CN203349197U

CN203349197U - Device supporting and correcting light emitting diode

Info

Publication number: CN203349197U
Application number: CN201320312846XU
Authority: CN
Inventors: 罗卡斯
Original assignee: Led Lenser Corp Ltd
Current assignee: Led Lenser Corp Ltd
Priority date: 2013-05-31
Filing date: 2013-05-31
Publication date: 2013-12-18
Anticipated expiration: 2023-05-31

Abstract

The utility model discloses an improved device providing a modularized LED circuit unit and especially an embodiment of the utility model provides a device supporting and correcting light emitting diode. The device comprises an LED circuit plate, a first main surface and a second main surface. The first main surface comprises a first contact pad and a second contact pad, wherein both the first and the second contact pads are designed to accommodate single connectors from the LED; the second main surface of the LED circuit plate comprises a first area, a second area and a third area; and a base plate passes through the third area and is connected to the LED circuit plate. The device supporting and correcting light emitting diode is applicable to an LED light emitting assembly and has high efficiency, fast heat radiation and good economic benefit.

Description

For supporting the device of light emitting diode and for calibrating the device of light emitting diode

Technical field

The utility model relates to a kind of system and method that illumination is provided, and more particularly, relates to a kind of device for the modularization light emitting diode circuit component, and this circuit unit heat dispersion is better, and manufacturing cost is lower and be easier to manufacture.

Background technology

From house or commercial ligthing paraphernalia to flashlight, electric light source can exist in a variety of forms.Traditional incandescent lamp bulb is replaced by fluorescent lamp bulb and energy-saving bulb (CFL) more efficiently, can provide roughly similar light in the energy expending still less.Although electricity-saving lamp is more efficient than the incandescent lamp of equal luminous intensity, light emitting diode (LEDs) can be more efficient under the equal intensity of light source of generation.

LED is more expensive than incandescent lamp or electricity-saving lamp at first, and is not suitable for many application.In addition, the low-intensity of LED and limited color select also to have limited their use.The nearest development in LED field has made LED light source become substitute or the complementary goods that conventional light source is general.Even, LED can be packaged into than the incandescent lamp of equal intensity of illumination or the less form of electricity-saving lamp.But LED is also easily overheated, thereby cause too early damage.

The utility model content

According to above-mentioned background, example embodiment of the present utility model provides a kind of improved device, method and system for the modularized limit emitting diode (LED) circuit unit is provided.Especially, example embodiment of the present utility model has comprised the modularized limit emitting diode (LED) circuit of expanding in a variety of forms and applying.An embodiment of the present utility model provides that a kind of this light emitting diode comprises the LED circuit plate for supporting the device of light emitting diode, and this circuit board comprises the first first type surface and the second first type surface.The first first type surface comprises the first contact pad and the second contact pad, and in this first contact pad and the second contact pad, each contact pad is configured to the accommodating connector separately from LED.The second first type surface of LED circuit plate comprises the firstth district, Second Region He 3rd district, and wherein substrate is connected on the LED circuit plate through the 3rd district.The firstth district of the second first type surface of LED circuit plate is configured to engage with the first pin of LED drive circuit, and the Second Region of the second first type surface of LED circuit plate is configured to engage with the second pin of LED drive circuit.Substrate can comprise that a kind of pyroconductivity is greater than the material of 30 watts every meter every Kelvin (W/ (m*k)).This substrate sticks on the LED circuit plate by binding agent, and the pyroconductivity of this binding agent is greater than 30 watts every meter every Kelvin (W/ (m*k)).

The first contact pad of LED circuit can electrically contact with the firstth district of the second first type surface, and the second contact pad can electrically contact with Second Region.The first contact pad and the second contact pad can not electrically contact mutually.The first pin of LED drive circuit comprises the first contact-making surface, and this first contact-making surface has the first contact-making surface zone, and the second pin of LED drive circuit comprises the second contact-making surface, and this second contact-making surface comprises the second contact-making surface zone.The first pin is connected with the firstth district through the first contact-making surface zone, and the second pin is connected with Second Region through the second contact-making surface zone.The firstth district of LED circuit plate may be greater than the first contact-making surface zone, and the Second Region of LED circuit plate may be greater than the second contact-making surface zone.Can form an air duct between substrate and LED drive circuit.

