CN203373144U - Packaging structure for micro electro mechanical system chip - Google Patents
Packaging structure for micro electro mechanical system chip Download PDFInfo
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- CN203373144U CN203373144U CN201320436020.4U CN201320436020U CN203373144U CN 203373144 U CN203373144 U CN 203373144U CN 201320436020 U CN201320436020 U CN 201320436020U CN 203373144 U CN203373144 U CN 203373144U
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- mechanical system
- micro electronic
- electronic mechanical
- system die
- encapsulating structure
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Abstract
The utility model provides a packaging structure for a micro electro mechanical system chip. The packaging structure for the micro electro mechanical system chip comprises the micro electro mechanical system chip, a first protective outer cover base plate, a second protective outer cover base plate and a second electrical connecting part, wherein the micro electro mechanical system chip comprises an upper surface and a lower surface with the back to the upper surface, a mechanical device, a first electrical connecting part and a groove communicated with the mechanical device are arranged on the micro electro mechanical system chip, the first protective outer cover base plate is used in cooperation with the upper surface of the micro electro mechanical system chip to form a cavity, the groove is communicated with the cavity, the second protective outer cover base plate and the lower surface of the micro electro mechanical system chip are in press fit to close the groove, and the second electrical connecting part is arranged on one side of the lower surface of the micro electro mechanical system chip, and is electrically connected with the first electrical connecting part. Compared with the prior art, the mechanical device can be formed in the process of packaging an MEMS wafer, impurities cannot easily enter the mechanical device, and reliability of the packaging structure is ensured.
Description
Technical field
The utility model belongs to field of semiconductor manufacture, relates in particular to a kind of encapsulating structure of Micro Electronic Mechanical System die.
Background technology
Microelectromechanical systems (MEMS---Micro Electro Mechanical systems), be the 21 century cutting edge technology be based upon on micrometer/nanometer technology (micro/nanotechnology) basis, refer to the technology that the micrometer/nanometer material is designed, processes, manufactures, measures and controls.It can be integrated into mechanical component, optical system, driver part, electric-control system the microsystem of an integral unit.This microelectromechanical systems not only can gather, process and transmission information or instruction, can also or take action according to outside instruction according to obtained information independence ground.The manufacturing process that it combines with microelectric technique and micro-processing technology (comprising the technology such as the micro-processing of silicon body, the micro-processing of silicon face, LIGA and bonding chip), produce various excellent performances, cheap, microminiaturized sensor, actuator, driver and micro-system.Microelectromechanical systems (MEMS) is the technology of development in recent years a kind of novel multidisciplinary intersection of getting up, and this technology will produce revolutionary impact to following human lives.
At present, in the encapsulation of existing MEMS, can only the MEMS chip that forms mechanical devices be encapsulated, so, can be caused mechanical devices long period contact external environment, easily sneaked into impurity.
Summary of the invention
The purpose of this utility model is to provide a kind of encapsulating structure of the Micro Electronic Mechanical System die solved the problems of the technologies described above.
Wherein, the encapsulating structure of the Micro Electronic Mechanical System die of the utility model one embodiment comprises:
Micro Electronic Mechanical System die, it comprises that upper surface reaches the lower surface opposing with upper surface, is provided with mechanical devices, the first electrical connector on described chip, and the groove be communicated with described mechanical devices;
The first protection enclosing cover substrate, connect the upper surface of described Micro Electronic Mechanical System die, and coordinate the formation cavity with the upper surface of described Micro Electronic Mechanical System die, and described groove and described cavity are communicated with;
The second protection enclosing cover substrate, with the lower surface pressing of described Micro Electronic Mechanical System die, seal described groove;
The second electrical connector, be arranged at lower surface one side of described Micro Electronic Mechanical System die, and described the second electrical connector is electrically connected described the first electrical connector.
As further improvement of the utility model, in described cavity and described groove, be full of large molecule inert gas is arranged.
As further improvement of the utility model, described the first protection enclosing cover substrate comprises cavity wall, and described cavity wall is connected with the upper surface pressing of described Micro Electronic Mechanical System die.
As further improvement of the utility model, between the upper surface of described cavity wall and described Micro Electronic Mechanical System die, be filled with epoxy resin.
As further improvement of the utility model, described epoxy resin covers described the first electrical connector.
As further improvement of the utility model, the encapsulating structure of described Micro Electronic Mechanical System die also comprises the mask layer of the lower surface that is arranged at described Micro Electronic Mechanical System die, the second protection enclosing cover substrate of described mask layer pressing.
As further improvement of the utility model, between described the second protection enclosing cover substrate and described mask layer, be filled with epoxy resin.
