CN203010558U - Modular semiconductor lighting device - Google Patents
Modular semiconductor lighting device Download PDFInfo
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- CN203010558U CN203010558U CN2013200416304U CN201320041630U CN203010558U CN 203010558 U CN203010558 U CN 203010558U CN 2013200416304 U CN2013200416304 U CN 2013200416304U CN 201320041630 U CN201320041630 U CN 201320041630U CN 203010558 U CN203010558 U CN 203010558U
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Abstract
The utility model relates to a modular semiconductor lighting device. The modular semiconductor lighting device is suitable for replacing a traditional semiconductor light source device to improve a whole heat conduction effect of the light source device. The modular semiconductor lighting device comprises an outer shell, a driving power module, a light source module and a heat conduction module, wherein the driving power module, the light source module and the heat conduction module are contained inside the outer shell. The heat conduction module comprises a heat conduction plate, heat conduction walls and a heat conduction column, wherein the heat conduction walls are connected on two sides of the heat conduction plate, the heat conduction column is placed on the heat conduction plate, the top of the heat conduction walls and the top of the heat conduction column are respectively and closely contacted with the light source module to bear and conduct work heat of the light source module, and the driving power module is placed in an accommodating space between the heat conduction walls and below the light source module. The modular semiconductor lighting device is ingenuous in structural design and good in heat dissipation effect. By means of the modular semiconductor lighting device, the compact space inside the outer shell can be well utilized, and the heat dissipation effect inside the outer shell is effectively improved.
Description
Technical field
The utility model relates to a kind of semiconductor illumination device, relates in particular to a kind of modularity semiconductor illumination device.
Background technology
along with the increasingly mature of semiconductor lighting technology and universal, the light fixture of existing all kinds of employing conventional light source is just progressively sought the design of adopting semiconductor light sources to substitute, yet existing semiconductor light sources has the design requirement of different and a conventional light source at present, namely need to provide heat radiation and heat-conducting system, because present field of semiconductor illumination just progressively realizes the design of light source modularity, and existing its work calories of high power semiconductor light source is higher, therefore how good design heat conductive structure and settling in the light supply apparatus of a compactness, become one of important topic in present field.
see also accompanying drawing 1, the DLM Down lamp module of existing Philip is the present Down lamp module of more common employing semiconductor light sources on the market, it need to connect external radiating device to obtain radiating effect at its heat-transfer device place, bottom under the use state, see also Fig. 1, what its heat conducting device structure adopted is the design of " mouth " font, purpose is to utilize the bulk heat-conducting area of upper surface to attach aluminium base to carry out the heat conduction, also can hold relevant components and parts in this square shape inner chamber simultaneously, thereby save and utilize the confined space, driving power as what hold in this product.
In working order, the work calories of the semiconductor grain on the aluminium base of above-mentioned heat-transfer device, to carry out with the both sides sidewall of this " mouth " font heat-transfer device the heat conduction, and to should " mouth " font heat conducting device on the bottom surface, finally carrying out the dissipation of heat by the external cooling device that is connected with this bottom surface processes, the heat conduction and heat radiation work that thus this DLM Down lamp module is continued guarantees the normal operation of this Down lamp.
but there is defective in the heat conduction scheme of above-mentioned the prior art, because its heat dissipation path of heat-transfer device of hollow can only conduct to the bottom surface by the two side, not only increased the heat conduction distance, reduced heat-conducting effect, also very easily gather heat in this heat-transfer device two bottom sides simultaneously, and middle part, heat-transfer device bottom surface temperature is lower, its central radiating effect is best usually to review existing external radiating device, therefore after being combined, this heat-transfer device will be difficult to produce radiating effect preferably when this radiator, not only reduced radiator service efficiency, also be unfavorable for simultaneously this Down lamp module dissipation work calories, very easily affect its job stability and service life.
