CN203368921U - Welding pad suitable for radiation windowing and arranged on flexible circuit board - Google Patents
Welding pad suitable for radiation windowing and arranged on flexible circuit board Download PDFInfo
- Publication number
- CN203368921U CN203368921U CN 201320284002 CN201320284002U CN203368921U CN 203368921 U CN203368921 U CN 203368921U CN 201320284002 CN201320284002 CN 201320284002 CN 201320284002 U CN201320284002 U CN 201320284002U CN 203368921 U CN203368921 U CN 203368921U
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- China
- Prior art keywords
- radium
- circuit board
- flexible circuit
- radiation
- welding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a welding pad suitable for radiation windowing and arranged on a flexible circuit board. The welding pad is combined with a substrate of the flexible circuit board and composed of a welding pad main body, the welding pad main body comprises a radiation area for radiation windowing to form welding points and a compensation area connected with the radiation area and used for increasing the binding force between the welding pad main body and the substrate of the flexible circuit board and conducting the heat during the radiation winding process. The welding pad comprises the radiation area and the compensation area, so that the radiation heat is dispersed by the compensation part during the radiation operation, so as to prevent the heat from being concentrated too much, and on the other hand, the compensation part is also used for increasing the binding force between the welding pad main body and the substrate, so as to prevent the welding pad from being knocked down or dropped off during the radiation process.
Description
Technical field
The utility model relates to the pad structure on a kind of flexible circuit board, specifically, relates to a kind of radium-shine pad of windowing that is suitable for carrying out thereon.
Background technology
Flexible circuit board is applied in the high-tech electron trades such as mobile phone, notebook, camera.Along with electronic product is increasingly light, littleization development, supporting flexible circuit board also requires more and more closelyr on the pad design of Part Encapsulation with it, can not adopt conventional LPSM directly expose to the mode of opening to make solder joint on pad.Current many employings are carried out radium-shine mode and are outputed solder joint (for example output the BGA solder joint, the opening of this BGA ball grid array mechanism is 0.05mm) after the LPSM printing.Shown in accompanying drawing 1, pad body 2 is arranged on the substrate 1 of flexible circuit board, it is small-sized, only bigger than the solder joint 3 for the treatment of opening, when carrying out radium-shine windowing task, because pad body 2 areas are less, make radium-shine heat too concentrated, and the adhesion between the substrate 1 of itself and flexible circuit board is less, therefore as easy as rolling off a logly is struck off in operation or comes off.
Summary of the invention
The purpose of this utility model is to provide the pad on a kind of flexible circuit board of avoiding being struck off in radium-shine operation or coming off.
For achieving the above object, the technical solution adopted in the utility model is:
The pad that can radium-shinely window on a kind of flexible circuit board, be incorporated on the substrate of flexible circuit board, it comprises the pad body, has the compensatory zone of for radium-shine, window to form the radium-shine zone of solder joint and being connected with described radium-shine zone and carrying out heat conduction for increasing the adhesion between the substrate of described pad body and described flexible circuit board and when radium-shine the windowing on described pad body.
Preferably, described pad body is kidney-shaped, and described radium-shine zone is positioned at an end of the pad body of described kidney-shaped, and described compensatory zone is positioned at the other end of the pad body of described kidney-shaped.
Preferably, described solder joint is for to be formed at the circular hole on described pad body by radium-shine windowing.
Because technique scheme is used, the utility model compared with prior art has following advantages: because pad of the present utility model comprises radium-shine zone and compensatory zone two parts, make when radium-shine operation, radium-shine heat can be disperseed by compensated part on the one hand, prevent that heat is too concentrated, this compensated part can also increase the adhesion between pad body and substrate on the other hand, thereby avoids pad in radium-shine process to be struck off or to come off.
The accompanying drawing explanation
The schematic diagram that accompanying drawing 1 is the pad on existing flexible circuit board.
The schematic diagram that accompanying drawing 2 is the pad that can radium-shinely window on flexible circuit board of the present utility model.
The schematic diagram that accompanying drawing 3 is the pad that can radium-shinely window on flexible circuit board of the present utility model.
In above accompanying drawing: 1, substrate; 2, pad body; 3, solder joint; 4, radium-shine zone; 5, compensatory zone.
Embodiment
Below in conjunction with embodiment shown in the drawings, the utility model is further described.
Embodiment mono-: shown in accompanying drawing 2 and accompanying drawing 3.The pad that can radium-shinely window on a kind of flexible circuit board, be incorporated on the substrate 1 of flexible circuit board, it comprises pad body 2, on the pad body, have radium-shine regional 4 with radium-shine regional 4 compensatory zones that are connected 5, wherein, solder joint 3 is windowed to form for radium-shine in radium-shine zone, and compensatory zone carries out heat conduction for increasing the adhesion between the substrate 1 of pad body 2 and flexible circuit board and when radium-shine the windowing.
Above-described embodiment is only explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the person skilled in the art can understand content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences of doing according to the utility model Spirit Essence change or modify, within all should being encompassed in protection range of the present utility model.
Claims (3)
1. the pad that can radium-shinely window on a flexible circuit board, be incorporated on the substrate of flexible circuit board, it is characterized in that: it comprises the pad body, has the compensatory zone of for radium-shine, window to form the radium-shine zone of solder joint and being connected with described radium-shine zone and carrying out heat conduction for increasing the adhesion between the substrate of described pad body and described flexible circuit board and when radium-shine the windowing on described pad body.
2. the pad that can radium-shinely window on flexible circuit board according to claim 1, it is characterized in that: described pad body is kidney-shaped, described radium-shine zone is positioned at an end of the pad body of described kidney-shaped, and described compensatory zone is positioned at the other end of the pad body of described kidney-shaped.
3. the pad that can radium-shinely window on flexible circuit board according to claim 1 is characterized in that: described solder joint is for to be formed at the circular hole on described pad body by radium-shine windowing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320284002 CN203368921U (en) | 2013-05-23 | 2013-05-23 | Welding pad suitable for radiation windowing and arranged on flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320284002 CN203368921U (en) | 2013-05-23 | 2013-05-23 | Welding pad suitable for radiation windowing and arranged on flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203368921U true CN203368921U (en) | 2013-12-25 |
Family
ID=49816628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320284002 Expired - Fee Related CN203368921U (en) | 2013-05-23 | 2013-05-23 | Welding pad suitable for radiation windowing and arranged on flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203368921U (en) |
-
2013
- 2013-05-23 CN CN 201320284002 patent/CN203368921U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20160523 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |