CN203352943U

CN203352943U - Circuit board and electronic assembly

Info

Publication number: CN203352943U
Application number: CN 201320265608
Authority: CN
Inventors: 李胜源
Original assignee: Via Technologies Inc
Current assignee: Weifeng Electronics Co ltd
Priority date: 2012-08-23
Filing date: 2013-05-16
Publication date: 2013-12-18
Anticipated expiration: 2023-05-16
Also published as: TWM451693U

Abstract

The utility model discloses a circuit board and electronic component, this circuit board include a circuit pile structure, two first resistance pieces and two second resistance pieces. The signal transmission structure of the circuit stack structure comprises a pair of first differential signal paths and a pair of second differential signal paths. The first differential signal path is suitable for connecting a pair of first differential signal pins of an electric connector and a transmission chip. The second differential signal path is suitable for connecting a pair of second differential signal pins of the electric connector and the first differential signal path and is respectively provided with a connecting point. The first resistance pieces are respectively arranged on the first differential signal paths and between the connection point and a starting point of the first differential signal paths and a midpoint between the connection points. The second resistance pieces are respectively arranged on the second differential signal paths and between the connecting points and a starting point of the second differential signal paths and a midpoint between the connecting points.

Description

Wiring board and electronic building brick

Technical field

The utility model relates to a kind of wiring board, and particularly relates to a kind of Electronic Assemblies of application circuit plate.

Background technology

USB 3.0(Universal Serial Bus3.0; USB3.0) be that a kind of from the signal transmission standard that USB2.0 developed out, its transmission rate can reach 5G bps, the transmission rate of traditional USB2.0 only has 480M bps.The USB3.0 electric connector is definite compatible in the USB2.0 electric connector at present, and meaning is that USB3.0 has adopted the electric connector structure identical with USB2.0, and has increased the pin of the several USB3.0 of being used to provide functions.Therefore, the USB3.0 electric connector replaces traditional USB2.0 electric connector gradually.

On the other hand, double-inserting type (2-way) USB3.0 socket connector can make general USB3.0 pin connector not be limited to single direction of insertion and improve practicality.Wherein, double-inserting type USB3.0 socket connector has the pin that two groups of transmission standards are USB3.0, making the wiring board that is provided with the double-inserting type socket connector need to possess than the more manufacturing cost of the wiring board that is applicable to general USB3.0 socket connector, is for example to increase the connectivity port of the transmission chip that circuit connects or increase connection wire etc.In addition, adjust configuration in order to reduce costs, the stable signal transmission after also needing to consider to adjust.

The utility model content

The purpose of this utility model is to provide a kind of wiring board, has preferably stable signal transmission and also can reduce cost of manufacture.

A purpose more of the present utility model is to provide a kind of electronic building brick, has stable signal transmission preferably and lower cost of manufacture.

For reaching above-mentioned purpose, the utility model proposes a kind of wiring board, be suitable for connecting an electric connector and a transmission chip.Wiring board comprises that a circuit folds structure, two first resistance units and two second resistance units.The folded structure of circuit comprises a signal transmission structure, is suitable for connecting pair of first differential signal pins and the pair of second differential signal pins of transmission chip and electric connector.Signal transmission structure comprises pair of first differential signal path and pair of second differential signal path.The first differential wave path is suitable for connecting the first differential signal pins and transmission chip.The second differential wave path is suitable for connecting the second differential signal pins, and is connected to respectively the first differential wave path and has respectively a tie point.The first resistance unit is separately positioned on the first differential wave path, and wherein each first resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively first differential wave path and corresponding each tie point.The second resistance unit is separately positioned on the second differential wave path, and wherein each second resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively second differential wave path and corresponding each tie point.

The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, this signal transmission structure comprises:

Should, to the first differential wave path, also comprise:

Two first connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the first differential signal pins; And

Two first cablings, be disposed at adjacent to each other this upper surface and be suitable for connecting this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And

Should, to the second differential wave path, also comprise:

Two second connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the second differential signal pins; And

Two second cablings, be configured in adjacent to each other this upper surface and this lower surface, and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.

The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.

The resistance value of those first resistance units and those the second resistance units is between 30 ohm (ohm, Ω) is to 180 ohm.

The utility model reintroduces a kind of electronic building brick, comprises a transmission chip, an electric connector and a wiring board.Electric connector has pair of first differential signal pins and pair of second differential signal pins.Wiring board comprises that a circuit folds structure, two first resistance units and two second resistance units.The folded structure of circuit comprises a signal transmission structure.Signal transmission structure comprises pair of first differential signal path and pair of second differential signal path.First differential wave Path Connection the first differential signal pins and transmission chip.Second differential wave Path Connection the second differential signal pins, and be connected to respectively the first differential wave path and there is respectively a tie point.The first resistance unit is separately positioned on the first differential wave path, and wherein each first resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively first differential wave path and corresponding each tie point.The second resistance unit is separately positioned on the second differential wave path, and wherein each second resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively second differential wave path and corresponding each tie point.

