CN203293291U - Double-sided adhesive tape die cutting tool - Google Patents
Double-sided adhesive tape die cutting tool Download PDFInfo
- Publication number
- CN203293291U CN203293291U CN201320306562XU CN201320306562U CN203293291U CN 203293291 U CN203293291 U CN 203293291U CN 201320306562X U CN201320306562X U CN 201320306562XU CN 201320306562 U CN201320306562 U CN 201320306562U CN 203293291 U CN203293291 U CN 203293291U
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- Prior art keywords
- cutter
- base
- adhesive tape
- flat
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Adhesive Tape Dispensing Devices (AREA)
Abstract
The utility model relates to a double-sided adhesive tape die cutting tool. The double-sided adhesive tape die cutting tool comprises a base and cutters, wherein the two cutters are fixed on the base. Each cutter is composed of a cutter body and a cutter point, a closed cutter hole is formed in the cutter body, the cutter body is flat and straight, the cutter point is a wedge body with the upper portion pointed and the lower portion flat, a layer of silicon gel coats the interior of the cutter hole, and a layer of silicon gel coats the exterior of the cutter body. A workpiece locating hole is formed in the base, and a base locating hole is further formed in the base. Due to the fact that one layer of silicon gel coats the interior of each cutter hole and one layer of silicon gel coats the exterior of each cutter body, a product can directly punch the gel faces, squeezing on the cutter holes is reduced; the flat cutter bodies and the cutter points with the upper portions pointed and the lower portions flat are combined to form a waste absorbing hole which is internally straight and externally inclined, and therefore material can fall down more easily.
Description
Technical field:
The utility model relates to a kind of double faced adhesive tape mold cutter.
Background technology:
In the production process of the double faced adhesive tape die cutting product to less, the general cutter of existing use, can there be to the cutter holes of cutter the phenomenon of extruding at the edge of product, like this can make product produce viscose glue to cutter when blanking, blanking not exclusively easily tool setting has and damages, and in process of producing product, raw-material loss also increases greatly.
Summary of the invention:
The technical problem that the utility model solves is to provide and can reduces a kind of double faced adhesive tape mold cutter of product to the extruding of tool bore and smooth blanking.
The technical scheme in the invention for solving the technical problem is: a kind of double faced adhesive tape mold cutter, comprise base and cutter, be fixed with two secondary cutters on described base, described cutter is comprised of blade, the knife edge, the inner sealing tool bore that forms of described blade, described blade is flat straight shape, and the described knife edge is wedge flat under upper point, in described tool bore and the outside one deck silica gel that all scribbles of blade; Described base is provided with the workpiece locating hole, also is provided with the base locating hole on described base.
Further, described tool bore is square opening.
Further, described tool bore is circular port.
The beneficial effects of the utility model are: in tool bore described in the utility model and the outside one deck silica gel that all scribbles of blade, can make product directly rush the glue face, the extruding of minimizing to tool bore, the combination of the flat knife edge under the blade of flat and upper point, in forming one, straight outer oblique waste suction hole, make blanking simpler and easy.
Description of drawings:
Below in conjunction with accompanying drawing, the utility model is further illustrated.
Fig. 1 is perspective view of the present utility model;
Fig. 2 is the schematic diagram of cutter of the present utility model.
In figure: 1, base 2, cutter 21, blade 211, tool bore 22, the knife edge 3, silica gel 4, workpiece locating hole 5, base locating hole.
The specific embodiment:
A kind of double faced adhesive tape mold cutter as shown in Fig. 1～2, comprise base 1 and cutter 2, it is characterized in that: be fixed with two secondary cutters 2 on described base 1, described cutter 2 is comprised of blade 21, the knife edge 22, the inner sealing tool bore 211 that forms of described blade 21, described blade 21 is flat straight shape, and the described knife edge 22 is wedge flat under upper point, and in described tool bore 211 and blade 21 outsides all scribble one deck silica gel 3; Described base is provided with workpiece locating hole 4, also is provided with base locating hole 5 on described base.
Further, described tool bore 211 is square opening.
Further, described tool bore 211 is circular port.
In tool bore 211 described in the utility model and blade 21 outsides all scribble one deck silica gel 3, can make product directly rush the glue face, reduce the extruding to tool bore 211, the combination of the flat knife edge 22 under the blade 21 of flat and upper point, in forming one, straight outer oblique waste suction hole, make blanking simpler and easy.
It is emphasized that, it is more than better implementation column of the present utility model, not utility model is done any type of restriction in appearance, every foundation technical spirit of the present utility model, to any simple modification, equivalent variations and modification that above embodiment does, all still belongs in the scope of technical solutions of the utility model.
Claims (3)
1. double faced adhesive tape mold cutter, comprise base (1) and cutter (2), it is characterized in that: be fixed with two secondary cutters (2) on described base (1), described cutter (2) is comprised of blade (21), the knife edge (22), the inner sealing tool bore (211) that forms of described blade (21), described blade (21) is flat straight shape, the described knife edge (22) is wedge flat under upper point, and in described tool bore (211) and blade (21) outside all scribbles one deck silica gel (3); Described base is provided with workpiece locating hole (4), also is provided with base locating hole (5) on described base.
2. a kind of double faced adhesive tape mold cutter according to claim 1, it is characterized in that: described tool bore (211) is square opening.
3. a kind of double faced adhesive tape mold cutter according to claim 1, it is characterized in that: described tool bore (211) is circular port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320306562XU CN203293291U (en) | 2013-05-30 | 2013-05-30 | Double-sided adhesive tape die cutting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320306562XU CN203293291U (en) | 2013-05-30 | 2013-05-30 | Double-sided adhesive tape die cutting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203293291U true CN203293291U (en) | 2013-11-20 |
Family
ID=49569329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320306562XU Expired - Fee Related CN203293291U (en) | 2013-05-30 | 2013-05-30 | Double-sided adhesive tape die cutting tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203293291U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108032369A (en) * | 2018-02-07 | 2018-05-15 | 靖江市亚通胶粘制品有限公司 | A kind of OCA optical cements die cutting method |
| CN108789644A (en) * | 2018-08-16 | 2018-11-13 | 深圳市山本光电股份有限公司 | A kind of die cut structural for multi-layer sheet |
| CN111070323A (en) * | 2019-12-20 | 2020-04-28 | 苏州高泰电子技术股份有限公司 | Ultra-soft heat-conducting silicon wafer die cutting processing technology |
-
2013
- 2013-05-30 CN CN201320306562XU patent/CN203293291U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108032369A (en) * | 2018-02-07 | 2018-05-15 | 靖江市亚通胶粘制品有限公司 | A kind of OCA optical cements die cutting method |
| CN108789644A (en) * | 2018-08-16 | 2018-11-13 | 深圳市山本光电股份有限公司 | A kind of die cut structural for multi-layer sheet |
| CN111070323A (en) * | 2019-12-20 | 2020-04-28 | 苏州高泰电子技术股份有限公司 | Ultra-soft heat-conducting silicon wafer die cutting processing technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131120 Termination date: 20180530 |