CN203325868U - Silicon wafer fixation device - Google Patents
Silicon wafer fixation device Download PDFInfo
- Publication number
- CN203325868U CN203325868U CN2013203221524U CN201320322152U CN203325868U CN 203325868 U CN203325868 U CN 203325868U CN 2013203221524 U CN2013203221524 U CN 2013203221524U CN 201320322152 U CN201320322152 U CN 201320322152U CN 203325868 U CN203325868 U CN 203325868U
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- silicon chip
- cover plate
- box body
- support box
- absorbing ring
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Abstract
The utility model discloses a silicon wafer fixation device. At least one absorption hole is arranged on the cover surface of a support box, an absorption ring is fixedly sleeved on the lower surface of each absorption hole to form a funnel shaped hollowed structure, and moreover a vacuum valve is arranged on one side plate of the support box and connected with a vacuum generation device outside, so that the air in the support box is pumped off by the vacuum generation device and therefore a silicon wafer fixed on the upper surface of the cover plate of the support box is fixed. In addition, a support device is arranged on the lower surface of the support box and composed of a fixation foot and at least two adjustment feet, a level meter is embedded into the cover plate of the support box and observed to control the adjustment degree of the adjustment feet, and furthermore the support box is allowed to be on a horizontal surface, so that the silicon wafer on the upper surface of the cover plate is allowed to be on a horizontal surface. Furthermore, the working efficiency of the manual extraction technology is improved.
Description
Technical field
The utility model relates to a kind of device, relates in particular to a kind of device of fixedly silicon chip.
Background technology
The need of production of semiconductor device, through roads up to a hundred technique, carries out manual extraction to carry out the analysis of certain road technique to silicon chip surface, along with semiconductor technology is day by day complicated and increasingly ordinary.
Yet, still there is no in the market the technique of special stage apparatus for manual extraction silicon chip surface, generally employing bigbore beaker as shown in Figure 1 is as platform, Fig. 1 utilizes beaker to carry out the structural representation of manual extraction process, silicon chip 100 is positioned on bigbore beaker 101, so that silicon chip surface is carried out to manual extraction process.
But, there are a lot of shortcomings while utilizing as shown in Figure 1 bigbore beaker to carry out manual extraction process, as: silicon chip only relies on the stiction between the rim of a cup on silicon chip itself and heavy caliber beaker to fix, easy left and right slippage during operation; Have in semiconductor production, in order to obtain higher efficiency and profit, the silicon chip of 12 cun becomes main flow as the substrate of semiconductor device again, and along with the increase of silicon chip, the bore of beaker and the ratio of silicon chip are more and more less, easily make silicon chip drop; While also having the platform of placing when beaker to be not horizontal level, the horizontality of silicon chip also can be affected, thereby can affect the operating efficiency of manual extraction.
Chinese patent (publication number: CN202275812U) disclose a kind of wafer bearing combination, comprised a load plate, a positioning disk and a platen.Load plate has a carrying platform.The ring-type excrescence that positioning disk has first opening penetrated and gives prominence to upward along the first edge of opening.The ring-type excrescence at least has a breach.Positioning disk is combined on load plate, makes the first opening fit carrying platform and the ring-type excrescence principle load plate of positioning disk.When a wafer is placed on carrying platform, platen has second opening penetrated and protruded stigma that at least one extends internally from the second edge of opening.Platen is combined on positioning disk, and the second opening sleeve cyclization shape excrescence and each protruded stigma are placed in a breach of ring-type excrescence, and at least one protruded stigma is tight against the top of wafer.
What the wafer bearing combination that this invention provides can allow the wafer of carried be tight against regional Area Ratio prior art comes littlely, to increase the wafer that carried, can utilize regional area; Yet this invention still fails to overcome in manual extraction process, owing to not having special platform to carry out placing wafer but use bigbore beaker, cause wafer the problem that landing and platform can not the assurance levels easily to occur, thereby affect the operating efficiency of manual extraction process.