As further improvement of the utility model, deviate from a side of described Micro Electronic Mechanical System die at described the second protection enclosing cover substrate, be coated with insulating barrier.
As further improvement of the utility model, be coated with circuit layer on described insulating barrier, described circuit layer is positioned to described the first electrical connector and described the second electrical connector is electrically connected.
As further improvement of the utility model, the encapsulating structure of described Micro Electronic Mechanical System die also comprises the welding resisting layer that covers described circuit layer.
Compared with prior art, the utility model can carry out forming mechanical devices in encapsulation process to the MEMS wafer, makes mechanical devices be difficult for sneaking into impurity, has guaranteed the reliability of encapsulating structure.
The accompanying drawing explanation
Fig. 1 is the side-looking structural representation of Micro Electronic Mechanical System die encapsulating structure in the utility model encapsulating structure one embodiment;
Fig. 2 is the side-looking structural representation of Micro Electronic Mechanical System die in the utility model encapsulating structure one embodiment;
Fig. 3 is the side-looking structural representation after Micro Electronic Mechanical System die and the first protection enclosing cover substrate pressing in the utility model encapsulating structure one embodiment;
Fig. 4 is that in the utility model encapsulating structure one embodiment, Micro Electronic Mechanical System die and first is carried out the side-looking structural representation that lightening holes exposes the first electrical connector after protecting the pressing of enclosing cover substrate;
Fig. 5 is the side-looking structural representation after Micro Electronic Mechanical System die formation mask layer in the utility model encapsulating structure one embodiment;
Fig. 6 forms the side-looking structural representation of the groove that exposes mechanical devices in Micro Electronic Mechanical System die in the utility model encapsulating structure one embodiment;
Fig. 7 is the mask layer of Micro Electronic Mechanical System die in the utility model encapsulating structure one embodiment and the side-looking structural representation of the second protection enclosing cover substrate pressing;
Fig. 8 is the side-looking structural representation that in the utility model encapsulating structure one embodiment, the second protection enclosing cover contour substrate of Micro Electronic Mechanical System die becomes insulating barrier and circuit layer.
The specific embodiment
Below with reference to the specific embodiment shown in the drawings, the utility model is described in detail.But these embodiments do not limit the utility model, the conversion on the structure that those of ordinary skill in the art makes according to these embodiments, method or function all is included in protection domain of the present utility model.
As shown in Figure 1, in the utility model one embodiment, the encapsulating structure of described Micro Electronic Mechanical System die comprises Micro Electronic Mechanical System die 10.Be provided with mechanical devices 101 in described Micro Electronic Mechanical System die 10.This Micro Electronic Mechanical System die 10 have upper surface and with the opposing lower surface of this upper surface.
Described Micro Electronic Mechanical System die 10 comprises at least one first electrical connector 102 that is arranged at upper surface, for example: weld pad; And be arranged at the groove 104 be communicated with described mechanical devices 101 in this Micro Electronic Mechanical System die 10.
The encapsulating structure of described Micro Electronic Mechanical System die also comprises the first protection enclosing cover substrate 20, and its material can be glass.Wherein, this the first protection enclosing cover substrate 20 comprises cavity wall 201; this cavity wall 201 is connected with the upper surface pressing of Micro Electronic Mechanical System die 10, makes this first protection enclosing cover substrate 20 coordinate with the upper surface of Micro Electronic Mechanical System die 10 and forms cavity 103.Described cavity 103 is communicated with described groove 104.
Preferably, this cavity wall 201 passes through epoxy resin 60 pressings with the upper surface of Micro Electronic Mechanical System die 10, and, after pressing, between the upper surface of described cavity wall 201 and Micro Electronic Mechanical System die 10, is filled with epoxy resin 60.Described epoxy resin 60 covers described the first electrical connector 102.
The encapsulating structure of described Micro Electronic Mechanical System die also comprises the mask layer 30 of the lower surface that is arranged at described Micro Electronic Mechanical System die 10, and protects enclosing cover substrate 40 with second of described mask layer 30 pressings.The described groove 104 of described the second protection enclosing cover substrate 40 sealing.Described the second protection enclosing cover substrate 40 materials can be glass.
Preferably, this second protection enclosing cover substrate 40 passes through epoxy resin 60 and these mask layer 30 pressings, and, after pressing, between described the second protection enclosing cover substrate 40 and described mask layer 30, is filled with epoxy resin 60.
In described cavity 103 and described groove 104, be full of large molecule inert gas is arranged, preferably, this gas is sulfur hexafluoride or xenon.Be filled with large molecule inert gas and can effectively prevent that external gas from entering in cavity, the air-tightness of protection cavity.
