CN203351584U - Camera module group packaging structure - Google Patents
Camera module group packaging structure Download PDFInfo
- Publication number
- CN203351584U CN203351584U CN 201320409514 CN201320409514U CN203351584U CN 203351584 U CN203351584 U CN 203351584U CN 201320409514 CN201320409514 CN 201320409514 CN 201320409514 U CN201320409514 U CN 201320409514U CN 203351584 U CN203351584 U CN 203351584U
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- CN
- China
- Prior art keywords
- pad
- circuit board
- camera module
- image sensor
- capacity cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Abstract
A camera module group packaging structure comprising a circuit board, an image sensor, first welding pads, capacitor components, and first welding wires, wherein the image sensor is arranged at the middle part of the top face of the circuit board, the first welding pads are arranged on the circuit board and are positioned around the image sensor, the first welding pads are electrically connected with the image sensor, the capacitor components are arranged on the top face of the circuit board and positioned at one sides of the welding discs, one ends of the first welding wires are connected to the first welding discs, the other ends of the first welding wires are connected to the capacitor components which are electrically connected with the first welding discs through the first welding wires, and therefore the capacitor components can be electrically connected with the image sensor. In the camera module group packaging structure, the capacitor components are electrically connected with the circuit board through the first welding wires and the small-sized first welding discs, large-sized capacitor component welding discs adopted in a conventional camera module group packaging structure are eliminated, and therefore the circuit board can be provided with a large wire arrangement space.
Description
Technical field
The utility model relates to camera module technology, particularly relates to a kind of camera module package structure.
Background technology
Camera model (CMOS Camera Module, CCM) is the core devices for various New Generation of Portable picture pick-up devices, compares and has miniaturization with traditional camera system, low-power consumption, low cost, the advantage of high image quality.Nowadays, the camera module has been widely used on the electronic installations such as mobile phone, personal digital aid (PDA), so that these electronic installations have, takes a picture or camera function.Along with improving constantly of camera module pixel, also more and more higher to the required precision of camera modular structure.
In traditional camera module package structure, on circuit board, need reserved a large amount of position to weld the capacity cell pad, then, by surface mount process, capacity cell is connected on the capacity cell pad by the tin ball bonding.Because the surface area of capacity cell is larger, can occupy spaces a large amount of on the circuit board top layer for the capacity cell pad that welds capacity cell, reduced cabling space a large amount of on the circuit board.
The utility model content
Based on this, be necessary to provide the camera that there is larger cabling space on a kind of circuit board module package structure.
A kind of camera module package structure comprises:
Circuit board;
Image sensor, be arranged at the middle part of the end face of described circuit board;
The first pad, be arranged on the end face of described circuit board, and be positioned at around described image sensor, and described the first pad is electrically connected to described image sensor;
Capacity cell, be arranged on described circuit board, and be positioned at described the first pad one side; And
The first sealing wire, one end of described the first sealing wire is connected in described the first pad, the other end is connected in described capacity cell, and described capacity cell is electrically connected to described the first pad by described the first sealing wire, so that described capacity cell is electrically connected to described image sensor.
In embodiment, also comprise therein:
The second pad, be arranged at the edge of described image sensor, and described the second pad is electrically connected to described image sensor;
The second sealing wire, one end of described the second sealing wire is connected on described the first pad, the other end is connected on described the second pad, so that described the first pad is electrically connected to described the second pad by the second sealing wire, described capacity cell is electrically connected to described image sensor by described the first sealing wire, described the second sealing wire and described the second pad.
In embodiment, described the second pad is arranged on described circuit board, and relative with described the first pad therein, and described the second pad and described capacity cell are positioned at the both sides of described the first pad.
In embodiment, described the first sealing wire and the second sealing wire are gold thread therein.
In embodiment, the surface of described the first pad and the second pad is with Gold plated Layer therein.
In embodiment, on described circuit board, be furnished with internal circuit therein, described the first pad is electrically connected to described image sensor by described internal circuit, so that described capacity cell is electrically connected to described image sensor.
In embodiment, described the first sealing wire is gold thread therein.
In embodiment, the surface of described the first pad is with Gold plated Layer therein.
In embodiment, described circuit board is flexible PCB therein.
In embodiment, the two ends of described the first sealing wire are welded in respectively on described the first pad and described capacity cell, and the two ends of described the first sealing wire are all covered by resin therein.
