CN203279437U - Heat pipe type heat dissipation module - Google Patents
Heat pipe type heat dissipation module Download PDFInfo
- Publication number
- CN203279437U CN203279437U CN 201320218795 CN201320218795U CN203279437U CN 203279437 U CN203279437 U CN 203279437U CN 201320218795 CN201320218795 CN 201320218795 CN 201320218795 U CN201320218795 U CN 201320218795U CN 203279437 U CN203279437 U CN 203279437U
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- heat pipe
- radiator
- radiating module
- substrate
- type radiating
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat pipe type heat dissipation module arranged on a substrate. The heat pipe type heat dissipation module comprises a support and a radiator. The support is fixed on the substrate. One end of the radiator is pivoted with the support, and a pedestal of the radiator corresponds to a heating element. The radiator can pivot on the support to be close to or separated from the substrate so as to be opened or closed as a whole, so that a user can conveniently and rapidly replace a processing chip without dismounting the whole heat pipe type heat dissipation module, meeting needs of convenient mounting for the user by himself/herself.
Description
Technical field
The utility model relates to a kind of radiating module, particularly relates to a kind of heat pipe-type radiating module.
Background technology
flourish along with high-tech industry of society now, its electronic installation, for example the volume of the electronic component of mobile computer (Notebook) or integrated molding computer (All-in-one PC) more is tending towards microminiaturization, and the closeness on unit are is also more and more high, overall efficiency constantly strengthens especially, and under these factors, effectively do not get rid of if there is no good radiating module the used heat that electronic component produces, these too high temperature will cause electronic component produce electronics free with the phenomenon such as thermal stress, and cause the stability of a system to reduce, and shorten electronic component useful life itself, therefore to how to get rid of these used heat to avoid electronic component overheated, it is the problem that can not be ignored always.
demand in view of DIY market, general electronic component, for example CPU (CUP) is very high with the operand of Graphics Processing Unit (GPU), the user is for speed up processing, must change more dynamical process chip and improve operational effectiveness, but in general, the spare part quantity of known heat pipe-type radiating module is many, when changing process chip as need, it must whole group disassembles from process chip or electronic component, cause dismounting quite consuming time, and the problems such as number of assembling steps is too numerous and diverse, cause the user easily dismounting heat pipe-type radiating module change process chip, cause user's inconvenience greatly.
Therefore, how allowing the user facilitate and dismounting heat pipe-type radiating module fast, so that change the demand of the process chip such as CPU or Graphics Processing Unit, is that factory of system and the radiator manufacturer of electronic product desires most ardently one of problem of solution.
The utility model content
In view of above problem, the utility model provides a kind of heat pipe-type radiating module, thereby solve known heat pipe-type radiating module, because spare part quantity is many, must whole assembling and dismantling unload replacing process chip smoothly down, cause the replacing operation of field-strip and process chip quite consuming time, and the problem such as number of assembling steps is too numerous and diverse.
In order to solve the problems of the technologies described above, the utility model provides a kind of heat pipe-type radiating module, is arranged on a substrate, and is provided with a heater element on substrate.The heat pipe-type radiating module comprises a support, is arranged on substrate; And a radiator, comprise a pedestal, at least one heat pipe and a fins group.Described heat pipe is connected between pedestal and fins group, and an end of radiator is articulated on support, and the position correspondence of pedestal is in the position of heater element, and radiator can draw close or separate with respect to substrate, draws close in substrate when radiator, and pedestal covers on heater element.
Further, above-mentioned heat pipe-type radiating module of the present utility model, wherein fins group has two rotating shafts, and two rotating shafts are articulated in respectively the relative two side faces of support.
Further, above-mentioned heat pipe-type radiating module of the present utility model, wherein fins group comprises a body and a movable part, movable part is fastened on body, and two rotating shafts are arranged on relative two ends of movable part.
Further, above-mentioned heat pipe-type radiating module of the present utility model, wherein movable part has a vertical section and bends one spacing section that extends from vertical section, vertically section is resisted against respectively two side faces adjacent on body with spacing section, and two rotating shafts are arranged on relative two ends of vertical section, and vertically section has at least one location hole, heat pipe has a heat conduction Duan Yuyi radiating segment, the heat conduction section is connected to pedestal, and radiating segment is connected in series body and movable part vertical section, and correspondence penetrates in location hole.