After carrying out the calorifics test through the DLM Down lamp module to this Philip simultaneously, draw the following table thermal parameters:
Summary of the invention
The utility model purpose is to provide a kind of modularity semiconductor illumination device, it can further improve the heat-conducting effect of above-mentioned existing semi-conductor light source device in the space of a compactness, strengthen the heat conduction effect, to improve product whole service life and product reliability.
for achieving the above object, the modularity semiconductor illumination device of the utility model, driving power module and light source module that it comprises the shell that substantially is cuboid and is located at enclosure, at the upper wall of shell and be formed with the light source mouth that can penetrate for light on the position of light source module light direction, the place is provided with the optics cover at this light source mouth, the its lower edge of described shell is formed with opening, the separable heat conducting module of fixing of the opening part of shell, described driving power module and light source module are successively set on the top of described heat conducting module, described heat conducting module comprises: roughly the same with the opening shape of described shell, and be arranged on a heat-conducting plate at outer casing underpart rim openings place, two symmetrical heat conducting wall that are basically perpendicular to heat-conducting plate and all extend towards described light source module one from described heat-conducting plate dual-side, be formed for holding the accommodation space of described driving power module and light source module between the relative madial wall of described two heat conducting wall, the relative lateral wall of described heat conducting wall all is close to the inner surface of described side wall of outer shell, and be arranged on the heat-conducting plate upper surface and towards the heating column of described light source module, heat-transfer area is formed on the top of described heating column.
In a preferred embodiment, described driving power module comprises an insulation tank and is housed in the interior drive circuit board of insulation tank; On the corresponding described heat conducting module of the bottom land of described insulation tank, the position of heating column forms first limited mouth that is complementary with heating column Outside Dimensions shape, and described insulation tank can be enclosed within the peripheral of heating column and described heat-conducting plate is close in the take advantage of a situation accommodation space that slips into described heat conducting module and the bottom of insulation tank by this first limited mouth; Be formed with the second limited mouth that mates with the first limited mouth on described drive circuit board, drive circuit board can be enclosed within the peripheral of heating column and take advantage of a situation and slip in corresponding described insulation tank by this second limited mouth.
In a preferred embodiment, but described light source module comprises a bridge joint at the substrate of two heat conducting wall ends of described heat conducting module, and the correspondence position of the upper surface of described substrate and described heating column top plan is evenly equipped with a plurality of LED light sources; The light emission direction of described LED light source is towards described light source mouth, and the lower surface of described substrate is close to the heat-transfer area at described heating column top.
In a preferred embodiment, the corresponding position of described heat conducting wall end and described light source module substrate is the corresponding locating hole that is provided with respectively, and described light source module is fixed on the end of described heat conducting wall by the securing member that passes locating hole.
In a preferred embodiment, the corresponding pilot hole that is provided with respectively on the sidewall of described shell and the heat conducting wall of described heat conducting module, described heat conducting module is fixed on the opening part of described shell by the securing member that passes fixing hole.
In a preferred embodiment, between described light source module substrate and described heating column heat-transfer area, be provided with heat conducting film between described substrate and described heat conducting wall contact-making surface.
In another preferred embodiment, a kind of modularity semiconductor illumination device according to claim 1, it is characterized in that: form respectively symmetrical opening draw-in groove on described two heat conducting wall, one end of described opening draw-in groove forms entrance, and described substrate can be taken advantage of a situation by the opening draw-in groove from the porch and is inserted and secured in described opening draw-in groove.
In another preferred embodiment, described heating column comprises the first heating column that an end is connected with heat-conducting plate, extend a plurality of the second heating columns from the other end of described the first heating column towards described light source module one, the tail end of described a plurality of the second heating columns is respectively arranged with heat-conducting block, and the upper surface of described a plurality of heat-conducting blocks forms respectively and is in conplane heat-transfer area.
The utility model modularity semiconductor illumination device, it is by arranging a heat-conducting plate, be connected to the heat conducting wall of heat-conducting plate dual-side and be arranged on heating column on heat-conducting plate on heat conducting module, the top of recycling heat conducting wall and heating column respectively with the light source module close contact, with the purpose of the work calories that reaches carrying and light conducting source module.Its advantage is, above-mentioned heat conducting module can carry out the heat conduction transmission for the work calories distribution situation of light source module with the shortest thermal conductance distance preferably, the design of above-mentioned driving power module simultaneously, can better rationally utilize the limited tight space in shell, thereby realize namely satisfying heat-conducting effect in the space of a compactness, also can satisfy the effect that each components and parts are settled simultaneously.
