CN203002684U - Silicon wafer cleaning system - Google Patents
Silicon wafer cleaning system Download PDFInfo
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- CN203002684U CN203002684U CN 201320010915 CN201320010915U CN203002684U CN 203002684 U CN203002684 U CN 203002684U CN 201320010915 CN201320010915 CN 201320010915 CN 201320010915 U CN201320010915 U CN 201320010915U CN 203002684 U CN203002684 U CN 203002684U
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Abstract
A silicon wafer cleaning system is characterized by comprising a silicon wafer pre-cleaning machine, a water storage device, a silicon wafer cleaning machine, a first water delivery pipeline and a second water delivery pipeline, wherein the silicon wafer pre-cleaning machine is at least provided with a water inlet and a water delivery port; the silicon wafer cleaning machine is at least provided with a water outlet; the water storage device is at least provided with a water inlet; the horizontal position of the water outlet of the silicon wafer cleaning machine is higher than the water inlet of the silicon wafer pre-cleaning machine; the water inlet of the silicon wafer pre-cleaning machine and the water outlet of the silicon wafer cleaning machine are connected through the first water delivery pipeline; and the water delivery port of the silicon wafer pre-cleaning machine and the water inlet of the water storage device are connected through the second water delivery pipeline. The silicon wafer cleaning system provided by the utility model is simple in design and low in both construction cost and maintenance frequency; and compared with the complicated system in the prior art, the energy consumption is greatly reduced and the manufacturing cost is lowered.
Description
Technical field
The utility model relates to semiconductor device processing technology, relates in particular to a kind of silicon chip cleaning system.
Background technology
Silicon chip is a kind of semiconductor devices basic material, is to have certain thickness sheet form base material by silicon ingot by being cut into.Forming the semiconductor devices with various functions by carry out some operations on base material, is the basis that forms various electronic equipments.
In the process of silicon chip, silicon chip precleaning machine and silicon wafer cleaner are generally used in the cleaning of silicon chip.The silicon chip precleaning machine is that the silicon chip after cutting is cleaned equipment with degumming process.Silicon wafer cleaner is that the silicon chip after cutting is cleaned and the dry equipment of processing.General matting is first cleaned and degumming process silicon chip by the silicon chip precleaning machine, then by silicon wafer cleaner, silicon chip is cleaned and dry the processing.Yet, in matting, need to expend a large amount of pure water, waste water resource simultaneously, has also increased sewage to a large amount of sewage disposal after cleaning and has reclaimed the burden of company.
Due to the silicon chip precleaning machine to water quality requirement lower than silicon wafer cleaner, silicon chip cleaning system of the prior art as shown in Figure 1, by laying pipeline, the wastewater collection of silicon wafer cleaner discharging in tank, by immersible pump, water is got in the secondary aqua storage tank of silicon chip precleaning machine for the silicon chip precleaning machine purpose of utilizing with the secondary that reaches waste water.
Because prior art need to dig tank, add immersible pump and corresponding control loop, design is complicated, and construction cost is high.And, during the work of prior art silicon chip cleaning system, also can consume mass energy.In addition, the life-span of immersible pump is limited, and the maintenance maintenance frequency is higher, has also increased the unstability of system.
The utility model content
For solving the problems of the technologies described above, the utility model provides a kind of silicon chip cleaning system, and simplicity of design has reduced construction cost, has reduced energy resource consumption, and has reduced the maintenance maintenance frequency, has reduced the unstability of system.
For achieving the above object, the utility model embodiment provides following technical scheme:
A kind of silicon chip cleaning system, it is characterized in that, comprise the silicon chip precleaning machine, water storage device, silicon wafer cleaner, the first hydraulic pipeline, the second hydraulic pipeline, wherein, described silicon chip precleaning machine has water inlet and water transport port at least, described silicon wafer cleaner has delivery port at least, and described water storage device has water inlet at least; The horizontal level of described silicon wafer cleaner delivery port is higher than the water inlet of described silicon chip precleaning machine, silicon chip precleaning machine water inlet is connected by the first hydraulic pipeline with the silicon wafer cleaner delivery port, and the water transport port of silicon chip precleaning machine is connected by the second hydraulic pipeline with the water inlet of water storage device.
