CN203045503U - Improved structure for sand discharging opening of grinding disc of sheet grinding machine - Google Patents

Improved structure for sand discharging opening of grinding disc of sheet grinding machine Download PDF

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Publication number
CN203045503U
CN203045503U CN 201220640905 CN201220640905U CN203045503U CN 203045503 U CN203045503 U CN 203045503U CN 201220640905 CN201220640905 CN 201220640905 CN 201220640905 U CN201220640905 U CN 201220640905U CN 203045503 U CN203045503 U CN 203045503U
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CN
China
Prior art keywords
grinding disc
mill
sand mouth
discharging opening
sand discharging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN 201220640905
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Chinese (zh)
Inventor
李海龙
张雪囡
苏荣义
陈宗永
郭红慧
陈强
邢玉军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Huanou Semiconductor Material Technology Co Ltd
Original Assignee
Tianjin Huanou Semiconductor Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin Huanou Semiconductor Material Technology Co Ltd filed Critical Tianjin Huanou Semiconductor Material Technology Co Ltd
Priority to CN 201220640905 priority Critical patent/CN203045503U/en
Application granted granted Critical
Publication of CN203045503U publication Critical patent/CN203045503U/en
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

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Abstract

The utility model provides an improved structure for a sand discharging opening of a grinding disc of a sheet grinding machine. The sand discharging opening is a through hole vertical to the horizontal plane and is positioned in a grinding disc base body of an upper grinding disc of the grinding disc, the upper grinding disc also comprises a grinding disc surface which is positioned under the grinding disc base body and is tightly pasted with the lower surface of the grinding disc base body, a disc groove vertical to the horizontal plane penetrates through the inside of the grinding disc surface, the sand discharging opening is in a conical shape, in addition, the inner diameter near the position of the grinding disc surface is smaller than the inner diameter of the position far away from the grinding disc surface, the inner diameter of the part of the sand discharging opening, pasted with the grinding disc surface, is identical to the width of the disc groove, and the sand discharging opening is directly opposite to the disc groove. The improved structure has the beneficial effects that the original easy-to-break position of the grinding disc surface is reinforced through the grinding disc base body, the potential quality hazard is prevented, the service life is prolonged, and the advantages of simple structure, low processing cost and the like are realized.

Description

The improvement of sand mouth structure under the wafer lapping machine abrasive disk
Technical field
The utility model belongs to the main grinding tool workpiece field for the production of the milling apparatus of monocrystalline silicon piece, especially relates to the improvement structure of sand mouth under a kind of wafer lapping machine abrasive disk.
Background technology
In recent years, because the develop rapidly of electron trade, the diversification of product demand, the initial raw material wafer that is used for electronic product also has new raising, and the technical parameter of silicon chip itself, as surface roughness Ra/Rz, TTV, warp etc., also be more and more higher to the requirement of silicon chip.In addition, the cost that is used for the supplementary material of silicon chip processing increases progressively trend growth along with the development in market is, the consumption of abrasive disk is one of major part of production cost, in order to enhance productivity to greatest extent, reduce production costs, be necessary the part of appliance of current use is carried out structure of modification.
Abrasive disk belongs to the consumptive material class, be a numerical value that occurs at random its real service life, it is very big to control difficulty in the production, having the mill face thickness that coils groove after grinding after a while constantly reduces, when the position that mill face and following sand mouth join is milled to when very thin, because the mill face portion at sand mouth place does not have the support of mill matrix down, the mill face is easy to fracture, has hidden danger of quality.For preventing hidden danger of quality, need stop using still spendable abrasive disk in advance, thereby cause waste.
The utility model content
Problem to be solved in the utility model provides the improvement structure of sand mouth under a kind of wafer lapping machine abrasive disk, the life-span that especially is suitable for improving abrasive disk in the silicon chip production.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: the improvement of sand mouth structure under a kind of wafer lapping machine abrasive disk, described sand mouth down is the through hole perpendicular to horizontal plane, be positioned at the mill matrix of the upper millstone of described abrasive disk, described upper millstone also comprises the mill face that is positioned at described mill matrix below and fits tightly with described mill matrix lower surface, described mill face internal run-through has the dish groove perpendicular to horizontal plane, described down sand mouth be shaped as taper shape, and the internal diameter of close described mill face position is less than the internal diameter away from described mill face position, described down sand mouth and described mill the face internal diameter of subsides place mutually equate that with the width of described dish groove described time sand mouth is over against described dish groove.
The utility model can also adopt following technical measures:
Described sand mouth down evenly is arranged in the described mill matrix.
Advantage and the good effect that the utlity model has are: technique scheme is modified to cone shape with columniform sand mouth down, and the mill matrix has been reinforced the original easily broken position of mill face, prevented hidden danger of quality, prolonged service life, have simple in structure, advantage such as processing cost is low.
Description of drawings
Fig. 1 is upper millstone profile before the improvement
Fig. 2 is improvement back upper millstone profile
Among the figure:
1, sand mouth 2, mill matrix 3, mill face under before the improvement
4, dish groove 5, the easily broken position 6 of mill face, following sand mouth
The specific embodiment
As shown in Figure 1, sand mouth 1 is the cylindrical hole perpendicular to horizontal plane under before the improvement, evenly be arranged in the mill matrix 2 of upper millstone of abrasive disk, upper millstone also comprises the mill face 3 that is positioned at mill matrix 2 belows and fits tightly with mill matrix 2 lower surfaces, mill face 3 internal run-throughs have the dish groove 4 perpendicular to horizontal plane, the central axis of following sand mouth 6 and the central axes of coiling groove 4.
As shown in Figure 2, the utility model provides the improvement structure of sand mouth under a kind of wafer lapping machine abrasive disk, following sand mouth 6 be shaped as taper shape, and the internal diameter of close mill face 3 positions is less than the internal diameter away from mill face 3 positions, following sand mouth 6 and mill face 3 internal diameter of subsides place mutually equate that with the width of dish groove 4 following sand mouth 6 is over against coiling groove 4.Following sand mouth 6 evenly is arranged in the mill matrix 2.
The course of work of this example: during grinding, constantly there is abrasive material to be injected into mill face 3 by following sand mouth 6, flow between the lower millstone through dish groove 4, in the process of last lower millstone relative motion, abrasive particle drives by mill at surface of the work and rolls, and relies on abrasive material that workpiece is carried out grinding to reach grinding purposes.Use after the improvement structure of sand mouth 6 down of the present utility model, mill face 3 is close to mill matrix 2 fully, even if reach operating limit, and 3 attenuation of mill face, mill matrix 2 can be reinforced the easily broken position 5 of mill face before the improvement, has prevented hidden danger of quality.Because avoiding potential quality risk, so mill needn't be scrapped in advance, prolonged its service life.
More than an embodiment of the present utility model is had been described in detail, but described content only is preferred embodiment of the present utility model, can not be considered to for limiting practical range of the present utility model.All equalizations of doing according to the utility model application range change and improve etc., all should still belong within the patent covering scope of the present utility model.