It is worth mentioning that in addition, the distribution that can follow the LED on substrate due to the heat-transfer area on the heating column of described heat conducting module designs, and its bottom surface is connected with described heat-conducting plate middle part, therefore distribute regardless of the thermal source on this substrate, final this strand thermal source all will be directed in the middle part of described heat-conducting plate, and normally low than the groundwork thermal source secondary heat source of the heat of this substrate upper rim, therefore by providing heat conducting wall can transmit this strand heat to described heat-conducting plate periphery.in the contrast prior art, the general radiating effect of radiator is to be in radiator middle part than Jia Chu as can be known, next is only periphery, therefore after being connected heat radiation with external heat sink when described heat-conducting plate, this burst groundwork heat can be dissipated within the very first time significantly, same secondary heat source also can be dissipated preferably, thereby and for to guarantee that the work calories of modularity semi-conductor light source device of the present utility model is continued efficient dissipation, to obtain stable operating temperature, thereby for working life and the reliability of this modularity semi-conductor light source device provides good assurance.
Description of drawings
Fig. 1 is the DLM Down lamp module three-dimensional exploded view of the Philip of prior art.
Fig. 2 is the modularity semiconductor illumination device three-dimensional exploded view of the utility model.
Fig. 3 is the three-dimensional exploded view of a preferred embodiment of light supply apparatus and heat conducting device.
Fig. 4 is the three-dimensional exploded view of the another preferred embodiment of light supply apparatus and heat conducting device.
Fig. 5 is the another form of expression of the three-dimensional exploded view of light supply apparatus and heat conducting device in Fig. 4.
Fig. 6 is the three-dimensional exploded view of another preferred embodiment of light supply apparatus and heat conducting device.
The specific embodiment
Below in conjunction with specific embodiment and accompanying drawing, the utility model modularity semiconductor illumination device is described in further detail.
Please refer to Fig. 2, the utility model modularity semiconductor illumination device comprises: substantially be the shell 10 of cuboid and be located at driving power module 40 and the light source module 20 of shell 10 inside, at the upper wall of shell 10 and be formed with the light source mouth 11 that can penetrate for light on the position of light source module 20 light directions, 11 places are provided with optics cover 23 at this light source mouth.Its lower edge at shell 10 is formed with opening 12, and at this separable heat conducting module 30 of fixing in opening 12 places, wherein, driving power module 40 and light source module 20 are successively set on the top of heat conducting module 30.
In a better embodiment, heat conducting module 30 roughly is " recessed " font, and it comprises: the heat-conducting plate 311 roughly the same with opening 12 shapes of shell 10, this heat-conducting plate 311 separable opening 12 places that are arranged on shell 10; Be basically perpendicular to heat-conducting plate 311 one from the dual-side of heat-conducting plate 311 and extend two symmetrical heat conducting wall 312, these two heat conducting wall 312 are all towards light source module 20, be formed for holding the accommodation space of described driving power module 40 and light source module 20 between the relative madial wall of two heat conducting wall 312, heat conducting wall 312 can enter the inside of shell 10 and the inner surface that the relative lateral wall of heat conducting wall 312 all is close to shell 10 sidewalls by opening 12; At the upper surface of heat-conducting plate 311 and be formed with heating column 32 towards light source module 20, the top of this heating column 31 forms and can contact with light source module 20 the also heat-transfer area 324 of output services heat.
But light source module 20 comprises the substrate 21 of a bridge joint two heat conducting wall 312 top ends on heat conducting module 30, upper surface at substrate 21 is evenly equipped with a plurality of LED light sources 22, the light emission direction of LED light source 22 is all towards light source mouth 11, this LED light source 22 also can adopt the LED of COB encapsulation, i.e. single great power LED as required; The lower surface of substrate 21 is close to the heat-transfer area 324 at heating column 32 tops.
the corresponding locating hole 3122 that is provided with respectively in the corresponding position of the end of heat conducting wall 312 and light source module 20 upper substrates 21, substrate 21 is fixed on the end of heat conducting wall 312 by the securing member that passes locating hole 3122, thereby light source module 20 bridge joints are fixed on heat conducting module 30, to form the heat conduction of light source module 20 peripheries, and substrate 21 lower surfaces are attached on the heat-transfer area 324 at described heating column 32 tops, to form the heat conduction at light source module 20 centers, simultaneously by power line with substrate 21 and driving power module 40 mutual connections, so that for light source module 20 provides working power.
can form a heat point when it is worth mentioning that due to heat accumulation on object, and heat can outwards continue diffusion along with this point, with this lasting dissipation heat, and when in the space of a compactness, namely need to hold relevant components and parts, it is very difficult need to increasing radiating effect on a less heat conduction object again, this is because compact space is limited for the space that heat conducting module and other components and parts provide, must seek each other optimum space utilization proportioning, for the heat that dissipates as soon as possible must be considered thermal conductance distance between heat conducting module and external cooling device, also must consider simultaneously the heat transfer efficiency of this heat conducting module.
