CN203289677U - Ultrahigh-frequency high-power induction heating power supply - Google Patents

Ultrahigh-frequency high-power induction heating power supply Download PDF

Info

Publication number
CN203289677U
CN203289677U CN2013203763227U CN201320376322U CN203289677U CN 203289677 U CN203289677 U CN 203289677U CN 2013203763227 U CN2013203763227 U CN 2013203763227U CN 201320376322 U CN201320376322 U CN 201320376322U CN 203289677 U CN203289677 U CN 203289677U
Authority
CN
China
Prior art keywords
resistance
signal
circuit
current
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2013203763227U
Other languages
Chinese (zh)
Inventor
周美兰
徐泽卿
张宇
李艳萍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin University of Science and Technology
Original Assignee
Harbin University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harbin University of Science and Technology filed Critical Harbin University of Science and Technology
Priority to CN2013203763227U priority Critical patent/CN203289677U/en
Application granted granted Critical
Publication of CN203289677U publication Critical patent/CN203289677U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Measurement Of Current Or Voltage (AREA)

Abstract

超高频大功率感应加热电源，属于开关电源领域。本实用新型解决了现有高频感应加热电源对于负载两端电压和电流的相位锁定准确度低和功率低的问题。本实用新型的电压信号检测及相位处理电路输出的电压相位信号经电压相位信号隔离电路后送至处理器，电流检测电路将采集到的电流信号经电流信号滤波电路后，分别发送至电流信号相位处理电路和电流幅值处理电路，电流信号相位处理电路输出的电流相位信号经电流相位信号隔离电路后，发送至处理器，处理器接收到电流相位信号和电压相位信号后，通过模糊PID控制策略，调整输出PWM开关频率和占空比，来达到减小电压和电流相位差，并且达到控制功率的目的，本实用新型主要应用在开关电源领域。

Figure 201320376322

An ultra-high-frequency high-power induction heating power supply belongs to the field of switching power supplies. The utility model solves the problems of low phase locking accuracy and low power of the existing high-frequency induction heating power supply for the voltage and current at both ends of the load. The voltage phase signal output by the voltage signal detection and phase processing circuit of the utility model is sent to the processor through the voltage phase signal isolation circuit, and the current detection circuit sends the collected current signal to the current signal phase respectively after passing through the current signal filter circuit Processing circuit and current amplitude processing circuit, the current phase signal output by the current signal phase processing circuit is sent to the processor after the current phase signal isolation circuit, after the processor receives the current phase signal and the voltage phase signal, through the fuzzy PID control strategy , adjust the output PWM switching frequency and duty cycle to reduce the voltage and current phase difference and achieve the purpose of power control. The utility model is mainly used in the field of switching power supply.

Figure 201320376322

Description

超高频大功率感应加热电源UHF high power induction heating power supply

技术领域technical field

本实用新型属于开关电源领域。The utility model belongs to the field of switching power supplies.

背景技术Background technique

高频大功率感应加热电源主要是针对细小金属工件进行热处理操作。通过相位跟踪可以实现负载近似于纯电阻的状态下工作。目前市场上并未见到基于TMS320F2812处理器与相位信号处理电路相配合的成熟产品，而与此相类似的产品是通过电压和电流传感器，或者使用模拟电路来实现相位跟踪功能，甚至有的并不对负载相位进行跟踪，这样的产品工作可靠性不高，性能不理想，功率也不大。The high-frequency high-power induction heating power supply is mainly used for heat treatment of small metal workpieces. Through phase tracking, the load can be operated in a state similar to that of pure resistance. At present, there is no mature product based on the combination of TMS320F2812 processor and phase signal processing circuit in the market, and similar products realize the phase tracking function through voltage and current sensors, or use analog circuits, and some even do not If the load phase is not tracked, such a product has low reliability, unsatisfactory performance, and low power.

实用新型内容Utility model content

本实用新型是为了解决现有高频感应加热电源对于负载两端电压和电流的相位锁定准确度低和功率低的问题，本实用新型提供了一种超高频大功率感应加热电源。The utility model aims to solve the problems of low phase locking accuracy and low power of the existing high-frequency induction heating power supply for the voltage and current at both ends of the load. The utility model provides an ultra-high-frequency high-power induction heating power supply.

超高频大功率感应加热电源，它包括电压信号检测及相位处理电路、逆变电路、整流电路、电流检测电路、负载输出电路、电流信号滤波电路、电流信号相位处理电路、电流相位信号隔离电路、电流幅值处理电路、模拟信号隔离电路、处理器、状态参数显示电路、驱动信号隔离电路、逆变器功率开关管驱动电路和电压相位信号隔离电路，Ultra-high frequency high-power induction heating power supply, which includes voltage signal detection and phase processing circuit, inverter circuit, rectification circuit, current detection circuit, load output circuit, current signal filter circuit, current signal phase processing circuit, current phase signal isolation circuit , current amplitude processing circuit, analog signal isolation circuit, processor, state parameter display circuit, drive signal isolation circuit, inverter power switch tube drive circuit and voltage phase signal isolation circuit,

所述的整流电路的直流信号输出端与逆变电路的直流信号输入端连接，The DC signal output end of the rectification circuit is connected to the DC signal input end of the inverter circuit,

