CN203289677U - Ultrahigh-frequency high-power induction heating power supply - Google Patents
Ultrahigh-frequency high-power induction heating power supply Download PDFInfo
- Publication number
- CN203289677U CN203289677U CN2013203763227U CN201320376322U CN203289677U CN 203289677 U CN203289677 U CN 203289677U CN 2013203763227 U CN2013203763227 U CN 2013203763227U CN 201320376322 U CN201320376322 U CN 201320376322U CN 203289677 U CN203289677 U CN 203289677U
- Authority
- CN
- China
- Prior art keywords
- resistance
- signal
- circuit
- current
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Images
Landscapes
- Measurement Of Current Or Voltage (AREA)
Abstract
Disclosed is an ultrahigh-frequency high-power induction heating power supply which belongs to the field of switching power supplies. The utility model solves the problems of low phase-locking accuracy and low power of a conventional high-frequency induction heating power supply to a voltage and a current across two terminals of a load. In the utility model, a voltage phase signal outputted by a circuit for voltage signal detection and phase processing passes through a voltage phase signal isolation circuit and then is sent to a processor. A current signal collected by a current detection circuit passes through a current signal filter circuit and then is sent to a current signal phase processing circuit and a current amplitude processing circuit. A current phase signal outputted by the current signal phase processing circuit passes through a current phase signal isolation circuit and then is sent to the processor. After the processor receives the voltage phase signal and the current phase signal, a PWM switching frequency and a duty ratio are adjusted and outputted through a fuzzy PID control strategy, so as to achieve the purpose of reducing voltage and current phase differences to reach a control frequency. The ultrahigh-frequency high-power induction heating power supply is mainly used in the field of switching power supplies.
Description
Technical field
The utility model belongs to field of switch power.
Background technology
The high-frequency high-power induction heating power is mainly to heat-treat operation for tiny metal works.Can realize by Phase Tracking that load is similar under the state of pure resistance works.Do not see in the market the matured product that matches with phase signal processing circuit based on the TMS320F2812 processor, and similar product is by the voltage and current transducer therewith, perhaps with analog circuit, realize the Phase Tracking function, what even have does not follow the tracks of load phase, such product work reliability is not high, performance is undesirable, and power is also little.
The utility model content
The utility model is to hang down and the low problem of power for the phase place locking accuracy of load both end voltage and electric current in order to solve existing high-frequency induction heating power, and the utility model provides a kind of hyperfrequency high-power induction heating power.
The high-power induction heating power of hyperfrequency, it comprises voltage signal detection and Phase Processing circuit, inverter circuit, rectification circuit, current detection circuit, load output circuit, current signal filter circuit, current signal Phase Processing circuit, current phase signal buffer circuit, current amplitude treatment circuit, analog signal buffer circuit, processor, state parameter display circuit, drives signal isolation circuit, inverter power switch tube driving circuit and voltage phase signal buffer circuit
The DC signal output end of described rectification circuit is connected with the direct current signal input of inverter circuit,
Voltage signal detection and Phase Processing circuit are for detection of the output voltage signal of described inverter circuit, described voltage signal detects and the signal output part of Phase Processing circuit is connected with the signal input part of voltage phase signal buffer circuit, the signal output part of described voltage phase signal buffer circuit is connected with the voltage phase signal input of processor, the display output of described processor is connected with the signal input part of state parameter display circuit
current detection circuit is connected between the output and load output circuit of inverter circuit, current signal for detection of described inverter circuit output, the testing result signal output part of described current detection circuit is connected with the signal input part of current signal filter circuit, the signal output part of described current signal filter circuit simultaneously and the signal input part of current signal Phase Processing circuit be connected signal input part with the current amplitude treatment circuit and be connected, the signal output part of current signal Phase Processing circuit is connected with the signal input part of current phase signal buffer circuit, the signal output part of described current phase signal buffer circuit is connected with the current phase signal input of processor, the signal output part of described current amplitude treatment circuit is connected with the current amplitude signal input part of analog signal buffer circuit, the current amplitude signal output part of described analog signal buffer circuit is connected with the current amplitude signal input part of processor,
The control signal output of described processor is connected with the signal input part that drives signal isolation circuit, the signal output part of described driving signal isolation circuit is connected with the signal input part of inverter power switch tube driving circuit, and the driving signal output part of described inverter power switch tube driving circuit is connected with the control signal input of inverter circuit.