Preferably, the internal diameter of described the first hydraulic pipeline is more than or equal to 100 millimeters.
Preferably, the internal diameter of described the second hydraulic pipeline is more than or equal to 200 millimeters.
Preferably, the level height at described water storage device top is higher than described secondary aqua storage tank.
Preferably, be provided with circulating water chennel, water circulating pump, secondary aqua storage tank in described silicon chip precleaning machine, the water inlet of described circulating water chennel is the water inlet of described silicon chip precleaning machine, the delivery port of described circulating water chennel connects the water inlet of described water circulating pump, and the delivery port of described water circulating pump connects the water inlet of described secondary aqua storage tank; The delivery port of described secondary aqua storage tank is the water transport port of described silicon chip precleaning machine, is connected by the second hydraulic pipeline with the water inlet of water storage device.
Preferably, described silicon chip precleaning machine also comprises, filtration flows to the filter of the water of secondary aqua storage tank and water storage device, and the water inlet of this filter is connected with the delivery port of described water circulating pump, and the delivery port of this filter is connected with the water inlet of described secondary aqua storage tank.
Preferably, described silicon chip cleaning system also comprises water pump, and wherein, described water pump has delivery port and water inlet at least; Described silicon wafer cleaner delivery port connects the water inlet of described water pump, and the delivery port of described water pump connects the water inlet of described silicon chip precleaning machine.
The silicon chip cleaning system that the utility model provides, take full advantage of the characteristic of silicon chip precleaning machine and silicon wafer cleaner itself, that is: the horizontal level of silicon wafer cleaner discharge outlet is higher than the water inlet of silicon chip precleaning machine, by direct connection silicon chip precleaning machine and silicon wafer cleaner, reach the purpose to the secondary utilization of waste water.Simultaneously, add water storage device to utilize to greatest extent the waste water that reclaims.Due to simplicity of design, construction cost is low, and the maintenance maintenance frequency is low, and than the complication system of prior art, energy resource consumption also greatly reduces, and has reduced production cost.
In addition, the waste water that silicon wafer cleaner ejects itself has certain temperature, because the utility model hydraulic pipeline is simply direct, when the waste water that silicon wafer cleaner is got rid of arrives the silicon chip precleaning machine, the dissipation of heat of waste water is less, reduce the energy consumption at the heating water source of precleaning machine, further reduced production cost.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or description of the Prior Art, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the organigram of silicon chip cleaning system in prior art;
Fig. 2 is the organigram of the silicon chip cleaning system in the utility model embodiment;
Fig. 3 is the syndeton schematic diagram of the silicon chip cleaning system in the utility model embodiment;
Fig. 4 is the syndeton schematic diagram of the silicon chip cleaning system in another embodiment of the utility model.
The specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the utility model protection.
A lot of details have been set forth in the following description so that fully understand the utility model, but the utility model can also adopt other to be different from alternate manner described here and implement, those skilled in the art can be in the situation that do similar popularization without prejudice to the utility model intension, so the utility model is not subjected to the restriction of following public specific embodiment.
Secondly, the utility model is described in detail in conjunction with schematic diagram, when the utility model embodiment is described in detail in detail; for ease of explanation; the profile of expression device architecture can be disobeyed general ratio and be done local the amplification, and described schematic diagram is example, and it should not limit the scope of the utility model protection at this.The three-dimensional space that should comprise in addition, length, width and the degree of depth in actual fabrication.