电压信号检测及相位处理电路用于检测所述的逆变电路的输出电压信号，所述的电压信号检测及相位处理电路的信号输出端与电压相位信号隔离电路的信号输入端连接，所述的电压相位信号隔离电路的信号输出端与处理器的电压相位信号输入端连接，所述的处理器的显示信号输出端与状态参数显示电路的信号输入端连接，The voltage signal detection and phase processing circuit is used to detect the output voltage signal of the inverter circuit, the signal output end of the voltage signal detection and phase processing circuit is connected to the signal input end of the voltage phase signal isolation circuit, and the The signal output end of the voltage phase signal isolation circuit is connected to the voltage phase signal input end of the processor, and the display signal output end of the processor is connected to the signal input end of the state parameter display circuit,

电流检测电路串联在逆变电路的输出端和负载输出电路之间，用于检测所述逆变电路输出的电流信号，所述的电流检测电路的检测结果信号输出端与电流信号滤波电路的信号输入端连接，所述的电流信号滤波电路的信号输出端同时与电流信号相位处理电路的信号输入端和电流幅值处理电路的信号输入端连接，电流信号相位处理电路的信号输出端与电流相位信号隔离电路的信号输入端连接，所述的电流相位信号隔离电路的信号输出端与处理器的电流相位信号输入端连接，所述的电流幅值处理电路的信号输出端与模拟信号隔离电路的电流幅值信号输入端连接，所述的模拟信号隔离电路的电流幅值信号输出端与处理器的电流幅值信号输入端连接，The current detection circuit is connected in series between the output terminal of the inverter circuit and the load output circuit, and is used to detect the current signal output by the inverter circuit, and the detection result signal output terminal of the current detection circuit is connected with the signal of the current signal filter circuit The input end is connected, the signal output end of the current signal filter circuit is connected with the signal input end of the current signal phase processing circuit and the signal input end of the current amplitude processing circuit at the same time, the signal output end of the current signal phase processing circuit is connected with the current phase The signal input end of the signal isolation circuit is connected, the signal output end of the current phase signal isolation circuit is connected with the current phase signal input end of the processor, the signal output end of the current amplitude processing circuit is connected with the analog signal isolation circuit The current amplitude signal input terminal is connected, and the current amplitude signal output terminal of the analog signal isolation circuit is connected to the current amplitude signal input terminal of the processor,

所述的处理器的控制信号输出端与驱动信号隔离电路的信号输入端连接，所述的驱动信号隔离电路的信号输出端与逆变器功率开关管驱动电路的信号输入端连接，所述的逆变器功率开关管驱动电路的驱动信号输出端与逆变电路的控制信号输入端连接。The control signal output end of the processor is connected to the signal input end of the drive signal isolation circuit, the signal output end of the drive signal isolation circuit is connected to the signal input end of the inverter power switch tube drive circuit, and the The drive signal output end of the inverter power switch tube drive circuit is connected to the control signal input end of the inverter circuit.

电压信号检测及相位处理电路输出的电压相位信号经电压相位信号隔离电路后，送至处理器，电流检测电路将采集到的电流信号经电流信号滤波电路后，分别发送至电流信号相位处理电路和电流幅值处理电路，电流信号相位处理电路输出的电流相位信号经电流相位信号隔离电路后，发送至处理器，处理器接收到电流相位信号和电压相位信号后，通过模糊PID控制策略，调整输出PWM开关频率和占空比，来达到减小电压和电流相位差，并且达到控制功率的目的，本实用新型主要应用在开关电源领域。The voltage phase signal output by the voltage signal detection and phase processing circuit is sent to the processor after being passed through the voltage phase signal isolation circuit, and the current detection circuit sends the collected current signal to the current signal phase processing circuit and the The current amplitude processing circuit, the current phase signal output by the current signal phase processing circuit is sent to the processor after the current phase signal isolation circuit, and after the processor receives the current phase signal and the voltage phase signal, it adjusts the output through the fuzzy PID control strategy The PWM switching frequency and the duty ratio are used to reduce the voltage and current phase difference and to control the power. The utility model is mainly used in the field of switching power supply.

本实用新型带来的有益效果是，本实用新型所述的超高频大功率感应加热电源对负载两端电压和电流的相位锁定准确度提高了15%、功率提高了15%。The beneficial effect brought by the utility model is that the ultra-high-frequency high-power induction heating power supply described in the utility model improves the phase locking accuracy of the voltage and current at both ends of the load by 15%, and the power increases by 15%.

附图说明Description of drawings

图1为本实用新型所述的超高频大功率感应加热电源的电气原理示意图。Fig. 1 is a schematic diagram of the electrical principle of the ultra-high frequency high-power induction heating power supply described in the present invention.

图2为具体实施方式三所述的电压信号检测及相位处理电路的结构示意图。FIG. 2 is a schematic structural diagram of the voltage signal detection and phase processing circuit described in the third embodiment.

图3为具体实施方式四所述的电流信号滤波电路的结构示意图。FIG. 3 is a schematic structural diagram of the current signal filter circuit described in Embodiment 4. FIG.

图4为具体实施方式五所述的电流信号相位处理电路的结构示意图。FIG. 4 is a schematic structural diagram of a current signal phase processing circuit described in Embodiment 5. FIG.

图5为具体实施方式六所述的电流幅值处理电路的结构示意图。FIG. 5 is a schematic structural diagram of the current amplitude processing circuit described in Embodiment 6. FIG.

图6为具体实施方式七所述的模拟信号隔离电路的结构示意图。FIG. 6 is a schematic structural diagram of the analog signal isolation circuit described in Embodiment 7. FIG.

