CN203175644U - Water-air intercooler - Google Patents
Water-air intercooler Download PDFInfo
- Publication number
- CN203175644U CN203175644U CN 201320225915 CN201320225915U CN203175644U CN 203175644 U CN203175644 U CN 203175644U CN 201320225915 CN201320225915 CN 201320225915 CN 201320225915 U CN201320225915 U CN 201320225915U CN 203175644 U CN203175644 U CN 203175644U
- Authority
- CN
- China
- Prior art keywords
- device core
- hydroecium
- water
- cooler core
- chip assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The utility model discloses a water-air intercooler which comprises a left water chamber, a right water chamber, a cooler core and an intermediate water chamber, wherein the cooler core is divided into a left cooler core part and a right cooler core part; each cooler core part comprises a plurality of chip components that are arrayed sequentially from the top down; water channels are formed in the chip components; flow guide sheets are arranged between the adjacent chip components; air channels for filling cooling air are arranged between the chip components; the left water chamber is connected with the left end of the left cooler core part and communicated with the water channels in the chip components of the left cooler core part; the intermediate water chamber is connected between the left cooler core part and the right cooler core part, and communicated with the water channels of the chip components of the left cooler core part and the right cooler core part; and the right water chamber is connected with the right end of the right cooler core part and communicated with the water channels in the chip components of the right cooler core part. The water-air intercooler is easy to assemble, side plates of the chip components are even, the brazing strength is high, and the possibility of leakage is low.
Description
Technical field
The utility model relates to the aerial cooler of a kind of water.
Background technique
The effect of the aerial cooler of water is to guarantee that the engine motor oil temperature is in the temperature range an of the best, and effect lubricated and cooling is played in each motion of motor.The working principle of the aerial cooler of water is the cooling air product guide plate of flowing through, and utilizes heat exchange principle to cool off circulating water in the central layer, makes water temperature be cooled to desirable temperature range.As depicted in figs. 1 and 2, the aerial cooler of the water of prior art comprises left hydroecium 1 ', right hydroecium 2 ' and device core 3 '.Described device core 3 ' comprises a plurality of chip assemblies 4 ', and each chip assembly 4 ' comprises chip, following chip and fin.The described chip of going up is fixed with following chips welding, and described fin is located at described going up between chip and the following chip.Described chip assembly 4 ' the inner water channel that forms.Be provided with guide plate 5 ' between adjacent chip assembly 4 ' and the chip assembly 4 ', form air passageways for logical cooling air between described chip assembly 4 ' and the chip assembly 4 '.Described left hydroecium 1 ' and right hydroecium 2 ' are located at left end and the right-hand member of described device core 3 ' respectively, and left hydroecium 1 ' and right hydroecium 2 ' all are connected with the interior water channel of chip assembly 4 '.
There is following defective in the aerial cooler of the water of prior art: the aerial cooler of some water is applied in large-scale industrial and mineral mechanically, the length of the aerial cooler of water is long, therefore, the length of chip assembly is just long, like this, the side plate that is difficult for assembling and chip assembly inadequately between the smooth and strip of paper used for sealing gap bigger, weld strength is lower during soldering, and causes leakage easily.
Prior art: 1 ', left hydroecium, 2 ', right hydroecium, 3 ', the device core, 4 ', chip assembly, 5 ', guide plate;
The utility model: 1, left hydroecium, 2, right hydroecium, 3, middle hydroecium, 4, chip assembly, 5, guide plate, 6, left device core, 7, right device core, 8, strip of paper used for sealing.
The model utility content
The technical problems to be solved in the utility model is, provides the side plate of a kind of easy assembling, chip assembly smooth, soldering strength is high and the aerial cooler of antileakaging water.
Technical solution of the present utility model is, a kind of aerial cooler of water with following structure is provided, and comprises left hydroecium, right hydroecium and device core; Hydroecium in the middle of also comprising; Described device core is divided into left device core and right device core; Each device core includes a plurality of chip assemblies, and these a plurality of chip assemblies are arranged in order from top to bottom; The inner water channel that forms of described chip assembly; Be provided with guide plate between adjacent chip assembly and the chip assembly, be the air passageways for logical cooling air between described chip assembly and the chip assembly; Described left hydroecium is connected with the left end of described left device core, and the water channel in the chip assembly of described left hydroecium and described left device core is communicated with; Hydroecium is connected between described left device core and the right device core in the middle of described, and the water channel of the chip assembly of the chip assembly of hydroecium and described left device core and described right device core is communicated with in the middle of described; Described right hydroecium is connected with the right-hand member of described right device core, and the water channel in the chip assembly of described right hydroecium and described right device core is communicated with.