Further, above-mentioned heat pipe-type radiating module of the present utility model, the relative two side faces of its medium-height trestle has respectively an axis hole, rotating shaft comprises an auricle and a locking part, auricle is connected to vertical section of movable part, and an end of locking part passes axis hole, and is fixed on auricle.
Further, above-mentioned heat pipe-type radiating module of the present utility model, its medium-height trestle has two axis holes, is separately positioned on the relative two side faces of support, and the pedestal of radiator has two projections, respectively corresponding penetrating in two axis holes of support.
Further, above-mentioned heat pipe-type radiating module of the present utility model is wherein drawn close in substrate when radiator, and fins group contacts at substrate.
effect of the present utility model is, the heat pipe-type radiating module utilizes the design that has rotating shaft between radiator and support, also each spare part in conjunction with radiator forms an integral body, make radiator can raise with respect to substrate swinging on the substrates such as casing or circuit board or entire on, so, allow the user not need the whole assembling and dismantling of heat pipe-type radiating module are removed, can facilitate and change fast CPU (CPU), Graphics Processing Unit (GPU) or circuit assembly, with the time that shortens dismounting heat pipe-type radiating module and change process chip, and then reduce the impact that assembly defect causes, therefore meet the convenient demand of installing voluntarily of user.Simultaneously, compared to known technology, heat pipe-type radiating module of the present utility model has higher usability and convenience.
About feature of the present utility model, enforcement and effect, now coordinate accompanying drawing to be described in detail as follows as most preferred embodiment.
Description of drawings
Fig. 1 is the decomposing schematic representation of the heat pipe-type radiating module of the first embodiment of the present utility model;
Fig. 2 is the combination schematic diagram of the heat pipe-type radiating module of the first embodiment of the present utility model;
Fig. 3 A and Fig. 3 B are the use view of the heat pipe-type radiating module of the first embodiment of the present utility model;
Fig. 4 is the decomposing schematic representation of the heat pipe-type radiating module of the second embodiment of the present utility model;
Fig. 5 is the combination schematic diagram of the heat pipe-type radiating module of the second embodiment of the present utility model;
Fig. 6 A and Fig. 6 B are the use view of the heat pipe-type radiating module of the second embodiment of the present utility model;
Fig. 7 is the use view that the heat pipe-type radiating module of the second embodiment of the present utility model comprises single heat pipe.
Description of reference numerals
10 heat pipe-type radiating modules
20 substrates
21 circuit boards
22 heater elements
100 supports
110 axis holes
200 radiators
210 pedestals
211 projections
212 screws
213 screw tightenings
220 heat pipes
221 heat conduction sections
222 radiating segments
230 fins group
231 bodies
232 movable parts
2321 vertical sections
2322 spacing sections
2323 location holes
233 rotating shafts
2331 auricles
2332 locking parts.
Embodiment
Heat pipe-type radiating module the illustrating as embodiment of following disclosed two embodiment of the utility model, but be not limited with disclosed form, the person skilled in the art, can be according to actual design demand or user demand and the corresponding mode of appearance that changes heat pipe-type radiating module of the present utility model, being suitable for being installed on the market in the various types of electronic installations of finding, computer equipments such as integrated molding computer (All-in-one PC) or mobile computer (Notebook).
Please refer to the decomposing schematic representation and combination schematic diagram of the heat pipe-type radiating module of the first embodiment of the present utility model shown in Fig. 1 to Fig. 3 B.The heat pipe-type radiating module 10 of the present embodiment is used for being installed in a substrate 20 of electronic installation, in order to the heater element 22 on substrate 20 is dispelled the heat, wherein substrate 20 can be the casing of electronic installation or the motherboard that is arranged on electronic installation inside, the present embodiment is that the casing take substrate 20 as electronic installation illustrates as an example, but not as limit.Therefore, in the present embodiment, be provided with a circuit board 21 on substrate 20, and be provided with a heater element 22 on circuit board 21, this heater element 22 comprises but can produce the electronic component of high heat when not being confined to CPU (CPU), Graphics Processing Unit (GPU) or other running.