the voltage phase signal that voltage signal detects and the Phase Processing circuit is exported is after the voltage phase signal buffer circuit, deliver to processor, the current signal that current detection circuit will collect is after the current signal filter circuit, be sent to respectively current signal Phase Processing circuit and current amplitude treatment circuit, the current phase signal of current signal Phase Processing circuit output is after the current phase signal buffer circuit, be sent to processor, after processor receives current phase signal and voltage phase signal, pass through fuzzy PID control strategy, adjust output PWM switching frequency and duty ratio, reach and reduce the voltage and current phase difference, and reach the purpose of power ratio control, the utility model is mainly used in field of switch power.
The beneficial effect that the utility model brings is, the high-power induction heating power of hyperfrequency described in the utility model to the phase place locking accuracy of load both end voltage and electric current improved 15%, power improved 15%.
Description of drawings
Fig. 1 is the electrical principle schematic diagram of the high-power induction heating power of hyperfrequency described in the utility model.
Fig. 2 is the structural representation of the described voltage signal detection of embodiment three and Phase Processing circuit.
Fig. 3 is the structural representation of the described current signal filter circuit of embodiment four.
Fig. 4 is the structural representation of the described current signal Phase Processing of embodiment five circuit.
Fig. 5 is the structural representation of the described current amplitude treatment circuit of embodiment six.
Fig. 6 is the structural representation of the described analog signal buffer circuit of embodiment seven.
Fig. 7 is the structural representation of the described voltage phase signal buffer circuit of embodiment one.
Fig. 8 is the structural representation of the described driving signal isolation circuit of embodiment one.
Fig. 9 is the structural representation of the described current phase signal buffer circuit of embodiment one.
Embodiment
embodiment one: referring to Fig. 1, 7, 8, with 9 explanation present embodiments, the high-power induction heating power of the described hyperfrequency of present embodiment, it comprises that voltage signal detects and Phase Processing circuit 1, inverter circuit 2, rectification circuit 3, current detection circuit 4, load output circuit 5, current signal filter circuit 6, current signal Phase Processing circuit 7, current phase signal buffer circuit 8, current amplitude treatment circuit 9, analog signal buffer circuit 10, processor 11, state parameter display circuit 12, drive signal isolation circuit 13, inverter power switch tube driving circuit 14 and voltage phase signal buffer circuit 15,
The DC signal output end of described rectification circuit 3 is connected with the direct current signal input of inverter circuit 2,
Voltage signal detection and Phase Processing circuit 1 are for detection of the output voltage signal of described inverter circuit 2, described voltage signal detects and the signal output part of Phase Processing circuit 1 is connected with the signal input part of voltage phase signal buffer circuit 15, the signal output part of described voltage phase signal buffer circuit 15 is connected with the voltage phase signal input of processor 11, the display output of described processor 11 is connected with the signal input part of state parameter display circuit 12
The control signal output of described processor 11 is connected with the signal input part that drives signal isolation circuit 13, the signal output part of described driving signal isolation circuit 13 is connected with the signal input part of inverter power switch tube driving circuit 14, and the driving signal output part of described inverter power switch tube driving circuit 14 is connected with the control signal input of inverter circuit 2.