Embodiment of the present utility model will provide one for calibrating the device of LED.This calibrating installation comprises the first element, and this first element has first side and Second Edge, and wherein the Second Edge of the first element is made as the accommodating LED circuit plate that LED is arranged on it.The first element has the ，Gai hole, hole of running through and is made as accommodating LED.The second element has first side and Second Edge, and this second element adheres to the first element by the first appendage.The second element has the hole of running through, for accommodating LED circuit plate.Hole on the first element is made as the LED circuit plate that has LED for calibrating on it.The size and shape in hole depends on and runs through the LED be contained in this hole.The first element, the second element and the first appendage consist of single monoblock unit.The first element comprises the material of insulation in fact.

It is a kind of for supporting the device of LED that embodiment of the present utility model will provide.This device comprises the LED circuit plate, and this LED circuit plate comprises the first first type surface and the second first type surface, and wherein the first first type surface comprises the first contact pad and the second contact pad, and the first contact pad and the second contact pad all are made as accommodating each connector from LED.The second first type surface comprises the firstth district, Second Region He 3rd district.This device also comprises the calibrated component with calibration hole, and this calibrated component is made as accommodating LED circuit plate and calibration LED.This device also comprises LED drive circuit, and described LED drive circuit comprises the first pin and the second pin, and wherein the first pin is made as with the firstth district of the second first type surface and electrically contacts, and the Second Region of the second pin and the second first type surface electrically contacts.The first pin of LED drive circuit and the second pin comprise respectively cylinder and axle, and this axle will be positioned at the deflection position of cylinder.

The first pin comprises the first contact-making surface, this contact-making surface contains the first contact-making surface zone, the second pin comprises the second contact-making surface, this contact-making surface contains the second contact-making surface zone, through the first contact-making surface zone, set up and electrically contact between the first pin and the firstth district, through the second contact-making surface zone, between the second pin and Second Region, set up and electrically contact.The size in the firstth district is greater than the first contact-making surface zone, and the size of Second Region is greater than the second contact-making surface zone.The first pin can cooperate with the firstth district and Second Region on the second first type surface respectively with the second pin, so that the firstth district and the first pin and Second Region and the second pin keep electrically contacting in three axis relative motion processes of any quadrature of LED circuit plate and LED drive circuit.

The accompanying drawing explanation

Referring now to accompanying drawing, the utility model is briefly described, these accompanying drawings do not need to draw in proportion, wherein:

Fig. 1 is the schematic diagram that can apply the flashlight of the utility model embodiment;

Fig. 2 is that it comprises the modularized limit emitting diode (LED) circuit according to the flashlight lens case of the utility model illustrative examples and the cross-sectional view of cylindrical shell;

Fig. 3 removes the cross-sectional view of lens case in order to be easier to illustrate flashlight in Fig. 2;

Fig. 4 is the perspective view according to the calibrating installation for LED of the utility model illustrative examples;

Fig. 5 is the LED circuit plate perspective view according to the utility model illustrative examples;

Fig. 6 is the LED circuit plate upward view according to the utility model illustrative examples;

Fig. 7 is that the LED circuit plate in Fig. 5 and Fig. 6 is contained in the constitutional diagram in Fig. 4 calibrating installation;

Fig. 8 A is the perspective view according to a pin of the LED drive circuit of the utility model illustrative examples;

Fig. 8 B is the cross-sectional view of Fig. 8 A;

Fig. 9 is the perspective view according to the LED circuit plate that comprises pin of the utility model illustrative examples;

Figure 10 is the cross-sectional view of the LED circuit assembly of LED circuit plate shown in application drawing 9;

Figure 11 is the perspective view according to the LED circuit plate that comprises pin of the utility model illustrative examples;

Figure 12 is the cross-sectional view of the LED circuit assembly of LED circuit plate shown in application Figure 10;

Figure 13 is the cross-sectional view of flashlight of the LED circuit assembly of application the utility model illustrative examples;

Figure 14 is the cutaway view of the LED circuit assembly in Figure 13 embodiment;

Figure 15 is the perspective view according to the LED circuit assembly of the utility model illustrative examples, and it comprises shell that can accommodating LED;

Figure 16 is another perspective view of LED circuit assembly in Figure 15;

Figure 17 is the cross-sectional view according to another illustrative examples of LED circuit assembly of the present utility model;

Figure 18 is the cross sectional representation of the embodiment that fixed of Figure 17 cap;

Figure 19 is the schematic diagram with the LED circuit plate of the utility model various embodiments application.

