CN203355124U - Micro-needle wafer carrier plate - Google Patents
Micro-needle wafer carrier plate Download PDFInfo
- Publication number
- CN203355124U CN203355124U CN 201320341078 CN201320341078U CN203355124U CN 203355124 U CN203355124 U CN 203355124U CN 201320341078 CN201320341078 CN 201320341078 CN 201320341078 U CN201320341078 U CN 201320341078U CN 203355124 U CN203355124 U CN 203355124U
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- Prior art keywords
- micro
- needles
- micropin
- wafer carrier
- carrier plate
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- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 238000009826 distribution Methods 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract 1
- 238000000638 solvent extraction Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 4
- 230000003796 beauty Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of medical cosmetology instruments, in particular to a micro-needle wafer carrier plate. The carrier plate comprises a plurality of dot matrix units which are distributed in an array mode. Each dot matrix unit comprises a plurality of micro-needles which are distributed in an array mode. Cutting ways are arranged between every two adjacent dot matrix units and are 80-120 micrometers in width. The distance between the needles between every two adjacent dot matrix units is 280-320 micrometers, and the distance between the needles in each dot matrix unit is 180-220 micrometers. The micro-needles are of a cone frustum shape. A platform is arranged on the top of each needle, all the micro-needles in a wafer are same in height, and the micro-needle wafer carrier plate has the advantages that the needles can be prevented from being broken, no scratch is generated, and safety and painlessness are guaranteed. According to the micro-needle wafer carrier plate, the dot matrix units and the micro-needles are all ranked in the array mode, the micro-needle wafer carrier plate can be cut into rectangles (squares) of different sizes with square millimeter being the unit, the needles can not be cut, integrality of the needles is effectively protected, and the defective rate of products is reduced. Due to the arrangement of the cutting ways, cutting accuracy and regularity in the partitioning process are guaranteed.
Description
Technical field
This utility model relates to the medical beauty treatment instrument technical field, is specifically related to a kind of micropin wafer carrier.
Background technology
At present, wafer carrier on the market is that micropin equidistantly intersperses among on support plate mostly, but micropin in cutting apart process in blocks, is easy to cut to micropin not according to rectangular array, is difficult to guarantee the integrity of micropin, causes defect rate high.
Summary of the invention
The purpose of this utility model is to overcome the defect of prior art, and a kind of wafer array carrying board that can guarantee the micropin integrity in cutting process is provided.
For achieving the above object, this utility model adopts following technical scheme:
A kind of micropin wafer carrier, described support plate comprises a plurality of some array elements that are array distribution, and each some array element comprises the branched micropin that is array distribution; Be provided with Cutting Road between adjacent two some array elements.
Distance between adjacent two some array elements between pin and pin is the 280-320 micron.
The width of described Cutting Road is the 80-120 micron.
Described micropin be shaped as truncated cone, the top of pin is a platform.
Micropin height all on wafer is consistent.
The length of described some array element and widely be 1 millimeter, the micropin number comprised in each some array element is 9.
The base diameter of described micropin is the 80-120 micron, and top diameter is the 5-20 micron, is highly the 50-400 micron; Distance in the some array element between pin and pin is the 180-220 micron.
Of the present utility model some array element of this utility model and micropin all are dot matrix and arrange, thereby take square millimeter and cut into the rectangle (square or rectangular) of various sizes as unit, all can not switch to pin, effectively protect the integrity of pin, reduce the product defect rate; By Cutting Road is set, accuracy and the regularity of cutting in the cutting procedure have been guaranteed.
the accompanying drawing explanation:
The structural representation that accompanying drawing 1 is this utility model;
Accompanying drawing 2 is the structural representation of some array element.
the specific embodiment:
Understand for the juror can be had purpose, feature and the function of this utility model further, hereby lift preferred embodiment and coordinate graphic being described in detail as follows:
Refer to shown in Fig. 1-2, it is the structural representation of the preferred embodiment of this utility model, this utility model is relevant a kind of micropin wafer carrier, and described support plate 1 comprises a plurality of some array elements 2 that are array distribution, and each some array element 2 comprises the branched micropin 3 that is array distribution; Be provided with the Cutting Road 4 that width is the 80-120 micron between adjacent two some array elements 2, in cutting process, can laterally or vertically cut into the rectangle wafer along Cutting Road 4, guaranteed accuracy and the regularity of cutting.Described micropin 3 be shaped as truncated cone, the top of pin is a platform, micropins 3 all on wafer is highly consistent, guarantee that needle point can not scratch skin, cause skin cut to occur, and can effectively prevent the needle point broken needle, avoid needle point to residue in skin, skin is damaged, have without needle point, do not fracture, the advantage such as noresidue, safe.The length of described some array element 2 and widely be 1 millimeter, micropin 3 numbers that comprise in each some array element 2 are 9.Distance between adjacent two some array elements 2 between pin and pin is the 280-320 micron; Distance in some array element 2 between pin and pin is the 180-220 micron; The base diameter of described micropin 3 is the 80-120 micron, and top diameter is the 5-20 micron, is highly the 50-400 micron.