图7为具体实施方式一所述的电压相位信号隔离电路的结构示意图。FIG. 7 is a schematic structural diagram of the voltage phase signal isolation circuit according to the first embodiment.

图8为具体实施方式一所述的驱动信号隔离电路的结构示意图。FIG. 8 is a schematic structural diagram of the driving signal isolation circuit described in the first embodiment.

图9为具体实施方式一所述的电流相位信号隔离电路的结构示意图。FIG. 9 is a schematic structural diagram of the current phase signal isolation circuit according to the first embodiment.

具体实施方式Detailed ways

具体实施方式一：参见图1、7、8、和9说明本实施方式，本实施方式所述的超高频大功率感应加热电源，它包括电压信号检测及相位处理电路1、逆变电路2、整流电路3、电流检测电路4、负载输出电路5、电流信号滤波电路6、电流信号相位处理电路7、电流相位信号隔离电路8、电流幅值处理电路9、模拟信号隔离电路10、处理器11、状态参数显示电路12、驱动信号隔离电路13、逆变器功率开关管驱动电路14和电压相位信号隔离电路15，Specific Embodiment 1: Referring to Figures 1, 7, 8, and 9 to illustrate this embodiment, the ultra-high-frequency high-power induction heating power supply described in this embodiment includes a voltage signal detection and phase processing circuit 1, and an inverter circuit 2 , rectification circuit 3, current detection circuit 4, load output circuit 5, current signal filter circuit 6, current signal phase processing circuit 7, current phase signal isolation circuit 8, current amplitude processing circuit 9, analog signal isolation circuit 10, processor 11. State parameter display circuit 12, drive signal isolation circuit 13, inverter power switch tube drive circuit 14 and voltage phase signal isolation circuit 15,

所述的整流电路3的直流信号输出端与逆变电路2的直流信号输入端连接，The DC signal output end of the rectification circuit 3 is connected with the DC signal input end of the inverter circuit 2,

电压信号检测及相位处理电路1用于检测所述的逆变电路2的输出电压信号，所述的电压信号检测及相位处理电路1的信号输出端与电压相位信号隔离电路15的信号输入端连接，所述的电压相位信号隔离电路15的信号输出端与处理器11的电压相位信号输入端连接，所述的处理器11的显示信号输出端与状态参数显示电路12的信号输入端连接，The voltage signal detection and phase processing circuit 1 is used to detect the output voltage signal of the inverter circuit 2, and the signal output end of the voltage signal detection and phase processing circuit 1 is connected to the signal input end of the voltage phase signal isolation circuit 15 , the signal output end of the voltage phase signal isolation circuit 15 is connected to the voltage phase signal input end of the processor 11, the display signal output end of the processor 11 is connected to the signal input end of the state parameter display circuit 12,

电流检测电路4串联在逆变电路2的输出端和负载输出电路5之间，用于检测所述逆变电路2输出的电流信号，所述的电流检测电路4的检测结果信号输出端与电流信号滤波电路6的信号输入端连接，所述的电流信号滤波电路6的信号输出端同时与电流信号相位处理电路7的信号输入端和电流幅值处理电路9的信号输入端连接，电流信号相位处理电路7的信号输出端与电流相位信号隔离电路8的信号输入端连接，所述的电流相位信号隔离电路8的信号输出端与处理器11的电流相位信号输入端连接，所述的电流幅值处理电路9的信号输出端与模拟信号隔离电路10的电流幅值信号输入端连接，所述的模拟信号隔离电路10的电流幅值信号输出端与处理器11的电流幅值信号输入端连接，The current detection circuit 4 is connected in series between the output terminal of the inverter circuit 2 and the load output circuit 5, and is used to detect the current signal output by the inverter circuit 2, and the detection result signal output terminal of the current detection circuit 4 is connected to the current The signal input end of the signal filter circuit 6 is connected, and the signal output end of the current signal filter circuit 6 is connected with the signal input end of the current signal phase processing circuit 7 and the signal input end of the current amplitude processing circuit 9 at the same time, and the current signal phase The signal output end of the processing circuit 7 is connected to the signal input end of the current phase signal isolation circuit 8, the signal output end of the current phase signal isolation circuit 8 is connected to the current phase signal input end of the processor 11, and the current amplitude The signal output end of the value processing circuit 9 is connected to the current amplitude signal input end of the analog signal isolation circuit 10, and the current amplitude signal output end of the analog signal isolation circuit 10 is connected to the current amplitude signal input end of the processor 11 ,

所述的处理器11的控制信号输出端与驱动信号隔离电路13的信号输入端连接，所述的驱动信号隔离电路13的信号输出端与逆变器功率开关管驱动电路14的信号输入端连接，所述的逆变器功率开关管驱动电路14的驱动信号输出端与逆变电路2的控制信号输入端连接。The control signal output end of the processor 11 is connected to the signal input end of the drive signal isolation circuit 13, and the signal output end of the drive signal isolation circuit 13 is connected to the signal input end of the inverter power switch tube drive circuit 14 , the drive signal output end of the inverter power switch tube drive circuit 14 is connected to the control signal input end of the inverter circuit 2 .

具体实施方式二：参见图1、7、8、和9说明本实施方式，本实施方式与具体实施方式一所述的超高频大功率感应加热电源的区别在于，所述的处理器11采用芯片TMS320F2812实现。Specific Embodiment 2: Refer to Fig. 1, 7, 8, and 9 to illustrate this embodiment. The difference between this embodiment and the ultra-high frequency high-power induction heating power supply described in Embodiment 1 is that the processor 11 adopts Chip TMS320F2812 realizes.