Should, to the first differential wave path, also comprise:

Two first connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the first differential signal pins; And

Two first cablings, be disposed at adjacent to each other this upper surface and connect this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And

Should, to the second differential wave path, also comprise:

Two second connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the second differential signal pins; And

Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.

The resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.

The utility model proposes again a kind of wiring board, is suitable for connecting an electric connector and a transmission chip.Wiring board comprises that a circuit folds structure, two pairs of the first resistance units and two pairs of the second resistance units.The folded structure of circuit comprises a first signal transmission structure and a secondary signal transmission structure.The first signal transmission structure is suitable for connecting pair of first differential signal pins and the pair of second differential signal pins of transmission chip and electric connector, and the secondary signal transmission structure is suitable for connecting another pair of first differential signal pins and the another pair of second differential signal pins of transmission chip and electric connector.Each signal transmission structure comprises pair of first differential signal path and pair of second differential signal path.The first differential wave path is suitable for connecting the first corresponding differential signal pins and transmission chip.The second differential wave path is suitable for connecting the second corresponding differential signal pins, and is connected to respectively the first differential wave path and has respectively a tie point.The first resistance unit is separately positioned on the first differential wave path, and wherein each first resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively first differential wave path and corresponding each tie point.The second resistance unit is separately positioned on the second differential wave path, and wherein each second resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively second differential wave path and corresponding each tie point.

The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, respectively this signal transmission structure comprises:

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

This first signal transmission structure is suitable for connecting two groups of USB 3.0 frameworks (Universal Serial Bus3.0; The USB3.0 framework) a pair of transmission (Transmitting) the differential signal pins T in _x ⁺and T _x ^-with the transmission differential signal, and this secondary signal transmission structure is suitable for connecting a pair of reception (Receiving) the differential signal pins R in two groups of USB3.0 frameworks _x ⁺and R _x ^-with the transmission differential signal.

The folded structure of this circuit also comprises the 3rd signal transmission structure, be suitable for this transmission chip and the not only pair of first differential signal pins that is connected this electric connector and but also pair of second differential signal pins, the 3rd signal transmission structure comprises:

The pair of first differential signal path, being suitable for connecting should be to the first differential signal pins and this transmission chip, and two first resistance units are separately positioned on those the first differential wave paths, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And

The pair of second differential signal path, being suitable for connecting should be to the second differential signal pins, and be connected to respectively this first differential wave path is had respectively to a tie point, and two second resistance units are separately positioned on those the second differential wave paths, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.

The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, the 3rd signal transmission structure comprises:

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

The 3rd signal transmission structure is suitable for connecting two groups of a pair of transmission/reception differential signal pins D that support USB1.0 framework or USB2.0 framework ⁺and D ^-with the transmission differential signal.

The utility model also proposes a kind of electronic building brick, comprises a transmission chip, an electric connector and a wiring board.Electric connector has two pairs of the first differential signal pins and two pairs of the second differential signal pins.Wiring board comprises that a circuit folds structure, two pairs of the first resistance units and two pairs of the second resistance units.The folded structure of circuit comprises a first signal transmission structure and a secondary signal transmission structure.The first signal transmission structure connects pair of first differential signal pins and the pair of second differential signal pins of transmission chip and electric connector, and the secondary signal transmission structure connects another pair of first differential signal pins and the another pair of second differential signal pins of transmission chip and electric connector.Each signal transmission structure comprises pair of first differential signal path and pair of second differential signal path.The first differential signal pins and transmission chip that the first differential wave Path Connection is corresponding.The second differential signal pins that the second differential wave Path Connection is corresponding, and be connected to respectively the first differential wave path and there is respectively a tie point.The first resistance unit is separately positioned on the first differential wave path, and wherein each first resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively first differential wave path and corresponding each tie point.The second resistance unit is separately positioned on the second differential wave path, and wherein each second resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively second differential wave path and corresponding each tie point.

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

What connect this first signal transmission structure should and should be respectively a pair of transmission differential signal pins T in the USB3.0 framework to the second differential signal pins to the first differential signal pins _x ⁺and T _x ^-, and connect should and being somebody's turn to do the first differential signal pins of this secondary signal transmission structure, to the second differential signal pins, be respectively a pair of reception differential signal pins R in the USB3.0 framework _x ⁺and R _x ^-.