The heat pipe-type radiating module 10 of the present embodiment comprises a support 100 and a radiator 200, support 100 is arranged on substrate 20, that is to say that support 100 is arranged on the casing of electronic installation, and with circuit board 21 segment distance of being separated by, combination between its medium-height trestle 100 and substrate 20 can be for locking, engage or in modes such as riveteds, but be not confined to this.Radiator 200 comprises a pedestal 210, a plurality of heat pipe 220 and a fins group 230, a plurality of heat pipes 220 are connected between pedestal 210 and fins group 230, radiator 200 is articulated on support 100 with an end of fins group 230, and the length of fins group 230 is matched with the distance between support 100 and circuit board 21, makes the lucky corresponding position at heater element 22, position of pedestal 210.Therefore; swing by the relative support of fins group 230 100 when radiator 200 and draw close or when separating with respect to substrate 20; the pedestal 210 of radiator 200 can be thereupon near or be away from heater element 22, wherein when radiator 200 was drawn close in substrate 20, pedestal 210 was to cover on heater element 22.
Detailed construction and the assembling mode of the radiator 200 of the present embodiment are described further, and each heat pipe 220 of the present embodiment has respectively a relative heat conduction section 221 and a radiating segment 222.And fins group has a plurality of through holes corresponding with each heat pipe 220, and each heat pipe 220 is to wear each through hole with radiating segment 222 respectively, and is connected on fins group 230.In addition, the heat conduction section 221 of heat pipe 220 is passed pedestal 210, and is fixed on pedestal 210 by clipping firmly, makes pedestal 210, heat pipe 220 be connected to form an overall structure with fins group 230.
Wherein, the fins group 230 of the present embodiment comprises a body 231 and a movable part 232, body 231 is to be formed by the mutual storehouse of a plurality of radiating fins, movable part 232 has a vertical section 2321 and bends one spacing section 2322 that extends from vertical section 2321, make movable part 232 be a L shaped structure, but be not limited with this shape.Movable part 232 is to be installed in the end that body 231 is away from pedestal 210, and be resisted against two side faces adjacent on body 231 with vertical section 2321 with spacing section 2322 respectively, wherein vertically section 2321 has a plurality of location holes 2323, each location hole 2323 is corresponding with each through hole of body 231 respectively, and each heat pipe 220 passes through hole and location hole 2323 with radiating segment 222, and make an end of radiating segment 222 stretch out in movable part 232, thus restriction body 231 on movable part 232 along the ability of the radial direction displacement of location hole 2323.
the support 100 of the present embodiment and detailed construction and the assembling mode of the movable part 232 of radiator 200 further are described, left and right two ends of the movable part 232 of the present embodiment have respectively a rotating shaft 233, and each rotating shaft 233 comprises an auricle 2331 and a locking part 2332, wherein auricle 2331 is to extend to form on vertical section 2321 of movable part 232, and the relative two side faces of support 100 has respectively an axis hole 110, therefore, in assembling, with auricle 2331 correspondences of rotating shaft 233 position at axis hole 110, then the end with locking part 2332 passes axis hole 110, and be fixed on auricle 2331, its fixed form can be for locking or the mode such as fixing, and locking part 2332 passes the diameter of an end of axis hole 110 less than the aperture of axis hole 110, and the diameter of the other end of locking part 2332 is greater than the aperture of axis hole 110, the relative two side faces of support 100 is limited in respectively between the auricle 2331 and locking part 2332 of rotating shaft 233, and movable part 232 can be articulated on support 100 by locking part 2332, and then make the movable part 232 can be take locking part 2332 as rotating shaft, drive in the lump radiator 200 swing with respect to substrate 20 and raise or entire on, and the axis direction during radiator 200 rotation and the orientation of a plurality of heat pipe 220 are parallel to each other.
Based on said structure, when radiator 200 is drawn close in substrate 20 by relative support 100 rotations of movable part 232, pedestal 210 and the heater element 22 of radiator 200 are to present the state of mutually drawing close, and the bottom surface of pedestal 210 is fitted on heater element 22, make the thermal source of heater element 22 conduct to heat pipe 220 and fins group 230 by pedestal 210, to reach thermolysis.The bottom surface of fins group 230 is to contact on substrate 20 simultaneously, that is to say that a side of fins group 230 is fitted on casing, makes the thermal source of fins group 230 can conduct faster and be dispersed to casing, to reach better radiating efficiency.
