CN203305626U - Chip overlying device for oxygen sensor - Google Patents
Chip overlying device for oxygen sensor Download PDFInfo
- Publication number
- CN203305626U CN203305626U CN2013203294690U CN201320329469U CN203305626U CN 203305626 U CN203305626 U CN 203305626U CN 2013203294690 U CN2013203294690 U CN 2013203294690U CN 201320329469 U CN201320329469 U CN 201320329469U CN 203305626 U CN203305626 U CN 203305626U
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- oxygen sensor
- workbench
- sensor chip
- heater
- copper coin
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Abstract
The utility model discloses a chip overlying device for an oxygen sensor. The device comprises a bracket, wherein a positioning mechanism for positioning the chip of the oxygen sensor is arranged at the lower part of the bracket, an aligning mechanism passing through the positioning mechanism for aligning the chip of the oxygen sensor on the positioning mechanism is arranged below the positioning mechanism, and a pressing mechanism for pressing the chip of the oxygen sensor down is arranged above the positioning mechanism. Each of the positioning mechanism and the pressing mechanism is provided with a heater for heating the chip of the oxygen sensor. The overlying device further comprises a control device for controlling the actions of the aligning mechanism, the pressing mechanism and the heaters. The device disclosed by the utility model can precisely control the relative position of adjacent zirconium oxide plates and can automatically control the overlying pressure, time and temperature, thereby greatly improving the work efficiency.
Description
Technical field
The utility model relates to a kind of machining and makes field, particularly a kind of be used to assembling the device of oxygen sensor chip.
Background technology
Lambda sensor is very important sensor in Hyundai Motor, for content or the concentration of monitoring motor vehicle exhaust emission oxygen, and, according to measured signal voltage of data output, feeds back to engine controller, thereby controls the size of distributive value.Existing automotive oxygen sensor mainly is divided into tubular type lambda sensor and board-like lambda sensor, and wherein board-like oxygen sensing chip laminates sintering by multilayer with the zirconia plate of circuit and form.The zirconia plate, in lamination process, must have relative position accurately between adjacent zirconia plate, and the circuit pattern between guarantee multilayer zirconia plate coincide mutually; And the zirconia plate needs that in lamination process fixing temperature, pressure and dwell time are arranged.Current zirconia plate laminates front main dependence operating personnel and by hand the zirconia plate is stacked in order successively, can't guarantee the relative position between adjacent zirconia plate; After having stacked, the zirconia plate is exerted pressure, the dwell time is adopted artificial range estimation, can't realize the accurate control of pressure application time; And operating efficiency is comparatively low.
Summary of the invention
The technical problem that the utility model solves is to overcome deficiency of the prior art, and a kind of stack-press device that can accurately control adjacent zirconia plate relative position is provided, and be used to laminating oxygen sensor chip, increases work efficiency.
For solving the problems of the technologies described above, technical solution adopted in the utility model is as follows.
The oxygen sensor chip stack-press device, comprise support, the bottom of support is provided be used to locating the detent mechanism of oxygen sensor chip, the below of detent mechanism is provided with passes the contraposition mechanism of detent mechanism for oxygen sensor chip in positioned in alignment mechanism, the top of detent mechanism is provided be used to pressing down the press mechanism of oxygen sensor chip, in described detent mechanism and press mechanism, is respectively arranged with the heater for oxygen sensor chip is heated; Described stack-press device also comprises be used to controlling the control device of contraposition mechanism, press mechanism and heater action.
The concrete structure of described support is: described support comprises the workbench supported by supporting leg, and described detent mechanism is fixedly installed on workbench; Described contraposition mechanism is fixedly mounted on the lower supporting plate of workbench below, and lower supporting plate is by being vertically set on the connecting rod location of workbench lower surface; Described press mechanism is arranged on the upper backup pad of workbench top, and upper backup pad is by being vertically set on the lead location of workbench upper surface; Between described workbench, lower supporting plate and upper backup pad, be arranged in parallel.
