CN203254684U - Compound die punching device for tetrafluoride pad - Google Patents

Compound die punching device for tetrafluoride pad Download PDF

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Publication number
CN203254684U
CN203254684U CN 201320290109 CN201320290109U CN203254684U CN 203254684 U CN203254684 U CN 203254684U CN 201320290109 CN201320290109 CN 201320290109 CN 201320290109 U CN201320290109 U CN 201320290109U CN 203254684 U CN203254684 U CN 203254684U
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CN
China
Prior art keywords
plate
dnockout
die
bolster
screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320290109
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Chinese (zh)
Inventor
周大全
李德寿
包行方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Central Power Transmission & Distribution Equipment (pinghu) Co Ltd
Original Assignee
China Central Power Transmission & Distribution Equipment (pinghu) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Central Power Transmission & Distribution Equipment (pinghu) Co Ltd filed Critical China Central Power Transmission & Distribution Equipment (pinghu) Co Ltd
Priority to CN 201320290109 priority Critical patent/CN203254684U/en
Application granted granted Critical
Publication of CN203254684U publication Critical patent/CN203254684U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a compound die punching device for a tetrafluoride pad. The compound die punching device comprises an upper die holder, a lower die holder, guide pillars, a ramming assembly and a pressing assembly, wherein the ramming assembly is fixed on the middle part of the upper die holder, the pressing assembly is fixed on the middle part of the lower die holder and aligned to the ramming assembly; the two guide pillars are respectively arranged on the left side and right side of the pressing assembly, the lower end of each guide pillar is fixed on the lower die holder, the upper end of each guide pillar is fixed on the upper die holder, and a guide sleeve is arranged on the upper part of each guide pillar. The compound die punching device is simple in structure and convenient to use.

Description

Phenyl tetrafluoride pad compund die device
Technical field
The utility model relates to a kind of compund die field, especially a kind of phenyl tetrafluoride pad compund die device.
Background technology
Existing compund die complex structure uses inconvenient.
Summary of the invention
The purpose of this utility model provides a kind of phenyl tetrafluoride pad compund die device.
What the utility model solved is the complex structure that exists in the prior art, inconvenient problem with use.
The skill scheme that the utility model technical solution problem adopts is: it comprises upper bolster, die shoe, guide pillar, dnockout assembly and binder assembly, described dnockout assembly is fixed on the middle part of upper bolster, described binder assembly is fixed on the middle part of die shoe, aligns with the dnockout assembly; The left and right sides of described binder assembly is respectively equipped with two guide pillars, and described guide pillar lower end is fixed on the die shoe, and the upper end is fixed on the upper bolster, and described guide pillar top is provided with guide pin bushing.
The beneficial effects of the utility model are: the utility model is simple in structure, the convenient use.
Description of drawings
Fig. 1 is structural representation of the present utility model.
The specific embodiment
The utility model is described in further detail below in conjunction with drawings and Examples.
As shown in the figure, comprise upper bolster 1, die shoe 4, guide pillar 3, dnockout assembly and binder assembly, it is characterized in that described dnockout assembly is fixed on the middle part of upper bolster 1, described binder assembly is fixed on the middle part of die shoe 4, aligns with the dnockout assembly; The left and right sides of described binder assembly is respectively equipped with two guide pillars 3, and described guide pillar 3 lower ends are fixed on the die shoe 4, and the upper end is fixed on the upper bolster 1, and described guide pillar 3 tops are provided with guide pin bushing 2.
In the present embodiment, described binder assembly comprises holding pad 5, cushion pad 11, bottom plate 10, lower bolster 9 and concave-convex mold 7, described lower bolster 9 is located at die shoe 4 upper surfaces, described concave-convex mold 7 is located at described lower bolster 9 tops, described bottom plate 10, cushion pad 11 and holding pad are placed in concave-convex mold 7 outsides, described bottom plate 10 is located at lower bolster 9 tops, described cushion pad 11 is located at bottom plate 10 tops, described holding pad 5 is located at cushion pad 11 tops, and described holding pad 5 upper surfaces are concordant with concave-convex mold 7 upper surfaces; Described bottom plate 10 and lower bolster 9 left parts are fixed by hexagon socket cap head screw 6 and die shoe, and the right part of described holding pad 5, cushion pad 11, bottom plate 10 and lower bolster 9 is fixing with die shoe 4 by interior hexagon cylindrical head shoulder screw 8.
In the present embodiment, it is characterized in that described dnockout assembly comprises die 12, punch 23, dnockout fast 13, the first upper mounted plate 24, the second upper mounted plate 14, dnockout pin 15, upper padding plate 22, knockout plate 17, knockout rod 20 and screw-in die shank 19, described upper padding plate 22 is located at described upper bolster 1 lower surface, described punch 23 is located at described upper padding plate 22 belows, described the first upper mounted plate 24 is located at described upper padding plate 22 belows and is placed in the upper outside of described punch 23, described dnockout piece 13 is placed in the lower outside of described punch 23, described die 12 is located at described the first upper mounted plate 24 belows and is placed in fast 13 outsides of described dnockout, the lower surface of dnockout fast 13 is concordant with the lower surface of die 12, and described the second upper mounted plate 14 is located at described the first upper mounted plate 24 belows and is placed in described die 12 outsides; Described upper bolster 1 lower surface is provided with a cavity 21, and described knockout plate 17 is located in the cavity 21 and is located at the top of upper padding plate 22; Described punch 23 both sides are respectively equipped with a dnockout pin 15, and described dnockout pin 15 lower ends withstand on described dnockout piece 13 upper surfaces, and the top that punch 23 is passed in the upper end withstands on the lower surface of described knockout plate 17; Described upper bolster 1 upper surface is provided with a screw, described knockout rod 20 is located at described knockout plate 17 tops, the lower end of knockout rod 20 withstands on described knockout plate 17 upper surfaces, the outside cover of knockout rod 20 has a screw-in die shank 19, described screw-in die shank 19 bottoms are located in the described screw, and are fixing by a fluting cone end holding screw 18; The right part of described upper padding plate 22, the first upper mounted plate 24 and the second upper mounted plate 14 positions by straight pin 16 and upper bolster 1, and left part is fixed by hexagon socket cap head screw.

