CN203131500U - Novel integrated packaging-structure LED light source - Google Patents

Novel integrated packaging-structure LED light source Download PDF

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Publication number
CN203131500U
CN203131500U CN2013200465103U CN201320046510U CN203131500U CN 203131500 U CN203131500 U CN 203131500U CN 2013200465103 U CN2013200465103 U CN 2013200465103U CN 201320046510 U CN201320046510 U CN 201320046510U CN 203131500 U CN203131500 U CN 203131500U
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CN
China
Prior art keywords
light source
carborundum
radiator
led light
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013200465103U
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Chinese (zh)
Inventor
叶新光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN YUHAO PHOTOELECTRIC CO Ltd
Original Assignee
SHENZHEN YUHAO PHOTOELECTRIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN YUHAO PHOTOELECTRIC CO Ltd filed Critical SHENZHEN YUHAO PHOTOELECTRIC CO Ltd
Priority to CN2013200465103U priority Critical patent/CN203131500U/en
Application granted granted Critical
Publication of CN203131500U publication Critical patent/CN203131500U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a novel integrated packaging-structure LED light source. The novel integrated packaging-structure LED light source comprises a light source module (1) and a silicon carbide heat dissipation body (2), wherein the light source module (1) is a square LED array which is composed of sixteen LED lamps in a four-line and four-column mode, the silicon carbide heat dissipation body (2) is cuboid, the light source module (1) is installed at the front end of the silicon carbide heat dissipation body (2) in an embedded mode, four mounting holes (3) are formed in the edge portion of the silicon carbide heat dissipation body (2), and two line-outgoing holes (4) are formed in the center of the silicon carbide heat dissipation body (2). The novel integrated packaging-structure LED light source is convenient to install, high in heat dissipation efficiency, easy to implement and low in cost.

Description

A kind of integration type encapsulating structure led light source
Technical field
The utility model relates to a kind of integration type encapsulating structure led light source.
Background technology
The development bottleneck of high-power LED light source is heat radiation, and traditional high-power LED light source generally adopts aluminium base to encapsulate, and not only heat dispersion does not reach application requirements, and complicated process of preparation, therefore the cost height, is necessary to design a kind of integration type encapsulating structure led light source.
The utility model content
Technical problem to be solved in the utility model provides a kind of integration type encapsulating structure led light source, and this integration type encapsulating structure led light source is convenient to install, the radiating efficiency height, and easy to implement, cost is low.
The technical solution of utility model is as follows:
A kind of integration type encapsulating structure led light source comprises light source module (1) and carborundum radiator (2); Light source module (1) is 4 * 4 square led array of being made up of 16 LED lamp; Carborundum radiator (2) is cuboid; Light source module (1) is inlaid in the front end of carborundum radiator (2); The edge portion of carborundum radiator (2) is provided with 4 installing holes (3); The central part of carborundum radiator (2) is provided with 2 wire holes (4).Installing hole (3) and wire hole (4) are along the thickness direction of carborundum radiator (2).
The thickness of carborundum radiator (2) is 60mm.
Beneficial effect:
Integration type encapsulating structure led light source of the present utility model adopts the carborundum radiator of die cast as thermal component, and is easy to implement, cost is low, good heat dissipation effect, and the carborundum radiator is provided with installing hole and fairlead, thereby easy for installation, be easy to safeguard.
Description of drawings
Fig. 1 is the Facad structure schematic diagram of integration type encapsulating structure led light source of the present utility model.
Fig. 2 is the side structure schematic diagram of integration type encapsulating structure led light source of the present utility model.
Fig. 3 is the structure schematic diagram of integration type encapsulating structure led light source of the present utility model.
Fig. 4 is the structural representation of light source module.
Label declaration: 1-light source module, 2-carborundum radiator, 3-installing hole, 4-wire hole.
The specific embodiment
Below with reference to the drawings and specific embodiments the utility model is described in further details:
Embodiment 1:
Shown in Fig. 1-4, a kind of integration type encapsulating structure led light source comprises light source module 1 and carborundum radiator 2; Light source module 1 is 4 * 4 square led array of being made up of 16 LED lamp; Carborundum radiator 2 is cuboid; Light source module 1 is inlaid in the front end of carborundum radiator 2; The edge portion of carborundum radiator 2 is provided with 4 installing holes 3; The central part of carborundum radiator 2 is provided with 2 wire holes 4.Installing hole 3 and wire hole 4 are along the thickness direction of carborundum radiator 2.
The thickness of carborundum radiator 2 is 60mm.
Preparation method: in mould, be coated with releasing agent, light source module is put into mould; Earlier silicon carbide powder and silicon dioxide gel are mixed the casting forming demoulding.Under 200 ℃ temperature, after dry 2 hours, finish the preparation of carborundum radiator.Fineness 30 orders of silicon carbide powder, the pressure during die casting is in the 400-600N scope.Wire hole leads to the back side of light source module from the back side of carborundum radiator, and power line is the light source module power supply by this wire hole.

Claims (2)

1. an integration type encapsulating structure led light source is characterized in that, comprises light source module (1) and carborundum radiator (2); Light source module (1) is 4 * 4 square led array of being made up of 16 LED lamp; Carborundum radiator (2) is cuboid; Light source module (1) is inlaid in the front end of carborundum radiator (2); The edge portion of carborundum radiator (2) is provided with 4 installing holes (3); The central part of carborundum radiator (2) is provided with 2 wire holes (4).
2. integration type encapsulating structure led light source according to claim 1 is characterized in that, the thickness of carborundum radiator (2) is 60mm.
CN2013200465103U 2013-01-29 2013-01-29 Novel integrated packaging-structure LED light source Expired - Fee Related CN203131500U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013200465103U CN203131500U (en) 2013-01-29 2013-01-29 Novel integrated packaging-structure LED light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013200465103U CN203131500U (en) 2013-01-29 2013-01-29 Novel integrated packaging-structure LED light source

Publications (1)

Publication Number Publication Date
CN203131500U true CN203131500U (en) 2013-08-14

Family

ID=48939476

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013200465103U Expired - Fee Related CN203131500U (en) 2013-01-29 2013-01-29 Novel integrated packaging-structure LED light source

Country Status (1)

Country Link
CN (1) CN203131500U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112885246A (en) * 2021-01-18 2021-06-01 江西睿芯科技有限公司 LED transparent soft screen convenient to interconnect is assembled

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112885246A (en) * 2021-01-18 2021-06-01 江西睿芯科技有限公司 LED transparent soft screen convenient to interconnect is assembled
CN112885246B (en) * 2021-01-18 2022-08-09 江西睿芯科技有限公司 LED transparent soft screen convenient to interconnect is assembled

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130814

Termination date: 20180129