The folded structure of this circuit also comprises one the 3rd signal transmission structure, connect this transmission chip and this electric connector not only pair of first differential signal pins and but also pair of second differential signal pins, the 3rd signal transmission structure comprises:

The pair of first differential signal path, connecting should be to the first differential signal pins and this transmission chip, and two first resistance units are separately positioned on those the first differential wave paths, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And

The pair of second differential signal path, connecting should be to the second differential signal pins, and be connected to respectively this first differential wave path is had respectively to a tie point, and two second resistance units are separately positioned on those the second differential wave paths, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

What connect the 3rd signal transmission structure should be to support a pair of transmission/reception differential signal pins D of USB1.0 framework or USB2.0 framework with being somebody's turn to do the second differential signal pins to the first differential signal pins ⁺and D ^-.

Based on above-mentioned, the utility model has the advantage of, the electronic building brick of a kind of wiring board with this circuit board of application is provided, wherein the first differential wave Path Connection of signal transmission structure is to transmitting chip, and the second differential wave path is connected to respectively the first corresponding differential wave path and has tie point.Each resistance unit is arranged on each corresponding differential wave path, and between the mid point between the starting point in each tie point of correspondence and corresponding each differential wave path and corresponding each tie point.Accordingly, the wiring board of electronic building brick can connect the electric connector with two groups of identical differential signal pins and have lower cost of manufacture, and wiring board has preferably stable signal transmission via resistance unit is set.For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.

The accompanying drawing explanation

Fig. 1 is the conspectus of the electronic building brick of the utility model one embodiment;

Fig. 2 is the local line schematic diagram of the electronic building brick of Fig. 1;

Fig. 3 is the stereogram of the electric connector of Fig. 1;

Fig. 4 is the front view of the electric connector of Fig. 3;

Fig. 5 is the partial schematic diagram of the electronic building brick of Fig. 1;

Fig. 6 is the end view of the electronic building brick of Fig. 5;

Fig. 7 is the differential mode usefulness figure that the electronic building brick of Fig. 1 does not have resistance unit;

Fig. 8 is the differential mode usefulness figure of the electronic building brick of Fig. 1.

The main element symbol description

100: electronic building brick

110: the transmission chip

110a: connectivity port

120: electric connector

122,124: pin

122a, 122b, 122c: the first differential signal pins

124a, 124b, 124c: the second differential signal pins

126: metal shell

128: insulating base frame

1000: wiring board

1100: circuit is folded structure

1110: the first signal transmission structure

1112a: the first connection pad

1112b: the second connection pad

1114a: the first cabling

1114b: the second cabling

1116a: the first conductive through hole

1116b: the second conductive through hole

1120: the secondary signal transmission structure

1130: the three signal transmission structures

1210,1220,1230: the first resistance units

1310,1320,1330: the second resistance units

C1, C2, C3: tie point

M1, M2: mid point

O1, O2: starting point

P11, P12, P13: the first differential wave path

P21, P22, P23: the second differential wave path

S1: upper surface

S2: lower surface

Embodiment

Fig. 1 is the conspectus of the electronic building brick of the utility model one embodiment.Please refer to Fig. 1, in the present embodiment, electronic building brick 100 comprises transmission chip 110, electric connector 120 and wiring board 1000.Transmission chip 110 is arranged at wiring board 1000 with electric connector 120.Wiring board 1000 comprises the folded structure of circuit 1100, three pairs of the

first resistance units

1210 and 1220 and 1230 and three pairs of the

second resistance units

1310 and 1320 and 1330.

In the present embodiment, the folded structure 1100 of circuit comprises first signal transmission structure 1110, secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130, and electric connector 120 has three couples of the first

differential signal pins

122a and 122b and 122c and three couples of the second

differential signal pins

124a and 124b and 124c.

The pair of first differential signal pins 122a of first signal transmission structure 1110 electrical connectors 120 and pair of second differential signal pins 124a and transmission chip 110.Similarly, the another pair of first differential signal pins 122b of secondary signal transmission structure 1120 electrical connectors 120 and another pair of second differential signal pins 124b and transmission chip 110, and the pair of first differential signal pins 122c of the 3rd signal transmission structure 1130 electrical connectors 120 and and pair of second differential signal pins 124c and transmission chip 110.

In other words, first signal transmission structure 1110, secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130 are connected to transmission chip 110 with signal transmission by three couple of electric connector 120 the first

differential signal pins

122a and 122b and 122c and three couples of the second

differential signal pins

124a and 124b and 124c respectively.Though these three

signal transmission structures

1110 and 1120 and 1130 have similar structure and configuration mode, have different transmission modes.Yet the present invention does not limit transmission mode, structure and the configuration mode of these three

signal transmission structures

1110 and 1120 and 1130.

Fig. 2 is the local line schematic diagram of the electronic building brick of Fig. 1.For making accompanying drawing clearer, Fig. 2 illustrates first signal transmission structure 1110 in Fig. 1 and omits and illustrate secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130, and structure and the configuration mode of secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130, can be with reference to structure and the configuration mode of the first signal transmission structure 1110 of figure 2.