So the position of the plural LED light source 22 of arranging on substrate 21 described in above-mentioned structure will be the main focus of whole light source module 20, for this reason by heating column 32 being arranged on the hotspot location bottom of light source module 20 substrates 21, can increase greatly heat transference efficiency, not only transmit this heat by described heating column 32 and evenly distribute to heat-conducting plate 311, the shorter thermal conductance distance of this heating column 32 also can significantly be improved heat transfer efficiency simultaneously.If also can rationally push away to get LED light source 22 positions that arrange on this substrate 21 when disperseing according to this technical scheme in addition, can increase at a plurality of LED light source 22 focus correspondence positions the quantity of heating columns 32 for increasing heat-conducting effect.
On described substrate 21, the position away from described LED light source 22 will be the less important focus of whole light source module 20 in addition, and heat is less herein, simultaneously for to leave installing space to driving power module 40, namely adopt peripheral heat exchange pattern, utilize that on described heat conducting wall 312 and described substrate 21, the bottom surface away from LED light source 22 is connected, to conduct heat on described heat-conducting plate 311, can improve significantly heat conduction efficiency and space availability ratio.
Can improve significantly by this heat conduction efficiency of this modularity semi-conductor light source device by above-mentioned peripheral heat conduction and the heat conducting dependency structure in center, and it is as follows to record related data:
Measured power in above-mentioned measured power contrast background technology the utility model is as can be known appointed under higher power and so can be reached the heat-conducting effect that is better than prior art.
described light source module 20 can also be matched the optics cover 23 adaptive with described LED light source 22 as required in addition, in order to change the light effect that of light source, this optics cover 23 is made by optical material, can be made by fluorescent plate according to different bright dipping demands, optical lens is made, light diffusion particle plate is made, so that cooperated with LED light source 22 light sources obtain default bright dipping light efficiency, for example adopting in the situation of LED light source 22 of blue light to adopt the optics cover 23 that fluorescent plate is made to go out light effect in order to obtain white, and the LED light source 22 of preferred white light in the present embodiment, and the adaptive optics cover 23 made from light diffusion particle plate material, wherein said optics cover 23 is arranged on light source mouth 11 places of described shell 10 upper walls, to seal this light source mouth 11, and the light direction that is placed in the LED light source 22 on light source module 20 is all towards light source mouth 11, and corresponding optics cover 23, in order to adjust for the bright dipping of this LED light source 22.
see also Fig. 3, in a better embodiment, form respectively symmetrical opening draw-in groove 3121 on two heat conducting wall 312 ', by this draw-in groove 3212, the substrate 21 ' of described light supply apparatus 2 ' can being inserted thus is fixedly connected on this heat conducting wall 312 ', described heating column 32 ' is arranged in the middle part of described heat-conducting plate 311 ' simultaneously, and concordant with described draw-in groove 3212 bottom surfaces, to be close to described substrate 21 ' bottom surface middle part heat conduction, can save thus the bolt connection piece of substrate 21 ' and described heat conducting wall 312 ', thereby when covering on described heat conducting device 3, described shell 1 can compress the fastening described substrate 21 ' of described draw-in groove 3212 upper walls, be convenient to increase the production efficiency of assembling.
See also Fig. 4, in another better embodiment, the first heating column 323 ' that heating column 32 ' ' comprise an end and heat-conducting plate 311 ' ' is connected ', from the first heating column 323 ' ' the other end extend a plurality of the second heating columns 322 ' towards light source module 20 one ', at these a plurality of the second heating columns 322 ' ' tail end be respectively arranged with heat-conducting block 321 ' ', this is a plurality of 321 ' years old ' upper surface form respectively be in conplane heat-transfer area 324 ' '.Specifically, middle part above described the first heating column 323 ' ' bottom be connected to described heat-conducting plate 311 ' ', the the second heating column 322 ' heat-conducting block 321 ' of the top ' ' all is attached to substrate 21 ' ' bottom and LED light source 22 ' ' position corresponding to the position of arranging, with this substrate 21 ' of box lunch ' upper LED light source 22 ' ' arrange the position not with heat-conducting plate 311 ' ' when the middle part is coaxial, also can conduct by this work calories of each orientation hotspot location of this light source module to heat-conducting plate 311 ' ' the middle part this strand heat so that external heat sink can better dissipate.Also can provide the second heating column 322 ' of plural number when ' upper LED light source 22 ' ' is distributed more widely if simultaneously can rationally release described substrate 21 ' according to such scheme ', the heat-conducting block 321 ' of the top ' ' all is attached at described substrate 21 ' in order to make each the second heating column 322 ' ' the corresponding LED light source 22 ' in bottom ' distributing position place, and described each second heating column 322 ' ' afterbody gather together to the first heating column 323 ' ' or one are connected to heat-conducting plate 311 ' ' the middle part.