The specific embodiment

The utility model is more comprehensively described in connection with accompanying drawing hereinafter, at these shown in the drawings of the utility model preferred embodiment.Yet the utility model can show as multiple different form, and should not be interpreted as the embodiment that only limits to embodied herein; On the contrary, provide these embodiment to make the utility model open comprehensively with complete, and will intactly show scope of the present utility model for those skilled in the art.In the text, identical Reference numeral means identical parts.

Example embodiment of the present utility model is described or describes to be presented as the form of flashlight usually.However, clearly, embodiment of the present utility model can expand and be applied to almost in any form, as house and commercial ligthing paraphernalia, automation application (as: headlight, signal lamp and/or indoor lamp), especially illuminating lamp, indoor/outdoor illumination, street lamp.Similarly, content disclosed herein only provides an example embodiment, and is not limited to this.

Refer now to the embodiment in Fig. 1, embodiment of the present utility model can be applicable to flashlight, and as flashlight in Fig. 1 100, it has comprised cylindrical shell 110, lens case 120 and lens 130.Lens case 120 also can comprise speculum (for example being essentially paraboloidal mirror), the part of the light beam exhaled from light source by reflection, and this light source is not directly towards lens, thus the amplification intensity of illumination.Selectively, lens can be set to refracted ray, thereby make the light beam exhaled from light source can focus to desirable focal length.Speculum and/or refractor can be regulated, thereby adjust the focal length from the light beam of flashlight 100.

Traditional incandescent lamp bulb can give out light image from hemispheric bulb, and this need to be focused to taper shape by light beam by speculum and/or refractor, and the LED lamp does not need speculum or refractor just can produce the circular cone light beam more focused on.Therefore, LED flashlight or other LED light source can not need speculum and/or refractor.But, in order to maximize the diversity of LED light source, can utilize refractor to strengthen and focus on the LED light beam.

With the light source of other type, compare, with respect to their size, LED can provide stronger light.Due to size and the structure of their compactnesses, LED also can produce heats a large amount of for its size.The problems of excessive heat of LED can cause too early damage.As this, example embodiment of the present utility model will provide improved heat dissipation characteristics for LED and LED circuit assembly, and modular, extendible design also is provided simultaneously, and this design is applicable to the LED light source of any size and shape.

Fig. 2 has shown the cross section of the utility model with the embodiment of flashlight form application, comprises lens case 200 and cylindrical shell 270.Lens case 200 comprises refractor 210 and fin 220 in the illustrated embodiment, and this fin 220 is positioned at the periphery of lens case 200.In order to dissipate better from the heat of LED, lens case adopts the material of better heat conductivility.These materials, as aluminium, have than other material heat conductivility as better as plastics, and plastics can not heat conduction.Lens 210 can adopt polypropylene, glass or other preferably provide the high grade of transparency and highly reflective can material.Lens case 200 can remove from the cylindrical shell 270 of flashlight, and the interface between lens case 200 and cylindrical shell 270 can be regulated, and to change the distance between LED250 and lens 210, thereby changes the focal length of flashlight beam.

Fig. 3 has shown that flashlight in Fig. 2 removes the state of lens case 200.Fig. 2 and Fig. 3 have described a kind of also LED circuit assembly of driving LED that supports.In figure, show, within the LED circuit assembly is encapsulated in cylindrical shell 270 or be connected to cylindrical shell 270, example embodiment can be also be arranged at lens case 200 within.In addition, the LED circuit assembly of other example embodiment also can be arranged at, for example, and within screw base, within this screw base is set to be placed in the common light socket for house or commercial ligthing paraphernalia.

Modularized limit emitting diode (LED) circuit unit in shown embodiment comprises LED drive circuit 230, and this LED drive circuit 230 comprises the first drive circuit board 232, the second drive circuit boards 236, and is located at the escapement 234 between them.Shown LED drive circuit is shown as two

independent circuit boards

232 and 236, by the pin of being located within escapement 234, electrically contacts.Yet this set can be designed to miniaturized components.Two

circuit boards

232 and 236 can be set to single circuit board in other embodiments.Shown in the configuration the parts that advantage is LED drive circuit 230, such as being arranged at microchip on

circuit board

232 and 236, resistor, capacitor etc., can be arranged between two circuit boards, this set be conducive to heat radiation and with flashlight in the insulation of other element.Extend two

pins

240 and 245 from the LED drive circuit of shown embodiment, with anode and the negative electrode that driving LED is provided.