Claims (3)

1. phenyl tetrafluoride pad compund die device, comprise upper bolster, die shoe, guide pillar, dnockout assembly and binder assembly, it is characterized in that described dnockout assembly is fixed on the middle part of upper bolster, described binder assembly is fixed on the middle part of die shoe, aligns with the dnockout assembly; The left and right sides of described binder assembly is respectively equipped with two guide pillars, and described guide pillar lower end is fixed on the die shoe, and the upper end is fixed on the upper bolster, and described guide pillar top is provided with guide pin bushing.
2. phenyl tetrafluoride pad compund die device according to claim 1, it is characterized in that described binder assembly comprises holding pad, cushion pad, bottom plate, lower bolster and concave-convex mold, described lower bolster is located at the die shoe upper surface, described concave-convex mold is located at described lower bolster top, described bottom plate, cushion pad and holding pad are placed in the concave-convex mold outside, described bottom plate is located at the lower bolster top, described cushion pad is located at the bottom plate top, described holding pad is located at the cushion pad top, and described holding pad upper surface is concordant with the concave-convex mold upper surface; Described bottom plate and lower bolster left part are fixed by hexagon socket cap head screw and die shoe, and the right part of described holding pad, cushion pad, bottom plate and lower bolster is fixed by interior hexagon cylindrical head shoulder screw and die shoe.
3. phenyl tetrafluoride pad compund die device according to claim 1, it is characterized in that described dnockout assembly comprises die, punch, dnockout is fast, the first upper mounted plate, the second upper mounted plate, the dnockout pin, upper padding plate, knockout plate, knockout rod and screw-in die shank, described upper padding plate is located at described upper bolster lower surface, described punch is located at described upper padding plate below, described the first upper mounted plate is located at described upper padding plate below and is placed in the upper outside of described punch, described dnockout piece is placed in the lower outside of described punch, described die is located at described the first upper mounted plate below and is placed in the fast outside of described dnockout, the fast lower surface of dnockout is concordant with the lower surface of die, and described the second upper mounted plate is located at described the first upper mounted plate below and is placed in the described die outside; Described upper bolster lower surface is provided with a cavity, and described knockout plate is located in the cavity and is located at the top of upper padding plate; Described punch both sides are respectively equipped with a dnockout pin, and described dnockout pin lower end withstands on described dnockout piece upper surface, and the top that punch is passed in the upper end withstands on the lower surface of described knockout plate; Described upper bolster upper surface is provided with a screw, described knockout rod is located at described knockout plate top, the lower end of knockout rod withstands on described knockout plate upper surface, the outside cover of knockout rod has a screw-in die shank, described screw-in die shank bottom is located in the described screw, fixes by a fluting cone end holding screw; The right part of described upper padding plate, the first upper mounted plate and the second upper mounted plate positions by straight pin and upper bolster, and left part is fixed by hexagon socket cap head screw.
CN 201320290109 2013-05-25 2013-05-25 Compound die punching device for tetrafluoride pad Expired - Fee Related CN203254684U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320290109 CN203254684U (en) 2013-05-25 2013-05-25 Compound die punching device for tetrafluoride pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320290109 CN203254684U (en) 2013-05-25 2013-05-25 Compound die punching device for tetrafluoride pad

Publications (1)

Publication Number Publication Date
CN203254684U true CN203254684U (en) 2013-10-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320290109 Expired - Fee Related CN203254684U (en) 2013-05-25 2013-05-25 Compound die punching device for tetrafluoride pad

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CN (1) CN203254684U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103286982A (en) * 2013-05-25 2013-09-11 中发输配电设备(平湖)有限公司 Complex stamping die set for polytetrafluoroethylene washers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103286982A (en) * 2013-05-25 2013-09-11 中发输配电设备(平湖)有限公司 Complex stamping die set for polytetrafluoroethylene washers

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131030

Termination date: 20160525

CF01 Termination of patent right due to non-payment of annual fee