Embodiment two: referring to Fig. 1,7,8 and 9 explanation present embodiments, the difference of present embodiment and the high-power induction heating power of the described hyperfrequency of embodiment one is, described processor 11 employing chip TMS 320 F 2812s realizations.
embodiment three: referring to Fig. 1, 2, 7, 8, with 9 explanation present embodiments, the difference of present embodiment and the high-power induction heating power of the described hyperfrequency of embodiment one or two is, described voltage signal detects and Phase Processing circuit 1 comprises diode D1, diode D2, diode D3, resistance R 1, resistance R 2, resistance R 3, resistance R 4, resistance R 5, capacitor C 1, capacitor C 2 and chip TLV3502, the positive pole of described diode D2 connects+5V power supply ground HGND, the negative pole while of diode D2 and the positive pole of diode D1, chip TLV3502+the other end that the INA port is connected with resistance R connects, the negative pole while of described diode D1 and an end of resistance R 1, one end of resistance R 2 be connected the 5V power supply and connect, the other end of described resistance R 1 is connected with the end that an end of resistance R 5 is connected with resistance R simultaneously, the other end of described resistance R 5 and chip TLV3502-the INA port is connected, another termination of described resistance R 3+5V power supply ground HGND, the other end while of described resistance R 2 and an end of resistance R 4, one end of capacitor C 1 is connected positive pole and is connected with diode D3, another termination of described capacitor C 1+5V power supply ground HGND, the negative pole of described diode D3 is connected with the voltage signal output end of inverter circuit 2, the V+ port of described chip TLV3502 is connected with+a end that the 5V power supply is connected with capacitor C simultaneously, the other end of described capacitor C 2 is connected with the V-port of chip TLV3502, another termination of described capacitor C 2+5V power supply ground HGND, the OUTA port of described chip TLV3502 is connected with the signal input part of voltage phase signal buffer circuit 15, the OUTA port of described chip TLV3502 is the signal output part of voltage signal detection and Phase Processing circuit 1, the negative pole of described diode D3 is used for receiving the output voltage signal of described inverter circuit 2.
embodiment four: referring to Fig. 1, 3, 7, 8, with 9 explanation present embodiments, the difference of present embodiment and the high-power induction heating power of the described hyperfrequency of embodiment one is, described current signal filter circuit 6 comprises resistance R 6, resistance R 7, resistance R 8, resistance R 9, capacitor C 3, capacitor C 4 and chip OPA3690, No. 1 port of described chip OPA3690 is connected with the end that an end of capacitor C 3 is connected with resistance R simultaneously, the other end while of described capacitor C 3 and an end of capacitor C 4, the end that one end of resistance R 6 is connected with resistance R connects, the other end while of described capacitor C 4 and the other end of resistance R 9, No. 14 ports of chip OPA3690, the signal input part that the signal input part of current signal Phase Processing circuit 7 is connected with the current amplitude treatment circuit connects, the other end while of described resistance R 6 and the testing result signal output part of current detection circuit 4, the other end that the other end of resistance R 7 is connected with resistance R connects, another termination signal ground SGND of described resistance R 8, and an end of described resistance R 8 is connected with No. 2 ports of chip OPA3690, No. 16 ports of described chip OPA3690 and V ﹠lt, sub TranNum="88" ﹠gt, cc ﹠lt, /sub ﹠gt, connect, the other end of described resistance R 6 is the signal input part of current signal filter circuit 6, and the other end of described resistance R 9 is the signal output part of current signal filter circuit 6.
embodiment five: referring to Fig. 1,4,7,8 and 9 explanation present embodiments, the difference of present embodiment and the high-power induction heating power of the described hyperfrequency of embodiment one is, described current signal Phase Processing circuit 7 comprises resistance R 10, resistance R 11 and chip TL3016ID, No. 1 port of described chip TL3016ID and V ﹠lt, sub TranNum="90" ﹠gt, cc ﹠lt, /sub ﹠gt, connect, No. 5 ports and No. 6 ports of described chip TL3016ID meet signal ground SGND, No. 3 ports of described chip TL3016ID are connected with an end of resistance R 10, the other end of described resistance R 10 is connected with the signal output part of current signal filter circuit 6, No. 2 ports of described chip TL3016ID are connected with an end of resistance R 11, another termination signal ground SGND of described resistance R 11, No. 7 ports of described chip TL3016ID are connected with the signal input part of current phase signal buffer circuit 8, the other end of described resistance R 10 is the signal input part of current signal Phase Processing circuit 7, No. 7 ports of described chip TL3016ID are the signal output part of current signal Phase Processing circuit 7.