Deviate from a side of described Micro Electronic Mechanical System die 10 at described the second protection enclosing cover substrate 40, be coated with insulating barrier 50.Be coated with circuit layer 70 on described insulating barrier 50.The encapsulating structure of described Micro Electronic Mechanical System die comprises: be arranged at least one second electrical connector 90 of lower surface one side of described Micro Electronic Mechanical System die 10, for example, and soldered ball, described the second electrical connector 90 is electrically connected described circuit layer 70.Described circuit layer 70 is positioned to described the first electrical connector 102 and described the second electrical connector 90 is electrically connected.
Preferably, the encapsulating structure of described Micro Electronic Mechanical System die also comprises the welding resisting layer 80 that covers described circuit layer 70.
In the present embodiment, the wafer-level packaging method of Micro Electronic Mechanical System die comprises:
The microelectromechanical systems wafer is provided, includes several independently Micro Electronic Mechanical System die 10 on it, described Micro Electronic Mechanical System die 10 comprises that upper surface reaches the lower surface opposing with this upper surface; The upper surface of described Micro Electronic Mechanical System die 10 also is provided with at least one first electrical connector 102, for example: weld pad.
As shown in Figure 2, from the upper surface of Micro Electronic Mechanical System die 10, on described Micro Electronic Mechanical System die 10, by dry etching, produce mechanical devices 101.
As shown in Figure 3, provide the first protection enclosing cover substrate 20, its material can be glass.By described Micro Electronic Mechanical System die 10 and described the first protection enclosing cover substrate 20 contrapositions and pressing, make described Micro Electronic Mechanical System die 10 upper surfaces coordinate and form cavity 103 with described the first 20 of protection enclosing cover substrates, described mechanical devices 101 is communicated with described cavity 103; Particularly; described the first protection enclosing cover substrate 20 comprises cavity wall 201; upper surface pressing by cavity wall 201 with described Micro Electronic Mechanical System die 10, make described the first protection enclosing cover substrate 20 coordinate with the upper surface of described Micro Electronic Mechanical System die 10 and form cavity 103.Wherein, in the upper surface pressing process of cavity wall 201 and described Micro Electronic Mechanical System die 10, can in described cavity, be filled with large molecule inert gas, enter in cavity effectively to prevent external gas, the air-tightness of protection cavity.
Preferably, this cavity wall 201 passes through epoxy resin 60 pressings with the upper surface of this Micro Electronic Mechanical System die 10, and, after pressing, between the upper surface of described cavity wall 201 and described Micro Electronic Mechanical System die 10, is filled with epoxy resin 60.Described epoxy resin 60 covers described the first electrical connector 102.
As shown in Figure 4, from the lower surface of described Micro Electronic Mechanical System die 10, to the first protection enclosing cover substrate 20 pressings after Micro Electronic Mechanical System die 10 carry out attenuate.Concrete, adopt machinery to carry out hemisection, exposure, etching method, make to form groove in the Cutting Road corresponding with each Micro Electronic Mechanical System die 10, until part exposes first electrical connector 102 corresponding with each Micro Electronic Mechanical System die 10.
As shown in Figure 5, lower surface from described Micro Electronic Mechanical System die 10, with some grooves of 60 pairs of formation of epoxy resin, filled, remove again the unnecessary epoxy resin of the lower surface of described Micro Electronic Mechanical System die 10, the lower surface that guarantees described Micro Electronic Mechanical System die 10 is smooth, is that the lower surface of the epoxy resin 60 in guaranteeing Micro Electronic Mechanical System die 10 lower surfaces and being filled in described groove is parallel.Then, at the lower surface of Micro Electronic Mechanical System die 10 and lower surface spin coating one deck resin of epoxy resin 60, through overexposure, development, form mask layer 30.
As shown in Figure 6, from the lower surface of Micro Electronic Mechanical System die 10, on Micro Electronic Mechanical System die 10, by dry etching, produce the groove 104 that exposes described mechanical devices 101, described groove 104 is communicated with described cavity 103.As the method, can in the process that the MEMS wafer is encapsulated, form mechanical devices, make mechanical devices be difficult for sneaking into impurity, guaranteed the reliability of encapsulating structure.
As shown in Figure 7, provide the second protection enclosing cover substrate 40, its material can be glass.By described the second protection enclosing cover substrate 40 and Micro Electronic Mechanical System die 10 pressings, seal described groove 104.Particularly, this second protection enclosing cover substrate 40 passes through epoxy resin 60 and these mask layer 30 pressings, and, after pressing, between described the second protection enclosing cover substrate 40 and described mask layer 30, is filled with epoxy resin 60.Wherein, in the second protection enclosing cover substrate 40 passes through epoxy resin 60 and these mask layer 30 pressing processes, can in described groove, be filled with large molecule inert gas, enter in groove the air-tightness of protection groove effectively to prevent external gas.