Chinese patent (publication number: CN202616216U) disclose a kind of LED wafer absorption platform, for coordinating a device for vacuum generation, device for vacuum generation has a suction face, a plurality of suction holes of the negative pressure of providing are provided suction face, and for adsorbing fixedly LED wafer, the utility model comprises porousness and adsorbs heat insulation and hermetic type fixed disk, wherein porousness absorption dottle pin has an adsorption plane and a face of bleeding, and porousness absorption dottle pin has a plurality of pore runners that interlock and connect adsorption plane and the face of bleeding, and at least one porousness absorption dottle pin is embedded in the hermetic type fixed disk, and convex to form a retaining surface in the ring side of adsorption plane, and LED wafer is arranged on adsorption plane and edge by the retaining surface blocking, the face of bleeding connects the suction face of device for vacuum generation and covers the plurality of suction hole, difference in height by retaining surface fixes LED wafer accordingly, while avoiding LED wafer high-speed mobile or rotation, because of the inertia force slippage, and the demand on satisfied the use.
This utility model can fix LED wafer by the difference in height of retaining surface, while avoiding LED wafer high-speed mobile or rotation, because of the inertia force slippage, and meets the demand on using; But this utility model still fails to overcome in manual extraction process, owing to not having special platform to come placing wafer to use bigbore beaker, cause wafer the problem that landing and platform can not the assurance levels easily to occur, thereby affect the operating efficiency of manual extraction process.
The utility model content
Problem for above-mentioned existence, the utility model provides a kind of device of fixedly silicon chip, to overcome in the manual extraction process to silicon chip, owing to not having special platform to come placing wafer to use bigbore beaker, cause wafer the problem that landing and platform can not the assurance levels easily to occur, thereby affect the operating efficiency of manual extraction process.
To achieve these goals, the technical solution of the utility model is:
A kind of device of fixedly silicon chip, be applied in the manual extraction process of silicon chip, and wherein, described device comprises a support box body, and this support box body consists of a cover plate, a backboard and four side plates;
The lower surface of described backboard is fixedly installed bracing or strutting arrangement;
Offer at least one adsorption hole on described cover plate, be placed on the silicon chip of described cover plate upper surface in order to absorption.
The device of above-mentioned fixedly silicon chip, wherein, at least one described side plate, be provided with vacuum valve, and described vacuum valve is connected with a device for vacuum generation.
The device of above-mentioned fixedly silicon chip, wherein, described device also comprises absorbing ring;
Described absorbing ring is fixedly installed on the lower surface of described cover plate, and each described absorbing ring all is sheathed on an adsorption hole, and each described adsorption hole and sheathed absorbing ring on it all form a funnel-form engraved structure.
The device of above-mentioned fixedly silicon chip, wherein, described device also comprises a level meter;
Wherein, described level meter is embedded on described cover plate.
The device of above-mentioned fixedly silicon chip, wherein, described level meter is air-bubble level.
The device of above-mentioned fixedly silicon chip, wherein, described bracing or strutting arrangement comprises a plurality of feets, and the plurality of feet evenly is arranged at the lower surface of described backboard.
The device of above-mentioned fixedly silicon chip, wherein, described feet comprises a fixing feet and at least two adjustment pin.
The device of above-mentioned fixedly silicon chip, wherein, described adjustment pin is that spiral is adjusted pin.
The device of above-mentioned fixedly silicon chip, wherein, a plurality of described adsorption holes are uniformly distributed in the zone of placing silicon chip on described cover plate.