Please also refer to Fig. 1 and Fig. 2, in the present embodiment, first signal transmission structure 1110 comprises pair of first differential signal path P 11 and pair of second differential signal path P 21.That of the first differential wave path P 11 connection correspondences is to the first differential signal pins 122a and transmission chip 110.The second differential wave path P 21 connects corresponding that to the second differential signal pins 124a, and is connected to respectively the first differential wave path P 11 and has respectively tie point C1.Similarly, secondary signal transmission structure 1120 comprises pair of first differential signal path P 12 and pair of second differential signal path P 22.That of the first differential wave path P 12 connection correspondences is to the first differential signal pins 122b and transmission chip 110.The second differential wave path P 22 connects corresponding that to the second differential signal pins 124b, and is connected to respectively the first differential wave path P 12 and has respectively tie point C2.The 3rd signal transmission structure 1130 comprises pair of first differential signal path P 13 and pair of second differential signal path P 23.That of the first differential wave path P 13 connection correspondences is to the first differential signal pins 122c and transmission chip 110.The second differential wave path P 23 connects corresponding that to the second differential signal pins 124c, and is connected to respectively the first differential wave path P 13 and has respectively tie point C3.

Hence one can see that, with first signal transmission structure 1110, first signal transmission structure 1110 has the first paired differential wave path P 11 and the second paired differential wave path P 21, and the first differential wave path P 11 and the second differential wave path P 21 are connected to each other by tie point C1, and then the first paired differential signal pins 122a and the second differential signal pins 124a are connected to transmission chip 110.Similarly, secondary signal transmission structure 1120 also has identical composition and configuration mode with the 3rd signal transmission structure 1130.

Accordingly, first signal transmission structure 1110, secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130 can reduce and be connected the required material of transmission chip 110 and reduce cost of manufacture, and can improve the configuration degree of a plurality of differential waves path in fixed range, for example that to use the transmission chip 110 of a connectivity port 110a(accompanying drawing of transmission chip 110 be that to have two connectivity port 110a be example, but the present invention is not as restriction) two group of pins 122 that can

electrical connectors

120, 124, and then the quantity of 110 electric connectors 120 that can connect of increase single transmission chip.

Fig. 3 is the stereogram of the electric connector of Fig. 1.Fig. 4 is the front view of the electric connector of Fig. 3.Please refer to Fig. 1 to Fig. 4, in the present embodiment, electric connector 120 is USB 3.0(Universal Serial Bus3.0, USB3.0 for double-inserting type (2-way) and transmission standard) the model socket connector that is Standard-A.In brief, it is USB3.0 and pin connector (not illustrating) that model is Standard-A that electric connector 120 can connect general common transmission standard, and pin connector, still inserting and electrical connectors 120 after the axis Rotate 180 degree corresponding to electric connector 120, makes electric connector 120 not be limited to single direction of insertion and improves practicality.

Therefore, electric connector 120 need to be than the many group of pins of general USB3.0Standard-A socket connector.This two group of

pins

122 and 124 be located on the insulating base frame 128 of connection metal housing 126 and respectively position upper row and the lower row of insulating base frame 128.When pin connector is for example while with front, inserting electric connector 120, upper row's pin 122 of pin connector electrical connectors 120.When pin connector is for example reverse side to differ 180 degree with front while inserting electric connector 120, lower row's pin 124 of pin connector electrical connectors 120.

Hence one can see that, and this two group of

pins

122 and 124 has identical composition.Therefore, when pin connector electrical connectors 120, electric connector 120 is via the wherein action of a group of

pins

122 or 124 execution signal transmissions, no matter and which group of pins of pin connector electrical connectors 120 can have identical function.

In the present embodiment, upper row's pin 122 comprises that aforesaid three couples of the first

differential signal pins

122a and 122b and 122c and other pins are for example power pin or ground connection pin, and lower row's pin 124 comprises that aforesaid three couples of the second

differential signal pins

124a and 124b and 124c and other pins are for example power pin or ground connection pin.For making accompanying drawing clearer, omit illustrating of other above-mentioned pins in diagram.Know this operator and can these other pins be disposed to suitable position according to actual service condition.

Three couples, the first differential signal pins 122a of upper row's

122 and 122b and 122c are respectively a pair of transmission (Transmitting) the differential signal pins T in the USB3.0 framework _x ⁺and T _x ^-, a pair of reception (Receiving) differential signal pins R _x ⁺and R _x ^-and a pair of transmission/reception differential signal pins D that supports USB1.0 framework or USB2.0 framework ⁺and D ^-.Three couples, the second differential signal pins 124a of lower row's

124 and 124b and 124c are respectively a pair of transmission differential signal pins T in the USB3.0 framework _x ⁺and T _x ^-, a pair of reception differential signal pins R _x ⁺and R _x ^-and a pair of transmission/reception differential signal pins D that supports USB1.0 framework or USB2.0 framework ⁺and D ^-.