Fig. 3 embodiment has further described the calibrating installation of LED, and this calibrating installation comprises the first element 285 and the second element 280.Fig. 4 depicts the stereogram of this calibrating installation 300.It should be noted that the calibrating installation 300 in Fig. 4 and Fig. 7, and the circuit board in Fig. 5 and Fig. 6, rotated 90 degree with respect to the diagram in Fig. 2 and Fig. 3.Calibrating installation 300 comprises that the interior 310，Gai hole, hole 310 of the first element 285 is for accommodating LED(Fig. 3 250).The size and shape in hole 310 can be adjusted according to the size and shape of accommodating LED in the inner, so that can align with the suitable projection of the light beam given out from LED of LED in hole 310.The first element 285 can be connected to the second element 280 by connecting portion 320.Although shown embodiment has described two coupling parts 320, can be around the first element setting only coupling part 320 or a plurality of coupling part 320, for connecting the first element 285 and the second element 280.Yet what be worth approval is according to hereinafter described, is that regional most do not have connecting portion between the first element 285 and the second element 280 ideally, so that heat radiation.In shown embodiment, the first element 285, the second element 280 and connecting portion 320 combinations form a air gap 340 between them.The first element 285, the second element 280 and connecting portion 320 can be made into single integrated, for example modular unit.

For calibrating installation being mounted on flashlight cylinder 270, calibrating installation can arrange connecting hole 330 or similar technical characterictic.As hereinafter mentioned, calibrating installation can be used to LED circuit is mounted in shell, as the cylindrical shell 270 of flashlight.

As mentioned above, calibrating installation 300 comprises that 310，Gai hole, hole 310 on the first element 285 is for accommodating LED250.Fig. 5 has described such LED250 who is connected on LED circuit plate 255.Circuit board can comprise the first first type surface 256, on this first first type surface 256, is the first and second contact pads 254.LED250 comprises two connectors 252, and each connector can be mounted on the contact pad separately 254 of LED circuit plate 255.These connectors can be welded in or alternate manner is mounted on contact pad separately by conductive adhesive.The LED circuit plate 255 of shown embodiment comprises the second first type surface, and it is arranged at the reverse side of the first first type surface 256 of circuit board 255.Substrate 260 can be connected on the part of the second first type surface.Substrate 260 is comprised of thermal conducting material, as copper or aluminium, etc., and can be mounted to the zone of the second first type surface of circuit board 255.Substrate 260 adheres on circuit board 255 by the thermal conductance binding agent, thereby the heat that LED is produced can shed by appended substrate 260.

Also further demonstrate the cut-off parts of substrate 260 in Fig. 5, a part that makes the second first type surface of circuit board 255 is expose and can be accessed by.Similarly cut-off parts is arranged on the reverse side of substrate 260, as shown in Figure 6.On the second first type surface of circuit board 255 two expose and accessible part, can comprise the Second Region of the second first type surface of firstth district of the second first type surface of circuit board 255 and circuit board 255.In the firstth district and Second Region, each district can be conductive region, can be made as accommodating pin (as 240 and 245 in Fig. 2 and Fig. 3).The first pin and the second pin can be respectively electrically contact with the firstth district of the second first type surface of circuit board 255 and the independent formation in Second Region.In the firstth district and Second Region each district can be further with the first first type surface of circuit board 255 on contact pad separately 254 form and electrically contact.Therefore, each pin 240 of LED drive circuit and 245 electrically contacts with the connector 252 of LED250, based on pin 240, with 245, with the firstth district on circuit board 255, with Second Region, is connected.

What Fig. 6 showed is to see the plane of circuit board from the second first type surface direction.As shown in the figure, the first district 258 that the cut-off parts 410 on substrate 260 is exposed to the second first type surface on circuit board is configured to the independent pin on LED drive circuit, contact respectively with Second Region 259 ，Zhe Liang districts.Substrate 260 is connected to the second first type surface 3rd district of circuit board, thereby heat is shed from LED250 and circuit board 255.

