CN203350696U - Multifunctional on-line data monitoring system - Google Patents
Multifunctional on-line data monitoring system Download PDFInfo
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- CN203350696U CN203350696U CN2013203442264U CN201320344226U CN203350696U CN 203350696 U CN203350696 U CN 203350696U CN 2013203442264 U CN2013203442264 U CN 2013203442264U CN 201320344226 U CN201320344226 U CN 201320344226U CN 203350696 U CN203350696 U CN 203350696U
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Abstract
The utility model relates to a multifunctional on-line data monitoring system. The multifunctional on-line data monitoring system comprises a master control module, a data monitoring module, a data storage module, a human-computer interaction module, a communication module and a power supply module, wherein two kinds of chips are used for the communication module to mainly achieve real-time monitoring of signals uploaded by devices with different communication modes; an LCD liquid crystal screen is used for the data monitoring module to display monitored data in real time, and when a plurality of devices are to be monitored, the plurality of devices can be monitored by turns through the human-computer interaction module; an SD card is used for the data storage module to store monitored signals; an STM32F103VCT6 is used for the master control module to analyze and convert the monitored signals and the like; and functions such as monitoring frequency control and data display and the like are fulfilled by the human-computer interaction module. Besides basic requirements are satisfied, data can be monitored from any time and by different frequencies, and the multifunctional on-line data monitoring system is relatively low in cost, simple in operation and convenient to carry.
Description
Technical field
The utility model belongs to areas of information technology, relates to a kind of multi-functional online data monitoring system.
Background technology
The online data monitoring system originates from mid-term in 20th century, because the online data monitoring system has high speed and certain flexible performance, can meet data monitoring and communication task that numerous classic methods can not complete, thereby obtain preliminary approval.Due to the raising gradually of ic manufacturing technology, the online data monitoring technology is widely used in fields such as Military Electronics equipment, avionic device and aerospace flight technology and industry.
In today of Internet technology fast development, the online data monitoring system has been widely used in internet and field of distributed type, and great variation has occurred in online data monitoring field.Domestic and international various data monitoring device successively comes out, and has brought the online data monitoring system into the brand-new epoch.The online data monitoring system is, according to different application demands, different definition is arranged, and this is with regard to seem especially important of the development that makes a kind of multi-functional online data monitoring system.
A kind of task of multi-functional online data monitoring system is exactly according to different need to being monitored signal, then convert the digital signal that single-chip microcomputer can be identified to, be sent to and calculate accordingly in single-chip microcomputer and process, obtain desired data, and data are shown or communicated by letter, in order to realize real-time control and the processing to certain tittle.Various aspects in daily productive life, the online data monitoring is almost ubiquitous, there is the appearance of online data monitoring system in every place that has an automatic monitored control system, needs along with the commercial production life, requirement to the online data monitoring system also will be more and more higher, especially according to the needs of different situations, realize Monitoring Data in a different manner.Therefore, the research of this problem had and wide development prospect and huge economic worth.
The key issue that native system solves is, in the process of data monitoring, guaranteed by realizing since any time Monitoring Data and meet a kind of multi-functional online data monitoring system of different needs of work with different frequency monitoring data.
Summary of the invention
In order to have guaranteed by realizing since any time Monitoring Data and with the problem of different frequency monitoring data, the utility model provides a kind of practicable technical scheme and according to the basic circuit of a kind of multi-functional online data monitoring system of this scheme constructs.
The technical solution of the utility model is as follows:
The utility model specifically comprises power module, main control module, human-computer interaction module, data monitoring module, data memory module, communication module.
Power module circuitry comprises one-level power conversion chip IC1, secondary power supply conversion chip IC2, diode D1, voltage stabilizing diode D2, three electrochemical capacitor C3, C4 and C5, four ceramic disc capacitor C1, C2, C6 and C7, two inductance L 1 and L2, a resistance R 2; The anodic bonding of 1 pin of one-level power conversion chip IC1 and the negative electrode of diode D1, electrochemical capacitor C3, C4, the anode of diode D1 is as the 24V voltage input end; 3 pin, 5 pin of one-level power conversion chip IC1 are connected with ground; 2 pin of one-level power conversion chip IC1 are connected with an end of inductance L 1 with after the parallel connection of voltage stabilizing diode D2 negative electrode; 4 pin of one-level power conversion chip IC1 are as the 5V voltage output end, and the 3 pin parallel connections of the anode of the other end of inductance L 1 and electrochemical capacitor C5, secondary power supply conversion chip IC2; 2 pin of secondary power supply conversion chip IC2 are the 3.3V voltage output end, and an end parallel connection of the end of ceramic disc capacitor C1, C2 and inductance L 2; The other end of inductance L 2 is 3.3V REF voltage output end, and in parallel with the end of an end of resistance R 2 and ceramic disc capacitor C6; The other end of resistance R 2 is connected with the end of ceramic disc capacitor C7; 2 pin of the other end of the negative electrode of electrochemical capacitor C3, C4, C5, ceramic disc capacitor C1, C2, C6 and C7, the anode of voltage stabilizing diode D2, secondary power supply conversion chip IC2 are ground connection all; One-level power conversion chip IC1 model is LM2576, and secondary power supply conversion chip IC2 model is ISP1117.