Above-mentioned camera module package structure, the camera module package structure than traditional at least has the following advantages:
At first, in traditional camera module package structure, first welding capacity cell pad on circuit board, and capacity cell is welded on the capacity cell pad by surface mount process, and the size of capacity cell pad is greater than capacity cell usually.In above-mentioned camera module package structure, capacity cell is electrically connected to circuit board by the first sealing wire and the first less pad of size, saved larger-size capacity cell pad in traditional camera module package structure, made on circuit board to there is larger cabling space.
In addition, in traditional camera module package structure, while being welded on the capacity cell pad by capacity cell by surface mount process, tin club produces welding slag, pollutes other pad or image sensor on circuit board.In above-mentioned camera module package structure, capacity cell is welded to connect on circuit board by chip on board technique, avoids producing welding slag, prevent pollute other pad or or the situation of image sensor occur.
The accompanying drawing explanation
The schematic diagram that Fig. 1 is the camera module package structure in the utility model preferred embodiment;
The schematic diagram of the camera module package structure that Fig. 2 is an embodiment.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.Provided better embodiment of the present utility model in accompanying drawing.But the utility model can be realized in many different forms, is not limited to execution mode described herein.On the contrary, providing the purpose of these execution modes is make disclosure of the present utility model is understood more comprehensively thorough.
It should be noted that, when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement just for illustrative purposes, do not mean it is unique execution mode.
Unless otherwise defined, all technology that this paper is used are identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term used in specification of the present utility model herein, just in order to describe the purpose of concrete execution mode, is not intended to be restriction the utility model.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
Refer to Fig. 1, the camera module package structure 100 in the utility model preferred embodiment, comprise circuit board 110, image sensor 120, the first pad 130, capacity cell 140, the first sealing wire 150, the second pad 160 and the second sealing wire 170.
The size of image sensor 120 is less than circuit board 110.Image sensor 120 is arranged at the middle part of the end face of circuit board 110.
The first pad 130 is arranged on circuit board 110, and is positioned at around image sensor 120.The first pad 130 is electrically connected to image sensor 120.
In traditional camera module package structure, need first welding capacity cell pad on circuit board 110, capacity cell 140 is welded on the capacity cell pad by surface mount process, and the size of capacity cell pad is greater than capacity cell 140.In above-mentioned camera module package structure 100, capacity cell 140 is electrically connected to circuit board 110 by the first sealing wire 150 and the first pad 130, saved larger-size capacity cell pad in traditional camera module package structure, made on circuit board 110 to have larger cabling space.
The second pad 160 is arranged on image sensor 120, and is positioned at the edge of image sensor 120, and the second pad 160 is electrically connected to image sensor 120.One end of the second sealing wire 170 is connected on the first pad 130, the other end is connected on the second pad 160, be electrically connected to the second pad 160 so that the first pad 130 passes through the second sealing wire 170, and then capacity cell 140 is electrically connected to image sensor 120 by the first sealing wire 150, the second sealing wire 170 and the second pad 160.
Specifically in the present embodiment, the second sealing wire 170 also can be gold thread, and the surface gold-plating of the second pad 160, so that the second pad 160 is outer with Gold plated Layer.The two ends of the second sealing wire 170 are connected on the second pad 160 and capacity cell 140 by the mode of welding respectively.Simultaneously, after the first sealing wire 150 and the second sealing wire 170 welding well, the two ends of the first sealing wire 150 and the second sealing wire 170 are all covered by resin, to protect the first sealing wire 150 and the second sealing wire 170.
In the camera module, General Requirements capacity cell 140 is as far as possible near image sensor 120.In the present embodiment, capacity cell 140 is arranged at the position of close image sensor 120 on circuit board 110.The second pad 160 is arranged on circuit board 110, and relative with the first pad 130, and the second pad 160 and capacity cell 140 are positioned at the both sides of the first pad 130, to meet the demand of capacity cell 140 near image sensor 120.
It is pointed out that the first sealing wire 150 and the second sealing wire 170 can also select the conductive metal wire of other material to replace gold thread.
