CN203036585U - Welding assembling structure for on-board light-emitting diode (LED) chip encapsulation - Google Patents
Welding assembling structure for on-board light-emitting diode (LED) chip encapsulation Download PDFInfo
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- CN203036585U CN203036585U CN2012204725389U CN201220472538U CN203036585U CN 203036585 U CN203036585 U CN 203036585U CN 2012204725389 U CN2012204725389 U CN 2012204725389U CN 201220472538 U CN201220472538 U CN 201220472538U CN 203036585 U CN203036585 U CN 203036585U
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Abstract
The utility model relates to a welding assembling structure for on-board light-emitting diode (LED) chip encapsulation. The welding assembling structure comprises a chip on board (COB)-LED light source assembly, an electrical interface support and a welding core wire. In assembling, end portions of two single core wires in the welding core wire are respectively correspondingly welded on corresponding soldering points on a printed circuit board (PCB), a PCB in the COB-LED light source assembly is arranged in a mounting tank in the bottom surface of the electrical interface support, an LED chip in the COB-LED light source assembly is exposed outside through a through hole in the middle of the electrical interface support, and the two single core wires welded on the PCB are respectively guided out through guide line tanks corresponding to respective single core wires. After the structure is adopted, the mounting tank in the bottom surface of the electrical interface support is pressed on the COB-LED light source assembly, so fixation and heat dissipation of the COB-LED light source assembly are completed. The structure is compact, small and exquisite, and space is saved.
Description
Technical field
This novel onboard led chip package illumination technical field that relates to is refered in particular to a kind of welding assembly structure of onboard led chip encapsulation.
Background technology
The Zhai crisis of current Europe constantly spreads diffusion, and under the tight atmosphere of market sentiment, the difficulty of China's economic development faces increases the weight of, and challenge increases.With severe power shortage, the famine of spending money, with no people, expensive, low profit, worsening appears in the medium-sized and small enterprises living environment, and the fear that " tide closes down " attacks is apparent in the industry personage on the face.Also there can be no exception whatever in LED enterprise, and as the LED of rising industry, market does not also begin, and haggling is cut larynx war and happened frequently, all operations cost increase, and the LED enterprise especially gross profit level of LED encapsulation enterprise glides.Seek cheaply production technology, marry again the conventional package cost pressure, become the focus that LED encapsulation enterprise contends.And the LED Corporate vision is risen again, is fade-in in the COB LED that cost is low, thermal diffusivity is good encapsulation gradually.
There is its GE standard in the U.S. to COB LED encapsulation assembly structure, its structure is the top that COB-LED light source assembly screw fastening is combined in the middle part through hole of electric interfaces support by screw, this assembling mode is unfavorable to the heat radiation of COB-LED light source assembly, and, the derivation of the heart yearn of this structure needs bigger space, this just makes and the not enough compact of product structure in view of this, is necessary that the welding assembly structure that provides a kind of novel onboard led chip to encapsulate overcomes above defective.
Summary of the invention
This novel purpose is exactly that a kind of welding assembly structure that satisfies the onboard led chip encapsulation that electric, optics, calorifics connects simultaneously is provided at the deficiencies in the prior art part.
For achieving the above object, this novel technical scheme is: a kind of welding assembly structure of onboard led chip encapsulation, include COB-LED light source assembly, electric interfaces support and welding heart yearn, the COB-LED light source assembly is to be packaged as a whole by the electrical connection of lead-in wire suture way after directly being mounted on the pcb board by led chip; The middle part of described electric interfaces support has the through hole of corresponding led chip, the bottom surface of described electric interfaces support has the mounting groove identical with shape with described pcb board size, and the side of described electric interfaces support also has two metallic channels that correspond respectively to two pads on the pcb board; Described welding heart yearn is made up of two single-core lines that are used for welding; During assembling, the end of two single-core lines in the described welding heart yearn is corresponding being welded on the pad corresponding on the described pcb board respectively, pcb board in the COB-LED light source assembly is installed in the mounting groove of bottom surface of electric interfaces support, led chip in the COB-LED light source assembly is exposed outside by the through hole of electric interfaces mid-stent, and two single-core lines that are welded on the pcb board are derived by each self-corresponding metallic channel respectively.
Pcb board at described electric interfaces support and COB-LED light source assembly has several installing holes, and several screws pass on the screwed hole that corresponding described installing hole is threaded in electric interfaces support and COB-LED light source assembly the radiator correspondence and make the bottom surface of COB-LED light source assembly be connected snug fit with radiator.
Described two single-core lines are derived the back merging from metallic channel and are connected double wired conductor on the interface.
The through hole inboard of described electric interfaces support has to connect the draw-in groove of optics.
Described draw-in groove is linked to each other with chute by the insertion mouth and forms.
The mounting groove of described pcb board and described electric interfaces support bottom surface is any one or the multiple combination in circular, square, regular hexagon, octagon, ellipse, rhombus, trapezoidal, the triangle.