Technique scheme has following advantage or beneficial effect:
The utility model is by arranging at least one adsorption hole on the capping at a support box body, and the lower surface of each adsorption hole is all fixed a sheathed absorbing ring, to form a funnel-form engraved structure, and on the side plate that supports box body, a vacuum valve is set, utilize this vacuum valve to be connected with outside device for vacuum generation, can pump the air supported in box body while starting device for vacuum generation, thereby fixed placement is in the silicon chip of the cover plate upper surface that supports box body; In addition, the utility model arranges a bracing or strutting arrangement by the lower surface at this support box body, this bracing or strutting arrangement comprises a fixing feet and at least two adjustment pin, inlay again a level meter on the cover plate of this support box body, just can control the scheduling of adjusting pin by the eye-level instrument, make to support box body in a horizontal plane, can be in a horizontal plane thereby make to be positioned over the silicon chip of cover plate upper surface; And then overcome in the manual extraction process of silicon chip, owing to not having special platform to come placing wafer to use bigbore beaker, cause wafer the problem that landing and platform can not the assurance levels easily to occur, further improved the operating efficiency of manual extraction process.
The accompanying drawing explanation
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that the utility model and feature thereof, profile and advantage will become.In whole accompanying drawings, identical mark is indicated identical part.Can proportionally not draw accompanying drawing, focus on illustrating purport of the present invention.
Fig. 1 utilizes beaker to carry out the structural representation of manual extraction process;
Fig. 2 is the structural representation of the device of the fixedly silicon chip that provides of the utility model embodiment;
Fig. 3 is the plan structure schematic diagram of the device of the fixedly silicon chip that provides of the utility model embodiment;
Fig. 4 is the adsorption hole that provides of the utility model embodiment and the cross-sectional view of absorbing ring.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the utility model is described further, but not as restriction of the present utility model.
Embodiment:
Fig. 2 is the structural representation of the device of the fixedly silicon chip that provides of the utility model embodiment, as shown in the figure, fixedly the device of silicon chip comprises support box body 200, support box body 200 by cover plate, backboard and four side plates form, offer three adsorption holes 201 on the cover plate that supports box body 200, these three adsorption holes 201 are uniformly distributed in the zone that prevents silicon chip on the cover plate that supports box body 200, be specially by three adsorption holes 201 as summit, can form an equilateral triangle, the cover plate that supports box body 200 is arranged with absorbing ring, and on cover plate, the lower surface of each adsorption hole 201 is all fixed a sheathed absorbing ring (not shown), this adsorption hole 201 and the absorbing ring formation one be set on this adsorption hole 201 have a funnelform engraved structure, be provided with a bracing or strutting arrangement on the lower surface of the backboard of support box body 200, this bracing or strutting arrangement comprises a plurality of feets, feet is a fixing feet 203 and three adjustment pin 204 in the present embodiment, adjust pin 204 and be preferably spiral adjustment pin, a fixing feet 203 and three adjustment pin 204 are separately positioned on four drift angle places that support box body 200, in addition, vacuum valve 202 is arranged on the side plate that supports box body 200, the other end of vacuum valve 202 (not shown) that is connected with outside device for vacuum generation, when silicon chip being placed on to the upper surface of the cover plate that supports box body 200, the gas that utilizes device for vacuum generation will support in box body 200 is taken away, make to support the interior generation negative pressure of box body 200, because outside atmospheric pressure is greater than the air pressure that supports box body 200 inside, thereby outside atmospheric pressure produces pressure to the cover plate that supports box body 200, thereby make silicon chip fit tightly the cover plate that supports box body 200, form a hermetically-sealed construction, thereby fix silicon chip.
Have again, be inlaid with a level meter 205 on the cover plate of support box body 200, this level meter 205 is preferably air-bubble level, when fixedly the device of silicon chip is placed on ground or laboratory table, by eye-level instrument 205 to judge that whether this support box body 200 is in Realize, when this support box body 200 does not measure up, regulate and adjust pin 204, so that this supports box body 200 in level, thereby the silicon chip reached on the cover plate that makes to be positioned over this support box body is horizontal, thereby can effectively carry out smoothly manual extraction process.