Shown in Fig. 7, described the situation that circuit board 400 and calibrator 300 are bonded together, the first first type surface 256 of circuit board 255 receives the first side of the first elements 285, and LED250 can be placed in the hole 310 of the first element 285.Circuit board 255 and substrate 260 are arranged between the first element 285 and the second element 280, and the part of substrate 260 is visible by the air gap 340 in calibrator 300.Substrate 260 has improved the heat radiation of substrate 260 by the expose portion of the air gap 340, and allows the zone of dissipation of heat to the calibrator top, rather than heat is sealed in to the calibrator below in flashlight cylinder 270.

Refer back to Fig. 3, during assembling, the LED circuit assembly comprises LED drive circuit 230, in order to receive for example, electric weight from power supply (battery), and is 255 power supplies of LED circuit plate by pin 240 and 245.Fig. 8 A has shown the stereogram according to the pin of example embodiment, and Fig. 8 B has shown its cross-sectional view.Each pin comprises cylinder 520, bottom 530 and axle 510.Within axle 510 is placed in cylinder 520, and by biasing element 540, this axle is biased by the spring to extended position, in the present embodiment, this biasing element 540 is helical spring.Axle 510 can be in cylinder 520 complete advanced position and full extended position between move.This moving range allows to align between LED drive circuit and LED circuit plate, to change the moving range of cylinder 520 interior axles 510.Due to the foozle of calibrator, when this calibrator, comprise LED circuit plate and LED, while being placed in the cylindrical shell 270 of illustrated embodiment, spring-loaded

240 and 245 foozles that can eliminate to a certain degree.

As described in Fig. 8 A and Fig. 8 B, the top of the axle 510 of each pin (as: pin 240 and 245) comprises the contact-making surface with contact area.The contact-making surface of pin is configured to, and with Yi Ge district in first or Second Region of the second first type surface through the LED circuit plate of contact area, contacts.This has just set up the electric general character between pin and the firstth district or Second Region.As shown in Figure 6, each district in the first district 258 and Second Region 259 has the zone that area is greater than the contact zone of pin contact-making surface 550.In addition, the size of cut-off parts 410 can surpass the diameter of axle 510.Therefore, the contact-making surface of pin will, through its contact-making surface zone, be set up and be electrically connected to any position of the first district 258 and Second Region 259.This allows the fault-tolerance of pin with respect to the alignment of circuit board 255.Because pin can be in the interior motion of cut-off parts 410, and can between pin and the first district 258 or Second Region 259, contact, this is to will definitely change to a certain extent along circuit board 255 planes the free degree of two orthogonal directions (namely).

The alignment tolerance provided in the configuration by circuit board 255, substrate 260 and cut-off parts 410 and cylinder 520 interior pins 240, the spring of the axle 510 in 245 loads between motion, be provided with alignment tolerance, in its mutually orthogonal three-axis moving between LED drive circuit 230 and LED circuit plate 255, allow to have a greater change in fabrication tolerance.By increasing this tolerance, thereby reduce manufacturing cost.

Although

240 and 245 has shown, the flexibility of fabrication tolerance is contributed to some extent, pin also provides additional space for the LED circuit plate, and this additional space has improved the heat dissipation properties of modularized limit emitting diode (LED) circuit unit.Refer again to Fig. 3, from the extended pin 240 of

LED drive circuit

230 and 245, allow to separate between LED drive circuit and circuit board 255.This will produce the air gap 560 between LED drive circuit 230 and circuit board 255, thereby allow substrate 260 to dispel the heat better.The accumulation of heat in the modularized limit emitting diode (LED) circuit unit that contended with better of this additional space, thus life-span of LED and component extended.

Purpose for above-mentioned specification and aforementioned claim, term " light emitting diode " or " LED " can include but not limited to the White LED of high brightness, blue led, red LED, orange LED, amber LED, yellow led, green LED, double-colored or three-color LED, multi-colored led, infrared LEDs, and ultraviolet LED.The advantage of these LED is, with conventional incandescent bulb or resistance bulb, compares, and only needs less electric weight but can produce higher illuminance.