In addition, the mode that the first pad 130 is electrically connected to image sensor 120 is not limited to the first pad 130 and is electrically connected to image sensor 120 by the second sealing wire 170 and the second pad 160.See also Fig. 2, in another embodiment, capacity cell 140 is electrically connected to the first pad 130 by the first sealing wire 150, and the first pad 130 is electrically connected to image sensor 120 by the internal circuit arranged on circuit board 110, so that capacity cell 140 is electrically connected to image sensor 120.Finally make capacity cell 140 directly be electrically connected to image sensor 120 by the internal circuit on the first sealing wire 150, the first pad 130 and circuit board 110, without adopting the second pad 160 and the second sealing wire 170.In the present embodiment, the area on the shared circuit board 110 of the first pad 130 is less, only needs to meet a demand that is electrically connected to capacity cells 140 by welding the first sealing wire 150 and gets final product.
Above-mentioned camera module package structure 100, the camera module package structure than traditional at least has the following advantages:
At first, in traditional camera module package structure, first welding capacity cell pad on circuit board 110, and capacity cell 140 is welded on the capacity cell pad by surface mount process, and the size of capacity cell pad is greater than capacity cell 140 usually.In above-mentioned camera module package structure 100, capacity cell 140 is electrically connected to circuit board 110 by the first sealing wire 150 and the first less pad 130 of size, saved larger-size capacity cell pad in traditional camera module package structure, made on circuit board 110 to have larger cabling space.
In addition, in traditional camera module package structure, while being welded on the capacity cell pad by capacity cell by surface mount process, tin club produces welding slag, pollutes other pad or image sensor on circuit board 110.In above-mentioned camera module package structure 100, capacity cell 140 is welded to connect on circuit board 110 by chip on board technique, avoids producing welding slag, prevents the situation of polluting other pad or image sensor and occurs.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a camera module package structure, is characterized in that, comprising:
Circuit board;
Image sensor, be arranged at the middle part of the end face of described circuit board;
The first pad, be arranged on described circuit board, and be positioned at around described image sensor, and described the first pad is electrically connected to described image sensor;
Capacity cell, be arranged on the end face of described circuit board, and be positioned at described the first pad one side; And
The first sealing wire, one end of described the first sealing wire is connected in described the first pad, the other end is connected in described capacity cell, and described capacity cell is electrically connected to described the first pad by described the first sealing wire, so that described capacity cell is electrically connected to described image sensor.
2. camera module package structure according to claim 1, is characterized in that, also comprises:
The second pad, be arranged at the edge of described image sensor, and described the second pad is electrically connected to described image sensor;
The second sealing wire, one end of described the second sealing wire is connected on described the first pad, the other end is connected on described the second pad, so that described the first pad is electrically connected to described the second pad by the second sealing wire, described capacity cell is electrically connected to described image sensor by described the first sealing wire, described the second sealing wire and described the second pad.
3. camera module package structure according to claim 2, is characterized in that, described the second pad is arranged on described circuit board, and relative with described the first pad, and described the second pad and described capacity cell are positioned at the both sides of described the first pad.
4. camera module package structure according to claim 2, is characterized in that, described the first sealing wire and the second sealing wire are gold thread.
5. camera module package structure according to claim 4, is characterized in that, the surface of described the first pad and the second pad is with Gold plated Layer.
6. camera module package structure according to claim 1, it is characterized in that, be furnished with internal circuit on described circuit board, described the first pad is electrically connected to described image sensor by described internal circuit, so that described capacity cell is electrically connected to described image sensor.
7. camera module package structure according to claim 6, is characterized in that, described the first sealing wire is gold thread.
8. camera module package structure according to claim 7, is characterized in that, the surface of described the first pad is with Gold plated Layer.
9. camera module package structure according to claim 1, is characterized in that, described circuit board is flexible PCB.
10. camera module package structure according to claim 1, is characterized in that, the two ends of described the first sealing wire are welded in respectively on described the first pad and described capacity cell, and the two ends of described the first sealing wire are all covered by resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320409514 CN203351584U (en) | 2013-07-10 | 2013-07-10 | Camera module group packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320409514 CN203351584U (en) | 2013-07-10 | 2013-07-10 | Camera module group packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203351584U true CN203351584U (en) | 2013-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320409514 Expired - Fee Related CN203351584U (en) | 2013-07-10 | 2013-07-10 | Camera module group packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203351584U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103347364A (en) * | 2013-07-10 | 2013-10-09 | 南昌欧菲光电技术有限公司 | Camera module packaging structure |
-
2013
- 2013-07-10 CN CN 201320409514 patent/CN203351584U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103347364A (en) * | 2013-07-10 | 2013-10-09 | 南昌欧菲光电技术有限公司 | Camera module packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20150710 |
|
| EXPY | Termination of patent right or utility model |