Of the present utility model some array element of this utility model and micropin all are dot matrix and arrange; thereby take square millimeter as unit cuts into the rectangle (square or rectangular) of various sizes, and all can not switch to pin, effectively protected the integrity of pin; reduce the product defect rate, thereby improved production efficiency.
Certainly, above diagram is only this utility model better embodiment, not with this, limits the scope of application of the present utility model, therefore, everyly make equivalent change all should be included in protection domain of the present utility model on this utility model principle.
Claims (7)
1. a micropin wafer carrier, it is characterized in that: described support plate (1) comprises a plurality of some array elements (2) that are array distribution, and each some array element (2) comprises the branched micropin (3) that is array distribution; Be provided with Cutting Road (4) between adjacent two some array elements (2).
2. a kind of micropin wafer carrier according to claim 1 is characterized in that: the distance between adjacent two some array elements (2) between pin and pin is the 280-320 micron.
3. a kind of micropin wafer carrier according to claim 1, it is characterized in that: the width of described Cutting Road (4) is the 80-120 micron.
4. a kind of micropin wafer carrier according to claim 1 is characterized in that: described micropin (3) be shaped as truncated cone, the top of pin is a platform.
5. according to the described a kind of micropin wafer carrier of claim 1 or 4, it is characterized in that: micropins (3) all on wafer is highly consistent.
6. a kind of micropin wafer carrier according to claim 1 and 2 is characterized in that: the length of described some array element (2) and widely be 1 millimeter, micropin (3) number comprised in each some array element (2) is 9.
7. a kind of micropin wafer carrier according to claim 5, it is characterized in that: the base diameter of described micropin (3) is the 80-120 micron, top diameter is the 5-20 micron, is highly the 50-400 micron; Distance in the some array element between pin and pin is the 180-220 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320341078 CN203355124U (en) | 2013-06-15 | 2013-06-15 | Micro-needle wafer carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320341078 CN203355124U (en) | 2013-06-15 | 2013-06-15 | Micro-needle wafer carrier plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203355124U true CN203355124U (en) | 2013-12-25 |
Family
ID=49802952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320341078 Expired - Lifetime CN203355124U (en) | 2013-06-15 | 2013-06-15 | Micro-needle wafer carrier plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203355124U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103623499A (en) * | 2013-06-15 | 2014-03-12 | 陈彦彪 | Microneedle chip supporting plate |
| CN109846785A (en) * | 2019-03-20 | 2019-06-07 | 广州纳丽生物科技有限公司 | A kind of solvable micropin and preparation method thereof with spot-removing function |
| WO2021036075A1 (en) * | 2019-08-23 | 2021-03-04 | 苏州纳生微电子有限公司 | Fixed-quantity liquid supply method |
-
2013
- 2013-06-15 CN CN 201320341078 patent/CN203355124U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103623499A (en) * | 2013-06-15 | 2014-03-12 | 陈彦彪 | Microneedle chip supporting plate |
| CN109846785A (en) * | 2019-03-20 | 2019-06-07 | 广州纳丽生物科技有限公司 | A kind of solvable micropin and preparation method thereof with spot-removing function |
| WO2021036075A1 (en) * | 2019-08-23 | 2021-03-04 | 苏州纳生微电子有限公司 | Fixed-quantity liquid supply method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161214 Address after: 510006 Guangdong city of Guangzhou province Panyu District Xiaoguwei Street Outer Ring Road No. 280 Building No. 225, a department of Guangdong Pharmaceutical University Patentee after: GUANGZHOU NALI BIOTECHNOLOGY CO.,LTD. Address before: 522000 Guangdong province Jieyang City Airport district town Room Seven Tu Wei village in Xinxiang Patentee before: Chen Yanbiao |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131225 |