The main control module circuit is comprised of main control chip IC3, crystal oscillator XTAL1, seven resistance R 9, R13, R14, R15, R16, R17 and R18, ten ceramic disc capacitor C13, C14, C15, C16, C17, C18, C19, C26, C27 and C28; 6 pin of main control chip IC3 are connected with the 3.3V voltage output end in power module circuitry; 49 pin of main control chip IC3,74 pin, 99 pin, 27 pin, 94 pin and 10 pin ground connection; Be connected with the end of crystal oscillator XTAL1 after the end parallel connection of 12 pin of main control chip IC3 and ceramic disc capacitor C13, be connected with the other end of crystal oscillator XTAL1 after the end parallel connection of 13 pin and ceramic disc capacitor C26, the other end of ceramic disc capacitor C13 and C26 is ground connection all; After 50 pin of main control chip IC3,75 pin, 100 pin, 28 pin and 11 pin parallel connections, with the end of ceramic disc capacitor C18, C17, C16, C15, C14 is in parallel, also with the 3.3V voltage output end in power module circuitry, be connected; After 49 pin of main control chip IC3,74 pin, 99 pin, 27 pin and 10 pin parallel connections and the other end earth of ceramic disc capacitor C18, C17, C16, C15, C14; 37 pin of main control chip IC3 and an end of resistance R 9 and in parallel with 28 pin of LCD LCD Interface J1 in the data monitoring modular circuit, the other end of resistance R 9 is connected with ground; 94 pin of main control chip IC3 are connected with an end of resistance R 18, the other end ground connection of resistance R 18; The end earth of 19 pin of main control chip IC3,20 pin and ceramic disc capacitor C26, C27; 21 pin of main control chip IC3 with after the other end parallel connection of ceramic disc capacitor C27, with the 3.3VREF voltage output end in power module circuitry, be connected; 22 pin of main control chip IC3 with after the other end parallel connection of ceramic disc capacitor C26, with the 3.3V voltage output end in power module circuitry, be connected; 63 pin of main control chip IC3 and an end of resistance R 13 and in parallel with 19 pin of LCD LCD Interface J1 in the data monitoring modular circuit; 64 pin of main control chip IC3 and an end of resistance R 14 and in parallel with 30 pin of LCD interface J1 in the data monitoring modular circuit; 65 pin of main control chip IC3 and an end of resistance R 15 and in parallel with 31 pin of LCD LCD Interface J1 in the data monitoring modular circuit; 66 pin of main control chip IC3 and an end of resistance R 16 and in parallel with 32 pin of LCD LCD Interface J1 in the data monitoring modular circuit; The end of 14 pin of main control chip IC3 and an end of resistance R 17, ceramic disc capacitor C28 and in parallel with 23 pin of LCD LCD Interface J1 in the data monitoring modular circuit; The other end of resistance R 17 is connected with the 3.3V voltage output end in power module circuitry; The other end ground connection of ceramic disc capacitor C28; Main control chip IC3 model is STM32F103VCT6.
The human-computer interaction module circuit is comprised of six resistance R 3, R4, R6, R7, R19 and R20, two ceramic disc capacitor C29 and C30, four light emitting diode D4, D5, D6 and D7, two button S1 and S2; One end of resistance R 3 is connected with the 3.3V voltage output end in power module circuitry; The anodic bonding of the other end of resistance R 3 and light emitting diode D4; The negative electrode of light emitting diode D4 is connected with 55 pin of main control chip IC3 in the main control module circuit; One end of resistance R 4 is connected with the 3.3V voltage output end in power module circuitry; The anodic bonding of the other end of resistance R 4 and light emitting diode D5; The negative electrode of light emitting diode D5 is connected with 56 pin of main control chip IC3 in the main control module circuit; One end of resistance R 6 is connected with the 3.3V voltage output end in power module circuitry; The anodic bonding of the other end of resistance R 6 and light emitting diode D6; The negative electrode of light emitting diode D6 is connected with 57 pin of main control chip IC3 in the main control module circuit; One end of resistance R 7 is connected with the 3.3V voltage output end in power module circuitry; The anodic bonding of the other end of resistance R 7 and light emitting diode D7; The negative electrode of light emitting diode D7 is connected with 58 pin of main control chip IC3 in the main control module circuit; One end of resistance R 19 is connected with the 3.3V voltage output end in power module circuitry; The 25 pin parallel connections of main control chip IC3 in the end of the other end of resistance R 19 and ceramic disc capacitor C29, the end of button S2 and main control module circuit; Ground connection after the other end parallel connection of the other end of ceramic disc capacitor C29 and button S2; One end of resistance R 20 is connected with the 3.3V voltage output end in power module circuitry; The 24 pin parallel connections of main control chip IC3 in the end of the other end of resistance R 20 and ceramic disc capacitor C30, the end of button S1 and main control module circuit; Ground connection after the other end parallel connection of the other end of ceramic disc capacitor C30 and button S1.
