CN203317477U - Mold structure for punching flexible circuit board with device - Google Patents
Mold structure for punching flexible circuit board with device Download PDFInfo
- Publication number
- CN203317477U CN203317477U CN2013203739694U CN201320373969U CN203317477U CN 203317477 U CN203317477 U CN 203317477U CN 2013203739694 U CN2013203739694 U CN 2013203739694U CN 201320373969 U CN201320373969 U CN 201320373969U CN 203317477 U CN203317477 U CN 203317477U
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- CN
- China
- Prior art keywords
- flexible circuit
- circuit board
- punching
- utility
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides a mold structure for punching a flexible circuit board with a device. The mold structure comprises an upper mold, a lower mold and a space, wherein the space is positioned between the upper mold and the lower mold and is used for containing the flexible circuit board with the device; the area, which corresponds to the device on the flexible circuit board, of the upper mold is provided with a device avoiding area; a punching part of the upper mold is provided with fillets. According to the mold structure provided by the utility model, the area, which corresponds to the device on the flexible circuit board, of the upper mold is provided with the device avoiding area and the punching part of the upper mold is provided with the fillets for punching and forming the flexible circuit board with the device, so that the whole forming process comprises the steps of firstly, punching a whole PNL paste to obtain the whole flexible circuit board with the device, and then punching by the molds to obtain a final product. The mold structure provided by the utility model has the advantage that the production efficiency is greatly improved.
Description
Technical field
The utility model relates to the flexible PCB manufacturing technology.
Background technology
The molding mode of existing industry flexible PCB is that whole PNL tabula rasa first is washed into single PCS tabula rasa, carry out again single-piece SMT paster, finally obtain the flexible PCB with device, because needs carry out single SMT paster, therefore this stamp mode has a strong impact on production efficiency.
The utility model content
For this reason, the utility model, for overcoming above-mentioned the deficiencies in the prior art, provides a kind of mould structure for flexible circuit strip device stamp.
The utility model realizes that the technical scheme that goal of the invention adopts is: a kind of mould structure for flexible circuit strip device stamp, comprise upper die and lower die and between upper die and lower die for the space of the accommodating flexible PCB with device, device area on the corresponding described flexible PCB of described patrix is provided with device and dodges district, and the die-cut section of described patrix is provided with fillet.
Preferably, described fillet diameter is the 0.4-0.6 millimeter.
The beneficial effects of the utility model are: be provided with device by the device area on the corresponding described flexible PCB of patrix and dodge district, and die-cut of patrix, fillet is set, can carry out punching molding to the flexible PCB with device, make whole forming process be: first whole PNL paster piece obtains the flexible PCB with device of whole plate, adopt again mould of the present utility model to carry out stamp, obtain final products, greatly improved production efficiency.
The accompanying drawing explanation
The structure chart that Fig. 1 is embodiment.
The specific embodiment
Below, by reference to the accompanying drawings the utility model is described in detail.
With reference to accompanying drawing 1, the structure chart that Fig. 1 is the present embodiment, a kind of mould structure for flexible circuit strip device stamp, comprise patrix 1, counterdie 2 and between patrix 1 and counterdie 2 for the space of the accommodating flexible PCB with device 3, device area on the corresponding flexible PCB of patrix is provided with device and dodges district 4, and the die-cut section of patrix is provided with the fillet 5 that diameter is 0.5mm.
The present embodiment is provided with device by the device area on the corresponding flexible PCB of patrix and dodges district, and die-cut of patrix, fillet is set, can carry out punching molding to the flexible PCB with device, make whole forming process be: first whole PNL paster piece obtains the flexible PCB with device of whole plate, adopt again mould of the present utility model to carry out stamp, obtain final products, greatly improved production efficiency.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (2)
1. the mould structure for flexible circuit strip device stamp, comprise upper die and lower die and between upper die and lower die for the space of the accommodating flexible PCB with device, it is characterized in that: the device area on the corresponding described flexible PCB of described patrix is provided with device and dodges district, and the die-cut section of described patrix is provided with fillet.
2. require the 1 described mould structure for flexible circuit strip device stamp according to claim, it is characterized in that: described fillet diameter is the 0.4-0.6 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203739694U CN203317477U (en) | 2013-06-27 | 2013-06-27 | Mold structure for punching flexible circuit board with device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203739694U CN203317477U (en) | 2013-06-27 | 2013-06-27 | Mold structure for punching flexible circuit board with device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203317477U true CN203317477U (en) | 2013-12-04 |
Family
ID=49656868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203739694U Expired - Lifetime CN203317477U (en) | 2013-06-27 | 2013-06-27 | Mold structure for punching flexible circuit board with device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203317477U (en) |
-
2013
- 2013-06-27 CN CN2013203739694U patent/CN203317477U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131204 |