The concrete structure of described contraposition mechanism is: described contraposition mechanism comprises and is fixedly installed on the lower cylinder that the controlled device in lower supporting plate below is controlled, the piston rod of lower cylinder vertically passes lower supporting plate the aligning plate of vertical connection one between workbench and lower supporting plate, on the upper surface of aligning plate, be vertically installed with at least three contraposition pins of even cloth, described contraposition pin passes successively workbench and is arranged on the detent mechanism on workbench.
Improvement of the present utility model is: on described lower supporting plate, be provided with the guider for aligning plate is play the guiding role.
The concrete structure of described detent mechanism is: described detent mechanism comprises and is fixedly installed on the lower copper coin that workbench top is embedded with heater, between lower copper coin and workbench, be provided with the lower thermal insulation board be used to preventing that heat from transmitting, be provided with the through hole that passes the contraposition pin on described lower copper coin, lower thermal insulation board and workbench; The control end of described heater connects control device.
The concrete structure of described press mechanism is: described press mechanism comprises the upper cylinder that is arranged on the controlled device control in upper backup pad top, the piston rod of upper cylinder vertically passes upper backup pad the pressing plate of vertical connection one between upper backup pad and workbench, on the lower surface of pressing plate, be fixedly installed the upper copper coin of setting-in heater, between upper copper coin and pressing plate, be provided with the upper thermal insulation board that prevents that heat from transmitting.
Further improvement of the utility model is: on described lead, be set with the linear bearing be slidably matched with lead, the lower surface of described pressing plate is fixedly connected on linear bearing.
Improvement of the present utility model also is: between the piston rod of described upper cylinder and pressing plate, be provided be used to monitoring the pressure sensor of the upper cylinder value of exerting pressure, the signal end of pressure sensor is connected with the input of control device.
The concrete structure of described control device is: described control device comprises CPU, display, timer and power module, and the output of power module is connected with CPU, display and timer respectively; The signal end of the input Bonding pressure sensor of described CPU, the output of CPU is connected with the control end of heater and lower cylinder respectively, and the output of CPU also is connected with the control end of upper cylinder by timer.
The concrete structure of described heater is: described heater comprises heater strip and thermocouple, and the control end of heater strip connects the output of CPU, and the signal end of thermocouple connects the input of CPU; On described upper copper coin and lower copper coin, be respectively arranged with the bottoming hole of placing heater strip and thermocouple.
Owing to having adopted above technical scheme, the obtained technological progress of the utility model is as follows.
The utility model by detent mechanism support oxygen sensor chip, oxygen sensor chip aligns in contraposition mechanism, press mechanism is treated and is laminated oxygen sensor chip and laminate, and by control device, laminate the automatic control of pressure, time and temperature, greatly improved operating efficiency.The linear bearing arranged on lead, move up and down for reducing pressing plate the frictional force that process produces, and reduced the source of the gas loss, saved cost.The aligning plate below arranges guider, under the acting in conjunction with lower cylinder, carries out the contraposition operation, has guaranteed the accuracy of contraposition.
Upper thermal insulation board between upper copper coin and pressing plate and the lower thermal insulation board between lower copper coin and workbench, prevent that effectively heat is delivered to the thermal loss caused on support, to guarantee the temperature requirement in lamination process.
The accompanying drawing explanation
Fig. 1 is structural front view of the present utility model.
Fig. 2 is the top view of contraposition described in the utility model mechanism.
Fig. 3 is the structured flowchart of control device described in the utility model.
Wherein: 1. upper cylinder, 2. upper backup pad, 3. pressure sensor, 4. linear bearing, 5. pressing plate, 6. lead, 7. bottoming hole, 8. play copper coin, 9. descends thermal insulation board, 10. workbench, 11. guiders, 12. supporting legs, 13. lower cylinder, 14. aligning plate, 15. lower supporting plates, 16. the contraposition pin, copper coin on 18., thermal insulation board on 19..
The specific embodiment
Below in conjunction with accompanying drawing, the utility model is further elaborated.