The data monitoring modular circuit is comprised of LCD LCD Interface J1, two ceramic disc capacitor C8 and C9; 3.3V voltage output end parallel connection in 1 pin of interface J1 and the end of ceramic disc capacitor C8, C9 and power module circuitry; Ground connection after 2 pin of interface J1 and the other end parallel connection of ceramic disc capacitor C8, C9; 3 pin of interface J1 are connected with 97 pin of main control chip IC3 in the main control module circuit; 4 pin of interface J1 are connected with 98 pin of main control chip IC3 in the main control module circuit; 5 pin of interface J1 are connected with 1 pin of main control chip IC3 in the main control module circuit; 6 pin of interface J1 are connected with 2 pin of main control chip IC3 in the main control module circuit; 7 pin of interface J1 are connected with 3 pin of main control chip IC3 in the main control module circuit; 8 pin of interface J1 are connected with 4 pin of main control chip IC3 in the main control module circuit; 9 pin of interface J1 are connected with 5 pin of main control chip IC3 in the main control module circuit; 10 pin of interface J1 are connected with 38 pin of main control chip IC3 in the main control module circuit; 11 pin of interface J1 are connected with 39 pin of main control chip IC3 in the main control module circuit; 12 pin of interface J1 are connected with 40 pin of main control chip IC3 in the main control module circuit; 13 pin of interface J1 are connected with 41 pin of main control chip IC3 in the main control module circuit; 14 pin of interface J1 are connected with 42 pin of main control chip IC3 in the main control module circuit; 15 pin of interface J1 are connected with 43 pin of main control chip IC3 in the main control module circuit; 16 pin of interface J1 are connected with 44 pin of main control chip IC3 in the main control module circuit; 17 pin of interface J1 are connected with 45 pin of main control chip IC3 in the main control module circuit; 18 pin of interface J1 are connected with 46 pin of main control chip IC3 in the main control module circuit; 20 pin of interface J1 are connected with 60 pin of main control chip IC3 in the main control module circuit; 21 pin of interface J1 are connected with 61 pin of main control chip IC3 in the main control module circuit; 22 pin of interface J1 are connected with 62 pin of main control chip IC3 in the main control module circuit; 24 pin of interface J1 are connected with 68 pin of main control chip IC3 in the main control module circuit; 25 pin of interface J1 are connected with 79 pin of main control chip IC3 in the main control module circuit; 26 pin of interface J1 are connected with 34 pin of main control chip IC3 in the main control module circuit; 27 pin of interface J1 are connected with 80 pin of main control chip IC3 in the main control module circuit; 29 pin of interface J1 are connected with 78 pin of main control chip IC3 in the main control module circuit.
The data memory module circuit is comprised of SD card read-write interface SD, resistance R 5 and ceramic disc capacitor C10; 2 pin of interface SD are connected with 77 pin of main control chip IC3 in the main control module circuit; 3 pin of interface SD are connected with 91 pin of main control chip IC3 in the main control module circuit; The end parallel connection of 4 pin of interface SD and an end of resistance R 5 and ceramic disc capacitor C10; The other end of resistance R 5 is connected with 10 pin of interface SD; The other end ground connection of ceramic disc capacitor C10; 5 pin of interface SD are connected with 89 pin of main control chip IC3 in the main control module circuit; 6, the 9 pin ground connection of interface SD; 7 pin of interface SD are connected with 90 pin of main control chip IC3 in the main control module circuit.
The real-time communication module circuit is comprised of level transferring chip MAX, transceiving chip CAN, two resistance R 10 and R11, six ceramic disc capacitor C11, C12, C20, C22, C24 and C25; 1 pin of level transferring chip MAX is connected with the end of ceramic disc capacitor C20; 3 pin of the other end of ceramic disc capacitor C20 and level transferring chip MAX are connected; 2 pin of level transferring chip MAX are connected with the end of ceramic disc capacitor C22; 16 pin of the other end of ceramic disc capacitor C22 and level transferring chip MAX and the 3.3V voltage output end parallel connection in power module circuitry; 4 pin of level transferring chip MAX are connected with the end of ceramic disc capacitor C25; 5 pin of the other end of ceramic disc capacitor C25 and level transferring chip MAX are connected; 6 pin of level transferring chip MAX are connected with the end of ceramic disc capacitor C24; Ground connection after the 15 pin parallel connections of the other end of ceramic disc capacitor C24 and level transferring chip MAX; 11 pin of level transferring chip MAX are connected with 86 pin of main control chip IC3 in the main control module circuit; 12 pin of level transferring chip MAX are connected with 87 pin of main control chip IC3 in the main control module circuit; 13 pin of level transferring chip MAX are the serial data receiving end; 14 pin of level transferring chip MAX are the serial data transmitting terminal; 1 pin of transceiving chip CAN is connected with 71 pin of main control chip IC3 in the main control module circuit; Ground connection after the end parallel connection of 2 pin of transceiving chip CAN and ceramic disc capacitor C11, C12; 3 pin of transceiving chip CAN with after the other end parallel connection of ceramic disc capacitor C11, C12, with the 3.3V voltage output end in power module circuitry, be connected; 4 pin of transceiving chip CAN are connected with an end of resistance R 10; The other end of resistance R 10 is connected with 70 pin of main control chip IC3 in the main control module circuit; 6 pin of transceiving chip CAN are connected the road as the CAN bus with an end of resistance R 11; 7 pin of transceiving chip CAN are connected another road as the CAN bus with the other end of resistance R 11; The 8 pin ground connection of transceiving chip CAN; Level transferring chip MAX model is that MAX3X232, transceiving chip CAN model are SN65HVD230D.