Just as described in the background section, purging system of the prior art need to dig tank, adds immersible pump, and need to add control loop to immersible pump, and design is complicated, and construction cost is high.And during the work of this silicon chip cleaning system, also can consume mass energy.Simultaneously, the life-span of immersible pump is limited, and the maintenance maintenance frequency is higher, has also increased the unstability of system.
For these reasons, the utility model embodiment discloses a kind of silicon chip cleaning system, the structure of this system as shown in Figures 2 and 3, Fig. 2 is this System Construction figure, Fig. 3 is this system's johning knot composition, this silicon chip cleaning system comprises:
Silicon chip precleaning machine 100, water storage device 200, silicon wafer cleaner 300, the first hydraulic pipeline 400, the second hydraulic pipelines 500.
Wherein, the silicon chip precleaning machine has water inlet 101 and water transport port 102 at least, and silicon wafer cleaner has delivery port 301 at least, and water storage device has water inlet 201 at least, and the horizontal level of silicon wafer cleaner delivery port is higher than the water inlet of silicon chip precleaning machine.
The annexation of this silicon chip cleaning system as shown in Figure 2, comprise: silicon chip precleaning machine water inlet 101 is connected by the first hydraulic pipeline 400 with silicon wafer cleaner delivery port 301, and the water transport port 102 of silicon chip precleaning machine is connected by the second hydraulic pipeline 500 with the water inlet 201 of water storage device.
By above annexation, can find out, due to the horizontal level of the silicon wafer cleaner delivery port water inlet higher than the silicon chip precleaning machine, the waste water that silicon wafer cleaner is discharged by delivery port can be flowed directly in the silicon chip precleaning machine.
A time difference is arranged when the work due to silicon wafer cleaner and silicon chip precleaning machine, to be the silicon chip precleaning machine shift to an earlier date 2-3 hour than silicon wafer cleaner finishes the work, and the secondary aqua storage tank volume in the silicon chip precleaning machine is limited, after if the silicon chip precleaning machine is finished the work, the waste water of silicon wafer cleaner is not stored, will have been slatterned a part of water resource.Be using water wisely to greatest extent, the utility model has added water storage device 200 on the silicon chip precleaning machine, enlarges the water storage volume of silicon chip precleaning machine, to reclaim the unnecessary waste water of deposit.
Owing to not installing power-equipment additional between silicon wafer cleaner and silicon chip precleaning machine, the waste water that the silicon wafer cleaner delivery port is discharged can only flow to the silicon chip precleaning machine under Action of Gravity Field, for guaranteeing that the waste water that the silicon wafer cleaner delivery port is discharged flows away as soon as possible, the internal diameter of the first hydraulic pipeline must be enough large, and the internal diameter of the first hydraulic pipeline is more than or equal to 100 millimeters in the present embodiment.
In addition, silicon chip precleaning machine itself is provided with circulating water chennel 110, water circulating pump 120, secondary aqua storage tank 130.The silicon chip precleaning machine with for guarantee the silicon chip precleaning machine to greatest extent the water storage device 200 that adds of water storage connected mode as shown in Figure 3, specific as follows:
The water inlet of circulating water chennel is the water inlet 101 of silicon chip precleaning machine, and the delivery port 112 of described circulating water chennel connects the water inlet of described water circulating pump, and the delivery port of described water circulating pump connects the water inlet 131 of described secondary aqua storage tank; The delivery port of described secondary aqua storage tank is the water transport port 102 of described silicon chip precleaning machine, is connected by the second hydraulic pipeline 500 with the water inlet 201 of water storage device.
Because the silicon chip precleaning machine itself arranges water circulating pump, at first the waste water of discharging at the silicon wafer cleaner delivery port flow into circulating water chennel, delivery port by circulating water chennel flows into secondary aqua storage tank and water storage device through water circulating pump, when the liquid level in secondary aqua storage tank arrives certain altitude, water circulating pump is started working, controlling current remains to the internal flow of silicon chip precleaning machine with certain flow velocity and direction, when avoiding secondary aqua storage tank and water storage device liquid level higher, current stop flowing, store to greatest extent water resource, in order to avoid waste.