具体实施方式三：参见图1、2、7、8、和9说明本实施方式，本实施方式与具体实施方式一或二所述的超高频大功率感应加热电源的区别在于，所述的电压信号检测及相位处理电路1包括二极管D1、二极管D2、二极管D3、电阻R1、电阻R2、电阻R3、电阻R4、电阻R5、电容C1、电容C2和芯片TLV3502，所述的二极管D2的正极接+5V电源地HGND，二极管D2的负极同时与二极管D1的正极、芯片TLV3502的+INA端口和电阻R4的另一端连接，所述的二极管D1的负极同时与电阻R1的一端、电阻R2的一端和+5V电源连接，所述的电阻R1的另一端同时与电阻R5的一端和电阻R3的一端连接，所述的电阻R5的另一端与芯片TLV3502的-INA端口连接，所述的电阻R3的另一端接+5V电源地HGND，所述的电阻R2的另一端同时与电阻R4的一端、电容C1的一端和二极管D3的正极连接，所述的电容C1的另一端接+5V电源地HGND，所述的二极管D3的负极与逆变电路2的电压信号输出端连接，所述的芯片TLV3502的V+端口同时与+5V电源和电容C2的一端连接，所述的电容C2的另一端与芯片TLV3502的V-端口连接，所述的电容C2的另一端接+5V电源地HGND，所述的芯片TLV3502的OUTA端口与电压相位信号隔离电路15的信号输入端连接，所述的芯片TLV3502的OUTA端口为电压信号检测及相位处理电路1的信号输出端，所述的二极管D3的负极用于接收所述的逆变电路2的输出电压信号。Specific embodiment three: Referring to Figs. 1, 2, 7, 8, and 9 to illustrate this embodiment, the difference between this embodiment and the ultra-high frequency high-power induction heating power supply described in specific embodiment one or two is that the described The voltage signal detection and phase processing circuit 1 includes a diode D1, a diode D2, a diode D3, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a capacitor C1, a capacitor C2 and a chip TLV3502. The anode of the diode D2 is connected to +5V power supply ground HGND, the cathode of diode D2 is connected to the anode of diode D1, the +INA port of chip TLV3502 and the other end of resistor R4 at the same time, and the cathode of diode D1 is connected to one end of resistor R1, one end of resistor R2 and +5V power supply connection, the other end of the resistor R1 is connected to one end of the resistor R5 and one end of the resistor R3 at the same time, the other end of the resistor R5 is connected to the -INA port of the chip TLV3502, and the other end of the resistor R3 One end is connected to +5V power supply ground HGND, the other end of the resistor R2 is connected to one end of the resistor R4, one end of the capacitor C1 and the anode of the diode D3 at the same time, and the other end of the capacitor C1 is connected to the +5V power supply ground HGND, so The cathode of the diode D3 is connected to the voltage signal output terminal of the inverter circuit 2, the V+ port of the chip TLV3502 is connected to the +5V power supply and one end of the capacitor C2 at the same time, and the other end of the capacitor C2 is connected to the chip TLV3502 The V-port is connected, the other end of the capacitor C2 is connected to the +5V power supply ground HGND, the OUTA port of the chip TLV3502 is connected to the signal input end of the voltage phase signal isolation circuit 15, and the OUTA port of the chip TLV3502 is The signal output end of the voltage signal detection and phase processing circuit 1 , the cathode of the diode D3 is used to receive the output voltage signal of the inverter circuit 2 .

具体实施方式四：参见图1、3、7、8、和9说明本实施方式，本实施方式与具体实施方式一所述的超高频大功率感应加热电源的区别在于，所述的电流信号滤波电路6包括电阻R6、电阻R7、电阻R8、电阻R9、电容C3、电容C4和芯片OPA3690，所述的芯片OPA3690的1号端口同时与电容C3的一端和电阻R9的一端连接，所述的电容C3的另一端同时与电容C4的一端、电阻R6的一端和电阻R7的一端连接，所述的电容C4的另一端同时与电阻R9的另一端、芯片OPA3690的14号端口、电流信号相位处理电路7的信号输入端和电流幅值处理电路9的信号输入端连接，所述的电阻R6的另一端同时与电流检测电路4的检测结果信号输出端、电阻R7的另一端和电阻R8的另一端连接，所述的电阻R8的另一端接信号地SGND，所述的的电阻R8的一端与芯片OPA3690的2号端口连接，所述的芯片OPA3690的16号端口与Vcc连接，所述的电阻R6的另一端为电流信号滤波电路6的信号输入端，所述的电阻R9的另一端为电流信号滤波电路6的信号输出端。Specific Embodiment 4: Referring to Figures 1, 3, 7, 8, and 9 to illustrate this embodiment, the difference between this embodiment and the ultra-high frequency high-power induction heating power supply described in Embodiment 1 is that the current signal Filtering circuit 6 comprises resistance R6, resistance R7, resistance R8, resistance R9, electric capacity C3, electric capacity C4 and chip OPA3690, and No. 1 port of described chip OPA3690 is connected with one end of electric capacity C3 and one end of resistance R9 simultaneously, described The other end of the capacitor C3 is connected with one end of the capacitor C4, one end of the resistor R6 and one end of the resistor R7 at the same time, and the other end of the capacitor C4 is simultaneously connected with the other end of the resistor R9, port No. 14 of the chip OPA3690, and current signal phase processing The signal input end of the circuit 7 is connected to the signal input end of the current amplitude processing circuit 9, and the other end of the resistor R6 is simultaneously connected with the detection result signal output end of the current detection circuit 4, the other end of the resistor R7, and the other end of the resistor R8. One end is connected, the other end of the resistor R8 is connected to the signal ground SGND, one end of the resistor R8 is connected to the No. 2 port of the chip OPA3690, and the No. 16 port of the chip OPA3690 is connected to V cc . The other end of the resistor R6 is the signal input end of the current signal filter circuit 6 , and the other end of the resistor R9 is the signal output end of the current signal filter circuit 6 .