embodiment six: referring to Fig. 1, 5, 7, 8, with 9 explanation present embodiments, the difference of present embodiment and the high-power induction heating power of the described hyperfrequency of embodiment one is, described current amplitude treatment circuit 9 comprises resistance R 12, resistance R 13, resistance R 14, resistance R 15, resistance R 16, resistance R 17, resistance R 18, resistance R 19, diode D4, diode D5 and 2 chip OPA360, one end of described resistance R 12 is connected with the end that the signal output part of current signal filter circuit 6 is connected with resistance R simultaneously, the other end while of described resistance R 12 and No. 4 ports of the first chip OPA360, one end of resistance R 14 is connected negative pole and is connected with diode D4, the other end of described resistance R 14 with simultaneously and an end of resistance R 19 be connected positive pole with diode D5 and be connected, the negative pole of described diode D5 simultaneously and No. 12 ports of the first chip OPA360 be connected positive pole with diode D4 and be connected, No. 5 ports of described the first chip OPA360 are connected with an end of resistance R 13, another termination signal ground SGND of described resistance R 13, No. 3 ports of described the first chip OPA360 are connected with No. 6 ports of the second chip OPA360, the other end while of described resistance R 18 and the other end of resistance R 19, one end of resistance R 16 be connected No. 7 ports of chip OPA360 and connect, the other end of described resistance R 16 simultaneously with the current amplitude signal input part of analog signal buffer circuit 10 be connected No. 10 ports of chip OPA360 and be connected, No. 8 ports of described the second chip OPA360 are connected with an end of resistance R 17, another termination signal ground SGND of described resistance R 17, one end of described resistance R 12 is the signal input part of current amplitude treatment circuit 9, the other end of described resistance R 16 is the signal output part of current amplitude treatment circuit 9.
embodiment seven: referring to Fig. 1, 6, 7, 8, with 9 explanation present embodiments, the difference of present embodiment and the high-power induction heating power of the described hyperfrequency of embodiment one is, described analog signal buffer circuit 10 comprises resistance R 20, resistance R 21, resistance R 22, resistance R 23, capacitor C 5, capacitor C 6 and photoelectrical coupler, one end of described resistance R 20 is connected with the signal output part of current amplitude treatment circuit 9, the other end while of described resistance R 20 and an end of capacitor C 5, the end that one end of resistance R 21 is connected with resistance R connects, the other end of described capacitor C 5, the other end of resistance R 22 is connected the negative electrode of light-emitting diode and is connected with the photoelectrical coupler input, another termination signal ground SGND of described resistance R 22, the anodic bonding of the light-emitting diode of the other end of described resistance R 21 and photoelectrical coupler input, the collector electrode of the phototriode of the output of described photoelectrical coupler is connected with+a end that the 3.3V power supply is connected with capacitor C simultaneously, the other end while of described capacitor C 6 and the emitter of the phototriode of the output of photoelectrical coupler, the current amplitude signal input part that one end of resistance R 23 is connected with processor connects, another termination of described resistance R 23+3.3V power supply ground GND, the other end of described capacitor C 6 is the signal output part of analog signal buffer circuit 10, one end of described resistance R 20 is the current amplitude signal input part of analog signal buffer circuit 10.
Embodiment eight: referring to Fig. 1,6,7,8 and 9 explanation present embodiments, the difference of present embodiment and the high-power induction heating power of the described hyperfrequency of embodiment one is, described optical coupling isolator adopts the TLP421 realization.