Simultaneously, for keeping water velocity faster, the liquid level of secondary aqua storage tank and water storage device can be descended simultaneously, to keep the hydraulic balance of silicon chip precleaning machine inside, in the present embodiment, the second hydraulic pipeline internal diameter is more than or equal to 200 millimeters.
Need to prove, in the present embodiment, the level height at water storage device top is higher than secondary aqua storage tank, so that after secondary aqua storage tank storage full water, still have certain height space to make current continue to flow to secondary aqua storage tank and water storage device direction.
In addition, silicon chip precleaning machine in the present embodiment also comprises, filtration flows to the filter 140 of the water of secondary aqua storage tank and water storage device, the water inlet of this filter is connected with the delivery port of water circulating pump, delivery port is connected with the water inlet of described secondary aqua storage tank, is used for the waste water of the outflow of silicon wafer cleaner is filtered.
Concrete, the course of work of this silicon chip cleaning system is as follows:
Step 1, silicon wafer cleaner is discharged waste water from delivery port, flow to the silicon chip precleaning machine through the first hydraulic pipeline.
Step 2, the waste water that silicon wafer cleaner is discharged flow to circulating water chennel through silicon chip precleaning machine water inlet.
Step 3, the waste water that silicon wafer cleaner is discharged flow to water circulating pump through the delivery port of circulating water chennel.
Step 4 after the waste water that the silicon wafer cleaner that flows out from water circulating pump is discharged filters through filter, enters secondary aqua storage tank and water storage device.
Step 5, during silicon chip precleaning machine water, it is inner for the silicon chip precleaning machine that the water in secondary aqua storage tank and water storage device flows into the silicon chip precleaning machine.
Wherein, step 3 comprises: when the liquid level of secondary aqua storage tank and water storage device during lower than certain altitude, and the recirculated water air pump inoperative, waste water directly flows through from water circulating pump; During higher than certain altitude, water circulating pump is started working, and makes the waste water that silicon wafer cleaner is discharged keep certain flow velocity and water (flow) direction to flow to secondary aqua storage tank and water storage device all the time when the liquid level of secondary aqua storage tank and water storage device.
The silicon chip cleaning system that provides in the present embodiment, take full advantage of the horizontal level of silicon wafer cleaner discharge outlet higher than this feature of water inlet of silicon chip precleaning machine, by direct connection silicon chip precleaning machine and silicon wafer cleaner, reach the purpose to the secondary utilization of waste water.Simultaneously, add water storage device to utilize to greatest extent the waste water that reclaims.Due to simplicity of design, construction cost is low, the corresponding reduction of maintenance maintenance frequency, and than complication system, energy resource consumption also greatly reduces, and has reduced production cost.
In addition, the waste water that silicon wafer cleaner ejects itself has certain temperature, because the utility model hydraulic pipeline is simply direct, when the waste water of getting rid of by silicon wafer cleaner arrives the silicon chip precleaning machine, the dissipation of heat of waste water is less, reduce the energy consumption at the heating water source of precleaning machine, further reduced production cost.
Another embodiment of the utility model is structure and the connected mode that this silicon chip cleaning system under the prerequisite of water circulating pump is not set in the silicon chip precleaning machine, as shown in Figure 4.
Concrete, this silicon chip cleaning system with also comprise water pump, wherein, water pump has delivery port and water inlet at least.The connected mode of this silicon chip cleaning system is: the silicon wafer cleaner delivery port connects the water inlet of water pump, and the delivery port of water pump connects the water inlet of silicon chip precleaning machine.
The present embodiment does not arrange under the prerequisite of water circulating pump in the silicon chip precleaning machine, realize that by outer water pump the waste water that silicon wafer cleaner is discharged remains that certain flow velocity and water (flow) direction flows to the silicon chip precleaning machine all the time, reach the purpose to the secondary utilization of waste water.