In the present embodiment, wiring board 1000 is suitable for connecting the electric connector 120 that transmission standard is USB3.0.Wherein, first signal transmission structure 1110 is suitable for connecting a pair of transmission differential signal pins T in two groups of USB3.0 frameworks _x ⁺and T _x ^-, secondary signal transmission structure 1120 is suitable for connecting a pair of reception differential signal pins R in two groups of USB3.0 frameworks _x ⁺and R _x ^-, and the 3rd signal transmission structure 1130 is suitable for connecting two groups of a pair of transmission/reception differential signal pins D that support USB1.0 framework or USB2.0 framework ⁺and D ^-.

Hence one can see that, aforesaid these three signal transmission structures 1110 can have different transmission modes from 1120 and 1130, for example, for example, but the first differential wave path of each signal transmission structure (being first signal transmission structure 1110) (being the first differential wave path P 11) for example, has identical transmission mode with the second differential wave path (being the second differential wave path P 21), and be suitable for connecting two pairs of differential signal pins with identical traffic pattern.Therefore, electric connector 120 energy connection line plates 1000, and by

signal transmission structure

1110 and 1120 and 1130 transmission differential signals.

The the first differential signal pins 122a and the second differential signal pins 124a that connect first signal transmission structure 1110 are a pair of transmission differential signal pins T in the USB3.0 framework _x ⁺and T _x ^-, the first differential signal pins 122b and the second differential signal pins 124b that connect secondary signal transmission structure 1120 are a pair of reception differential signal pins R in the USB3.0 framework _x ⁺and R _x ^-, and connect the first differential signal pins 122c of the 3rd signal transmission structure 1130 and a pair of transmission/reception differential signal pins D that the second differential signal pins 124c is support USB1.0 framework or USB2.0 framework ⁺and D ^-.

In brief, the differential signal pins that there is the identical traffic pattern in the upper row's pin 122 in each

signal transmission structure

1110 and 1120 and 1130 while electrical connectors 120 and lower row's pin 124.Therefore, no matter upper row's pin 122 or lower row's pin 124 of pin connector electrical connectors 120, signal can transfer to transmission chip 110 via these

signal transmission structures

1110 and 1120 and 1130.

On the other hand, please also refer to Fig. 1 and Fig. 2, in the present embodiment, three couples, first resistance unit 1210 of

wiring board

1000 and 1220 and 1230 and three pairs of the

second resistance units

1310 and 1320 and 1330 are separately positioned in first signal transmission structure 1110, secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130 of the folded structure 1100 of circuit, that is

signal transmission structure

1110 and 1120 and 1130 is connected respectively corresponding a pair of the

first resistance unit

1210 and 1220 and 1230 and corresponding a pair of the

second resistance unit

1310 and 1320 and 1330.

Take connect first signal transmission structure 1110 this to the first resistance unit 1210, with this, to the second resistance unit 1310, be example, this is separately positioned on the first differential wave path P 11 the first resistance unit 1210, wherein each first resistance unit 1210 is between the mid point M1 between the starting point O1 of each tie point C1 of correspondence and corresponding respectively first differential wave path P 11 and corresponding each tie point C1, and this is separately positioned on the second differential wave path P 21 the second resistance unit 1310, wherein each second resistance unit 1310 is between the mid point M2 between the starting point O2 of each tie point C1 of correspondence and corresponding respectively second differential wave path P 21 and corresponding each tie point C1.

Also say further, each first resistance unit 1210 is between between each tie point C1 of correspondence and corresponding each mid point M1 and contiguous corresponding tie point C1, and each second resistance unit 1310 is between tie point C1 corresponding to vicinity also between each tie point C1 of correspondence and corresponding each mid point M2.Via on each differential wave path, resistance unit being set, can avoiding signal from the differential wave path transmission that is connected to another differential wave path and be reflected back former differential signal path and affect the intensity that high-frequency signal transfers to the transmission chip.

Particularly, take first signal transmission structure 1110 as example, when pin connector electrical connectors 120, first signal transmission structure 1110 only carrys out signal transmission by one of them of the first differential wave path P 11 or the second differential wave path P 21.Because the first differential wave path P 11 is connected via tie point C1 with the second differential wave path P 21, when signal via the first differential wave path P 11 while being transmitted, part signal may transfer to untapped the second differential wave path P 21 through tie point C1 the time, and this part signal can be reflected back the first differential wave path P 11 via tie point C1 again, and then the intensity of attenuates high frequency signals, and make to transfer to the signal strength signal intensity of transmission chip 110 not in accepting scope.

