CN203007401U - Horizontal type thin film deposition cooling plate device - Google Patents

Horizontal type thin film deposition cooling plate device Download PDF

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Publication number
CN203007401U
CN203007401U CN 201220714838 CN201220714838U CN203007401U CN 203007401 U CN203007401 U CN 203007401U CN 201220714838 CN201220714838 CN 201220714838 CN 201220714838 U CN201220714838 U CN 201220714838U CN 203007401 U CN203007401 U CN 203007401U
Authority
CN
China
Prior art keywords
cooling
thin film
cooling plate
film deposition
type thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220714838
Other languages
Chinese (zh)
Inventor
周文彬
刘幼海
刘吉人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jifu New Energy Technology Shanghai Co Ltd
Original Assignee
Jifu New Energy Technology Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jifu New Energy Technology Shanghai Co Ltd filed Critical Jifu New Energy Technology Shanghai Co Ltd
Priority to CN 201220714838 priority Critical patent/CN203007401U/en
Application granted granted Critical
Publication of CN203007401U publication Critical patent/CN203007401U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model mainly aims at providing a horizontal type thin film deposition cooling plate device. The horizontal type thin film deposition cooling plate device provided by the utility model can be used for coating a cooling copper pipe by utilizing a cooling copper pipe groove arranged in a cooling plate, enabling the surface of a stainless steel plate to uniformly reach a certain temperature by accessing a cooling medium with certain temperature into the cooling copper pipe and enabling the surface of a photovoltaic glass to carry out temperature conduction by contacting the stainless steel plate with the surface of the photovoltaic glass, thereby effectively reducing the surface temperature of a photovoltaic glass film during deposition; and the horizontal type thin film deposition cooling plate device provided by the utility model has the advantages of reduced cost, no maintenance and excellent cooling effect.

Description

A kind of horizontal thin film deposition cooling board device
Affiliated technical field
The utility model belongs to photovoltaic glass processing unit field, is specifically related to a kind of horizontal thin film deposition cooling board device.
Background technology
At present, in horizontal photovoltaic glass film deposition equipment, photovoltaic glass must be heated, and concrete surface temperature approximately reaches about 200 degree, after processing procedure finishes, send out outside cavity to descend one photovoltaic glass surface temperature before technique just to seem especially important.The mode that overcomes on equipment was arranged at for directly running through with depth drill the cooling plate that both sides form water channel the cooling of carrying out the surface temperature of photovoltaic glass in chamber in the past, but this set cost is high, and processing is difficult for, and spended time is also longer.
The utility model content
In sum, in order to overcome above deficiency, main purpose of the present utility model is to provide a kind of horizontal thin film deposition cooling board device, it utilizes the inner cooling copper tube groove that arranges of cooling plate in order to coat cooling copper tube, pass into simultaneously the heat-eliminating medium of certain temperature in cooling copper tube, make cold plate surface reach equably certain temperature, contact with photovoltaic glass surface by cooling plate again, make it carry out temperature conduction, surface temperature when effectively reducing the photovoltaic glass thin film deposition, Cost reduction need not keep in repair, the device that cooling performance is good.
The purpose of this utility model is achieved through the following technical solutions:
A kind of horizontal thin film deposition cooling board device comprises two cooling board devices in up and down, and inside is provided with the cooling plate groove of the 5mm degree of depth, in order to placing cooling copper tube, and cooling copper tube diameter 10mm, the up and down cooling plate locks with the M6 screw.
The utility model further improves and is.
1. described cooling plate is the stainless steel 304 material, thickness 10mm, and surface finish is processed.
2. described cooling plate is with the locking of M6 screw, convenient disassembly.
3. described cooling copper tube is general fine copper.
The utility model compared with prior art has advantages of: cooling plate is the stainless steel 304 material, and handling ease reduces costs, and adopts the cooling copper tube mode, can prevent cooling water leakage, changes easily, and is easy to maintenance.
Description of drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is the plate structure of cooling schematic diagram.
Fig. 3 is the cooling copper tube schematic diagram.
The primary clustering nomenclature.
1... upper cooling plate.
2... lower cooling plate.
3... cooling copper tube.
21... cooling plate groove.
31... cooling copper tube.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described further:
See also shown in Figure 1, a kind of horizontal thin film deposition cooling board device, it comprises that cooling plate 1 and lower cooling plate 2 forms, the up and down cooling plate is provided with M6 screw hole position 4, the middle cooling copper tube 3 that coats.
See also shown in Figure 2, a kind of horizontal thin film deposition cooling board device, cooling plate 1,2 surface is provided with the dark cooling plate groove 21 of 5mm, in order to coat cooling copper tube.
See also shown in Figure 3, a kind of horizontal thin film deposition cooling board device, cooling copper tube 31 can pass into heat-eliminating medium, make temperature can be directly transferred to the up and down cooling plate 1,2 on.In cooling copper tube 3, make cooling copper tube 3 arrive the temperature identical with heat-eliminating medium by the heat-eliminating medium that passes into certain temperature, then via the mode of contact transmission, the cooling plate that makes 1,2 surface uniform ground reaches certain cooling temperature
The above example is to the explanation of technical solutions of the utility model and unrestricted, the modification that is equal to replacement or makes according to prior art of affiliated technical field those of ordinary skill, as long as do not exceed thinking and the scope of technical solutions of the utility model, within all should being included in claim scope of the present utility model.

Claims (4)

1. horizontal thin film deposition cooling board device, it comprises two of up and down cooling board device, cooling plate groove, cooling copper tube.
2. a kind of horizontal thin film deposition cooling board device according to claim 1, is characterized in that, described cooling plate material is stainless steel 304, and thickness 10mm and surface finish are processed.
3. a kind of horizontal thin film deposition cooling board device according to claim 1, is characterized in that described cooling copper tube diameter 10mm.
4. a kind of horizontal thin film deposition cooling board device according to claim 1, it is characterized in that, described on lower cooling plate be provided with the cooling plate groove, make the up and down cooling plate can coat cooling copper tube fully, and be provided with M6 screw hole position, in order to the up and down cooling plate is locked together.
CN 201220714838 2012-12-23 2012-12-23 Horizontal type thin film deposition cooling plate device Expired - Fee Related CN203007401U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220714838 CN203007401U (en) 2012-12-23 2012-12-23 Horizontal type thin film deposition cooling plate device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220714838 CN203007401U (en) 2012-12-23 2012-12-23 Horizontal type thin film deposition cooling plate device

Publications (1)

Publication Number Publication Date
CN203007401U true CN203007401U (en) 2013-06-19

Family

ID=48599013

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220714838 Expired - Fee Related CN203007401U (en) 2012-12-23 2012-12-23 Horizontal type thin film deposition cooling plate device

Country Status (1)

Country Link
CN (1) CN203007401U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104195511A (en) * 2014-09-09 2014-12-10 安徽铜峰电子股份有限公司 Cooling baffle for zinc furnace heater of high vacuum coating machine
WO2019165760A1 (en) * 2018-02-28 2019-09-06 北京铂阳顶荣光伏科技有限公司 Cooling system and coating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104195511A (en) * 2014-09-09 2014-12-10 安徽铜峰电子股份有限公司 Cooling baffle for zinc furnace heater of high vacuum coating machine
WO2019165760A1 (en) * 2018-02-28 2019-09-06 北京铂阳顶荣光伏科技有限公司 Cooling system and coating device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130619

Termination date: 20141223

EXPY Termination of patent right or utility model