CN203218230U - Pressing claw handle for semiconductor encapsulation aluminium wire bonding - Google Patents

Pressing claw handle for semiconductor encapsulation aluminium wire bonding Download PDF

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Publication number
CN203218230U
CN203218230U CN2013202262599U CN201320226259U CN203218230U CN 203218230 U CN203218230 U CN 203218230U CN 2013202262599 U CN2013202262599 U CN 2013202262599U CN 201320226259 U CN201320226259 U CN 201320226259U CN 203218230 U CN203218230 U CN 203218230U
Authority
CN
China
Prior art keywords
handle body
connecting portion
handle
pressing claw
body connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013202262599U
Other languages
Chinese (zh)
Inventor
诸伟
方浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGYIN SUNNY ORIENT TECHNOLOGY Co Ltd
Original Assignee
JIANGYIN SUNNY ORIENT TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGYIN SUNNY ORIENT TECHNOLOGY Co Ltd filed Critical JIANGYIN SUNNY ORIENT TECHNOLOGY Co Ltd
Priority to CN2013202262599U priority Critical patent/CN203218230U/en
Application granted granted Critical
Publication of CN203218230U publication Critical patent/CN203218230U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)

Abstract

The utility model relates to a pressing claw handle for semiconductor encapsulation aluminium wire bonding. The provided pressing claw handle that comprises a handle body (1) and a handle body connecting portion (2) at the front end of the handle body (1) is characterized in that waist-round holes (3) are arranged at the handle body (1); a bar-shaped boss (4) is arranged at the rear end of the handle body connecting portion (2) and the upper surface of the handle body connecting portion (2) is an inclined surface; and circular installation holes (5) are arranged at the handle body connecting portion (2). With utilization of the structure, the strength of the pressing claw handle is improved; and the provided pressing claw handle has the advantages of uneasy deformation, long service life, and bonding quality guarantee.

Description

Semiconductor packages aluminum steel bonding paw handle
Technical field
The utility model relates to a kind of semiconductor packages aluminum steel bonding paw handle, belongs to the semiconductor packages field.
Background technology
At present, semiconductor packages aluminum steel bonding requires must fasten at bonding wire process middle frame, so will use paw in bonding process.And the paw handle of present employed paw adopts hollow-core construction, uses generally the distortion of paw handle just to occur owing to intensity is relatively poor about 3 months, causes well fastening framework, and bonding can not be ensured the quality of products.Therefore seek a kind of distortion that is not easy, long service life guarantees that the semiconductor packages aluminum steel bonding of bonding quality is particularly important with the paw handle.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and a kind of distortion that is not easy is provided, long service life, the semiconductor packages aluminum steel bonding paw handle of assurance bonding quality.
The purpose of this utility model is achieved in that
A kind of semiconductor packages aluminum steel bonding paw handle, it comprises the handle body connecting portion of handle body and handle body front end, described handle body is provided with the oval installing hole, the rear end of described handle body connecting portion is provided with the bar shaped boss, the upper surface of described handle body connecting portion is the inclined-plane, and described handle body connecting portion is provided with the circular mounting hole.
Compared with prior art, the beneficial effects of the utility model are:
The utility model adopts this structure to make the intensity of paw handle be improved, and has the distortion of being not easy, long service life, the advantage of assurance bonding quality.
Description of drawings
Fig. 1 is the structural representation that the utility model semiconductor packages aluminum steel bonding is used the paw handle.
Wherein:
Handle body 1
Handle body connecting portion 2
Oval installing hole 3
Bar shaped boss 4
Circular mounting hole 5.
Embodiment
Referring to Fig. 1, a kind of semiconductor packages aluminum steel bonding paw handle that the utility model relates to, it comprises the handle body connecting portion 2 of handle body 1 and handle body 1 front end, described handle body connecting portion 2 is used for connecting the paw head, described handle body 1 is provided with the oval installing hole 3 of two above-below directions, the rear end of described handle body connecting portion 2 is provided with bar shaped boss 4, the upper surface of described handle body connecting portion 2 from inside to outside is inclined downward, and described handle body connecting portion 2 is provided with the circular mounting hole 5 of four above-below directions.

Claims (1)

1. semiconductor packages aluminum steel bonding paw handle, it comprises the handle body connecting portion (2) of handle body (1) and handle body (1) front end, it is characterized in that described handle body (1) is provided with oval installing hole (3), the rear end of described handle body connecting portion (2) is provided with bar shaped boss (4), the upper surface of described handle body connecting portion (2) is the inclined-plane, and described handle body connecting portion (2) is provided with circular mounting hole (5).
CN2013202262599U 2013-04-28 2013-04-28 Pressing claw handle for semiconductor encapsulation aluminium wire bonding Expired - Fee Related CN203218230U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013202262599U CN203218230U (en) 2013-04-28 2013-04-28 Pressing claw handle for semiconductor encapsulation aluminium wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013202262599U CN203218230U (en) 2013-04-28 2013-04-28 Pressing claw handle for semiconductor encapsulation aluminium wire bonding

Publications (1)

Publication Number Publication Date
CN203218230U true CN203218230U (en) 2013-09-25

Family

ID=49207743

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013202262599U Expired - Fee Related CN203218230U (en) 2013-04-28 2013-04-28 Pressing claw handle for semiconductor encapsulation aluminium wire bonding

Country Status (1)

Country Link
CN (1) CN203218230U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130925

Termination date: 20200428