The utility model is compared some other online data monitoring system, when meeting basic demand, realizes again since any time Monitoring Data and lower, simple to operate, easy to carry with different frequency monitoring data and cost.
The accompanying drawing explanation
Fig. 1 is a kind of theory diagram of multi-functional online data monitoring system;
Fig. 2 is the basic circuit schematic diagram of power module in this data monitoring system;
Fig. 3 is the basic circuit schematic diagram of main control module in this data monitoring system;
Fig. 4 is the basic circuit schematic diagram of human-computer interaction module in this data monitoring system;
Fig. 5 is the basic circuit schematic diagram of data monitoring module in this data monitoring system;
Fig. 6 is the basic circuit schematic diagram of data memory module in this data monitoring system;
Fig. 7 is the basic circuit schematic diagram of real-time communication module in this data monitoring system.
Embodiment
Below engage accompanying drawing to the in addition detailed explanation of a kind of multi-functional online data monitoring system.
A kind of is mainly that this system mainly comprises main control module, data monitoring module, data memory module, human-computer interaction module, communication module, power module in order to realize the system of multi-functional data monitoring.Wherein communication module adopts SN65HVD230D and MAX3232 chip mainly to realize different communication mode equipment is uploaded the Real-Time Monitoring of signal; The MAX3232 serial communication function mainly realizes take the monitoring that equipment that serial ports is communication mode is uploaded signal, is applicable to short haul connection; SN65HVD230D mainly realizes take the monitoring that equipment that the CAN bus is communication mode is uploaded signal, is applicable to long distance, the monitoring of many equipment carry.The data monitoring module adopts the LCD liquid crystal display to show in real time the data of monitoring, when many equipment of monitoring, can realize many equipment is monitored in turn by human-computer interaction module.Data memory module mainly adopts the SD card to be responsible for the signal monitored is stored.Main control module adopt STM32F103VCT6 be responsible for to the signal monitored analyzed, the operation such as conversion; Human-computer interaction module is to realize the functions such as monitoring frequency control and demonstration data.
Adopt above technical scheme, the notebook data monitoring system can reach the purpose of multifunctional monitoring easily, and while facts have proved that it is in the data monitoring process, work that can be steady in a long-term.
In accompanying drawing 1, each functional block title explanation: 1. power module, 2. main control module, 3. human-computer interaction module, 4. data monitoring module, 5. data memory module, 6. real-time communication module.
Below, with regard in accompanying drawing 1, the effect of each functional block is briefly described:
1. power module; The operating voltage of whole system is provided;
2. main control module; To the signal monitored analyzed, converted, the operation such as control;
3. human-computer interaction module; The platform of man-machine interaction is provided;
4. data monitoring module; Data to monitoring show in real time, when many equipment of monitoring, can realize many equipment is monitored in turn by human-computer interaction module;
5. data memory module; The signal monitored is stored;
6. real-time communication module; The signal that different communication mode equipment is uploaded carries out Real-Time Monitoring;
As shown in Figure 1, power module circuitry 1 is provided by provide+3.3V of main control module circuit 2 power supply, two groups of provide+3.3V of different telecommunication circuits power supplys in real-time communication module circuit 6 are provided, provide+3.3V power supply in human-computer interaction module circuit 3 is provided, provide+3.3V power supply in data monitoring modular circuit 4 is provided, provide+3.3V power supply in data memory module circuit 5 is provided, human-computer interaction module circuit 3 provides the artifactual epochs to main control module circuit 2, main control module circuit 2 provides feedback signal to human-computer interaction module circuit 3, main control module circuit 2 provides control signal to data monitoring modular circuit 4 and data memory module circuit 5, real-time communication module circuit 6 passes to main control module circuit 2 by communication data and communicates with the external world.
As shown in Figure 2, power module circuitry comprise one-level power conversion chip IC1, secondary power supply conversion chip IC2, diode D1, voltage stabilizing diode D2, three electrochemical capacitor C3, C4 and C5, four ceramic disc capacitor C1, C2, C6 and C7,, two inductance L 1 and L2, a resistance R 2.Wherein, one-level power conversion chip IC1 adopts the LM2576 of MICREL company, and secondary power supply conversion chip IC2 adopts ISP1117.
1 pin of power conversion chip IC1 is connected with the negative electrode of diode D1, and flying capcitor C3 and C4 are to ground simultaneously; The anode of diode D1 is the 24V voltage input end; 3 pin of IC1,5 pin ground connection; The 2 pin cross-over connection diode D2 of IC1 arrive ground, the inductance L of cross-over connection simultaneously 1 to 4 pin, and 4 pin shunt capacitance C5 also are connected with 3 pin of secondary power supply conversion chip IC2 to ground; The 1 pin ground connection of IC2,2 pin flying capcitor C1 and capacitor C 2 to ground, while also leads to whole power module circuitry+3.3V output terminal, 2 pin of IC2 are gone back cross-over connection inductance L 2 simultaneously and are connected with resistance R 2, C6, also draw whole power module circuitry+the 3.3VREF voltage output end, and flying capcitor C6 to ground; Resistance R 2 flying capcitor C7 are to ground.