具体实施方式五：参见图1、4、7、8、和9说明本实施方式，本实施方式与具体实施方式一所述的超高频大功率感应加热电源的区别在于，所述的电流信号相位处理电路7包括电阻R10、电阻R11和芯片TL3016ID，所述的芯片TL3016ID的1号端口与Vcc连接，所述的芯片TL3016ID的5号端口和6号端口接信号地SGND，所述的芯片TL3016ID的3号端口与电阻R10的一端连接，所述的电阻R10的另一端与电流信号滤波电路6的信号输出端连接，所述的芯片TL3016ID的2号端口与电阻R11的一端连接，所述的电阻R11的另一端接信号地SGND，所述的芯片TL3016ID的7号端口与电流相位信号隔离电路8的信号输入端连接，所述的电阻R10的另一端为电流信号相位处理电路7的信号输入端，所述的芯片TL3016ID的7号端口为电流信号相位处理电路7的信号输出端。Embodiment 5: Refer to Figs. 1, 4, 7, 8, and 9 to illustrate this embodiment. The difference between this embodiment and the ultra-high frequency high-power induction heating power supply described in Embodiment 1 is that the current signal The phase processing circuit 7 includes a resistor R10, a resistor R11 and a chip TL3016ID. The No. 1 port of the chip TL3016ID is connected to V cc , and the No. 5 port and the No. 6 port of the chip TL3016ID are connected to the signal ground SGND. Port No. 3 of TL3016ID is connected to one end of resistor R10, the other end of the resistor R10 is connected to the signal output end of the current signal filter circuit 6, port No. 2 of the chip TL3016ID is connected to one end of resistor R11, the The other end of the resistor R11 is connected to the signal ground SGND, the No. 7 port of the chip TL3016ID is connected to the signal input end of the current phase signal isolation circuit 8, and the other end of the resistor R10 is the signal of the current signal phase processing circuit 7 The input terminal, the No. 7 port of the chip TL3016ID is the signal output terminal of the current signal phase processing circuit 7 .

具体实施方式六：参见图1、5、7、8、和9说明本实施方式，本实施方式与具体实施方式一所述的超高频大功率感应加热电源的区别在于，所述的电流幅值处理电路9包括电阻R12、电阻R13、电阻R14、电阻R15、电阻R16、电阻R17、电阻R18、电阻R19、二极管D4、二极管D5和2个芯片OPA360，所述的电阻R12的一端同时与电流信号滤波电路6的信号输出端和电阻R18的一端连接，所述的电阻R12的另一端同时与第一芯片OPA360的4号端口、电阻R14的一端和二极管D4的负极连接，所述的电阻R14的另一端与同时与电阻R19的一端和二极管D5的正极连接，所述的二极管D5的负极同时与第一芯片OPA360的12号端口和二极管D4的正极连接，所述的第一芯片OPA360的5号端口与电阻R13的一端连接，所述的电阻R13的另一端接信号地SGND，所述的第一芯片OPA360的3号端口与第二芯片OPA360的6号端口连接，所述的电阻R18的另一端同时与电阻R19的另一端、电阻R16的一端和第二芯片OPA360的7号端口连接，所述的电阻R16的另一端同时与模拟信号隔离电路10的电流幅值信号输入端和第二芯片OPA360的10号端口连接，所述的第二芯片OPA360的8号端口与电阻R17的一端连接，所述的电阻R17的另一端接信号地SGND，所述的电阻R12的一端为电流幅值处理电路9的信号输入端，所述的电阻R16的另一端为电流幅值处理电路9的信号输出端。Specific Embodiment 6: Refer to Figures 1, 5, 7, 8, and 9 to illustrate this embodiment. The difference between this embodiment and the ultra-high frequency high-power induction heating power supply described in Embodiment 1 is that the current amplitude Value processing circuit 9 comprises resistance R12, resistance R13, resistance R14, resistance R15, resistance R16, resistance R17, resistance R18, resistance R19, diode D4, diode D5 and 2 chip OPA360, and one end of described resistance R12 is connected with current simultaneously The signal output end of the signal filter circuit 6 is connected to one end of the resistor R18, and the other end of the resistor R12 is connected to the No. 4 port of the first chip OPA360, one end of the resistor R14 and the negative pole of the diode D4, and the resistor R14 The other end of the resistor R19 is connected to the positive pole of the diode D5 at the same time, the negative pole of the diode D5 is connected to the No. 12 port of the first chip OPA360 and the positive pole of the diode D4, and the 5th pole of the first chip OPA360 The No. port is connected to one end of the resistor R13, the other end of the resistor R13 is connected to the signal ground SGND, the No. 3 port of the first chip OPA360 is connected to the No. 6 port of the second chip OPA360, and the No. 6 port of the second chip OPA360 is connected to the other end of the resistor R18. The other end is simultaneously connected with the other end of the resistor R19, one end of the resistor R16, and the No. 7 port of the second chip OPA360, and the other end of the resistor R16 is simultaneously connected with the current amplitude signal input end of the analog signal isolation circuit 10 and the second The No. 10 port of the chip OPA360 is connected, the No. 8 port of the second chip OPA360 is connected to one end of the resistor R17, the other end of the resistor R17 is connected to the signal ground SGND, and one end of the resistor R12 is the current amplitude The signal input end of the processing circuit 9 , and the other end of the resistor R16 is the signal output end of the current amplitude processing circuit 9 .