As shown in Figure 8, deviate from a side of described Micro Electronic Mechanical System die 10 at described the second protection enclosing cover substrate 40, form insulating barrier 50; By vapour deposition, exposure, development, etching method on described insulating barrier 50, the circuit forming surface layer 70 of epoxy resin in described groove, this circuit layer 70 is electrically connected described the first electrical connector 102.
Again as shown in Figure 1, also be provided with at least one second electrical connector 90 in lower surface one side of described Micro Electronic Mechanical System die 10, for example: soldered ball.Described the second electrical connector 90 is electrically connected described circuit layer 70.Described circuit layer 70 is arranged so that described the first electrical connector 102 and described the second electrical connector 90 are electrically connected.
Form the welding resisting layer 80 that covers described circuit layer 70 on described circuit layer 70.
Be to be understood that, although this specification is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should make specification as a whole, technical scheme in each embodiment also can, through appropriate combination, form other embodiments that it will be appreciated by those skilled in the art that.
Above listed a series of detailed description is only illustrating for feasibility embodiment of the present utility model; they are not in order to limit protection domain of the present utility model, all disengaging within equivalent embodiment that the utility model skill spirit does or change all should be included in protection domain of the present utility model.
Claims (10)
1. the encapsulating structure of a Micro Electronic Mechanical System die, is characterized in that, described encapsulating structure comprises:
Micro Electronic Mechanical System die, it comprises that upper surface reaches the lower surface opposing with upper surface, is provided with mechanical devices, the first electrical connector on described chip, and the groove be communicated with described mechanical devices;
The first protection enclosing cover substrate, connect the upper surface of described Micro Electronic Mechanical System die, and coordinate the formation cavity with the upper surface of described Micro Electronic Mechanical System die, and described groove and described cavity are communicated with;
The second protection enclosing cover substrate, with the lower surface pressing of described Micro Electronic Mechanical System die, seal described groove;
The second electrical connector, be arranged at lower surface one side of described Micro Electronic Mechanical System die, and described the second electrical connector is electrically connected described the first electrical connector.
2. the encapsulating structure of Micro Electronic Mechanical System die according to claim 1, is characterized in that, in described cavity and described groove, is full of large molecule inert gas is arranged.
3. the encapsulating structure of Micro Electronic Mechanical System die according to claim 1, is characterized in that, described the first protection enclosing cover substrate comprises cavity wall, and described cavity wall is connected with the upper surface pressing of described Micro Electronic Mechanical System die.
4. the encapsulating structure of Micro Electronic Mechanical System die according to claim 3, is characterized in that, between the upper surface of described cavity wall and described Micro Electronic Mechanical System die, is filled with epoxy resin.
5. the encapsulating structure of Micro Electronic Mechanical System die according to claim 4, is characterized in that, described epoxy resin covers described the first electrical connector.
6. the encapsulating structure of Micro Electronic Mechanical System die according to claim 1; it is characterized in that; the encapsulating structure of described Micro Electronic Mechanical System die also comprises the mask layer of the lower surface that is arranged at described Micro Electronic Mechanical System die, the second protection enclosing cover substrate of described mask layer pressing.
7. the encapsulating structure of Micro Electronic Mechanical System die according to claim 6, is characterized in that, between described the second protection enclosing cover substrate and described mask layer, is filled with epoxy resin.
8. the encapsulating structure of Micro Electronic Mechanical System die according to claim 1, is characterized in that, deviates from a side of described Micro Electronic Mechanical System die at described the second protection enclosing cover substrate, is coated with insulating barrier.
9. the encapsulating structure of Micro Electronic Mechanical System die according to claim 8, is characterized in that, on described insulating barrier, is coated with circuit layer, and described circuit layer is positioned to described the first electrical connector and described the second electrical connector are electrically connected.
10. the encapsulating structure of Micro Electronic Mechanical System die according to claim 9, is characterized in that, the encapsulating structure of described Micro Electronic Mechanical System die also comprises the welding resisting layer that covers described circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320436020.4U CN203373144U (en) | 2013-07-22 | 2013-07-22 | Packaging structure for micro electro mechanical system chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320436020.4U CN203373144U (en) | 2013-07-22 | 2013-07-22 | Packaging structure for micro electro mechanical system chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203373144U true CN203373144U (en) | 2014-01-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320436020.4U Expired - Lifetime CN203373144U (en) | 2013-07-22 | 2013-07-22 | Packaging structure for micro electro mechanical system chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203373144U (en) |
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2013
- 2013-07-22 CN CN201320436020.4U patent/CN203373144U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140101 |