As shown in Figure 3, the main control module circuit is comprised of main control chip IC3, crystal oscillator XTAL1, seven resistance R 9, R13, R14, R15, R16, R17 and R18, ten ceramic disc capacitor C13, C14, C15, C16, C17, C18, C19, C26, C27 and C28.
6 pin of IC3 are connected with the 3.3V voltage output end; 49 pin of IC3,74 pin, 99 pin, 27 pin, 94 pin and 10 pin ground connection; 12 pin of IC3 and flying capcitor C13 are to ground, and 13 pin flying capcitor C19 are to ground, cross-over connection crystal oscillator XTAL1 between them; After 50 pin of IC3,75 pin, 100 pin, 28 pin and 11 pin parallel connections, flying capcitor C27, C28, C20, C26, C21 and the 3.3V voltage output end in power module circuitry are connected; The 37 pin cross-over connection resistance R 9 of IC3 are connected with ground, and are connected with 28 pin of LCD LCD Interface J1 in the data monitoring modular circuit; 94 pin cross-over connection resistance R 18 ground connection of main control chip IC3; 19 pin of main control chip IC3,20 pin ground connection; The 21 pin flying capcitor C27 ground connection of main control chip IC3, and be connected with the 3.3VREF voltage output end in power module circuitry; The ground connection of the 22 pin flying capcitor C26 of main control chip IC3, and be connected with the 3.3V voltage output end in power module circuitry; The 63 pin cross-over connection resistance R 13 of main control chip IC3 are connected with the 3.3V voltage output end in power module circuitry, and are connected with 19 pin of LCD LCD Interface J1 in the data monitoring modular circuit; 64 of main control chip IC3 pin cross-over connection resistance R 14 is connected with 3.3V voltage output end in power module circuitry, and is connected with 30 pin of LCD interface J1 in the data monitoring modular circuit; The 65 pin cross-over connection resistance R 15 of main control chip IC3 are connected with the 3.3V voltage output end in power module circuitry, and are connected with 31 pin of LCD LCD Interface J1 in the data monitoring modular circuit; The 66 pin cross-over connection resistance R 16 of main control chip IC3 are connected with the 3.3V voltage output end in power module circuitry, and are connected with 32 pin of LCD LCD Interface J1 in the data monitoring modular circuit; The 14 pin cross-over connection resistance R 17 of main control chip IC3 are connected with the 3.3V voltage output end in power module circuitry, the C28 of cross-over connection simultaneously ground connection, and be connected with 23 pin of LCD LCD Interface J1 in the data monitoring modular circuit.
As shown in Figure 4, the human-computer interaction module circuit is comprised of six resistance R 3, R4, R6, R7, R19 and R20, two ceramic disc capacitor C29 and C30, four light emitting diode D4, D5, D6 and D7, two button S1 and S2.
Resistance R 3 cross-over connection light emitting diode D4 are connected with 55 pin of main control chip IC3 in the main control module circuit; Resistance R 4 cross-over connection light emitting diode D5 are connected with 56 pin of main control chip IC3 in the main control module circuit; In resistance R 6 cross-over connection light emitting diode D6 main control module circuit, 57 pin of main control chip IC3 connect; Resistance R 7 cross-over connection light emitting diode D7 are connected with 58 pin of main control chip IC3 in the main control module circuit; The other end of resistance R 3, R4, R6, R7 is connected with the 3.3V voltage output end in power module circuitry.
One end of resistance R 19 is connected with the 3.3V voltage output end in power module circuitry; The other end flying capcitor C29 ground connection of resistance R 19; The end of button S2 is connected with 25 pin of main control chip IC3 in the main control module circuit, other end ground connection; One end of resistance R 20 is connected with the 3.3V voltage output end in power module circuitry; The other end flying capcitor C30 ground connection of resistance R 20; The end of button S1 is connected with 24 pin of main control chip IC3 in the main control module circuit, other end ground connection.
As shown in Figure 5, the data monitoring modular circuit is comprised of LCD LCD Interface J1, two ceramic disc capacitor C8 and C9.
The 1 pin flying capcitor C8 of interface J1, C9 ground connection, and be connected with the 3.3V voltage output end in power module circuitry, the 2 pin ground connection of interface J1, 3 pin of interface J1, 4 pin, 5 pin, 6 pin, 7 pin, 8 pin, 9 pin, 10 pin, 11 pin, 12 pin, 13 pin, 14 pin, 15 pin, 16 pin, 17 pin, 18 pin, 20 pin, 21 pin, 22 pin, 24 pin, 25 pin, 26 pin, 27 pin, 29 pin respectively with the main control module circuit in 97 pin of main control chip IC3, 98 pin, 1 pin, 2 pin, 3 pin, 4 pin, 5 pin, 38 pin, 39 pin, 40 pin, 41 pin, 42 pin, 43 pin, 44 pin, 45 pin, 46 pin, 60 pin, 61 pin, 62 pin, 68 pin, 79 pin, 34 pin, 80 pin, 78 pin connect.
As shown in Figure 6, the data memory module circuit is comprised of SD card read-write interface SD, resistance R 5 and ceramic disc capacitor C10.
2 pin of interface SD, 3 pin, 5 pin, 7 pin are connected with 77 pin, 91 pin, 89 pin, 90 pin of main control chip IC3 in the main control module circuit respectively; 4 pin of interface SD are connected with the 3.3V voltage output end in power module circuitry, and 10 pin of cross-over connection resistance R 5 and interface SD are connected simultaneously, flying capcitor C10 ground connection; 6, the 9 pin ground connection of interface SD.