The mounting groove of described pcb board and described electric interfaces support bottom surface is square, and corresponding pad lays respectively at two square diagonal positions on the described pcb board.
The through hole of described electric interfaces mid-stent is circular, the rounded center that is distributed in pcb board of the led chip on the described COB-LED light source assembly.
The through hole edge of described electric interfaces mid-stent is the back taper approaching face.
The cross-sectional shape of described electric interfaces support is regular polygon.
After adopting said structure, this novel mounting groove with electric interfaces support bottom surface is pressed on the COB-LED light source assembly, finishes the fixing and heat radiation of COB-LED light source assembly, and this compact conformation is small and exquisite, conserve space; Appear led chip by the through hole on the electric interfaces support, met the optics requirement of product; And by convince wire casing structure by patient analysis in electric interfaces support side, can derive smoothly after making two single-core lines be welded on the solder joint of pcb board correspondence, meet the electric requirement of product.As from the foregoing, this is novel to have that compact conformation is small and exquisite, conserve space, good heat dissipation effect, and satisfies electric, optics, calorifics connection characteristics simultaneously.
Description of drawings
Fig. 1 is the three-dimensional decomposition texture schematic diagram one of this new embodiment.
Fig. 2 is the three-dimensional decomposition texture schematic diagram two of this new embodiment.
Fig. 3 is the perspective view of this new embodiment.
The specific embodiment
Embodiment below in conjunction with accompanying drawing 1-3 is described in further detail:
The welding assembly structure of a kind of onboard led chip encapsulation among the embodiment, include COB-LED light source assembly 10, electric interfaces support 20 and welding heart yearn 30, COB-LED light source assembly 10 is to be packaged as a whole by the electrical connection of lead-in wire suture way after directly being mounted on the pcb board 12 by led chip 11; The middle part of described electric interfaces support 20 has the through hole 21 of corresponding led chip 11, the bottom surface of described electric interfaces support 20 has the mounting groove 22 identical with shape with described pcb board 12 sizes, and the side of described electric interfaces support 20 also has two metallic channels 23 that correspond respectively to two pads 121 on the pcb board 12; Described welding heart yearn 30 is made up of two single-core lines 31 that are used for welding; During assembling, the end of two single-core lines 31 in the described welding heart yearn 30 is corresponding being welded on the pad 121 corresponding on the described pcb board 12 respectively, pcb board 12 in the COB-LED light source assembly 10 is installed in the mounting groove 22 of bottom surface of electric interfaces support 20, led chip 11 in the COB-LED light source assembly 10 is exposed outside by the through hole 21 at electric interfaces support 20 middle parts, and two single-core lines 31 that are welded on the pcb board 12 are derived by each self-corresponding metallic channel 23 respectively.
Described two single-core lines 31 are derived the back merging from metallic channel 23 and are connected double wired conductor on the interface 32.
Through hole 21 inboards of described electric interfaces support 20 have to connect the draw-in groove 211 of optics.
Described draw-in groove 211 is linked to each other with chute 211b by an insertion mouthful 211a and forms.
The mounting groove 22 of described pcb board 12 and described electric interfaces support 20 bottom surfaces is any one or the multiple combination in circular, square, regular hexagon, octagon, ellipse, rhombus, trapezoidal, the triangle.
The mounting groove 22 of described pcb board 12 and described electric interfaces support 20 bottom surfaces is square, and corresponding pad 121 lays respectively at two square diagonal positions on the described pcb board 12.
The through hole 21 at described electric interfaces support 20 middle parts is circular, the led chip 11 rounded centers that are distributed in pcb board 12 on the described COB-LED light source assembly 10.
Through hole 21 edges at described electric interfaces support 20 middle parts are back taper approaching face 212.
The cross-sectional shape of described electric interfaces support 20 is regular polygon.
During installation, the end that to weld two single-core lines 31 in the heart yearn 30 earlier is corresponding being welded on the pad 121 corresponding on the described pcb board 12 respectively, mounting groove 22 with electric interfaces support 20 bottom surfaces is pressed on the COB-LED light source assembly 10 then, pcb board 12 is contained in the mounting groove 22, and led chip 11 is exposed outside by the through hole 21 on the electric interfaces support 20, simultaneously, be welded on and be connected double wired conductor on the interface 32 after two single-core lines 31 on the pcb board 12 are derived by each self-corresponding metallic channel 23 respectively, be locked to electric interfaces support 20 and COB-LED light source assembly 10 on the radiator together with screw 40 at last, and make the bottom surface of COB-LED light source assembly 10 be connected snug fit with radiator, guarantee that heat radiation is fully.As from the foregoing, this is novel to have that compact conformation is small and exquisite, conserve space, good heat dissipation effect, and satisfies electric, optics, calorifics connection characteristics simultaneously.
Below only be this novel specific embodiment, do not limit the protection domain of this novel patent, the equivalent arrangements that those skilled in the art have done all should be within this novel protection domain.