A kind of oxygen sensor chip stack-press device, comprise support, detent mechanism, contraposition mechanism, press mechanism and control device.Detent mechanism is arranged on the bottom of support, be used to locating oxygen sensor chip; Contraposition mechanism is arranged on the below of detent mechanism, and can pass detent mechanism, for the oxygen sensor chip in positioned in alignment mechanism; Press mechanism is arranged on the top of detent mechanism, be used to pressing down oxygen sensor chip.In detent mechanism and press mechanism, be respectively arranged with heater, for oxygen sensor chip is heated.Control device is for controlling contraposition mechanism, press mechanism and heater action.
The structure of support as shown in Figure 1, comprises upper backup pad 2, workbench 10 and lower supporting plate 15, be arranged in parallel between workbench 10, lower supporting plate 15 and upper backup pad 2.Wherein workbench supports on the ground by supporting leg 12, and upper backup pad 2 is arranged on the top of workbench by the lead 6 that is vertically set on the workbench upper surface, and lower supporting plate 15 is arranged on the below of workbench by the connecting rod that is vertically set on the workbench lower surface.
Contraposition mechanism is fixedly mounted on lower supporting plate 15, and contraposition mechanism comprises lower cylinder 13, aligning plate 14, contraposition pin 16 and guider 11.Lower cylinder 13 is fixedly installed on lower supporting plate 15 belows, works under control device is controlled, and the piston rod of lower cylinder vertically connects aligning plate 14 after vertically passing lower supporting plate, and aligning plate 14 is between workbench 10 and lower supporting plate 15.Contraposition pin 16 vertically arranges on the upper surface of aligning plate, the utility model is before laminating work, the contraposition pin passes successively workbench 10, is arranged on detent mechanism and oxygen sensor chip on workbench 10, stacks neat purpose to realize the multi-disc oxygen sensor chip.Contraposition pin 16 is provided with three at least, in the present embodiment, is provided with eight, as shown in Figure 2.
Detent mechanism is fixedly installed on workbench 10, and detent mechanism comprises lower copper coin 8 and lower thermal insulation board 9, and lower copper coin 8 is fixedly installed on workbench 10 tops, is embedded with heater in lower copper coin 8, and the controlled device of the duty of heater is controlled; Lower thermal insulation board 9 is arranged between lower copper coin 8 and workbench 10, at the heat that heating process produces, passes to support for preventing lower copper coin.
On described lower copper coin 8, lower thermal insulation board 9 and workbench 10, be provided with the through hole that passes contraposition pin 16.
Press mechanism arranges on upper backup pad 2, and press mechanism comprises upper cylinder 1, pressing plate 5, upper thermal insulation board 19 and upper copper coin 18.Upper cylinder 1 is fixedly installed on upper backup pad 2 tops, works under control device is controlled, and the piston rod of upper cylinder 1 vertically connects pressing plate 5 after vertically passing upper backup pad, and pressing plate 5 is between upper backup pad and workbench.Upper copper coin 18 is fixedly installed on the lower surface of pressing plate 5, is embedded with heater in upper copper coin 18, and the controlled device of the duty of heater is controlled.Upper thermal insulation board 19 is arranged between copper coin 18 and pressing plate 5, at the heat that heating process produces, passes to support for preventing lower copper coin.
Heater comprises heater strip and thermocouple, and the control end of heater strip and the signal end of thermocouple are connected with control device respectively.On described upper copper coin 18 and lower copper coin 8, be respectively arranged with the bottoming hole 7 of placing heater strip and thermocouple.
On the lead of support, be set with linear bearing 4, linear bearing 4 is slidably matched with lead; The lower surface of pressing plate 5 is fixedly connected on linear bearing.Being provided for of lead and linear bearing play the guiding role for press mechanism.
Between the piston rod of described upper cylinder 1 and pressing plate, be provided with pressure sensor 3, be used to monitoring upper cylinder to oxygen sensor chip applied pressure value, and implement to pass to control device.
The structured flowchart of control device as shown in Figure 3, comprises CPU, display, timer and power module, and the output of power module is connected with CPU, display and timer respectively; The signal end of the input Bonding pressure sensor 3 of CPU and the signal end of thermocouple, the output of CPU is connected with the control end of lower cylinder 13 with heating wire respectively, and the output of CPU also is connected with the control end of upper cylinder 1 by timer.