As shown in Figure 7, the real-time communication module circuit is comprised of level transferring chip MAX, transceiving chip CAN, two resistance R 10 and R11, six ceramic disc capacitor C11, C12, C20, C22, C24 and C25.
The 1 pin flying capcitor C20 of level transferring chip MAX and 3 pin of level transferring chip MAX are connected; The 2 pin flying capcitor C22 of level transferring chip MAX and 16 pin of level transferring chip MAX are connected; 16 pin of level transferring chip MAX are connected with the 3.3V voltage output end in power module circuitry; The 4 pin flying capcitor C25 of level transferring chip MAX and 5 pin of level transferring chip MAX are connected; Ground connection after the 6 pin flying capcitor C24 of level transferring chip MAX and 15 pin of level transferring chip MAX are connected; 11 pin of level transferring chip MAX, 12 pin are connected with 86 pin, 87 pin of main control chip IC3 in the main control module circuit respectively; 13 pin of level transferring chip MAX are the serial data receiving end; 14 pin of level transferring chip MAX are the serial data transmitting terminal; 1 pin of transceiving chip CAN is connected with 71 pin of main control chip IC3 in the main control module circuit; The 2 pin ground connection of transceiving chip CAN; The 3 pin flying capcitor C11 of transceiving chip CAN, C12 ground connection, and be connected with the 3.3V voltage output end in power module circuitry; The 4 pin cross-over connection resistance R 10 of transceiving chip CAN are connected with 70 pin of main control chip IC3 in the main control module circuit; 6 pin of transceiving chip CAN, 7 pin are as two buses of CAN, between cross-over connection resistance R 11; The 8 pin ground connection of transceiving chip CAN.
The related system of the utility model can be carried arbitrary equipment that possesses the lift-launch condition, can actual measurement equipment the state of operation, for the state of equipment provides raw data, realize since any time Monitoring Data and with different frequency monitoring data, directly perceived, convenient.
Claims (1)
1. a multi-functional online data monitoring system, comprise power module, main control module, human-computer interaction module, data monitoring module, data memory module and communication module, it is characterized in that:
Power module circuitry comprises one-level power conversion chip IC1, secondary power supply conversion chip IC2, diode D1, voltage stabilizing diode D2, three electrochemical capacitor C3, C4 and C5, four ceramic disc capacitor C1, C2, C6 and C7, two inductance L 1 and L2, a resistance R 2; The anodic bonding of 1 pin of one-level power conversion chip IC1 and the negative electrode of diode D1, electrochemical capacitor C3, C4, the anode of diode D1 is as the 24V voltage input end; 3 pin, 5 pin of one-level power conversion chip IC1 are connected with ground; 2 pin of one-level power conversion chip IC1 are connected with an end of inductance L 1 with after the parallel connection of voltage stabilizing diode D2 negative electrode; 4 pin of one-level power conversion chip IC1 are as the 5V voltage output end, and the 3 pin parallel connections of the anode of the other end of inductance L 1 and electrochemical capacitor C5, secondary power supply conversion chip IC2; 2 pin of secondary power supply conversion chip IC2 are the 3.3V voltage output end, and an end parallel connection of the end of ceramic disc capacitor C1, C2 and inductance L 2; The other end of inductance L 2 is 3.3V REF voltage output end, and in parallel with the end of an end of resistance R 2 and ceramic disc capacitor C6; The other end of resistance R 2 is connected with the end of ceramic disc capacitor C7; 2 pin of the other end of the negative electrode of electrochemical capacitor C3, C4, C5, ceramic disc capacitor C1, C2, C6 and C7, the anode of voltage stabilizing diode D2, secondary power supply conversion chip IC2 are ground connection all; One-level power conversion chip IC1 model is LM2576, and secondary power supply conversion chip IC2 model is ISP1117;
The main control module circuit is comprised of main control chip IC3, crystal oscillator XTAL1, seven resistance R 9, R13, R14, R15, R16, R17 and R18, ten ceramic disc capacitor C13, C14, C15, C16, C17, C18, C19, C26, C27 and C28; 6 pin of main control chip IC3 are connected with the 3.3V voltage output end in power module circuitry; 49 pin of main control chip IC3,74 pin, 99 pin, 27 pin, 94 pin and 10 pin ground connection; Be connected with the end of crystal oscillator XTAL1 after the end parallel connection of 12 pin of main control chip IC3 and ceramic disc capacitor C13, be connected with the other end of crystal oscillator XTAL1 after the end parallel connection of 13 pin and ceramic disc capacitor C26, the other end of ceramic disc capacitor C13 and C26 is ground connection all; After 50 pin of main control chip IC3,75 pin, 100 pin, 28 pin and 11 pin parallel connections, with the end of ceramic disc capacitor C18, C17, C16, C15, C14 is in parallel, also with the 3.3V voltage output end in power module circuitry, be connected; After 49 pin of main control chip IC3,74 pin, 99 pin, 27 pin and 10 pin parallel connections and the other end earth of ceramic disc capacitor C18, C17, C16, C15, C14; 37 pin of main control chip IC3 and an end of resistance R 9 and in parallel with 28 pin of LCD LCD Interface J1 in the data monitoring modular circuit, the other end of resistance R 9 is connected with ground; 94 pin of main control chip IC3 are connected with an end of resistance R 18, the other end ground connection of