See also Fig. 5, in another form of expression for Fig. 4 embodiment, for better with substrate 21 ' ' ' on LED light source 22 work calorieses conduct on heat conducting module, the second heating column 322 ' wherein ' ' want to adopt heat pipe or heat pipe boundling to make according to number needs.
See also Fig. 6, in order better to improve degree of being adjacent to and the heat-conducting effect of heat conducting wall 312, heating column 32 and substrate 21 bottom surfaces, in the above-described embodiment, by between substrate 21 and heating column 21 heat-transfer areas, be provided with heat conducting film 44 between substrate 21 and heat conducting wall 312 contact-making surfaces, to increase heat-conducting effect.
Separately, on the sidewall of shell 10 with the heat conducting wall 312 of heat conducting module 30 on the corresponding pilot hole 14 that arranges respectively, utilize securing member heat conducting module 30 can be fixed on opening 12 places of shell 10.
Need to illustrate, in above-mentioned several embodiments, the driving power module is the periphery that is enclosed within successively heating column by first, second limited mouth that arranges on it, and then in the relative accommodation space of two heat conducting wall slipping into heat conducting module of taking advantage of a situation, thereby complete being mounted with of driving power module and heat conducting module.
To sum up, the utility model modularity semiconductor illumination device, one heat conducting module is set, by with the heat conducting wall on light source module and heat conducting module and heating column top close contact, with the effect that realizes carrying and pass to the light source module work calories below light source module.The utility model modularity semiconductor illumination device, structural design is ingenious, and good heat dissipation effect not only can be good at utilizing the tight space of enclosure, and more effectively improves the internal heat dissipating effect.
Although the description of this invention carries out in conjunction with above each specific embodiment,, those skilled in the art that can carry out many replacements, modifications and variations, be apparent according to above-mentioned content.Therefore, all are such substitute, improve and change all is included in the spirit and scope of attached claim.
Claims (8)
1. modularity semiconductor illumination device, driving power module and light source module that it comprises the shell that substantially is cuboid and is located at enclosure, at the upper wall of shell and be formed with the light source mouth that can penetrate for light on the position of light source module light direction, the place is provided with the optics cover at this light source mouth, it is characterized in that, the its lower edge of described shell is formed with opening, the separable heat conducting module of fixing of the opening part of shell, described driving power module and light source module are successively set on the top of described heat conducting module, and described heat conducting module comprises:
Roughly the same and be arranged on the heat-conducting plate at outer casing underpart rim openings place with the opening shape of described shell;
Two symmetrical heat conducting wall that are basically perpendicular to heat-conducting plate and all extend towards described light source module one from described heat-conducting plate dual-side, be formed for holding the accommodation space of described driving power module and light source module between the relative madial wall of described two heat conducting wall, the relative lateral wall of described heat conducting wall all is close to the inner surface of described side wall of outer shell; And
Be arranged on the heat-conducting plate upper surface and towards the heating column of described light source module, heat-transfer area is formed on the top of described heating column.
2. a kind of modularity semiconductor illumination device according to claim 1 is characterized in that: described driving power module comprises an insulation tank and is housed in drive circuit board in insulation tank; On the corresponding described heat conducting module of the bottom land of described insulation tank, the position of heating column forms first limited mouth that is complementary with heating column Outside Dimensions shape, and described insulation tank can be enclosed within the peripheral of heating column and described heat-conducting plate is close in the take advantage of a situation accommodation space that slips into described heat conducting module and the bottom of insulation tank by this first limited mouth; Be formed with the second limited mouth that mates with the first limited mouth on described drive circuit board, drive circuit board can be enclosed within the peripheral of heating column and take advantage of a situation and slip in corresponding described insulation tank by this second limited mouth.
3. a kind of modularity semiconductor illumination device according to claim 1, it is characterized in that: but described light source module comprises a bridge joint at the substrate of two heat conducting wall ends of described heat conducting module, and the correspondence position of the upper surface of described substrate and described heating column top plan is evenly equipped with a plurality of LED light sources; The light emission direction of described LED light source is towards described light source mouth, and the lower surface of described substrate is close to the heat-transfer area at described heating column top.