Fig. 2-7 have shown the first embodiment for the system of modularization light emitting diode circuit component, at this, have also described other embodiment, calibration further is provided and improves light emitting diode circuit component.Fig. 9 demonstrates the embodiment comprised with Fig. 8 A and the similar pin of 8B.In the embodiment shown in fig. 9, pin comprises cylinder 630 and receives this spring of 630 loading axle 640 that 620 places are connected on LED circuit plate 600 at backing plate.Each backing plate 620 electrically contacts by the trace 625 on LED circuit plate 600 and the connector separately of LED610 respectively.

Figure 10 is LED circuit plate 600 in Fig. 9 and pin configuration to the cross-sectional view in the LED circuit assembly.Circuit board 600 is supported in shell 655, and this shell is provided with hole 660 with accommodating LED610.Comprising that cylinder 630 and the pin of axle 640 are placed in LED drive circuit plate 650 electrically contacts.In certain embodiments, the LED drive circuit plate will be mounted in the cylindrical shell of flashlight, as Fig. 2 middle cylinder body 270, and comprise that 653，Gai hole, hole 653 is used for placing the locking plate 657 of shell 655.Like this, shell 655 can accommodating LED circuit plate 600, comprises LED610 and pin.Shell 655 will be mounted on LED drive circuit plate 650 by locking plate 657 subsequently.Variation to a certain degree, occur by the position of the fabrication tolerance of the cylindrical shell inside and outside shell 655 of permission flashlight and LED drive circuit plate 650 in axle 640 motion in the cylinder 630 of pin.

Described as Fig. 2-7 embodiment, the space between LED circuit plate 600 and LED drive circuit plate 650 can be used for improving the heat radiation of LED circuit plate.It is open that zone between LED circuit plate 600 and LED drive circuit 650 keeps, so that air while therefrom flowing through, can be connected to heat conducting material on the LED circuit plate material 665 as described in Figure 10.These materials will contribute to the heat of LED circuit plate 600 to dissipate.

Figure 11 has shown the LED circuit plate of another example embodiment of the utility model, and this LED circuit plate 700 comprises LED710 and is attached to the pin 730 on circuit board 700 by backing plate 720.In Figure 11, the pin 730 of embodiment is regular length, and this is very common to those of ordinary skills.Figure 12 has shown an example embodiment of applying the LED circuit assembly of LED circuit plate in Figure 11.LED circuit plate 700 is placed on shell 740, and pin 730 is placed in opening 745.By cap 750, LED circuit plate 700 is fixed on shell 740, this cap 750 is provided with the hole of running through for accommodating LED710.Each root pin 730 can be made as with electric wire 755 and be connected, and this electric wire 755 extends out between pin 730 and LED drive circuit plate 760.Pin can utilize any conventional method to be fixed on the LED drive circuit plate.

Figure 13 has shown another example embodiment of LED assembly.Shown embodiment comprises the cross section of lens case 830, with similar shown in Fig. 2, comprises fin 835.LED drive circuit plate 825 will be placed in lens case 830 as shown in the figure; And other embodiment can comprise that the LED drive circuit plate is placed in flashlight cylinder.LED drive circuit plate 825 can comprise pin sockets 820, and this pin sockets 820 is made as the accommodating pin be connected on LED circuit plate 800.Within the LED circuit plate can be contained in shell 815.As shown in figure 14, this shell comprises the hole for accommodating LED810, and comprises that two conductive traces 817, this conductive trace 817 are applicable to be electrically connected to the connector separately of LED810.Each conductive trace 817 comprises pin 819, and it runs through from shell 815 and extends, and is located in the socket 820 on LED drive circuit plate 825.As shown in figure 13, shell further comprises the radiator 805 with high-termal conductivity, and its Nei，Gai space, space be filled at least in part between LED circuit plate 800 and LED drive circuit 825 is produced by example embodiment of the present utility model.As long as between LED circuit plate 800 and LED drive circuit plate 825, enough the air gaps are arranged, when distributing the heat produced by LED circuit plate 800, shown radiator 805 can omit in an embodiment.

Figure 15 shows another example embodiment of LED assembly.In the embodiment shown, shell 940 comprises conductive prong thigh 920 and 930.Fork thigh 920,930 is plastic to shell 940.Shell 940 is configured in the accommodating cavity to shell 940 of LED circuit plate 900.LED910 is mounted on LED circuit plate 900, within being arranged at the hole 915 of shell 940.Conductive prong thigh 920,930 is configured to respectively electrically contact with the connector separately of LED910.