resistance R 18; The end earth of 19 pin of main control chip IC3,20 pin and ceramic disc capacitor C26, C27; 21 pin of main control chip IC3 with after the other end parallel connection of ceramic disc capacitor C27, with the 3.3VREF voltage output end in power module circuitry, be connected; 22 pin of main control chip IC3 with after the other end parallel connection of ceramic disc capacitor C26, with the 3.3V voltage output end in power module circuitry, be connected; 63 pin of main control chip IC3 and an end of resistance R 13 and in parallel with 19 pin of LCD LCD Interface J1 in the data monitoring modular circuit; 64 pin of main control chip IC3 and an end of resistance R 14 and in parallel with 30 pin of LCD interface J1 in the data monitoring modular circuit; 65 pin of main control chip IC3 and an end of resistance R 15 and in parallel with 31 pin of LCD LCD Interface J1 in the data monitoring modular circuit; 66 pin of main control chip IC3 and an end of resistance R 16 and in parallel with 32 pin of LCD LCD Interface J1 in the data monitoring modular circuit; The end of 14 pin of main control chip IC3 and an end of resistance R 17, ceramic disc capacitor C28 and in parallel with 23 pin of LCD LCD Interface J1 in the data monitoring modular circuit; The other end of resistance R 17 is connected with the 3.3V voltage output end in power module circuitry; The other end ground connection of ceramic disc capacitor C28; Main control chip IC3 model is STM32F103VCT6;
The human-computer interaction module circuit is comprised of six resistance R 3, R4, R6, R7, R19 and R20, two ceramic disc capacitor C29 and C30, four light emitting diode D4, D5, D6 and D7, two button S1 and S2; One end of resistance R 3 is connected with the 3.3V voltage output end in power module circuitry; The anodic bonding of the other end of resistance R 3 and light emitting diode D4; The negative electrode of light emitting diode D4 is connected with 55 pin of main control chip IC3 in the main control module circuit; One end of resistance R 4 is connected with the 3.3V voltage output end in power module circuitry; The anodic bonding of the other end of resistance R 4 and light emitting diode D5; The negative electrode of light emitting diode D5 is connected with 56 pin of main control chip IC3 in the main control module circuit; One end of resistance R 6 is connected with the 3.3V voltage output end in power module circuitry; The anodic bonding of the other end of resistance R 6 and light emitting diode D6; The negative electrode of light emitting diode D6 is connected with 57 pin of main control chip IC3 in the main control module circuit; One end of resistance R 7 is connected with the 3.3V voltage output end in power module circuitry; The anodic bonding of the other end of resistance R 7 and light emitting diode D7; The negative electrode of light emitting diode D7 is connected with 58 pin of main control chip IC3 in the main control module circuit; One end of resistance R 19 is connected with the 3.3V voltage output end in power module circuitry; The 25 pin parallel connections of main control chip IC3 in the end of the other end of resistance R 19 and ceramic disc capacitor C29, the end of button S2 and main control module circuit; Ground connection after the other end parallel connection of the other end of ceramic disc capacitor C29 and button S2; One end of resistance R 20 is connected with the 3.3V voltage output end in power module circuitry; The 24 pin parallel connections of main control chip IC3 in the end of the other end of resistance R 20 and ceramic disc capacitor C30, the end of button S1 and main control module circuit; Ground connection after the other end parallel connection of the other end of ceramic disc capacitor C30 and button S1;
The data monitoring modular circuit is comprised of LCD LCD Interface J1, two ceramic disc capacitor C8 and C9; 3.3V voltage output end parallel connection in 1 pin of interface J1 and the end of ceramic disc capacitor C8, C9 and power module circuitry; Ground connection after 2 pin of interface J1 and the other end parallel connection of ceramic disc capacitor C8, C9; 3 pin of interface J1 are connected with 97 pin of main control chip IC3 in the main control module circuit; 4 pin of interface J1 are connected with 98 pin of main control chip IC3 in the main control module circuit; 5 pin of interface J1 are connected with 1 pin of main control chip IC3 in the main control module circuit; 6 pin of interface J1 are connected with 2 pin of main control chip IC3 in the main control module circuit; 7 pin of interface J1 are connected with 3 pin of main control chip IC3 in the main control module circuit; 8 pin of interface J1 are connected with 4 pin of main control chip IC3 in the main control module circuit; 9 pin of interface J1 are connected with 5 pin of main control chip IC3 in the main control module circuit; 10 pin of interface J1 are connected with 38 pin of main control chip IC3 in the main control module circuit; 11 pin of interface J1 are connected with 39 pin of main control chip IC3 in the main control module circuit; 12 pin of interface J1 are connected with 40 pin of main control chip IC3 in the main control module circuit; 13 pin of interface J1 are connected with 41 pin of main control chip IC3 in the main control module circuit; 14 pin of interface J1 are connected with 42 pin of main control chip IC3 in the main control module circuit; 15 pin of interface J1 are connected with 43 pin of main control chip IC3 in the main control module circuit; 16 pin of interface J1 are connected with 44 pin of main control chip IC3 in the main control