Claims (8)
1. the high-power induction heating power of hyperfrequency, it is characterized in that, it comprises that voltage signal detects and Phase Processing circuit (1), inverter circuit (2), rectification circuit (3), current detection circuit (4), load output circuit (5), current signal filter circuit (6), current signal Phase Processing circuit (7), current phase signal buffer circuit (8), current amplitude treatment circuit (9), analog signal buffer circuit (10), processor (11), state parameter display circuit (12), drive signal isolation circuit (13), inverter power switch tube driving circuit (14) and voltage phase signal buffer circuit (15),
The DC signal output end of described rectification circuit (3) is connected with the direct current signal input of inverter circuit (2),
Voltage signal detection and Phase Processing circuit (1) are for detection of the output voltage signal of described inverter circuit (2), described voltage signal detects and the signal output part of Phase Processing circuit (1) is connected with the signal input part of voltage phase signal buffer circuit (15), the signal output part of described voltage phase signal buffer circuit (15) is connected with the voltage phase signal input of processor (11), the display output of described processor (11) is connected with the signal input part of state parameter display circuit (12)
current detection circuit (4) is connected between the output and load output circuit (5) of inverter circuit (2), current signal for detection of described inverter circuit (2) output, the testing result signal output part of described current detection circuit (4) is connected with the signal input part of current signal filter circuit (6), the signal output part of described current signal filter circuit (6) is connected 9 with the signal input part of current signal Phase Processing circuit (7) with the current amplitude treatment circuit simultaneously) signal input part be connected, the signal output part of current signal Phase Processing circuit (7) is connected with the signal input part of current phase signal buffer circuit (8), the signal output part of described current phase signal buffer circuit (8) is connected with the current phase signal input of processor (11), the signal output part of described current amplitude treatment circuit (9) is connected with the current amplitude signal input part of analog signal buffer circuit (10), the current amplitude signal output part of described analog signal buffer circuit (10) is connected with the current amplitude signal input part of processor (11)
The control signal output of described processor (11) is connected with the signal input part that drives signal isolation circuit (13), the signal output part of described driving signal isolation circuit (13) is connected with the signal input part of inverter power switch tube driving circuit (14), and the driving signal output part of described inverter power switch tube driving circuit (14) is connected with the control signal input of inverter circuit (2).
2. the high-power induction heating power of hyperfrequency according to claim 1, is characterized in that, described processor (11) adopts chip TMS 320 F 2812 to realize.
3. the high-power induction heating power of hyperfrequency according to claim 1 and 2, it is characterized in that, described voltage signal detects and Phase Processing circuit (1) comprises diode D1, diode D2, diode D3, resistance R 1, resistance R 2, resistance R 3, resistance R 4, resistance R 5, capacitor C 1, capacitor C 2 and chip TLV3502, the positive pole of described diode D2 connects+5V power supply ground HGND, the negative pole while of diode D2 and the positive pole of diode D1, chip TLV3502+the other end that the INA port is connected with resistance R connects, the negative pole while of described diode D1 and an end of resistance R 1, one end of resistance R 2 be connected the 5V power supply and connect, the other end of described resistance R 1 is connected with the end that an end of resistance R 5 is connected with resistance R simultaneously, the other end of described resistance R 5 and chip TLV3502-the INA port is connected, another termination of described resistance R 3+5V power supply ground HGND, the other end while of described resistance R 2 and an end of resistance R 4, one end of capacitor C 1 is connected positive pole and is connected with diode D3, another termination of described capacitor C 1+5V power supply ground HGND, the negative pole of described diode D3 is connected with the voltage signal output end of inverter circuit (2), the V+ port of described chip TLV3502 is connected with+a end that the 5V power supply is connected with capacitor C simultaneously, the other end of described capacitor C 2 is connected with the V-port of chip TLV3502, another termination of described capacitor C 2+5V power supply ground HGND, the OUTA port of described chip TLV3502 is connected with the signal input part of voltage phase signal buffer circuit (15), the OUTA port of described chip TLV3502 is the signal output part of voltage signal detection and Phase Processing circuit (1), the negative pole of described diode D3 is used for receiving the output voltage signal of described inverter circuit (2).
