CN203243606U - Porting structure of printed circuit board - Google Patents
Porting structure of printed circuit board Download PDFInfo
- Publication number
- CN203243606U CN203243606U CN 201320122812 CN201320122812U CN203243606U CN 203243606 U CN203243606 U CN 203243606U CN 201320122812 CN201320122812 CN 201320122812 CN 201320122812 U CN201320122812 U CN 201320122812U CN 203243606 U CN203243606 U CN 203243606U
- Authority
- CN
- China
- Prior art keywords
- motherboard
- printed wiring
- tie point
- wiring board
- daughter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Combinations Of Printed Boards (AREA)
Abstract
The utility model relates to a porting structure of a multiple connected piece printed circuit board, including a motherboard. The motherboard is provided with a plurality of sub-plates. At least one of the plurality of sub-plates is formed by connecting at least two first connection points and the motherboard. Each first connection point is of a mortise and tenon joint structure including tenons and mortises. The tenons locate on the sub-plate. The mortises locate on the motherboard. The motherboard and the sub-plates of the multiple connected piece printed circuit board are connected by the first connection points, the first connection points use the mortise and tenon joint structure, the efficiency of porting process is improved and the quality of the circuit board is stabilized.
Description
Technical field
The utility model relates to many in flakes formula printed wiring boards, specifically a kind of many in flakes transplant structures of formula printed wiring board.
Background technology
How in flakes the formula printed wiring board is to be furnished with a plurality of daughter boards at a motherboard.If it is defective that one of them daughter board occurs, then the monoblock motherboard all will be scrapped, thereby has caused great waste.
Scrap the utilance of plate in order to improve printed wiring board, reduce the production cost of wiring board enterprise, improve the shipment rate, adopt transplanting technique to repair and scrap plate.The action principle of transplanting technique is: with the bad daughter board of certain position on many in flakes formula printed wiring board motherboards, cut down by moulding, with identical qualified daughter board, put into the position of the bad daughter board of taking off, carry out combination, making any one daughter board on its many in flakes formula printed wiring board motherboards all is qualified product.
In the prior art, transplant the forming machine of process using high accuracy band CCD location and directly locate jigsaw.The shortcoming of this transplanting technique is that equipment cost is high, and working (machining) efficiency is low, and processing quality is uncontrollable.
Summary of the invention
The utility model provides a kind of transplant structure of printed wiring board for the problems referred to above, and this structure can improve the quality of transplanting, enhances productivity.
According to the technical solution of the utility model: a kind of transplant structure of printed wiring board, comprise motherboard, be provided with a plurality of daughter boards on the described motherboard, at least one described daughter board in described a plurality of daughter board is connected with described motherboard by at least two the first tie points, and each described first tie point is joinery and its construction.
Described joinery and its construction comprises tenon and tongue-and-groove, and described tenon is positioned on the described daughter board, and described tongue-and-groove is positioned on the described motherboard.
Be provided with the gap between described tenon and the described tongue-and-groove, be filled with glue in the described gap.
Described tenon and described tongue-and-groove are corresponding rectangle, T shape or swallow-tail form.
Described the first tie point has four, is symmetrically distributed in the relative two ends of described daughter board.
Be provided with the second tie point between the described daughter board that is connected with described motherboard by described the first tie point and the adjacent described daughter board, described the second tie point also adopts joinery and its construction.
Technique effect of the present utility model is: the utility model adopts the first tie point to be connected between the motherboard of many in flakes formula printed wiring boards and daughter board, and the first tie point adopts joinery and its construction, improve the production efficiency of transplanting technique, stablized the quality of wiring board.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is further described.
Among Fig. 1, comprise motherboard 1, daughter board 2, the first tie point 3, the second tie point 4 etc.
As shown in Figure 1, the utility model is a kind of transplant structure of printed wiring board, comprises motherboard 1, is provided with a plurality of daughter boards 2 on the motherboard 1, and four Yangtze plate are arranged in the present embodiment.
At least one daughter board 2 in a plurality of daughter boards 2 is connected with motherboard 1 by at least two the first tie points 3, and the first tie point 3 has four in the present embodiment, is symmetrically distributed in the relative two ends of daughter board 2.
