CN203104960U - IC (Integrated Circuit) card base plate - Google Patents
IC (Integrated Circuit) card base plate Download PDFInfo
- Publication number
- CN203104960U CN203104960U CN 201320123350 CN201320123350U CN203104960U CN 203104960 U CN203104960 U CN 203104960U CN 201320123350 CN201320123350 CN 201320123350 CN 201320123350 U CN201320123350 U CN 201320123350U CN 203104960 U CN203104960 U CN 203104960U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- foil layer
- base plate
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an IC (Integrated Circuit) card base plate. The IC card base plate comprises a base plate body, a copper foil layer and a nickel-gold layer, wherein the copper foil layer is provided with a first copper foil layer and a second copper foil layer; the base plate body is arranged between the first copper foil layer and the second copper foil layer; a plurality of blind holes are formed between the first copper foil layer and the second copper foil layer; the blind holes penetrate through the base plate body; copper foil is filled inside the blind holes; and the nickel-gold layer is arranged on one surface of the first copper foil layer. According to the IC card base plate disclosed by the utility model, the blind holes are used for conducting the two copper foil layers, and the IC card base plate can realize the double-faced and bidirectional conduction on the two copper foil layers without a leading wire, so that the thickness of the IC card base plate is reduced, and the volume of the IC card base plate is shortened.
Description
Technical field
The utility model belongs to electronic technology field, relates to a kind of IC-card substrate in particular.
Background technology
The exploitation of IC-card, development and application are system engineerings, relate to computer, communication, network, software, card read-write equipment, use the multiple technologies subject in multiple product field such as facility.Therefore, global IC-card industry develops rapidly in the competition of technology, market and application.IC-card has been one of focus product of current international electronics and information industry, except being used widely in non-financial fields such as commerce, medical treatment, insurance, traffic, the energy, communication, safety management, identification, application in the financial field is also increasingly extensive, influences very far-reaching.The hardware technology of IC-card generally comprises semiconductor technology, substrate technology, encapsulation technology, terminal technology and other parts technology etc.
Nowadays the thickness of IC-card substrate is thicker on the market, and volume is also bigger, and manufacture craft difficulty height, and is also very high for operating personnel's requirement.
The utility model content
In order to address the above problem, the utility model provides a kind of IC-card substrate.
According to an aspect of the present utility model, provide a kind of IC-card substrate.It comprises substrate, copper foil layer and nickel-gold layer, copper foil layer is provided with first copper foil layer and second copper foil layer, substrate is located between first copper foil layer and second copper foil layer, be provided with a plurality of blind holes between first copper foil layer and second copper foil layer, blind hole runs through substrate, blind hole inside is filled with Copper Foil, and nickel-gold layer is located at the one side of first copper foil layer.
In some embodiments, blind hole runs through the one side of substrate to the first copper foil layer by the one side perforate of second copper foil layer, and does not run through the another side of first copper foil layer.
In some embodiments, the material of substrate is a glass-epoxy, and this material hardness is big, in light weight, is fit to be used as the substrate of IC-card.
The IC-card substrate described in the utility model two-layer copper foil layer of blind hole conducting, the IC-card substrate need not to go between and can realize the two-sided two-way admittance of two-layer copper foil layer, has reduced the thickness of IC-card substrate, has dwindled the volume of IC-card substrate.
Description of drawings
Fig. 1 is the structural representation of the IC-card substrate of the utility model one execution mode.
Embodiment
Below in conjunction with embodiment the utility model is further described.
As shown in Figure 1, the IC-card substrate of an execution mode described in the utility model, comprise substrate 1, copper foil layer and nickel-gold layer 2, copper foil layer is provided with first copper foil layer 3 and second copper foil layer 4, substrate 1 is located between first copper foil layer 3 and second copper foil layer 4, be provided with a plurality of blind holes 5 between first copper foil layer 3 and second copper foil layer 4, blind hole 5 runs through substrate 1, blind hole 5 inside are filled with Copper Foil, blind hole 5 is by the one side perforate of second copper foil layer 4, the one side that runs through substrate 1 to first copper foil layer 3, and do not run through the another side of first copper foil layer 3.Nickel-gold layer 2 is located at the another side of first copper foil layer 3, protects first copper foil layer 3.The material of substrate 1 is a glass-epoxy, and this material hardness is big, in light weight, is fit to be used as the substrate of IC-card.
IC-card substrate described in the utility model is with the two-layer copper foil layer of blind hole conducting, and the IC-card substrate need not to go between and can realize two-way admittance between the two-layer copper foil layer.The thickness that this has not only reduced the IC-card substrate has also dwindled the volume of IC-card substrate.
Above-described only is execution modes more of the present utility model; should be pointed out that for the person of ordinary skill of the art, under the prerequisite that does not break away from creation design of the present utility model; can also make other distortion and improvement, these all belong to protection range of the present utility model.
Claims (3)
1. IC-card substrate, it is characterized in that, comprise substrate, copper foil layer and nickel-gold layer, described copper foil layer is provided with first copper foil layer and second copper foil layer, described substrate is located between first copper foil layer and second copper foil layer, is provided with a plurality of blind holes between described first copper foil layer and second copper foil layer, and described blind hole runs through substrate, described blind hole inside is filled with Copper Foil, and described nickel-gold layer is located at the one side of first copper foil layer.
2. a kind of IC-card substrate according to claim 1 is characterized in that, described blind hole runs through the one side of substrate to the first copper foil layer by the one side perforate of second copper foil layer, and does not run through the another side of first copper foil layer.
3. a kind of IC-card substrate according to claim 1 is characterized in that the material of described substrate is a glass-epoxy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320123350 CN203104960U (en) | 2013-03-19 | 2013-03-19 | IC (Integrated Circuit) card base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320123350 CN203104960U (en) | 2013-03-19 | 2013-03-19 | IC (Integrated Circuit) card base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203104960U true CN203104960U (en) | 2013-07-31 |
Family
ID=48856327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320123350 Expired - Fee Related CN203104960U (en) | 2013-03-19 | 2013-03-19 | IC (Integrated Circuit) card base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203104960U (en) |
-
2013
- 2013-03-19 CN CN 201320123350 patent/CN203104960U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130731 Termination date: 20150319 |
|
| EXPY | Termination of patent right or utility model |