具体实施方式七：参见图1、6、7、8、和9说明本实施方式，本实施方式与具体实施方式一所述的超高频大功率感应加热电源的区别在于，所述的模拟信号隔离电路10包括电阻R20、电阻R21、电阻R22、电阻R23、电容C5、电容C6和光电耦合器，所述的电阻R20的一端与电流幅值处理电路9的信号输出端连接，所述的电阻R20的另一端同时与电容C5的一端、电阻R21的一端和电阻R22的一端连接，所述的电容C5的另一端、电阻R22的另一端和光电耦合器输入端的发光二极管的阴极连接，所述的电阻R22的另一端接信号地SGND，所述的电阻R21的另一端与光电耦合器输入端的发光二极管的阳极连接，所述的光电耦合器的输出端的光敏三极管的集电极同时与+3.3V电源和电容C6的一端连接，所述的电容C6的另一端同时与光电耦合器的输出端的光敏三极管的发射极、电阻R23的一端和处理器11的电流幅值信号输入端连接，所述的电阻R23的另一端接+3.3V电源地GND，所述的电容C6的另一端为模拟信号隔离电路10的信号输出端，所述的电阻R20的一端为模拟信号隔离电路10的电流幅值信号输入端。Embodiment 7: Refer to Figures 1, 6, 7, 8, and 9 to illustrate this embodiment. The difference between this embodiment and the ultra-high frequency high-power induction heating power supply described in Embodiment 1 is that the analog signal The isolation circuit 10 includes a resistor R20, a resistor R21, a resistor R22, a resistor R23, a capacitor C5, a capacitor C6 and a photocoupler, one end of the resistor R20 is connected to the signal output terminal of the current amplitude processing circuit 9, and the resistor The other end of R20 is connected with one end of capacitor C5, one end of resistor R21 and one end of resistor R22 at the same time, the other end of capacitor C5, the other end of resistor R22 are connected with the cathode of the light-emitting diode at the input end of the photocoupler, and the The other end of the resistor R22 is connected to the signal ground SGND, the other end of the resistor R21 is connected to the anode of the light-emitting diode at the input end of the optocoupler, and the collector of the phototransistor at the output end of the optocoupler is simultaneously connected to +3.3V The power supply is connected to one end of the capacitor C6, and the other end of the capacitor C6 is connected to the emitter of the phototransistor at the output end of the photocoupler, one end of the resistor R23, and the current amplitude signal input end of the processor 11. The other end of the resistor R23 is connected to the +3.3V power ground GND, the other end of the capacitor C6 is the signal output end of the analog signal isolation circuit 10, and one end of the resistor R20 is the current amplitude signal of the analog signal isolation circuit 10 input.

具体实施方式八：参见图1、6、7、8、和9说明本实施方式，本实施方式与具体实施方式一所述的超高频大功率感应加热电源的区别在于，所述的光耦隔离器采用TLP421实现的。Embodiment 8: Refer to Figures 1, 6, 7, 8, and 9 to illustrate this embodiment. The difference between this embodiment and the ultra-high frequency high-power induction heating power supply described in Embodiment 1 is that the optocoupler The isolator is realized by TLP421.

Claims (8)

