CN203351580U - Semiconductor radiator - Google Patents

Semiconductor radiator Download PDF

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Publication number
CN203351580U
CN203351580U CN 201320440157 CN201320440157U CN203351580U CN 203351580 U CN203351580 U CN 203351580U CN 201320440157 CN201320440157 CN 201320440157 CN 201320440157 U CN201320440157 U CN 201320440157U CN 203351580 U CN203351580 U CN 203351580U
Authority
CN
China
Prior art keywords
radiator
hollow
core construction
fin
heating panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320440157
Other languages
Chinese (zh)
Inventor
和俊莉
王丹
张文涛
陈磊
钱俊有
蔡水占
刘栓红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Hongchang Electronics Co Ltd
Original Assignee
Henan Hongchang Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan Hongchang Electronics Co Ltd filed Critical Henan Hongchang Electronics Co Ltd
Priority to CN 201320440157 priority Critical patent/CN203351580U/en
Application granted granted Critical
Publication of CN203351580U publication Critical patent/CN203351580U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a radiator, and specially relates to a semiconductor radiator. The semiconductor radiator comprises radiating fins. The semiconductor radiator is characterized in that radiating plates are respectively arranged over and under the radiating fins, the radiating fins and the radiating plates have a communication hollow structure, and the radiating plates are provided with circular pipes communicated with the hollow structure. The semiconductor radiator is advantageous in that the heat radiation effect is good, and usage is convenient.

Description

A kind of semi-conductive radiator
Technical field
The utility model relates to a kind of radiator, specifically relates to a kind of semi-conductive radiator.
Background technology
In the prior art, radiator is a fin that is bent into S shape, and the fin that radiator relies on is dispelled the heat, and such radiator exists, and radiating effect is poor, uses inconvenient shortcoming.
Summary of the invention
The purpose of this utility model is exactly for above-mentioned shortcoming, and a kind of radiating effect a kind of semi-conductive radiator better, easy to use that has is provided.
The technical solution of the utility model is achieved in that a kind of semi-conductive radiator, comprise fin, it is characterized in that: on described fin, have heating panel, the inner hollow-core construction for communicating of described fin and heating panel, described heating panel is provided with the pipe communicated with hollow-core construction.
Further say: described pipe is provided with medium tube and blast pipe, and described medium tube is in hollow-core construction, injecting refrigeration filling, and described blast pipe is for discharging the gas in hollow-core construction.
The beneficial effects of the utility model are: a kind of semi-conductive radiator of this spline structure has advantages of that radiating effect is better, easy to use.
The accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Wherein: 1, fin 2, heating panel 3, pipe 4, medium tube 5, blast pipe.
Embodiment
Below in conjunction with accompanying drawing, the utility model will be further described.
As shown in Figure 1, a kind of semi-conductive radiator, comprise fin 1, it is characterized in that: on described fin 1, have heating panel 2, described fin 1 and the inner hollow-core construction for communicating of heating panel 2, described heating panel 2 is provided with the pipe 3 communicated with hollow-core construction.
Further say: described pipe 3 is provided with medium tube 4 and blast pipe 5, and described medium tube 4 is in hollow-core construction, injecting refrigeration filling, and described blast pipe 5 is discharged for the gas by hollow-core construction.
A kind of semi-conductive radiator of this spline structure has advantages of that radiating effect is better, easy to use.

Claims (2)

1. a semi-conductive radiator, comprise fin, it is characterized in that: have heating panel on described fin, and the inner hollow-core construction for communicating of described fin and heating panel, described heating panel is provided with the pipe communicated with hollow-core construction.
2. a kind of semi-conductive radiator according to claim 1, it is characterized in that: described pipe is provided with medium tube and blast pipe, described medium tube is in hollow-core construction, injecting refrigeration filling, and described blast pipe is for discharging the gas in hollow-core construction.
CN 201320440157 2013-07-24 2013-07-24 Semiconductor radiator Expired - Fee Related CN203351580U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320440157 CN203351580U (en) 2013-07-24 2013-07-24 Semiconductor radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320440157 CN203351580U (en) 2013-07-24 2013-07-24 Semiconductor radiator

Publications (1)

Publication Number Publication Date
CN203351580U true CN203351580U (en) 2013-12-18

Family

ID=49751445

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320440157 Expired - Fee Related CN203351580U (en) 2013-07-24 2013-07-24 Semiconductor radiator

Country Status (1)

Country Link
CN (1) CN203351580U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131218

Termination date: 20140724

EXPY Termination of patent right or utility model