Fig. 3 is the plan structure schematic diagram of the device of the fixedly silicon chip that provides of the utility model embodiment; As shown in the figure, when using this fixedly the device of silicon chip fixing with horizontal silicon chip, at first by the bubble in eye-level instrument 205, whether mediate, confirm whether the cover plate that supports box body 200 is horizontal; When not at horizontal level, adjust pin 204 by adjusting and make to support the cover plate of box body 200 in level; After the cover plate that supports box body 200 is horizontal, placing silicon chip supports on box body 200 in this, start outside device for vacuum generation, open vacuum valve 202, take away with the air that will support in box body 200, thereby make the inside of supporting box body 200 form negative pressure, make silicon chip fit tightly the cover plate that supports box body 200, form a hermetically-sealed construction, thereby fix silicon chip, and then the smooth efficient manual extraction process that completes.
Fig. 4 is the adsorption hole that provides of the utility model embodiment and the cross-sectional view of absorbing ring, as shown in the figure, offer adsorption hole 201 on the cover plate of support box body 200, the lower surface that supports the cover plate of box body 200 is provided with absorbing ring 206, specifically at the sheathed absorbing ring 206 of the lower surface fixing compact of adsorption hole 201, and the absorbing ring 206 that this adsorption hole 201 and fixed cover are located at adsorption hole 201 lower surfaces forms a funnelform engraved structure 207, thereby make when supporting the inner formation negative pressure of box body 200, can effectively adsorb the silicon chip of fixed placement on the upper surface of the cover plate that supports box body 200 by engraved structure 207, and then overcome in the manual extraction process of silicon chip, owing to not having special platform to come placing wafer to use bigbore beaker, easily cause wafer the problem of landing easily to occur, further improved the operating efficiency of manual extraction process.
The utility model embodiment is by arranging at least one adsorption hole on the capping at a support box body, and the lower surface of each adsorption hole is all fixed a sheathed absorbing ring, to form a funnel-form engraved structure, and on the side plate that supports box body, a vacuum valve is set, utilize this vacuum valve to be connected with outside device for vacuum generation, can pump the air supported in box body while starting device for vacuum generation, thereby fixed placement is in the silicon chip of the cover plate upper surface that supports box body; In addition, the utility model arranges a bracing or strutting arrangement by the lower surface at this support box body, this bracing or strutting arrangement comprises a fixing feet and at least two adjustment pin, inlay again a level meter on the cover plate of this support box body, just can control the scheduling of adjusting pin by the eye-level instrument, make to support box body in a horizontal plane, can be in a horizontal plane thereby make to be positioned over the silicon chip of cover plate upper surface; And then overcome in the manual extraction process of silicon chip, owing to not having special platform to come placing wafer to use bigbore beaker, cause wafer the problem that landing and platform can not the assurance levels easily to occur, further improved the operating efficiency of manual extraction process.
In sum, the utility model is by arranging at least one adsorption hole on the capping at a support box body, and the lower surface of each adsorption hole is all fixed a sheathed absorbing ring, to form a funnel-form engraved structure, and on the side plate that supports box body, a vacuum valve is set, utilize this vacuum valve to be connected with outside device for vacuum generation, while starting device for vacuum generation, can pump the air supported in box body, thereby fixed placement is in the silicon chip of the cover plate upper surface that supports box body; In addition, the utility model arranges a bracing or strutting arrangement by the lower surface at this support box body, this bracing or strutting arrangement comprises a fixing feet and at least two adjustment pin, inlay again a level meter on the cover plate of this support box body, just can control the scheduling of adjusting pin by the eye-level instrument, make to support box body in a horizontal plane, can be in a horizontal plane thereby make to be positioned over the silicon chip of cover plate upper surface; And then overcome in the manual extraction process of silicon chip, owing to not having special platform to come placing wafer to use bigbore beaker, cause wafer the problem that landing and platform can not the assurance levels easily to occur, further improved the operating efficiency of manual extraction process.
It should be appreciated by those skilled in the art that those skilled in the art can realize described variation example in conjunction with prior art and above-described embodiment, do not repeat them here.Such variation example does not affect flesh and blood of the present utility model, does not repeat them here.