1. the high-power induction heating power of hyperfrequency, it is characterized in that, it comprises that voltage signal detects and Phase Processing circuit (1), inverter circuit (2), rectification circuit (3), current detection circuit (4), load output circuit (5), current signal filter circuit (6), current signal Phase Processing circuit (7), current phase signal buffer circuit (8), current amplitude treatment circuit (9), analog signal buffer circuit (10), processor (11), state parameter display circuit (12), drive signal isolation circuit (13), inverter power switch tube driving circuit (14) and voltage phase signal buffer circuit (15),
The DC signal output end of described rectification circuit (3) is connected with the direct current signal input of inverter circuit (2),
Voltage signal detection and Phase Processing circuit (1) are for detection of the output voltage signal of described inverter circuit (2), described voltage signal detects and the signal output part of Phase Processing circuit (1) is connected with the signal input part of voltage phase signal buffer circuit (15), the signal output part of described voltage phase signal buffer circuit (15) is connected with the voltage phase signal input of processor (11), the display output of described processor (11) is connected with the signal input part of state parameter display circuit (12)
current detection circuit (4) is connected between the output and load output circuit (5) of inverter circuit (2), current signal for detection of described inverter circuit (2) output, the testing result signal output part of described current detection circuit (4) is connected with the signal input part of current signal filter circuit (6), the signal output part of described current signal filter circuit (6) is connected 9 with the signal input part of current signal Phase Processing circuit (7) with the current amplitude treatment circuit simultaneously) signal input part be connected, the signal output part of current signal Phase Processing circuit (7) is connected with the signal input part of current phase signal buffer circuit (8), the signal output part of described current phase signal buffer circuit (8) is connected with the current phase signal input of processor (11), the signal output part of described current amplitude treatment circuit (9) is connected with the current amplitude signal input part of analog signal buffer circuit (10), the current amplitude signal output part of described analog signal buffer circuit (10) is connected with the current amplitude signal input part of processor (11)
The control signal output of described processor (11) is connected with the signal input part that drives signal isolation circuit (13), the signal output part of described driving signal isolation circuit (13) is connected with the signal input part of inverter power switch tube driving circuit (14), and the driving signal output part of described inverter power switch tube driving circuit (14) is connected with the control signal input of inverter circuit (2).
2. the high-power induction heating power of hyperfrequency according to claim 1, is characterized in that, described processor (11) adopts chip TMS 320 F 2812 to realize.
3. the high-power induction heating power of hyperfrequency according to claim 1 and 2, it is characterized in that, described voltage signal detects and Phase Processing circuit (1) comprises diode D1, diode D2, diode D3, resistance R 1, resistance R 2, resistance R 3, resistance R 4, resistance R 5, capacitor C 1, capacitor C 2 and chip TLV3502, the positive pole of described diode D2 connects+5V power supply ground HGND, the negative pole while of diode D2 and the positive pole of diode D1, chip TLV3502+the other end that the INA port is connected with resistance R connects, the negative pole while of described diode D1 and an end of resistance R 1, one end of resistance R 2 be connected the 5V power supply and connect, the other end of described resistance R 1 is connected with the end that an end of resistance R 5 is connected with resistance R simultaneously, the other end of described resistance R 5 and chip TLV3502-the INA port is connected, another termination of described resistance R 3+5V power supply ground HGND, the other end while of described resistance R 2 and an end of resistance R 4, one end of capacitor C 1 is connected positive pole and is connected with diode D3, another termination of described capacitor C 1+5V power supply ground HGND, the negative pole of described diode D3 is connected with the voltage signal output end of inverter circuit (2), the V+ port of described chip TLV3502 is connected with+a end that the 5V power supply is connected with capacitor C simultaneously, the other end of described capacitor C 2 is connected with the V-port of chip TLV3502, another termination of described capacitor C 2+5V power supply ground HGND, the OUTA port of described chip TLV3502 is connected with the signal input part of voltage phase signal buffer circuit (15), the OUTA port of described chip TLV3502 is the signal output part of voltage signal detection and Phase Processing circuit (1), the negative pole of described diode D3 is used for receiving the output voltage signal of described inverter circuit (2).
4. the high-power induction heating power of hyperfrequency according to claim 1, it is characterized in that, described current signal filter circuit (6) comprises resistance R 6, resistance R 7, resistance R 8, resistance R 9, capacitor C 3, capacitor C 4 and chip OPA3690, No. 1 port of described chip OPA3690 is connected with the end that an end of capacitor C 3 is connected with resistance R simultaneously, the other end while of described capacitor C 3 and an end of capacitor C 4, the end that one end of resistance R 6 is connected with resistance R connects, the other end while of described capacitor C 4 and the other end of resistance R 9, No. 14 ports of chip OPA3690, the signal input part of current signal Phase Processing circuit (7) is connected 9 with the current amplitude treatment circuit) signal input part connect, the other end while of described resistance R 6 and the testing result signal output part of current detection circuit (4), the other end that the other end of resistance R 7 is connected with resistance R connects, another termination signal ground SGND of described resistance R 8, one end of described resistance R 8 is connected with No. 2 ports of chip OPA3690, No. 16 ports of described chip OPA3690 and V ﹠lt, sub TranNum="107" ﹠gt, cc ﹠lt, /sub ﹠gt, connect, the other end of described resistance R 6 is the signal input part of current signal filter circuit (6), and the other end of described resistance R 9 is the signal output part of current signal filter circuit (6).
5. the high-power induction heating power of hyperfrequency according to claim 1, is characterized in that, described current signal Phase Processing circuit (7) comprises resistance R 10, resistance R 11 and chip TL3016ID, No. 1 port of described chip TL3016ID and V ﹠lt, sub TranNum="110" ﹠gt, cc ﹠lt, /sub ﹠gt, connect, No. 5 ports and No. 6 ports of described chip TL3016ID meet signal ground SGND, No. 3 ports of described chip TL3016ID are connected with an end of resistance R 10, the other end of described resistance R 10 is connected with the signal output part of current signal filter circuit (6), No. 2 ports of described chip TL3016ID are connected with an end of resistance R 11, another termination signal ground SGND of described resistance R 11, No. 7 ports of described chip TL3016ID are connected with the signal input part of current phase signal buffer circuit (8), the other end of described resistance R 10 is the signal input part of current signal Phase Processing circuit (7), No. 7 ports of described chip TL3016ID are the signal output part of current signal Phase Processing circuit (7).
6. the high-power induction heating power of hyperfrequency according to claim 1, it is characterized in that, described current amplitude treatment circuit (9) comprises resistance R 12, resistance R 13, resistance R 14, resistance R 15, resistance R 16, resistance R 17, resistance R 18, resistance R 19, diode D4, diode D5 and 2 chip OPA360, one end of described resistance R 12 is connected with the end that the signal output part of current signal filter circuit (6) is connected with resistance R simultaneously, the other end while of described resistance R 12 and No. 4 ports of the first chip OPA360, one end of resistance R 14 is connected negative pole and is connected with diode D4, the other end of described resistance R 14 with simultaneously and an end of resistance R 19 be connected positive pole with diode D5 and be connected, the negative pole of described diode D5 simultaneously and No. 12 ports of the first chip OPA360 be connected positive pole with diode D4 and be connected, No. 5 ports of described the first chip OPA360 are connected with an end of resistance R 13, another termination signal ground SGND of described resistance R 13, No. 3 ports of described the first chip OPA360 are connected with No. 6 ports of the second chip OPA360, the other end while of described resistance R 18 and the other end of resistance R 19, one end of resistance R 16 be connected No. 7 ports of chip OPA360 and connect, the other end of described resistance R 16 simultaneously with the current amplitude signal input part of analog signal buffer circuit (10) be connected No. 10 ports of chip OPA360 and be connected, No. 8 ports of described the second chip OPA360 are connected with an end of resistance R 17, another termination signal ground SGND of described resistance R 17, one end of described resistance R 12 is the signal input part of current amplitude treatment circuit (9), the other end of described resistance R 16 is the signal output part of current amplitude treatment circuit (9).
7. the high-power induction heating power of hyperfrequency according to claim 1, it is characterized in that, described analog signal buffer circuit (10) comprises resistance R 20, resistance R 21, resistance R 22, resistance R 23, capacitor C 5, capacitor C 6 and photoelectrical coupler, one end of described resistance R 20 is connected with the signal output part of current amplitude treatment circuit (9), the other end while of described resistance R 20 and an end of capacitor C 5, the end that one end of resistance R 21 is connected with resistance R connects, the other end of described capacitor C 5, the other end of resistance R 22 is connected the negative electrode of light-emitting diode and is connected with the photoelectrical coupler input, another termination signal ground SGND of described resistance R 22, the anodic bonding of the light-emitting diode of the other end of described resistance R 21 and photoelectrical coupler input, the collector electrode of the phototriode of the output of described photoelectrical coupler is connected with+a end that the 3.3V power supply is connected with capacitor C simultaneously, the other end while of described capacitor C 6 and the emitter of the phototriode of the output of photoelectrical coupler, one end of resistance R 23 is connected 11 with processor) the current amplitude signal input part connect, another termination of described resistance R 23+3.3V power supply ground GND, the other end of described capacitor C 6 is the signal output part of analog signal buffer circuit (10), one end of described resistance R 20 is the current amplitude signal input part of analog signal buffer circuit (10).
8. the high-power induction heating power of hyperfrequency according to claim 1, is characterized in that, described optical coupling isolator adopts TLP421 to realize.
CN2013203763227U 2013-06-27 2013-06-27 Ultrahigh-frequency high-power induction heating power supply Expired - Lifetime CN203289677U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013203763227U CN203289677U (en) 2013-06-27 2013-06-27 Ultrahigh-frequency high-power induction heating power supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013203763227U CN203289677U (en) 2013-06-27 2013-06-27 Ultrahigh-frequency high-power induction heating power supply