Claims (10)
1. the welding assembly structure of onboard led chip encapsulation, include COB-LED light source assembly, electric interfaces support and welding heart yearn, the COB-LED light source assembly is to be packaged as a whole by the electrical connection of lead-in wire suture way after directly being mounted on the pcb board by led chip; It is characterized in that: the middle part of described electric interfaces support has the through hole of corresponding led chip, the bottom surface of described electric interfaces support has the mounting groove identical with shape with described pcb board size, and the side of described electric interfaces support also has two metallic channels that correspond respectively to two pads on the pcb board; Described welding heart yearn is made up of two single-core lines that are used for welding; During assembling, the end of two single-core lines in the described welding heart yearn is corresponding being welded on the pad corresponding on the described pcb board respectively, pcb board in the COB-LED light source assembly is installed in the mounting groove of bottom surface of electric interfaces support, led chip in the COB-LED light source assembly is exposed outside by the through hole of electric interfaces mid-stent, and two single-core lines that are welded on the pcb board are derived by each self-corresponding metallic channel respectively.
2. the welding assembly structure of a kind of onboard led chip encapsulation according to claim 1, it is characterized in that: the pcb board at described electric interfaces support and COB-LED light source assembly has several installing holes, and several screws pass on the screwed hole that corresponding described installing hole is threaded in electric interfaces support and COB-LED light source assembly the radiator correspondence and make the bottom surface of COB-LED light source assembly be connected snug fit with radiator.
3. the welding assembly structure of a kind of onboard led chip encapsulation according to claim 2 is characterized in that: described two single-core lines are derived the back from metallic channel and are merged and be connected double wired conductor on the interface.
4. according to the welding assembly structure of claim 1 or 2 or 3 described a kind of onboard led chip encapsulation, it is characterized in that: the through hole inboard of described electric interfaces support has to connect the draw-in groove of optics.
5. the welding assembly structure of a kind of onboard led chip encapsulation according to claim 4 is characterized in that: described draw-in groove forms by inserting mouthful to link to each other with chute.
6. according to the welding assembly structure of claim 1 or 2 or 3 described a kind of onboard led chips encapsulation, it is characterized in that: the mounting groove of described pcb board and described electric interfaces support bottom surface is any one or multiple combination in circular, square, regular hexagon, octagon, ellipse, rhombus, trapezoidal, the triangle.
7. the welding assembly structure of a kind of onboard led chip encapsulation according to claim 6, it is characterized in that: the mounting groove of described pcb board and described electric interfaces support bottom surface is square, and corresponding pad lays respectively at two square diagonal positions on the described pcb board.
8. according to the welding assembly structure of claim 1 or 2 or 3 described a kind of onboard led chips encapsulation, it is characterized in that: the through hole at described electric interfaces middle part is circle, the rounded center that is distributed in pcb board of the led chip on the described COB-LED light source assembly.
9. the welding assembly structure of a kind of onboard led chip encapsulation according to claim 8, it is characterized in that: the through hole edge of described electric interfaces mid-stent is the back taper approaching face.
10. according to the welding assembly structure of claim 1 or 2 or 3 described a kind of onboard led chip encapsulation, it is characterized in that: the cross-sectional shape of described electric interfaces support is regular polygon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204725389U CN203036585U (en) | 2012-09-17 | 2012-09-17 | Welding assembling structure for on-board light-emitting diode (LED) chip encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204725389U CN203036585U (en) | 2012-09-17 | 2012-09-17 | Welding assembling structure for on-board light-emitting diode (LED) chip encapsulation |
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| Publication Number | Publication Date |
|---|---|
| CN203036585U true CN203036585U (en) | 2013-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012204725389U Expired - Fee Related CN203036585U (en) | 2012-09-17 | 2012-09-17 | Welding assembling structure for on-board light-emitting diode (LED) chip encapsulation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098040A (en) * | 2014-05-14 | 2015-11-25 | 通用电气照明解决方案有限公司 | Optical module and packaging method thereof |
| CN105782767A (en) * | 2014-12-23 | 2016-07-20 | 厦门通士达照明有限公司 | Lighting lamp and production method thereof |
-
2012
- 2012-09-17 CN CN2012204725389U patent/CN203036585U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098040A (en) * | 2014-05-14 | 2015-11-25 | 通用电气照明解决方案有限公司 | Optical module and packaging method thereof |
| CN105782767A (en) * | 2014-12-23 | 2016-07-20 | 厦门通士达照明有限公司 | Lighting lamp and production method thereof |
| CN105782767B (en) * | 2014-12-23 | 2018-03-20 | 厦门通士达照明有限公司 | A kind of illuminating lamp and its production method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171101 Address after: 523565 Guangdong city of Dongguan province Changping Zhen Heng Jiang Jiang Xia Heng Industrial Road, set up a file Patentee after: KINGSUN OPTOELECTRONIC CO., LTD. Address before: 523000 Guangdong city of Dongguan province Changping Zhen Heng Jiang set up a file Patentee before: Dongguan Qinshang Photoelectric Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130703 Termination date: 20180917 |