Each first tie point 3 is joinery and its construction.Joinery and its construction comprises tenon and tongue-and-groove, and tenon and tongue-and-groove are corresponding rectangle, T shape or swallow-tail form.Tenon is positioned on the daughter board 2, and tongue-and-groove is positioned on the motherboard 1.Be provided with the gap between tenon and the tongue-and-groove, be filled with glue in the gap, glue strengthens the fastness of joinery and its construction.
Be provided with the second tie point 4, the second tie points 4 between the daughter board 2 that is connected with motherboard 1 by the first tie point 3 and the adjacent daughter board 2 and also adopt joinery and its construction.The stability that the second tie point 4 can further improve transplanted daughter board 2 is set.
When adopting the utility model to implement to transplant technique, bad daughter board 2 on many in flakes formula printed wiring board motherboards 1 is cut away, and making tongue-and-groove, make the tenon corresponding with tongue-and-groove at qualified daughter board 2, be combined with tongue-and-groove by tenon and form joinery and its construction, make the qualified daughter board 2 qualified many in flakes formula printed wiring boards of formation that are connected with the motherboard 1 that cuts away bad daughter board 2.
The utility model adopts the first tie point 3 to be connected at the motherboard 1 of many in flakes formula printed wiring boards with 2 of daughter boards, and the first tie point 3 employing joinery and its constructions, has improved the production efficiency of transplanting technique, has stablized the quality of wiring board; The utility model can reduce the production cost of printed wiring board effectively, and reduction is scrapped, and has improved production efficiency and has shortened ETCD estimated time of commencing discharging, and improved the efficient of assembling merchant's SMT.
Claims (6)
1. the transplant structure of a printed wiring board, comprise motherboard (1), be provided with a plurality of daughter boards (2) on the described motherboard (1), it is characterized in that: at least one the described daughter board (2) in described a plurality of daughter boards (2) is connected with described motherboard (1) by at least two the first tie points (3), and each described first tie point (3) is joinery and its construction.
2. according to the transplant structure of printed wiring board claimed in claim 1, it is characterized in that: described joinery and its construction comprises tenon and tongue-and-groove, and described tenon is positioned on the described daughter board (2), and described tongue-and-groove is positioned on the described motherboard (1).
3. according to the transplant structure of printed wiring board claimed in claim 2, it is characterized in that: be provided with the gap between described tenon and the described tongue-and-groove, be filled with glue in the described gap.
4. according to the transplant structure of claim 2 perhaps described printed wiring board, it is characterized in that: described tenon and described tongue-and-groove are corresponding rectangle, T shape or swallow-tail form.
5. according to the transplant structure of printed wiring board claimed in claim 1, it is characterized in that: described the first tie point (3) has four, is symmetrically distributed in the relative two ends of described daughter board (2).
6. according to the transplant structure of printed wiring board claimed in claim 1, it is characterized in that: be provided with the second tie point (4) between the described daughter board (2) that is connected with described motherboard (1) by described the first tie point (3) and the adjacent described daughter board (2), described the second tie point (4) also adopts joinery and its construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320122812 CN203243606U (en) | 2013-03-19 | 2013-03-19 | Porting structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320122812 CN203243606U (en) | 2013-03-19 | 2013-03-19 | Porting structure of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203243606U true CN203243606U (en) | 2013-10-16 |
Family
ID=49320859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320122812 Expired - Lifetime CN203243606U (en) | 2013-03-19 | 2013-03-19 | Porting structure of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203243606U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106507610A (en) * | 2016-10-12 | 2017-03-15 | 郑州云海信息技术有限公司 | A kind of preparation method of printed circuit board (PCB) and printed circuit board (PCB) |
-
2013
- 2013-03-19 CN CN 201320122812 patent/CN203243606U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106507610A (en) * | 2016-10-12 | 2017-03-15 | 郑州云海信息技术有限公司 | A kind of preparation method of printed circuit board (PCB) and printed circuit board (PCB) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131016 |