When the utility model was used, at first, CPU controlled the lower cylinder action, and the contraposition pin is along with the piston rod of lower cylinder rises, until aligning plate contacts with the workbench lower surface.
Second step, cut out and the corresponding registration holes of contraposition pin according to the position of contraposition pin on aligning plate on oxygen sensor chip, this registration holes is namely the position reference of oxygen sensor chip, matches with the circuit pattern that guarantees all oxygen sensor chips.Then on oxygen sensor chip, print bonding agent, after guaranteeing that the contraposition step completes, can not produce displacement between adjacent chips.
The 3rd step, CPU controls heating wire upper copper coin and lower copper coin is heated respectively, and electroheat pair is for the temperature value of copper coin on Real-Time Monitoring and lower copper coin, and passes in real time CPU, the duty of the Numerical Control heating wire that CPU returns according to thermocouple.When upper copper coin and lower copper coin reached design temperature, the oxygen sensor chip that will be printed on circuit pattern was sleeved on contraposition pin 16 one by one according to correct order.
The 4th step, CPU controls the lower cylinder action, and the contraposition pin moves downward under the drive of lower cylinder, until the top of contraposition pin falls in lower thermal insulation layer, can not be delivered on support by the contraposition pin to guarantee the heat on lower copper coin.
The 5th step, CPU controls the upper cylinder action, and pressing plate, under the effect of upper cylinder, moves down along lead with the piston rod of upper cylinder, drives further upper copper coin and moves to oxygen sensor chip.When upper copper coin touches wait the oxygen sensor chip that laminates, pressure sensor can pass to CPU by recording force value in real time, CPU records according to pressure sensor the admission pressure that force value is regulated upper cylinder in real time, treats thereby reach the control that laminates the workpiece value of exerting pressure.
When the 6th step, the pressure sensor recorded when pressure sensor met oxygen sensor chip and laminate pressure in operation and require, CPU controlled upper cylinder and no longer moves, and starts simultaneously the timer timing and starts.
The 7th step, after timing finished, CPU controlled upwards action of upper cylinder, and upper copper coin rises, and takes out the oxygen sensor chip overlapped together, and lamination process finishes.
In the course of the work, display shows laminating the time, laminate pressure and laminating temperature the utility model in real time under the control of CPU, and convenient operation the person watch.
Claims (10)
1. oxygen sensor chip stack-press device, it is characterized in that: comprise support, the bottom of support is provided be used to locating the detent mechanism of oxygen sensor chip, the below of detent mechanism is provided with passes the contraposition mechanism of detent mechanism for oxygen sensor chip in positioned in alignment mechanism, the top of detent mechanism is provided be used to pressing down the press mechanism of oxygen sensor chip, in described detent mechanism and press mechanism, is respectively arranged with the heater for oxygen sensor chip is heated; Described stack-press device also comprises be used to controlling the control device of contraposition mechanism, press mechanism and heater action.
2. oxygen sensor chip stack-press device according to claim 1 is characterized in that: described support comprises the workbench (10) supported by supporting leg (12), and described detent mechanism is fixedly installed on workbench (10); It is upper that described contraposition mechanism is fixedly mounted on the lower supporting plate (15) of workbench below, and lower supporting plate (15) is by being vertically set on the connecting rod location of workbench lower surface; The upper backup pad (2) that described press mechanism is arranged on above workbench is upper, and upper backup pad (2) is by lead (6) location that is vertically set on the workbench upper surface; Between described workbench (10), lower supporting plate (15) and upper backup pad (2), be arranged in parallel.
3. oxygen sensor chip stack-press device according to claim 2, it is characterized in that: described contraposition mechanism comprises and is fixedly installed on the lower cylinder (13) that the controlled device in lower supporting plate (15) below is controlled, the piston rod of lower cylinder vertically passes lower supporting plate the vertical aligning plate (14) be positioned between workbench (10) and lower supporting plate (15) that connects, on the upper surface of aligning plate, be vertically installed with at least three contraposition pins (16) of even cloth, described contraposition pin passes successively workbench (10) and is arranged on the detent mechanism on workbench (10).