Publications (1)

Publication Number Publication Date
CN203289677U true CN203289677U (en) 2013-11-13

Family

ID=49546016

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013203763227U Expired - Lifetime CN203289677U (en) 2013-06-27 2013-06-27 Ultrahigh-frequency high-power induction heating power supply

Country Status (1)

Country Link
CN (1) CN203289677U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103313450A (en) * 2013-06-27 2013-09-18 哈尔滨理工大学 Ultrahigh-frequency high-power induction heating source

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103313450A (en) * 2013-06-27 2013-09-18 哈尔滨理工大学 Ultrahigh-frequency high-power induction heating source
CN103313450B (en) * 2013-06-27 2015-03-11 哈尔滨理工大学 Ultrahigh-frequency high-power induction heating source

Similar Documents

Publication Publication Date Title
CN204216790U (en) A Programmable Scanning Power Supply
CN103066865B (en) Three-phase Bridgeless power factor correction A.C.-D.C. converter
CN102496933B (en) Double parallel active power filtering apparatus
CN104578743B (en) Power-supplying circuit
CN106655538B (en) One kind is based on exchange envelope modulation radio energy transmission system
CN103313450B (en) Ultrahigh-frequency high-power induction heating source
CN105490360A (en) Mobile phone wireless charging circuit
CN105958661A (en) Efficient E class resonant type magnetic coupling wireless energy transmission system
CN203289677U (en) Ultrahigh-frequency high-power induction heating power supply
CN106655803A (en) Intelligent half-bridge sine wave voltage conversion circuit based on Vienna PFC
CN103796389B (en) High-high brightness hoisting module, controllable silicon light modulation LED drive circuit and system
CN102916497B (en) A socket for safe electric energy wireless transmission
CN114744864A (en) Power control circuit and control method thereof
CN205232491U (en) Electromagnetism stove circuit
CN203278653U (en) Direct current charging module of full bridge phase shift soft switch
CN203590068U (en) A high-frequency conversion circuit of a resonant wireless power transmission system
CN209343216U (en) A control circuit capable of reducing temperature rise of power devices
CN202818099U (en) A high-efficiency switching power supply frequency modulation circuit
CN203883686U (en) Single-phase rectification inverter
CN208723784U (en) A PFC Converter with Constant Current Output
CN201622339U (en) A switching power supply full-wave zero-crossing detection circuit
CN205070803U (en) Exchange direct transform ware based on singlechip
CN205622292U (en) Wireless charging circuit of cell -phone
CN206506442U (en) An intelligent half-bridge sine wave voltage conversion circuit based on Vienna PFC
CN102270933B (en) High voltage power circuit with AC input and low-power isolated fixed output

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20131113

Effective date of abandoning: 20150311

RGAV Abandon patent right to avoid regrant