Referring now to Figure 16, each

conductive prong thigh

920 and 930 extends through shell to terminal 950, at this place's conductive prong thigh, with electric wire 960, is connected.Electric wire 960 is connected to the LED drive circuit plate subsequently.The interior zone 925 of shell 940 can be configured to and contributes to 900 heat radiations of LED circuit plate.Interior zone 925 can be the air gap, by the air in this gap, the heat from LED circuit plate 900 can be taken away, or alternately, interior zone 925 can comprise a kind of material with high-termal conductivity, to be used as fin.

Figure 17 has shown another example embodiment of the present utility model, has described the cross-sectional view of the assembly for supporting LED circuit.Go out as illustrated, LED circuit plate 1000 comprises LED1010, and it is positioned over from the top of the extended projection 1007 of shell 1003.For LED circuit plate 1000 is dispelled the heat effectively, projection 1007 reaches shell 1003 possibly, can be made by a kind of high conductivity material.Extended from shell can be two shell connectors 1040, and they are configured to conduct the electric current between LED circuit plate 1000 and LED drive circuit plate (not shown).For example,, within the LED drive circuit plate can be positioned at shell 1003.Lid 1009 can be placed on the top of LED circuit plate 1000 and be pasted to projection 1007.Within this lid 1009, can be the first and second conductive prong thighs 1020.Each conductive prong thigh 1020 can be set to be connected with the single connector of LED1010.Conductive prong thigh 1020 comprises trace 1030, and this trace 1030 is electrically connected to shell connector 1040 along projection 1007 to downward-extension and by this fork thigh 1020.

Figure 18 demonstrates projection 1007 and the cross-sectional view of the lid 1009 placed on it, and demonstrates fork strands 1020.As shown in the figure, lid 1009 is positioned on projection 1007, and is connected with projection by tooth 1045, thereby lid 1009 is fixed to projection 1007 and LED circuit plate 1000 is fixed between the two.

Figure 19 demonstrates the schematic diagram according to the example embodiment of LED circuit plate of the present utility model.The embodiment of Figure 19 can be used in the embodiment of some or all of assemblies mentioned above.Shown embodiment comprises LED1110, and its each connector in pad 1130 places are electrically connected to 1100, two LED connectors of LED circuit plate is provided with a pad.Each pad 1130 is connected to wiring layer 1140, and it is that each LED connector arranges route to conductive trace.The pyroconductivity of insulating materials 1150 is about 2.5 watts every meter every Kelvin (W/ (m*k)), is arranged between wiring layer 1140 and core layer 1160, by heat conducting material, is made of such as copper.The fin 1120 of highly heat-conductive material can be arranged between LED1110 and core layer 1160, is not insulated 1150, layer and separates.With by insulating barrier 1150, LED is separated and compares with core layer 1160, the speed that fin 1120 impels heat directly from LED1110, to be distributed to core layer 1160 is about the former 20 times.The opposite side of core layer is provided with the second insulation material layer 1170, and it has another wiring layer 1180 that is arranged at LED circuit plate 1100 bottoms.This wiring layer 1180 can provide the conductive trace between LED circuit plate 1100 bottoms and LED circuit plate top wiring layer 1140.Pin 1090 is set and is electrically connected to single conductive trace, with conductive electric current between single welded gasket 1130 and single pin 1090.Frame for movement 1190 is configured to connect core layer 1160, further to distribute the heat from LED circuit plate 1100, and/or supports the LED circuit plate within the LED supporting component.

To those skilled in the art, be easy to expect multiple modification of the present utility model and other embodiments, the utility model has useful technology enlightenment in the content shown in aforementioned specification and relevant accompanying drawing.Therefore, should be understood to, the utility model is not limited to disclosed specific embodiment and distortion thereof, and also intention comprises other embodiments claimed within the claim scope.Although used some particular term herein, they are only for general and descriptive meaning, and are not construed as limiting.