Above preferred embodiment of the present utility model is described.It will be appreciated that, the utility model is not limited to above-mentioned specific implementations, and the equipment of wherein not describing in detail to the greatest extent and structure are construed as with the common mode in this area to be implemented; Any those of ordinary skill in the art, do not breaking away from technical solutions of the utility model scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible changes and modification to technical solutions of the utility model, or being revised as the equivalent embodiment of equivalent variations, this does not affect flesh and blood of the present utility model.Therefore, every content that does not break away from technical solutions of the utility model,, all still belong in the scope of technical solutions of the utility model protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present utility model.
Claims (9)
1. the fixing device of silicon chip, be applied to, in the manual extraction process of silicon chip, it is characterized in that, described device comprises a support box body, and this support box body consists of a cover plate, a backboard and four side plates;
The lower surface of described backboard is fixedly installed bracing or strutting arrangement;
Offer at least one adsorption hole on described cover plate, be placed on the silicon chip of described cover plate upper surface in order to absorption.
2. the device of fixedly silicon chip as claimed in claim 1, is characterized in that, at least one described side plate, is provided with vacuum valve, and described vacuum valve is connected with a device for vacuum generation.
3. the device of fixedly silicon chip as claimed in claim 1, is characterized in that, described device also comprises absorbing ring;
Described absorbing ring is fixedly installed on the lower surface of described cover plate, and each described absorbing ring all is sheathed on an adsorption hole, and each described adsorption hole and sheathed absorbing ring on it all form a funnel-form engraved structure.
4. the device of fixedly silicon chip as claimed in claim 1, is characterized in that, described device also comprises a level meter;
Wherein, described level meter is embedded on described cover plate.
5. the device of fixedly silicon chip as claimed in claim 4, is characterized in that, described level meter is air-bubble level.
6. the device of fixedly silicon chip as claimed in claim 1, is characterized in that, described bracing or strutting arrangement comprises a plurality of feets, and the plurality of feet evenly is arranged at the lower surface of described backboard.
7. the device of fixedly silicon chip as claimed in claim 6, is characterized in that, described feet comprises a fixing feet and at least two adjustment pin.
8. the device of fixedly silicon chip as claimed in claim 7, is characterized in that, described adjustment pin is that spiral is adjusted pin.
9. the device of fixedly silicon chip as claimed in claim 1, is characterized in that, a plurality of described adsorption holes are uniformly distributed in the zone of placing silicon chip on described cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203221524U CN203325868U (en) | 2013-06-04 | 2013-06-04 | Silicon wafer fixation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203221524U CN203325868U (en) | 2013-06-04 | 2013-06-04 | Silicon wafer fixation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203325868U true CN203325868U (en) | 2013-12-04 |
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ID=49665177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203221524U Expired - Lifetime CN203325868U (en) | 2013-06-04 | 2013-06-04 | Silicon wafer fixation device |
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| Country | Link |
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| CN (1) | CN203325868U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269374A (en) * | 2016-09-22 | 2017-01-04 | 东莞市联洲知识产权运营管理有限公司 | A kind of work platforms being applied to spray SMT laser template |
| CN109698157A (en) * | 2018-12-27 | 2019-04-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | The fixation device of wafer film magazine |
| CN114713510A (en) * | 2022-06-10 | 2022-07-08 | 成都泰美克晶体技术有限公司 | Automatic wafer sorting equipment |
-
2013
- 2013-06-04 CN CN2013203221524U patent/CN203325868U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269374A (en) * | 2016-09-22 | 2017-01-04 | 东莞市联洲知识产权运营管理有限公司 | A kind of work platforms being applied to spray SMT laser template |
| CN106269374B (en) * | 2016-09-22 | 2019-04-09 | 戴金燕 | A kind of workbench applied to spraying SMT laser template |
| CN109698157A (en) * | 2018-12-27 | 2019-04-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | The fixation device of wafer film magazine |
| CN114713510A (en) * | 2022-06-10 | 2022-07-08 | 成都泰美克晶体技术有限公司 | Automatic wafer sorting equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131204 |
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| CX01 | Expiry of patent term |