Therefore, by the first differential wave path P 11 with the first corresponding resistance unit 1210 and the second resistance unit 1310 are set on the second differential wave path P 21, can make the part signal that transfers to untapped differential wave path reduce volume reflection by the first resistance unit 1210 and the second resistance unit 1310 weakening signal strength signal intensities before the differential wave path in being reflected back use, to avoid the signal transmitted in impact differential wave path in use.

In addition, make the first resistance unit 1210 and the contiguous tie point C1 of the second resistance unit 1310, can make part signal can weaken signal value via the first resistance unit 1210 and the second resistance unit 1310 after by tie point C1, transferring to untapped differential wave path and reduce volume reflection, to avoid part signal not yet to be transferred to resistance unit, with regard to producing reflex, affect signal strength signal intensity.Although the signal that socket connector transmits by electric connector 120 is also because resistance unit produces loss, the signal strength signal intensity that transfers to transmission chip 110 is still enough.

In addition, secondary signal transmission structure 1120 has identical configuration mode and function with the 3rd signal transmission structure 1130 with first signal transmission structure 1110.That is, via on the first differential wave path P 12 and P13 and the second differential wave path P 22 and P23, the first corresponding resistance unit 1220 and the 1230 and

second resistance unit

1320 and 1330 being set respectively, the differential wave path that also can reduce in use is affected.This part can, with reference to the description of aforesaid relevant first signal transmission structure 1110, not added to repeat at this.

Fig. 5 is the partial schematic diagram of the electronic building brick of Fig. 1.For making accompanying drawing clearer, Fig. 5 illustrates first signal transmission structure 1110 and corresponding the first differential signal pins 122a and the second differential signal pins 124a, and omit, illustrates pin that secondary signal transmission structure 1120 is corresponding with it with the 3rd signal transmission structure 1130 and the body of electric connector 120.Wherein, structure and the configuration mode of secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130, can be with reference to structure and the configuration mode of the first signal transmission structure 1110 of figure 5.

Please refer to Fig. 5, in the present embodiment, the embodiment of electronic building brick 100 is as following: the folded structure 1100 of circuit has upper surface S1 and with respect to the lower surface S2 of upper surface S1.First signal transmission structure 1110 comprises pair of first differential signal path P 11 and pair of second differential signal path P 21.This comprises two first connection pad 1112a, two first cabling 1114a and two first conductive through hole 1116a to the first differential wave path P 11, and this comprises two second connection pad 1112b, two second cabling 1114b and two second conductive through hole 1116b to the second differential wave path P 21.

Particularly, two first connection pad 1112a are disposed at adjacent to each other the side of upper surface S1 and connect corresponding that to the first differential signal pins 122a.Two first cabling 1114a are disposed at adjacent to each other upper surface S1 and connect respectively transmission chip 110 from the first connection pad 1112a through running through circuit to fold two first conductive through hole 1116a of structure 1100.

On the other hand, two second connection pad 1112b are disposed at adjacent to each other the side of upper surface S1 and connect corresponding that to the second differential signal pins 124a.Two second cabling 1114b are configured in upper surface S1 and lower surface S2 adjacent to each other, and extend to lower surface S2 by upper surface S1 through the two second conductive through hole 1116b that run through the folded structure 1100 of circuit from the second connection pad 1112b respectively, and be connected to the first cabling 1114a by lower surface S2 through the first conductive through hole 1116a respectively.Therefore, the tie point C1 of aforesaid the first differential wave path P 11 is positioned at the first conductive through hole 1116a.

In addition, two the first resistance units 1210 are positioned at upper surface S1 and are arranged at respectively the first cabling 1114a, and each first resistance unit 1210 is between each first conductive through hole 1116a of correspondence and corresponding respectively first connection pad 1112a and corresponding respectively between the mid point between first conductive through hole 1116a.Two the second resistance units 1310 are positioned at lower surface S2 and are arranged at respectively the second cabling 1114b, and each second resistance unit 1310 is between each first conductive through hole 1116a of correspondence and corresponding respectively second connection pad 1112b and corresponding respectively between the mid point between first conductive through hole 1116a.

Fig. 6 is the end view of the electronic building brick of Fig. 5.Please refer to Fig. 5 and Fig. 6, in the present embodiment, the first resistance unit 1210 is overlapped in the second resistance unit 1310 in the orthographic projection of lower surface S2 accordingly in the orthographic projection of upper surface S1, but the present invention is not as restriction.In addition, the first resistance unit 1210 and the second resistance unit 1310 can be for example that the mode of welding is arranged on the first cabling 1114a and the second cabling 1114b accordingly, but the present invention does not limit the set-up mode of the first resistance unit 1210 and the second resistance unit 1310.