Claims

1. one kind for supporting the device of light emitting diode, comprise: the LED circuit plate, comprise the first first type surface and the second first type surface, described the first first type surface comprises the first contact pad and the second contact pad, each in the first contact pad and the second contact pad is made as the single connector received from light emitting diode, and described the second first type surface comprises the firstth district, Second Region He 3rd district; And substrate, it is connected to the LED circuit plate through the second first type surface 3rd district; It is characterized in that: the firstth district of the second first type surface of described LED circuit plate is made as the first pin of connecting luminous diode drive circuit, and the Second Region of the second first type surface of described LED circuit plate is made as the second pin that connects described LED driving circuit; The firstth district that reaches described the first contact pad and described the second first type surface electrically contacts, and wherein, the Second Region of described the second contact pad and described the second first type surface electrically contacts, and wherein, between described the first contact pad and described the second contact pad are mutual, nothing electrically contacts.

2. device according to claim 1, it is characterized in that: described substrate comprises that pyroconductivity is greater than the material of 30 watts every meter every Kelvin (30W/ (m*k)); Be greater than the binding agent of 30 watts every meter every Kelvin (30W/ (m*k)) by pyroconductivity, described substrate is adhered to described LED circuit plate.

3. device according to claim 1, it is characterized in that: described first pin of described LED driving circuit has the first contact-making surface, this first contact-making surface has the first contact-making surface zone, wherein, described the first contact-making surface is connected with the firstth district of described circuit board through described the first contact-making surface zone, the second pin of described LED driving circuit has the second contact-making surface, this second contact-making surface has the second contact-making surface zone, and described the second contact-making surface is connected with the Second Region of described circuit board through the second contact-making surface zone; The firstth district that reaches described LED circuit plate is greater than described the first contact-making surface zone, and the Second Region of described LED circuit plate is greater than described the second contact-making surface zone.

4. device according to claim 1, is characterized in that: between described substrate and described LED driving circuit, air duct is set.

5. for calibrating the device of light emitting diode, comprise: the first element, comprise first side and Second Edge, wherein, the described Second Edge of described the first element is set to receive the LED circuit plate which is provided with light emitting diode, and shown in the first element be provided with perforation hole wherein, described hole is set to accommodating light emitting diode; The second element, comprise first side and Second Edge, and wherein, described the first element is connected to described the second element by the first appendage; Reach and be provided with contiguous described the first appendage in ，Gai the air gap, the air gap between described the first element and described the second element.

6. device according to claim 5, it is characterized in that: described the second element is provided with perforation hole wherein, and described hole is set to accommodating described LED circuit plate; The hole of described the first element is made as aims at the LED circuit plate which is provided with light emitting diode; Described hole arranges size and size according to accommodating described light emitting diode in the inner.

7. device according to claim 5, it is characterized in that: described the first element, described the second element and described the first appendage are made by single whole block material; And described the first element comprises non electrically conductive material in fact.

8. one kind for supporting the device of light emitting diode, comprise the LED circuit plate, comprise the first first type surface and the second first type surface, described the first first type surface comprises the first contact pad and the second contact pad, each in described the first contact pad and described the second contact pad is made as the single connector received from light emitting diode, and described the second first type surface comprises the firstth district, Second Region He 3rd district; Characterized by further comprising: alignment members, comprise mating holes, wherein, described alignment members is set to accommodating described LED circuit plate, and described mating holes is set to the accommodating and described light emitting diode of aligning; LED driving circuit, comprise the first pin and the second pin, and wherein, described the first pin is set to be electrically connected to the firstth district of described the second first type surface, and described the second pin is set to be electrically connected to the Second Region of described the second first type surface.

9. device according to claim 8, it is characterized in that: described first pin of described LED driving circuit and each pin in described the second pin comprise cylindrical shell and axle, and wherein, described axle is offset along extended position in described cylindrical shell.

10. device according to claim 9, it is characterized in that, described the first pin comprises the first contact-making surface with first contact-making surface zone, described the second pin comprises the second contact-making surface with second contact-making surface zone, wherein, set up and electrically contact through described the first contact-making surface zone between described the first pin and described the firstth district, wherein, set up and electrically contact through described the second contact-making surface zone between described the second pin and described Second Region, the size in described the firstth district is greater than the size in described the first contact-making surface zone, the size of described Second Region is greater than the size in described the second contact-making surface zone, reach described the first pin and described the second pin and cooperate with the firstth district and the Second Region of described the second first type surface respectively, so that described the firstth district and described the first pin, described Second Region and described the second pin keep electrical contact in three axis relative motion processes of any quadrature of LED circuit plate and LED drive circuit.