CN203034745U - Thermal insulation floor board - Google Patents
Thermal insulation floor board Download PDFInfo
- Publication number
- CN203034745U CN203034745U CN 201320031331 CN201320031331U CN203034745U CN 203034745 U CN203034745 U CN 203034745U CN 201320031331 CN201320031331 CN 201320031331 CN 201320031331 U CN201320031331 U CN 201320031331U CN 203034745 U CN203034745 U CN 203034745U
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- China
- Prior art keywords
- thermal insulation
- insulation layer
- basic unit
- layer
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a thermal insulation floor board which comprises a base layer and a thermal insulation layer. The bottom face of the base layer is connected with the ground, the bottom face of the thermal insulation layer is connected with the upper face of the base layer, the upper face of the thermal insulation layer is connected with a decorative layer, and the thermal insulation layer is connected with the base layer in a staggered mode. The thermal insulation floor board has the advantages that the structure is simple, due to the fact that the thermal insulation layer and the base layer are in staggered connection, connection among floor boards is tighter, the thermal insulation effect is good, and manufacturing cost is low.
Description
Technical field
The utility model relates to building material technical field, particularly a kind of floor with heat insulation function.
Background technology
Existing floor major part is wood floors or ceramic floor, heat preservation effect can not be played in cold and stern winter in such floor, existing heat insulation floor complex structure, relate to such an extent that raw materials for production are comparatively complicated, cost of manufacture is higher, therefore product cost page or leaf is higher, is not suitable for large-scale promotion.
The utility model content
The purpose of this utility model is at the defective of prior art and deficiency, provides between a kind of simple in structure, high insulating effect and the plate to connect heat insulation floor closely.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of heat insulation floor described in the utility model comprises basic unit, insulation layer, and described basic unit bottom surface is connected with ground, and the bottom surface of described insulation layer is connected with the top of basic unit, the top connection decorative layer of insulation layer, and described insulation layer staggers with basic unit and is connected.
Further, described insulation layer adopts adhesive sticker to fixedly connected with basic unit.
Further, described basic unit adopts the thermosetting resin material to make.
After adopting said structure, the utility model beneficial effect is: simple in structure, owing to adopted insulation layer to be connected with staggering of basic unit, make to be connected more fasteningly between plate and the plate that high insulating effect, cost are low.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Description of reference numerals:
1. basic unit, 2. insulation layer, 3. decorative layer.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is further described.
As shown in Figure 1, a kind of heat insulation floor described in the utility model, comprise basic unit 1, insulation layer 2, described basic unit 1 adopts the thermosetting resin material to make, and described basic unit 1 bottom surface is connected with ground, fixedlys connected with the top employing adhesive sticker of basic unit 1 in the bottom surface of described insulation layer 2, the top connection decorative layer 3 of insulation layer 2, described insulation layer 2 staggers with basic unit 1 and is connected, make between plate and the plate be connected more fastening, high insulating effect.
The above only is preferred embodiments of the present utility model, so all equivalences of doing according to the described structure of the utility model patent claim, feature and principle change or modify, is included in the utility model patent claim.
Claims (3)
1. a heat insulation floor comprises basic unit, insulation layer, it is characterized in that: described basic unit bottom surface is connected with ground, and the bottom surface of described insulation layer is connected with the top of basic unit, the top connection decorative layer of insulation layer, and described insulation layer staggers with basic unit and is connected.
2. heat insulation floor according to claim 1 is characterized in that: described insulation layer adopts adhesive sticker to fixedly connected with basic unit.
3. heat insulation floor according to claim 1 is characterized in that: described basic unit adopts the thermosetting resin material to make.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201320031331 CN203034745U (en) | 2013-01-22 | 2013-01-22 | Thermal insulation floor board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201320031331 CN203034745U (en) | 2013-01-22 | 2013-01-22 | Thermal insulation floor board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203034745U true CN203034745U (en) | 2013-07-03 |
Family
ID=48686879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201320031331 Expired - Fee Related CN203034745U (en) | 2013-01-22 | 2013-01-22 | Thermal insulation floor board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203034745U (en) |
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2013
- 2013-01-22 CN CN 201320031331 patent/CN203034745U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130703 Termination date: 20170122 |