After adopting above structure, the aerial cooler of water of the present utility model compared with prior art has the following advantages:
Because the aerial cooler of water of the present utility model, the device core is divided into left device core and right device core, hydroecium in the middle of also increasing between left device core and the right device core, like this, the chip assembly of the device core of the aerial cooler of water of prior art is separated into two chip assemblies, middlely is connected with middle hydroecium; Therefore, the length of the chip assembly of single device core has just reduced half, and not only easily the flatness of the side plate of assembling and chip assembly is better, and the gap is less during assembling and between the strip of paper used for sealing, and the soldering strength height is difficult for leaking.
Description of drawings
Fig. 1 is the plan structure schematic representation of the aerial cooler of water of prior art.
Fig. 2 is the main TV structure schematic representation of the aerial cooler of water of prior art.
Fig. 3 is the plan structure schematic representation of the aerial cooler of water of the present utility model.
Fig. 4 is the main TV structure schematic representation of the aerial cooler of water of the present utility model.
Shown in the figure:
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
See also Fig. 3 and shown in Figure 4, the aerial cooler of water of the present utility model comprises left hydroecium 1, middle hydroecium 3, right hydroecium 2 and device core.Described device core is divided into left device core 6 and right device core 7.Each device core includes a plurality of chip assemblies 4, and these a plurality of chip assemblies 4 are arranged in order from top to bottom.The described chip assembly 4 inner water channels that form.Be provided with guide plate 5 between adjacent chip assembly 4 and the chip assembly 4, be the air passageways for logical cooling air between described chip assembly 4 and the chip assembly 4.Described left hydroecium 1 is connected with the left end of described left device core 6, and the water channel in the chip assembly 4 of described left hydroecium 1 and described left device core 6 is communicated with.Hydroecium 3 is connected between described left device core 6 and the right device core 7 in the middle of described, and the water channel of the chip assembly 4 of the chip assembly 4 of hydroecium 3 and described left device core 6 and described right device core 7 is communicated with in the middle of described.Described right hydroecium 2 is connected with the right-hand member of described right device core 7, and the water channel in the chip assembly 4 of described right hydroecium 2 and described right device core 7 is communicated with.
Be equipped with strip of paper used for sealing 8 between the left end of two adjacent chip assemblies 4 of described left device core 6, all fixing by welding between described strip of paper used for sealing 8 and this two chip assemblies 4.Described strip of paper used for sealing 8 also is welded on the sidewall of described left hydroecium 1.Also be equipped with strip of paper used for sealing 8 between the right-hand member of two adjacent chip assemblies 4 of described right device core 7, all fixing by welding between described strip of paper used for sealing 8 and this two chip assemblies 4.Described strip of paper used for sealing 8 also is welded on the sidewall of described right hydroecium 2.
Claims (1)
1. the aerial cooler of water comprises left hydroecium (1), right hydroecium (2) and device core; It is characterized in that: hydroecium (3) in the middle of also comprising; Described device core is divided into left device core (6) and right device core (7); Each device core includes a plurality of chip assemblies (4), and these a plurality of chip assemblies (4) are arranged in order from top to bottom; The inner water channel that forms of described chip assembly (4); Be provided with guide plate (5) between adjacent chip assembly (4) and the chip assembly (4), be the air passageways for logical cooling air between described chip assembly (4) and the chip assembly (4); Described left hydroecium (1) is connected with the left end of described left device core (6), and the water channel in the chip assembly (4) of described left hydroecium (1) and described left device core (6) is communicated with; Hydroecium (3) is connected between described left device core (6) and the right device core (7) in the middle of described, and the water channel of the chip assembly (4) of the chip assembly (4) of described centre hydroecium (3) and described left device core (6) and described right device core (7) is communicated with; Described right hydroecium (2) is connected with the right-hand member of described right device core (7), and the water channel in the chip assembly (4) of described right hydroecium (2) and described right device core (7) is communicated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320225915 CN203175644U (en) | 2013-04-28 | 2013-04-28 | Water-air intercooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320225915 CN203175644U (en) | 2013-04-28 | 2013-04-28 | Water-air intercooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203175644U true CN203175644U (en) | 2013-09-04 |
Family
ID=49072358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320225915 Expired - Fee Related CN203175644U (en) | 2013-04-28 | 2013-04-28 | Water-air intercooler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203175644U (en) |
-
2013
- 2013-04-28 CN CN 201320225915 patent/CN203175644U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20190428 |