4. the high-power induction heating power of hyperfrequency according to claim 1, it is characterized in that, described current signal filter circuit (6) comprises resistance R 6, resistance R 7, resistance R 8, resistance R 9, capacitor C 3, capacitor C 4 and chip OPA3690, No. 1 port of described chip OPA3690 is connected with the end that an end of capacitor C 3 is connected with resistance R simultaneously, the other end while of described capacitor C 3 and an end of capacitor C 4, the end that one end of resistance R 6 is connected with resistance R connects, the other end while of described capacitor C 4 and the other end of resistance R 9, No. 14 ports of chip OPA3690, the signal input part of current signal Phase Processing circuit (7) is connected 9 with the current amplitude treatment circuit) signal input part connect, the other end while of described resistance R 6 and the testing result signal output part of current detection circuit (4), the other end that the other end of resistance R 7 is connected with resistance R connects, another termination signal ground SGND of described resistance R 8, one end of described resistance R 8 is connected with No. 2 ports of chip OPA3690, No. 16 ports of described chip OPA3690 and V ﹠lt, sub TranNum="107" ﹠gt, cc ﹠lt, /sub ﹠gt, connect, the other end of described resistance R 6 is the signal input part of current signal filter circuit (6), and the other end of described resistance R 9 is the signal output part of current signal filter circuit (6).
5. the high-power induction heating power of hyperfrequency according to claim 1, is characterized in that, described current signal Phase Processing circuit (7) comprises resistance R 10, resistance R 11 and chip TL3016ID, No. 1 port of described chip TL3016ID and V ﹠lt, sub TranNum="110" ﹠gt, cc ﹠lt, /sub ﹠gt, connect, No. 5 ports and No. 6 ports of described chip TL3016ID meet signal ground SGND, No. 3 ports of described chip TL3016ID are connected with an end of resistance R 10, the other end of described resistance R 10 is connected with the signal output part of current signal filter circuit (6), No. 2 ports of described chip TL3016ID are connected with an end of resistance R 11, another termination signal ground SGND of described resistance R 11, No. 7 ports of described chip TL3016ID are connected with the signal input part of current phase signal buffer circuit (8), the other end of described resistance R 10 is the signal input part of current signal Phase Processing circuit (7), No. 7 ports of described chip TL3016ID are the signal output part of current signal Phase Processing circuit (7).
6. the high-power induction heating power of hyperfrequency according to claim 1, it is characterized in that, described current amplitude treatment circuit (9) comprises resistance R 12, resistance R 13, resistance R 14, resistance R 15, resistance R 16, resistance R 17, resistance R 18, resistance R 19, diode D4, diode D5 and 2 chip OPA360, one end of described resistance R 12 is connected with the end that the signal output part of current signal filter circuit (6) is connected with resistance R simultaneously, the other end while of described resistance R 12 and No. 4 ports of the first chip OPA360, one end of resistance R 14 is connected negative pole and is connected with diode D4, the other end of described resistance R 14 with simultaneously and an end of resistance R 19 be connected positive pole with diode D5 and be connected, the negative pole of described diode D5 simultaneously and No. 12 ports of the first chip OPA360 be connected positive pole with diode D4 and be connected, No. 5 ports of described the first chip OPA360 are connected with an end of resistance R 13, another termination signal ground SGND of described resistance R 13, No. 3 ports of described the first chip OPA360 are connected with No. 6 ports of the second chip OPA360, the other end while of described resistance R 18 and the other end of resistance R 19, one end of resistance R 16 be connected No. 7 ports of chip OPA360 and connect, the other end of described resistance R 16 simultaneously with the current amplitude signal input part of analog signal buffer circuit (10) be connected No. 10 ports of chip OPA360 and be connected, No. 8 ports of described the second chip OPA360 are connected with an end of resistance R 17, another termination signal ground SGND of described resistance R 17, one end of described resistance R 12 is the signal input part of current amplitude treatment circuit (9), the other end of described resistance R 16 is the signal output part of current amplitude treatment circuit (9).
7. the high-power induction heating power of hyperfrequency according to claim 1, it is characterized in that, described analog signal buffer circuit (10) comprises resistance R 20, resistance R 21, resistance R 22, resistance R 23, capacitor C 5, capacitor C 6 and photoelectrical coupler, one end of described resistance R 20 is connected with the signal output part of current amplitude treatment circuit (9), the other end while of described resistance R 20 and an end of capacitor C 5, the end that one end of resistance R 21 is connected with resistance R connects, the other end of described capacitor C 5, the other end of resistance R 22 is connected the negative electrode of light-emitting diode and is connected with the photoelectrical coupler input, another termination signal ground SGND of described resistance R 22, the anodic bonding of the light-emitting diode of the other end of described resistance R 21 and photoelectrical coupler input, the collector electrode of the phototriode of the output of described photoelectrical coupler is connected with+a end that the 3.3V power supply is connected with capacitor C simultaneously, the other end while of described capacitor C 6 and the emitter of the phototriode of the output of photoelectrical coupler, one end of resistance R 23 is connected 11 with processor) the current amplitude signal input part connect, another termination of described resistance R 23+3.3V power supply ground GND, the other end of described capacitor C 6 is the signal output part of analog signal buffer circuit (10), one end of described resistance R 20 is the current amplitude signal input part of analog signal buffer circuit (10).