Via such configuration, can make 1310 of part the second cabling 1114b and the second resistance units improve the free space of the folded structure 1100 of circuit at lower surface S2.Yet, in other embodiments, the first cabling 1114a and the second cabling 1114b and the first resistance unit 1210 and the second resistance unit 1310 also can be arranged at the upper surface S1 of the folded structure 1100 of circuit simultaneously and omit conductive through hole is set, and the present invention does not limit the configuration mode of these cablings and resistance unit.

In addition, in the present embodiment, these to the

first resistance unit

1210 and 1220 and 1230 and these resistance values to the

second resistance unit

1310 and 1320 and 1330 between 30 ohm to 180 ohm.The first resistance unit 1210 can have different resistance values from the second resistance unit 1310.Accordingly, wiring board 1000 can be for example the transmission mode of connected differential signal pins and adjust the resistance value of each first resistance unit 1210 and each the second resistance unit 1310 according to demand, excessive or too small and cause loss excessive or affect signal transmission efficiency to avoid resistance value.

Fig. 7 is the differential mode usefulness figure that the electronic building brick of Fig. 1 does not have resistance unit.Fig. 8 is the differential mode usefulness figure of the electronic building brick of Fig. 1.Fig. 7 illustrates the usefulness figure of the electronic building brick without the first resistance unit 1210 and the 1220 and 1230 and

second resistance unit

1310 and 1320 and 1330, and Fig. 8 illustrates the usefulness figure of the electronic building brick 100 with the first resistance unit 1210 and the 1220 and 1230 and

second resistance unit

1310 and 1320 and 1330 of the present embodiment.In addition, in Fig. 8, the resistance value of the first resistance unit 1210 and the 1220 and 1230 and

second resistance unit

1310 and 1320 and 1330 is 90 ohm.

Please refer to Fig. 7 and Fig. 8, consume (return loss) Sdd11 that returns of these two cases is compared with intervention consume (insertion loss) Sdd12.In the case of resistance unit is not set, although it is less with the summation loss that gets involved consume Sdd12 to return to consume Sdd11, can produces short circuit and can't carry out the signal transmission when frequency is 1.7GHz, 4.4GHz and 7.6GHz.In addition, return to consume Sdd11 larger with the fluctuation that gets involved consume Sdd12, that is transmission stability is not high.

Otherwise, in the case that resistance unit is set of the present embodiment, although be subject to the impact of resistance unit, make the initial summation loss of returning to consume Sdd11 and intervention consume Sdd12 larger, the signal transmission can not be subject to the impact of signal reflex, therefore can not produce short circuit.In addition, return to consume Sdd11 less with the fluctuation that gets involved consume Sdd12, there is higher stability.Accordingly, electronic building brick 100 has preferably stable signal transmission.

In sum, the utility model provides the electronic building brick of a kind of wiring board with this circuit board of application, wherein the first differential wave Path Connection of signal transmission structure is to transmitting chip, and the second differential wave path is connected to respectively the first corresponding differential wave path and has tie point.Each resistance unit is arranged on each corresponding differential wave path, and between the mid point between the starting point in each tie point of correspondence and corresponding each differential wave path and corresponding each tie point.Accordingly, the wiring board of electronic building brick can connect the electric connector with two groups of identical differential signal pins and have lower cost of manufacture by reducing the required material of signal transmission, and wiring board can have via resistance unit is set preferably stable signal transmission.

Claims

1. a wiring board, be suitable for connecting an electric connector and a transmission chip, it is characterized in that, this wiring board comprises:

Circuit is folded structure, comprising:

Signal transmission structure, be suitable for connecting pair of first differential signal pins and the pair of second differential signal pins of this transmission chip and this electric connector, and this signal transmission structure comprises:

The pair of first differential signal path, being suitable for connecting should be to the first differential signal pins and this transmission chip; And

The pair of second differential signal path, being suitable for connecting should be to the second differential signal pins, and is connected to respectively this first differential wave path is had respectively to a tie point;

Two first resistance units, be separately positioned on this on the first differential wave path, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And

Two second resistance units, be separately positioned on this on the second differential wave path, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.

2. wiring board as claimed in claim 1, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, this signal transmission structure comprises:

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

3. wiring board as claimed in claim 1, it is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.

4. wiring board as claimed in claim 1, is characterized in that, the resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.

5. an electronic building brick, is characterized in that, this electronic building brick comprises:

The transmission chip;

Electric connector, have pair of first differential signal pins and pair of second differential signal pins; And

Wiring board comprises:

Circuit is folded structure, comprising:

Signal transmission structure comprises:

The pair of first differential signal path, connecting should be to the first differential signal pins and this transmission chip; And

The pair of second differential signal path, connecting should be to the second differential signal pins, and is connected to respectively this first differential wave path is had respectively to a tie point;

6. electronic building brick as claimed in claim 5, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, this signal transmission structure comprises:

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

7. electronic building brick as claimed in claim 5, it is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.