module circuit; 17 pin of interface J1 are connected with 45 pin of main control chip IC3 in the main control module circuit; 18 pin of interface J1 are connected with 46 pin of main control chip IC3 in the main control module circuit; 20 pin of interface J1 are connected with 60 pin of main control chip IC3 in the main control module circuit; 21 pin of interface J1 are connected with 61 pin of main control chip IC3 in the main control module circuit; 22 pin of interface J1 are connected with 62 pin of main control chip IC3 in the main control module circuit; 24 pin of interface J1 are connected with 68 pin of main control chip IC3 in the main control module circuit; 25 pin of interface J1 are connected with 79 pin of main control chip IC3 in the main control module circuit; 26 pin of interface J1 are connected with 34 pin of main control chip IC3 in the main control module circuit; 27 pin of interface J1 are connected with 80 pin of main control chip IC3 in the main control module circuit; 29 pin of interface J1 are connected with 78 pin of main control chip IC3 in the main control module circuit;
The data memory module circuit is comprised of SD card read-write interface SD, resistance R 5 and ceramic disc capacitor C10; 2 pin of interface SD are connected with 77 pin of main control chip IC3 in the main control module circuit; 3 pin of interface SD are connected with 91 pin of main control chip IC3 in the main control module circuit; The end parallel connection of 4 pin of interface SD and an end of resistance R 5 and ceramic disc capacitor C10; The other end of resistance R 5 is connected with 10 pin of interface SD; The other end ground connection of ceramic disc capacitor C10; 5 pin of interface SD are connected with 89 pin of main control chip IC3 in the main control module circuit; 6, the 9 pin ground connection of interface SD; 7 pin of interface SD are connected with 90 pin of main control chip IC3 in the main control module circuit;
The real-time communication module circuit is comprised of level transferring chip MAX, transceiving chip CAN, two resistance R 10 and R11, six ceramic disc capacitor C11, C12, C20, C22, C24 and C25; 1 pin of level transferring chip MAX is connected with the end of ceramic disc capacitor C20; 3 pin of the other end of ceramic disc capacitor C20 and level transferring chip MAX are connected; 2 pin of level transferring chip MAX are connected with the end of ceramic disc capacitor C22; 16 pin of the other end of ceramic disc capacitor C22 and level transferring chip MAX and the 3.3V voltage output end parallel connection in power module circuitry; 4 pin of level transferring chip MAX are connected with the end of ceramic disc capacitor C25; 5 pin of the other end of ceramic disc capacitor C25 and level transferring chip MAX are connected; 6 pin of level transferring chip MAX are connected with the end of ceramic disc capacitor C24; Ground connection after the 15 pin parallel connections of the other end of ceramic disc capacitor C24 and level transferring chip MAX; 11 pin of level transferring chip MAX are connected with 86 pin of main control chip IC3 in the main control module circuit; 12 pin of level transferring chip MAX are connected with 87 pin of main control chip IC3 in the main control module circuit; 13 pin of level transferring chip MAX are the serial data receiving end; 14 pin of level transferring chip MAX are the serial data transmitting terminal; 1 pin of transceiving chip CAN is connected with 71 pin of main control chip IC3 in the main control module circuit; Ground connection after the end parallel connection of 2 pin of transceiving chip CAN and ceramic disc capacitor C11, C12; 3 pin of transceiving chip CAN with after the other end parallel connection of ceramic disc capacitor C11, C12, with the 3.3V voltage output end in power module circuitry, be connected; 4 pin of transceiving chip CAN are connected with an end of resistance R 10; The other end of resistance R 10 is connected with 70 pin of main control chip IC3 in the main control module circuit; 6 pin of transceiving chip CAN are connected the road as the CAN bus with an end of resistance R 11; 7 pin of transceiving chip CAN are connected another road as the CAN bus with the other end of resistance R 11; The 8 pin ground connection of transceiving chip CAN; Level transferring chip MAX model is that MAX3X232, transceiving chip CAN model are SN65HVD230D.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013203442264U CN203350696U (en) | 2013-06-13 | 2013-06-13 | Multifunctional on-line data monitoring system |
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| CN2013203442264U CN203350696U (en) | 2013-06-13 | 2013-06-13 | Multifunctional on-line data monitoring system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103425097A (en) * | 2013-06-13 | 2013-12-04 | 杭州电子科技大学 | Multifunctional on-line data monitoring system |
| CN103760864A (en) * | 2014-01-21 | 2014-04-30 | 杭州电子科技大学 | Monitoring node of effluvial gas and VOCs |
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2013
- 2013-06-13 CN CN2013203442264U patent/CN203350696U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103425097A (en) * | 2013-06-13 | 2013-12-04 | 杭州电子科技大学 | Multifunctional on-line data monitoring system |
| CN103425097B (en) * | 2013-06-13 | 2015-12-23 | 杭州电子科技大学 | Multi-functional online data monitoring system |
| CN103760864A (en) * | 2014-01-21 | 2014-04-30 | 杭州电子科技大学 | Monitoring node of effluvial gas and VOCs |
| CN103760864B (en) * | 2014-01-21 | 2016-08-17 | 杭州电子科技大学 | Stench class gas and VOCs monitoring node |
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