Claims (2)

1. the improvement of sand mouth structure under the wafer lapping machine abrasive disk, described sand mouth down is the through hole perpendicular to horizontal plane, be positioned at the mill matrix of the upper millstone of described abrasive disk, described upper millstone also comprises the mill face that is positioned at described mill matrix below and fits tightly with described mill matrix lower surface, described mill face internal run-through has the dish groove perpendicular to horizontal plane, it is characterized in that: described down sand mouth be shaped as taper shape, and the internal diameter of close described mill face position is less than the internal diameter away from described mill face position, described down sand mouth and described mill the face internal diameter of subsides place mutually equate that with the width of described dish groove described time sand mouth is over against described dish groove.
2. improvement according to claim 1 is constructed, and it is characterized in that: described sand mouth down evenly is arranged in the described mill matrix.
CN 201220640905 2012-11-28 2012-11-28 Improved structure for sand discharging opening of grinding disc of sheet grinding machine Withdrawn - After Issue CN203045503U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220640905 CN203045503U (en) 2012-11-28 2012-11-28 Improved structure for sand discharging opening of grinding disc of sheet grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220640905 CN203045503U (en) 2012-11-28 2012-11-28 Improved structure for sand discharging opening of grinding disc of sheet grinding machine

Publications (1)

Publication Number Publication Date
CN203045503U true CN203045503U (en) 2013-07-10

Family

ID=48728499

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220640905 Withdrawn - After Issue CN203045503U (en) 2012-11-28 2012-11-28 Improved structure for sand discharging opening of grinding disc of sheet grinding machine

Country Status (1)

Country Link
CN (1) CN203045503U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102950539A (en) * 2012-11-28 2013-03-06 天津市环欧半导体材料技术有限公司 Improved structure for lower sand opening of grinding disc of sheet grinding machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102950539A (en) * 2012-11-28 2013-03-06 天津市环欧半导体材料技术有限公司 Improved structure for lower sand opening of grinding disc of sheet grinding machine
CN102950539B (en) * 2012-11-28 2015-06-24 天津市环欧半导体材料技术有限公司 Improved structure for lower sand opening of grinding disc of sheet grinding machine

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C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20130710

Effective date of abandoning: 20150624

RGAV Abandon patent right to avoid regrant