-08-22 | 长鑫存储技术有限公司 | Wafer lamination alignment measuring device and measuring method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202683514U (en) | Dust removal mechanism of board surface cleaner | |
| CN103028570A (en) | Intelligent robot cleaning center | |
| CN102649625A (en) | Method for cleaning glass substrate for coating | |
| CN203380147U (en) | Cleaning device and detection machine table | |
| CN204122436U (en) | Semiconductor dust arrester | |
| CN203485548U (en) | Printing machine with temporary storage positioning function | |
| CN105236720A (en) | Glass cutting device | |
| CN204714065U (en) | A kind of glass lower piece table | |
| CN203389893U (en) | Dust removal multipurpose machine | |
| CN202715969U (en) | Laser drilling machine workbench | |
| CN202634890U (en) | Antioxidant production line of printed circuit board | |
| CN203181422U (en) | OSP plate producing device | |
| CN102358517B (en) | Assisting method for absorbing glass substrate | |
| CN104175733A (en) | Glass printing technology | |
| CN104407498A (en) | Method for treating photomask contamination particle | |
| CN103737563A (en) | Die maintaining working table | |
| CN203876214U (en) | Novel plastic vacuum forming machine | |
| CN202845378U (en) | Dust removing cabinet of coating line | |
| CN207172129U (en) | A kind of robot terminal motion compensation detection means | |
| CN204339896U (en) | Drilling machine | |
| CN204523673U (en) | The broken film cleaning plant of thin film leftover material | |
| CN204898385U (en) | Filoplume remove device | |
| CN204396385U (en) | A kind of wind is washed suction relaying and is refuted pipe | |
| CN204681660U (en) | A kind of cloth inspecting machine destatic conveying pipeline | |
| CN204637837U (en) | The pre-dust cleaning case of a kind of laser machine of playing a minor role |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140108 |