4. oxygen sensor chip stack-press device according to claim 3, is characterized in that: on described lower supporting plate (15), be provided with the guider (11) for aligning plate (14) is play the guiding role.
5. oxygen sensor chip stack-press device according to claim 3, it is characterized in that: described detent mechanism comprises and is fixedly installed on the lower copper coin (8) that workbench (10) top is embedded with heater, between lower copper coin (8) and workbench (10), be provided with the lower thermal insulation board (9) be used to preventing that heat from transmitting, be provided with the through hole that passes contraposition pin (16) on described lower copper coin (8), lower thermal insulation board (9) and workbench (10); The control end of described heater connects control device.
6. oxygen sensor chip stack-press device according to claim 5, it is characterized in that: described press mechanism comprises the upper cylinder (1) that is arranged on the controlled device control in upper backup pad (2) top, the piston rod of upper cylinder (1) vertically passes upper backup pad the pressing plate (5) of vertical connection one between upper backup pad and workbench, on the lower surface of pressing plate (5), be fixedly installed the upper copper coin (18) of setting-in heater, between upper copper coin (18) and pressing plate (5), be provided with the upper thermal insulation board (19) that prevents that heat from transmitting.
7. oxygen sensor chip stack-press device according to claim 6, it is characterized in that: on described lead, be set with the linear bearing (4) be slidably matched with lead, the lower surface of described pressing plate (5) is fixedly connected on linear bearing.
8. oxygen sensor chip stack-press device according to claim 6, it is characterized in that: between the piston rod of described upper cylinder (1) and pressing plate, be provided with the pressure sensor (3) be used to monitoring the upper cylinder value of exerting pressure, the signal end of pressure sensor is connected with the input of control device.
9. oxygen sensor chip stack-press device according to claim 8, it is characterized in that: described control device comprises CPU, display, timer and power module, the output of power module is connected with CPU, display and timer respectively; The signal end of the input Bonding pressure sensor (3) of described CPU, the output of CPU are connected with the control end of lower cylinder (13) with heater respectively, and the output of CPU also is connected with the control end of upper cylinder (1) by timer.
10. oxygen sensor chip stack-press device according to claim 9, it is characterized in that: described heater comprises heater strip and thermocouple, and the control end of heater strip connects the output of CPU, and the signal end of thermocouple connects the input of CPU; On described upper copper coin (18) and lower copper coin (8), be respectively arranged with the bottoming hole (7) of placing heater strip and thermocouple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203294690U CN203305626U (en) | 2013-06-07 | 2013-06-07 | Chip overlying device for oxygen sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203294690U CN203305626U (en) | 2013-06-07 | 2013-06-07 | Chip overlying device for oxygen sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203305626U true CN203305626U (en) | 2013-11-27 |
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ID=49611858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203294690U Withdrawn - After Issue CN203305626U (en) | 2013-06-07 | 2013-06-07 | Chip overlying device for oxygen sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203305626U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103273719A (en) * | 2013-06-07 | 2013-09-04 | 无锡隆盛科技股份有限公司 | Oxygen sensor chip laminating apparatus |
| CN104103535A (en) * | 2014-07-08 | 2014-10-15 | 无锡隆盛科技股份有限公司 | Oxygen sensor chip hole filling apparatus |
-
2013
- 2013-06-07 CN CN2013203294690U patent/CN203305626U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103273719A (en) * | 2013-06-07 | 2013-09-04 | 无锡隆盛科技股份有限公司 | Oxygen sensor chip laminating apparatus |
| CN103273719B (en) * | 2013-06-07 | 2015-09-09 | 无锡隆盛科技股份有限公司 | Oxygen sensor chip stack-press device |
| CN104103535A (en) * | 2014-07-08 | 2014-10-15 | 无锡隆盛科技股份有限公司 | Oxygen sensor chip hole filling apparatus |
| CN104103535B (en) * | 2014-07-08 | 2016-08-24 | 无锡隆盛科技股份有限公司 | Oxygen sensor chip filling perforation equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20131127 Effective date of abandoning: 20150909 |
|
| RGAV | Abandon patent right to avoid regrant |