CN202998679U - Film removing device for PCB - Google Patents
Film removing device for PCB Download PDFInfo
- Publication number
- CN202998679U CN202998679U CN 201220715981 CN201220715981U CN202998679U CN 202998679 U CN202998679 U CN 202998679U CN 201220715981 CN201220715981 CN 201220715981 CN 201220715981 U CN201220715981 U CN 201220715981U CN 202998679 U CN202998679 U CN 202998679U
- Authority
- CN
- China
- Prior art keywords
- liquid container
- film removing
- film
- heating rod
- film liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a film removing device for a PCB, comprising a film removing liquid container; a first heating rod mounted at the bottom of the film removing liquid container, wherein one end of the first heating rod passes through the side wall of the film removing liquid container and protrudes from the film removing liquid container; a temperature sensor mounted inside the film removing liquid container; a temperature controller electrically connected with the first heating rod and the temperature sensor and used for controlling the start and stop of the first heating rod in real time according to a temperature detected by the temperature sensor; and a support arranged inside the film removing liquid container. The film removing device for a PCB can heat the film removing liquid contained inside the film removing liquid container through using the first heating rod, and maintains the temperature of the film removing liquid to be in a preset range through the temperature controller, thereby enabling the film of the PCB with a film to be removed in the film removing liquid and increasing the film removing quality; and in addition, the film removing device for a PCB also has the characteristics of being simple in structure and low in cost.
Description
Technical field
The utility model relates to PCB and makes the field, particularly relates to a kind of film device that moves back of pcb board.
Background technology
Printed substrate (Printed Circuit Board is called for short PCB) is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.Need to carry out etching in PCB manufacturing process, wherein relate to the operation of moving back film, be about to pcb board and put into and move back film liquid (sig water), when diluted alkaline enter in dry film the resin reaction that contains acidic group and dissolved out after, will make dry film break away from copper face.
Yet the film device that moves back of the prior art does not possess the function of heating, like this, moves back film liquid ground leg film effect thereby affected.
The utility model content
The purpose of this utility model be to provide a kind of simple in structure, cost is low, move back the film device that moves back of the effective pcb board of film.
For solving the problems of the technologies described above, as an aspect of the present utility model, provide a kind of film device that moves back of pcb board, comprising: move back the film liquid container; The first heating rod is arranged on the bottom of moving back the film liquid container, and an end of the first heating rod passes the sidewall that moves back the film liquid container and protrudes from the outside of moving back the film liquid container; Temperature sensor is installed on the inside of moving back the film liquid container; Temperature controller is electrically connected to the first heating rod and temperature sensor, and the temperature that is used for detecting according to temperature sensor is controlled the start and stop of the first heating rod in real time; Support is arranged on and moves back in the film liquid container.
Preferably, moving back the film liquid container adopts stainless steel to make.
The utility model can utilize the first heating rod to heat being contained in the film liquid that moves back that moves back in the film liquid container, and by temperature controller, the temperature of moving back film liquid is remained in predetermined scope, thereby make pcb board leg film in the leg film liquid of heat of film, improved and moved back film quality.In addition, the utility model also has characteristics simple in structure, that cost is low.
Description of drawings
Fig. 1 has schematically shown the structural representation that moves back film device in the utility model.
Reference numeral in figure: 10, move back the film liquid container; 11, sidewall; 20, the first heating rod; 30, temperature sensor; 40, support.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated, but the multitude of different ways that the utility model can be defined by the claims and cover is implemented.
As shown in Figure 1, the pcb board in the utility model move back film device, comprising: move back film liquid container 10; The first heating rod 20 is arranged on the bottom of moving back film liquid container 10, and an end of the first heating rod 20 passes the sidewall 11 that moves back film liquid container 10 and protrudes from the outside of moving back film liquid container 10; Temperature sensor 30 is installed on the inside of moving back film liquid container 10; The temperature controller (not shown) is electrically connected to the first heating rod 20 and temperature sensor 30, and the temperature that is used for detecting according to temperature sensor 30 is controlled the start and stop of the first heating rod 20 in real time; Support 40 is arranged on and moves back in film liquid container 10.Preferably, support 40 is connected with the madial wall that moves back film liquid container 10.
The film liquid that moves back that the utility model can utilize 20 pairs of the first heating rods to be contained in and move back in film liquid container 10 heats, and make the temperature of moving back film liquid remain on (for example 50 degree ± 5 degree) in predetermined scope by temperature controller, thereby make pcb board leg film in the leg film liquid of heat of film, improved and moved back film quality.In addition, the utility model also has characteristics simple in structure, that cost is low.
Preferably, move back film liquid container 10 and adopt stainless steel to make, move back the resistance to corrosion of film liquid container 10 with raising.
Preferably, support 40 is multilayers, can place more pcb board like this.
Preferably, move back film device and also comprise a plurality of the second heating rods, be connected with temperature controller, a plurality of the second heating rods vertically are arranged on and move back in film liquid container 10, and a plurality of the second heating rod is along moving back circumferentially evenly distributing of film liquid container 10.
The above is only preferred embodiment of the present utility model, is not limited to the utility model, and for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (2)
- A pcb board move back film device, it is characterized in that, comprising:Move back film liquid container (10);The first heating rod (20), be arranged on described bottom of moving back film liquid container (10), an end of described the first heating rod (20) passes and describedly moves back the sidewall (11) of film liquid container (10) and protrude from described outside of moving back film liquid container (10);Temperature sensor (30) is installed on described inside of moving back film liquid container (10);Temperature controller is electrically connected to described the first heating rod (20) and described temperature sensor (30), and the temperature that is used for detecting according to described temperature sensor (30) is controlled the start and stop of described the first heating rod (20) in real time;Support (40) is arranged on described moving back in film liquid container (10).
- 2. the film device that moves back according to claim 1, is characterized in that, the described film liquid container (10) that moves back adopts stainless steel to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220715981 CN202998679U (en) | 2012-12-21 | 2012-12-21 | Film removing device for PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220715981 CN202998679U (en) | 2012-12-21 | 2012-12-21 | Film removing device for PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202998679U true CN202998679U (en) | 2013-06-12 |
Family
ID=48569800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220715981 Expired - Fee Related CN202998679U (en) | 2012-12-21 | 2012-12-21 | Film removing device for PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202998679U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454754A (en) * | 2017-09-08 | 2017-12-08 | 英德启利达电子有限公司 | A kind of pcb board that film is retreated for pcb board etching moves back film machine |
-
2012
- 2012-12-21 CN CN 201220715981 patent/CN202998679U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454754A (en) * | 2017-09-08 | 2017-12-08 | 英德启利达电子有限公司 | A kind of pcb board that film is retreated for pcb board etching moves back film machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20211221 |