8. electronic building brick as claimed in claim 5, is characterized in that, the resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.

9. a wiring board, be suitable for connecting an electric connector and a transmission chip, it is characterized in that, this wiring board comprises:

Circuit is folded structure, comprising:

First signal transmission structure and secondary signal transmission structure, this first signal transmission structure is suitable for connecting pair of first differential signal pins and the pair of second differential signal pins of this transmission chip and this electric connector, and this secondary signal transmission structure is suitable for connecting another pair of first differential signal pins and the another pair of second differential signal pins of this transmission chip and this electric connector, respectively this signal transmission structure comprises:

The pair of first differential signal path, be suitable for connecting corresponding being somebody's turn to do the first differential signal pins and this transmission chip; And

The pair of second differential signal path, be suitable for connecting corresponding should be to the second differential signal pins, and be connected to respectively this first differential wave path had respectively to a tie point;

Two pairs of the first resistance units, be separately positioned on those the first differential wave paths, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And

Two pairs of the second resistance units, be separately positioned on those the second differential wave paths, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.

10. wiring board as claimed in claim 9, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, respectively this signal transmission structure comprises:

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

11. wiring board as claimed in claim 9, it is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.

12. wiring board as claimed in claim 9, is characterized in that, the resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.

13. wiring board as claimed in claim 9, is characterized in that, this first signal transmission structure is suitable for connecting a pair of transmission differential signal pins T in two groups of USB 3.0 frameworks _x ⁺and T _x ^-with the transmission differential signal, and this secondary signal transmission structure is suitable for connecting a pair of reception (Receiving) the differential signal pins R in two groups of USB3.0 frameworks _x ⁺and R _x ^-with the transmission differential signal.

14. wiring board as claimed in claim 9, it is characterized in that, the folded structure of this circuit also comprises the 3rd signal transmission structure, be suitable for this transmission chip and the not only pair of first differential signal pins that is connected this electric connector and but also pair of second differential signal pins, the 3rd signal transmission structure comprises:

15. wiring board as claimed in claim 14, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, the 3rd signal transmission structure comprises:

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

16. wiring board as claimed in claim 14, is characterized in that, the 3rd signal transmission structure is suitable for connecting two groups of a pair of transmission/reception differential signal pins D that support USB1.0 framework or USB2.0 framework ⁺and D ^-with the transmission differential signal.

17. an electronic building brick, is characterized in that, this electronic building brick comprises:

The transmission chip;

Electric connector, have two pairs of the first differential signal pins and two pairs of the second differential signal pins; And

Wiring board comprises:

Circuit is folded structure, comprising:

First signal transmission structure and secondary signal transmission structure, this first signal transmission structure connects pair of first differential signal pins and the pair of second differential signal pins of this transmission chip and this electric connector, and this secondary signal transmission structure connects another pair of first differential signal pins and the another pair of second differential signal pins of this transmission chip and this electric connector, respectively this signal transmission structure comprises:

The pair of first differential signal path, connect corresponding being somebody's turn to do the first differential signal pins and this transmission chip; And

The pair of second differential signal path, connect corresponding should be to the second differential signal pins, and be connected to respectively this first differential wave path had respectively to a tie point;

18. electronic building brick as claimed in claim 17, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, respectively this signal transmission structure comprises:

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

19. electronic building brick as claimed in claim 17, it is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.

20. electronic building brick as claimed in claim 17, is characterized in that, the resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.

21. electronic building brick as claimed in claim 17, is characterized in that, what connect this first signal transmission structure should and should be respectively a pair of transmission differential signal pins T in the USB3.0 framework to the second differential signal pins to the first differential signal pins _x ⁺and T _x ^-, and connect should and being somebody's turn to do the first differential signal pins of this secondary signal transmission structure, to the second differential signal pins, be respectively a pair of reception differential signal pins R in the USB3.0 framework _x ⁺and R _x ^-.

22. electronic building brick as claimed in claim 17, it is characterized in that, the folded structure of this circuit also comprises one the 3rd signal transmission structure, connect this transmission chip and this electric connector not only pair of first differential signal pins and but also pair of second differential signal pins, the 3rd signal transmission structure comprises:

23. electronic building brick as claimed in claim 22, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, the 3rd signal transmission structure comprises:

Should, to the first differential wave path, also comprise:

Should, to the second differential wave path, also comprise:

24. electronic building brick as claimed in claim 22, it is characterized in that, what connect the 3rd signal transmission structure should be to support a pair of transmission/reception differential signal pins D of USB1.0 framework or USB2.0 framework with being somebody's turn to do the second differential signal pins to the first differential signal pins ⁺and D ^-.