In addition, above-mentioned pedestal 210 optionally installs a plurality of screw tightenings 213 additional, and each corner of pedestal 210 has respectively a plurality of screws 212, each screw tightening 213 passes respectively each screw 212, and lock on circuit board 21, pedestal 210 can be fitted on heater element 22 more closely, to promote heat conduction efficiency, and make simultaneously radiator 200 can not become flexible displacement because of external force collision or vibrations, to reach fixing effect.Wherein, above-mentioned screw tightening 213 comprises but is not confined to screw or bolt.
On the contrary, if when unclamping each screw tightening 213, radiator 200 can be raised from substrate 20 by relative support 100 rotations of movable part 232, make pedestal 210 and heater element 22 be the state that is separated from each other, and then make heater element 22 can not covered by pedestal 210 and expose outside, the user can not needed from whole group of radiator 200 of substrate 20 dismounting, can be fast and change easily the purpose of heater element 22, and then reach the effect that number of assembling steps is oversimplified.
Therefore the structural similarity of the overall structure of the second disclosed heat pipe-type radiating module 10 of embodiment of the present utility model and the heat pipe-type radiating module of above-mentioned the first embodiment, following content only is elaborated between the two difference place.
Please refer to the decomposing schematic representation and combination schematic diagram of the heat pipe-type radiating module of the second embodiment of the present utility model shown in Fig. 4 to Fig. 6 B.The utility model the second disclosed heat pipe-type radiating module 10 of embodiment is used on a substrate 20 that is installed in electronic installation, and this substrate 20 is for electrically being provided with the motherboard of a heater element 22 or the circuit board of other form.
The heat pipe-type radiating module 10 of the utility model the second embodiment is with the architectural difference of above-mentioned the first disclosed heat pipe-type radiating module of embodiment, the heat pipe-type radiating module 10 of the second embodiment comprises a support 100 and a radiator 200, its medium-height trestle 100 is arranged on substrate 20 side adjacent to heater element 22, and the relative two side faces of support 100 has respectively an axis hole 110, that is to say that support 100 directly is fixed on motherboard or circuit board.Radiator 200 comprises a pedestal 210, a plurality of heat pipe 220 and a fins group 230.A plurality of heat pipes 220 are to present an end to be bent upwards shape, and are connected between pedestal 210 and fins group 230, make fins group 230 be suspended at pedestal 210 tops.In addition, heat pipe 220 quantity of the disclosed radiator 200 of above-mentioned the utility model also can be one (as shown in Figure 7), for example configure the quantity of heat pipe according to separating heat demand, or select the larger heat pipe of caliber to realize, but not as limitation.
please refer to Fig. 4 to Fig. 6 B, it should be noted that, relative two ends of pedestal 210 are respectively arranged with a projection 211, it can be but the cylinder that is not confined to extend to form from the pedestal lateral margin, and the axis direction of two projections 211 is mutually vertical with the orientation of a plurality of heat pipes 220, wherein pedestal 210 penetrates respectively in the axis hole 110 of the relative two side faces of support 100 by two projections 211, radiator 200 can be swung with respect to support take two projections 211 as rotating shaft, be separated and draw close in substrate 20 or with substrate 20, pedestal 210 is covered on heater element 22 or from heater element 22 to be removed.Based on said structure, the heat pipe-type radiating module 10 of the present embodiment can reach the spinfunction identical with the first embodiment heat pipe-type radiating module equally.Therefore, allow equally the user reach need not to dismantle whole group of radiator 200, can be fast and change easily the purpose of heater element 22, reach the effect that number of assembling steps is oversimplified.
But different places is, the radiator 200 of the present embodiment, its raise or entire on direction of rotation be the setting party that is parallel to heat pipe 220 to, therefore be different from the direction of rotation of the radiator 200 of the first embodiment, and the present embodiment is by this rotation and entire when upper, pedestal 210 is to present the state of mutually drawing close with heater element 22, and the bottom surface of fins group 230 is and substrate 20 interval one distances, that is to say that fins group 230 does not contact at circuit board, accumulate on circuit board with the thermal source that prevents fins group 230, cause circuit board to produce short circuit because of overheated.Simultaneously, direction of rotation that can be by radiator 200 is different, comes in the corresponding electronic installation that is arranged on the different spaces restriction, radiator 200 to be applied in a flexible way in the use more.