8. the high-power induction heating power of hyperfrequency according to claim 1, is characterized in that, described optical coupling isolator adopts TLP421 to realize.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203763227U CN203289677U (en) | 2013-06-27 | 2013-06-27 | Ultrahigh-frequency high-power induction heating power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203763227U CN203289677U (en) | 2013-06-27 | 2013-06-27 | Ultrahigh-frequency high-power induction heating power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203289677U true CN203289677U (en) | 2013-11-13 |
Family
ID=49546016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203763227U Withdrawn - After Issue CN203289677U (en) | 2013-06-27 | 2013-06-27 | Ultrahigh-frequency high-power induction heating power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203289677U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313450A (en) * | 2013-06-27 | 2013-09-18 | 哈尔滨理工大学 | Ultrahigh-frequency high-power induction heating source |
-
2013
- 2013-06-27 CN CN2013203763227U patent/CN203289677U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313450A (en) * | 2013-06-27 | 2013-09-18 | 哈尔滨理工大学 | Ultrahigh-frequency high-power induction heating source |
| CN103313450B (en) * | 2013-06-27 | 2015-03-11 | 哈尔滨理工大学 | Ultrahigh-frequency high-power induction heating source |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204216790U (en) | A kind of scanning power supply able to programme | |
| CN203840210U (en) | AC inverter circuit | |
| CN202721450U (en) | Fully controllable energy feedback device | |
| CN110224627A (en) | A kind of Multipurpose composite plasma coating grid bias power supply | |
| CN201774245U (en) | PFC overcurrent protecting circuit | |
| CN201985777U (en) | High-voltage high-power switching power amplifier | |
| CN103313450B (en) | Ultrahigh-frequency high-power induction heating source | |
| CN203984738U (en) | For the phase-cut dimming control circuit of LED lamp | |
| CN202997986U (en) | Direct current brushless motor driving device | |
| CN203289677U (en) | Ultrahigh-frequency high-power induction heating power supply | |
| CN103796389B (en) | High-high brightness hoisting module, controllable silicon light modulation LED drive circuit and system | |
| CN201310962Y (en) | IGBT (Insulated Gate Bipolar Transistor) protection device of induction cooker | |
| CN203135826U (en) | Drive circuit of voltage type gate control device | |
| CN104483579A (en) | Switching value acquisition circuit | |
| CN203523020U (en) | Audio power amplifier circuit and wireless loudspeaker box | |
| CN204302420U (en) | A kind of switch quantity acquisition circuit | |
| CN203368305U (en) | Driving circuit of IGBT module power switch | |
| CN110048632A (en) | Linear variable-frequency power sources based on novel efficient large-capacity linear power amplifier | |
| CN209030117U (en) | A kind of single-phase Sinusoidal Inverter system adjusted based on feed forward approach | |
| CN104578454A (en) | Novel single-phase load wireless electric energy transmission system and design method thereof | |
| CN203896189U (en) | Power adapter control circuit for monitor | |
| CN104038191A (en) | Driving circuit of voltage type gate control device | |
| CN102148571A (en) | High-frequency high-voltage DC switching power source based on current source mode | |
| CN203859678U (en) | Switching power supply of photovoltaic grid-connected inverter | |
| CN202026242U (en) | High-frequency and high-voltage direct-current switching power supply based on current source mode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20131113 Effective date of abandoning: 20150311 |
|
| RGAV | Abandon patent right to avoid regrant |