4. a kind of modularity semiconductor illumination device according to claim 1, it is characterized in that: the corresponding position of described heat conducting wall end and described light source module substrate is the corresponding locating hole that is provided with respectively, and described light source module is fixed on the end of described heat conducting wall by the securing member that passes locating hole.
5. a kind of modularity semiconductor illumination device according to claim 4, it is characterized in that: the corresponding pilot hole that is provided with respectively on the sidewall of described shell and the heat conducting wall of described heat conducting module, described heat conducting module is fixed on the opening part of described shell by the securing member that passes fixing hole.
6. a kind of modularity semiconductor illumination device according to claim 4 is characterized in that: between described light source module substrate and described heating column heat-transfer area, be provided with heat conducting film between described substrate and described heat conducting wall contact-making surface.
7. a kind of modularity semiconductor illumination device according to claim 1, it is characterized in that: form respectively symmetrical opening draw-in groove on described two heat conducting wall, one end of described opening draw-in groove forms entrance, and described substrate can be taken advantage of a situation by the opening draw-in groove from the porch and is inserted and secured in described opening draw-in groove.
8. a kind of modularity semiconductor illumination device according to claim 1, it is characterized in that: described heating column comprises the first heating column that an end is connected with heat-conducting plate, extend a plurality of the second heating columns from the other end of described the first heating column towards described light source module one, the tail end of described a plurality of the second heating columns is respectively arranged with heat-conducting block, and the upper surface of described a plurality of heat-conducting blocks forms respectively and is in conplane heat-transfer area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200416304U CN203010558U (en) | 2013-01-25 | 2013-01-25 | Modular semiconductor lighting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200416304U CN203010558U (en) | 2013-01-25 | 2013-01-25 | Modular semiconductor lighting device |
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| CN203010558U true CN203010558U (en) | 2013-06-19 |
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| CN2013200416304U Expired - Fee Related CN203010558U (en) | 2013-01-25 | 2013-01-25 | Modular semiconductor lighting device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106655335A (en) * | 2016-11-09 | 2017-05-10 | 合肥邦立电子股份有限公司 | Vehicle-mounted USB charging interface |
| CN107110449A (en) * | 2014-12-02 | 2017-08-29 | 照明科学集团公司 | Slim lighting device and attachment members and the external member including it |
| CN108167723A (en) * | 2017-12-29 | 2018-06-15 | 深圳市超频三科技股份有限公司 | Projecting lamp and its stent |
-
2013
- 2013-01-25 CN CN2013200416304U patent/CN203010558U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107110449A (en) * | 2014-12-02 | 2017-08-29 | 照明科学集团公司 | Slim lighting device and attachment members and the external member including it |
| CN107110449B (en) * | 2014-12-02 | 2020-10-16 | 照明科学集团公司 | Thin lighting device and attachment member and kit comprising same |
| CN106655335A (en) * | 2016-11-09 | 2017-05-10 | 合肥邦立电子股份有限公司 | Vehicle-mounted USB charging interface |
| CN108167723A (en) * | 2017-12-29 | 2018-06-15 | 深圳市超频三科技股份有限公司 | Projecting lamp and its stent |
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Owner name: NVC (CHINA) CO., LTD. Free format text: FORMER NAME: CHONGQING NVC INDUSTRIES CO., LTD. |
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Address after: Nanbin road 400060 Chongqing Nan'an District No. 76 (Chongqing international financial center) 22 floor Patentee after: NVC (China) Co., Ltd. Patentee after: Huizhou Leishi Optoelectronic Technology Co., Ltd. Address before: Nanbin road 400060 Chongqing Nan'an District No. 76 (Chongqing international financial center) 22 floor Patentee before: Chongqing NVC Industries Co., Ltd. Patentee before: Huizhou Leishi Optoelectronic Technology Co., Ltd. |
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Effective date of registration: 20170510 Address after: 516021 Guangdong city of Huizhou province Ru Town East Village Bridge (NVC Industrial Park) Patentee after: Huizhou Leishi Optoelectronic Technology Co., Ltd. Address before: Nanbin road 400060 Chongqing Nan'an District No. 76 (Chongqing international financial center) 22 floor Co-patentee before: Huizhou Leishi Optoelectronic Technology Co., Ltd. Patentee before: NVC (China) Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20200125 |