What in this specification, various piece stressed is all and the difference of other parts that between various piece, identical similar part is mutually referring to getting final product.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can be in the situation that do not break away from spirit or scope of the present utility model, realization in other embodiments.Therefore, the utility model will can not be restricted to embodiment illustrated herein, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. silicon chip cleaning system, it is characterized in that, comprise the silicon chip precleaning machine, water storage device, silicon wafer cleaner, the first hydraulic pipeline, the second hydraulic pipeline, wherein, described silicon chip precleaning machine has water inlet and water transport port at least, described silicon wafer cleaner has delivery port at least, and described water storage device has water inlet at least; The horizontal level of described silicon wafer cleaner delivery port is higher than the water inlet of described silicon chip precleaning machine, silicon chip precleaning machine water inlet is connected by the first hydraulic pipeline with the silicon wafer cleaner delivery port, and the water transport port of silicon chip precleaning machine is connected by the second hydraulic pipeline with the water inlet of water storage device.
2. silicon chip cleaning system according to claim 1, is characterized in that, the internal diameter of described the first hydraulic pipeline is more than or equal to 100 millimeters.
3. silicon chip cleaning system according to claim 2, is characterized in that, the internal diameter of described the second hydraulic pipeline is more than or equal to 200 millimeters.
4. silicon chip cleaning system according to claim 3, is characterized in that, the level height at described water storage device top is higher than described secondary aqua storage tank.
5. silicon chip cleaning system according to claim 4, it is characterized in that, be provided with circulating water chennel, water circulating pump, secondary aqua storage tank in described silicon chip precleaning machine, the water inlet of described circulating water chennel is the water inlet of described silicon chip precleaning machine, the delivery port of described circulating water chennel connects the water inlet of described water circulating pump, and the delivery port of described water circulating pump connects the water inlet of described secondary aqua storage tank; The delivery port of described secondary aqua storage tank is the water transport port of described silicon chip precleaning machine, is connected by the second hydraulic pipeline with the water inlet of water storage device.
6. silicon chip cleaning system according to claim 5, it is characterized in that, described silicon chip precleaning machine also comprises, filtration flows to the filter of the water of secondary aqua storage tank and water storage device, the water inlet of this filter is connected with the delivery port of described water circulating pump, and the delivery port of this filter is connected with the water inlet of described secondary aqua storage tank.
7. silicon chip cleaning system according to claim 4, is characterized in that, described silicon chip cleaning system also comprises water pump, and wherein, described water pump has delivery port and water inlet at least; Described silicon wafer cleaner delivery port connects the water inlet of described water pump, and the delivery port of described water pump connects the water inlet of described silicon chip precleaning machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320010915 CN203002684U (en) | 2013-01-09 | 2013-01-09 | Silicon wafer cleaning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320010915 CN203002684U (en) | 2013-01-09 | 2013-01-09 | Silicon wafer cleaning system |
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| Publication Number | Publication Date |
|---|---|
| CN203002684U true CN203002684U (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320010915 Expired - Fee Related CN203002684U (en) | 2013-01-09 | 2013-01-09 | Silicon wafer cleaning system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103418565A (en) * | 2013-07-24 | 2013-12-04 | 镇江大成新能源有限公司 | Water cleaning system for silicon wafer cutting |
| CN106984584A (en) * | 2017-05-23 | 2017-07-28 | 禹州市银星专用磨料有限公司 | A kind of abrasive rinsing machine |
-
2013
- 2013-01-09 CN CN 201320010915 patent/CN203002684U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103418565A (en) * | 2013-07-24 | 2013-12-04 | 镇江大成新能源有限公司 | Water cleaning system for silicon wafer cutting |
| CN106984584A (en) * | 2017-05-23 | 2017-07-28 | 禹州市银星专用磨料有限公司 | A kind of abrasive rinsing machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20170109 |