Can be known by above-mentioned each embodiment explanation of the present utility model and learn, heat pipe-type radiating module of the present utility model, by being provided with the technological means of rotating shaft on radiator, can solve known heat pipe-type radiating module because spare part quantity is many, and must must whole assembling and dismantling unload the problem such as when causing dismounting and assembling quite consuming time and number of assembling steps is too numerous and diverse when changing process chip.
With prior art in comparison, heat pipe-type radiating module of the present utility model not only utilizes radiator to have the design of rotating shaft, also each spare part in conjunction with radiator forms an integral body, make radiator can with respect to casing or circuit board raise simultaneously or entire on, so, allow the user can facilitate and change fast CPU (CPU), Graphics Processing Unit (GPU) or other electron component, with time of shortening the dismounting radiator and reduce the trouble that assembly defect causes, and then meet the convenient demand of installing voluntarily of user.Therefore compared to known technology, heat pipe-type radiating module of the present utility model has higher usability and convenience.
Although embodiment of the present utility model discloses as mentioned above; yet be not to limit the utility model; any people who is familiar with related art techniques; within not breaking away from spirit and scope of the present utility model; every according to the described shape of the utility model claim, structure, feature and quantity when can do a little change, therefore scope of patent protection of the present utility model must be looked this specification appending claims person of defining and is as the criterion.
Claims (7)
1. a heat pipe-type radiating module, be arranged on a substrate, and be provided with a heater element on described substrate, it is characterized in that, described heat pipe-type radiating module comprises:
One support is arranged on described substrate; And
One radiator; comprise a pedestal, at least one heat pipe and a fins group; described heat pipe is connected between described pedestal and described fins group; one end of described radiator is articulated on described support; the position correspondence of described pedestal is in the position of described heater element; and described radiator can be drawn close or separate with respect to described substrate, draws close in described substrate when described radiator, and described pedestal covers on described heater element.
2. heat pipe-type radiating module according to claim 1, is characterized in that, described fins group has two rotating shafts, and described two rotating shafts are articulated in respectively the relative two side faces of described support.
3. heat pipe-type radiating module according to claim 2, is characterized in that, described fins group comprises a body and a movable part, and described movable part is fastened on described body, and described two rotating shafts are arranged on relative two ends of described movable part.
4. heat pipe-type radiating module according to claim 3, it is characterized in that, described movable part has a vertical section and bends one spacing section that extends from described vertical section, described vertical section is resisted against respectively two side faces adjacent on described body with described spacing section, described two rotating shafts are arranged on relative two ends of described vertical section, and described vertical section has at least one location hole, described heat pipe has a heat conduction Duan Yuyi radiating segment, described heat conduction section is connected to described pedestal, described radiating segment is connected in series described body and described movable part described vertical section, and correspondence penetrates in described location hole.
5. heat pipe-type radiating module according to claim 4, it is characterized in that, the relative two side faces of described support has respectively an axis hole, described rotating shaft comprises an auricle and a locking part, described auricle is connected to described vertical section of movable part, one end of described locking part passes described axis hole, and is fixed on described auricle.
6. heat pipe-type radiating module according to claim 1, it is characterized in that, described support has two axis holes, is separately positioned on the relative two side faces of described support, and the described pedestal of described radiator has two projections, respectively corresponding penetrating in described two axis holes of described support.
7. heat pipe-type radiating module according to claim 1, is characterized in that, described radiator is drawn close in described substrate, and described fins group contact is at described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320218795 CN203279437U (en) | 2013-04-26 | 2013-04-26 | Heat pipe type heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320218795 CN203279437U (en) | 2013-04-26 | 2013-04-26 | Heat pipe type heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203279437U true CN203279437U (en) | 2013-11-06 |
Family
ID=49509752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320218795 Expired - Lifetime CN203279437U (en) | 2013-04-26 | 2013-04-26 | Heat pipe type heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203279437U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014172887A1 (en) * | 2013-04-26 | 2014-10-30 | 技嘉科技股份有限公司 | Heat pipe type heat dissipation module |
-
2013
- 2013-04-26 CN CN 201320218795 patent/CN203279437U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014172887A1 (en) * | 2013-04-26 | 2014-10-30 | 技嘉科技股份有限公司 | Heat pipe type heat dissipation module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131106 |