CN202989439U

CN202989439U - Electronic-grade low-dielectric constant glass fiber cloth

Info

Publication number: CN202989439U
Application number: CN201220679537.1U
Authority: CN
Inventors: 邹新娥; 杜甫; 严海林
Original assignee: SHANGHAI HONGHE ELECTRONIC MATERIAL CO Ltd
Current assignee: Honghe Electronic Material Technology Co ltd
Priority date: 2012-12-11
Filing date: 2012-12-11
Publication date: 2013-06-12
Anticipated expiration: 2022-12-11

Abstract

The utility model relates to an electronic-grade low-dielectric constant glass fiber cloth, which is suitable for copper-clad plates in the high-frequency and high-speed field. The glass fiber cloth is characterized by forming through mutually weaving warp yarns and weft yarns, wherein the warp yarns, as well as the weft yarns, are formed by filaments; the electronic-grade glass fiber cloth is oblate as a whole; and both the warp yarns and the weft yarns adopt low-dielectric constant fiber threads. The glass fiber cloth provided by the utility model greatly reduces the dielectric constant as a whole, is thinner as adopting an oblate structure as whole, and is more uniform in distribution in resin.

Description

A kind of electron level glass fiber with low dielectric constant cloth

Technical field

The utility model relates to a kind of electron level glass fiber with low dielectric constant cloth, a kind of electron level glass fiber with low dielectric constant cloth that is applicable to high-frequency high-speed field copper-clad plate.

Background technology

Develop rapidly along with information technology, various electric consumers with high speed information processing capacity have become an indispensable part in people's daily life, thereby wireless telecommunications and wideband applicable industry technology have been accelerated by the speed of traditional military domain to civilian consumer electronics field transfer, because consumer electronics market is sought-after, and higher specification requirement is proposed constantly, transmit high speed, integrality and product multifunction and microminiaturization etc. as information, thereby promoted the development of frequency applications technology.Copper clad foil substrate material technology particularly, the Dk of traditional F R-4 and Df are relatively high, even also can't satisfy signal high-speed transfer under high frequency and the application demand of signal integrity fully by improving line design, because high Dk can make the signal transfer rate slack-off, high Df can make part signal be converted into heat energy loss in baseplate material, thereby reduction Dk/Df has become substrate dealer's the focus of chasing, new technology and the new type of substrate product of various reduction Dk/Df also constantly emerge, and are constantly accepted by PCB dealer and manufacturer terminal simultaneously.

Affect the many factors of baseplate material Dk/Df, mainly contain following several respects: resin, glass fabric, resin content, environment temperature and humidity and applying frequency etc.Glass fabric is as the main insulation reinforcing material of PCB, its Dk/Df is also very important, because E-glass is 6.6 at the Dk of 1MHz, and traditional F R-4 epoxy is 3.6 at the Dk of 1MHZ, the Dk of the traditional F R-4 substrate that both make is at 4.2-4.8, and the reduction of the Dk value of resin also has certain scope and limit, so downstream PCB manufacturer constantly proposes the requirement that development of new low (LOW) Dk glass fabric reaches the whole Dk value decline of substrate.

The utility model content

The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of electron level glass fiber with low dielectric constant cloth is provided, and is conducive to reduce dielectric constant Dk value and the dielectric loss Df value of electronic-grade glass fiber cloth.

The utility model is achieved through the following technical solutions:

A kind of electron level glass fiber with low dielectric constant cloth, it is characterized in that, formed by warp thread and the mutual braiding of weft yarn, described warp thread and weft yarn all are comprised of monofilament, whole electronic-grade glass fiber cloth structure is the flattening form, and described warp thread, weft yarn all adopt the filamental thread of low-k.

Described warp thread adopts glass fiber with low dielectric constant yarn or aramid fiber yarn, perhaps their mixing.

Described weft yarn adopts glass fiber with low dielectric constant yarn or aramid fiber yarn, perhaps their mixing.

The utility model electronic-grade glass fiber cloth overall dielectric constant reduces greatly, and whole electronic-grade glass fiber cloth flat structure, makes the electronic-grade glass fiber cloth slimming more that becomes, being more evenly distributed in resin.Because prepreg is comprised of resin and electronic-grade glass fiber cloth, and the dielectric constant of resin is less than the dielectric constant of electronic-grade glass fiber cloth, electronic-grade glass fiber cloth by such variation is called as electron level glass fiber with low dielectric constant cloth, compare with common cloth, lower dielectric constant is arranged, applicable to the high frequency substrate that requires low-k after the utility model product and resin-bonded.

Description of drawings

Fig. 1 is the electron level glass fiber with low dielectric constant cloth schematic diagram of the utility model compressed structure.

Fig. 2 is the schematic cross-section of the thickness direction of Fig. 1.

Figure notation: 1 warp thread, 2 weft yarns.

The specific embodiment

The utility model is described in further detail below in conjunction with accompanying drawing.

As shown in Figure 1 and Figure 2, electron level glass fiber with low dielectric constant cloth is to be formed by warp thread 1 and the mutual braiding of weft yarn 2, and warp thread and weft yarn all are comprised of monofilament, and whole electronic-grade glass fiber cloth structure is the flattening form.

Embodiment 1 adopts electron level glass fiber with low dielectric constant warp thread, weft weaving 1080,3313,2116 fabrics:

The dielectric constant test result:

Be respectively used to general in Tg(Mid-Tg) resin and low (Low) dielectric property resin, be made into test material dielectric property after substrate.

Claims

1. electron level glass fiber with low dielectric constant cloth, it is characterized in that, formed by warp thread and the mutual braiding of weft yarn, described warp thread and weft yarn all are comprised of monofilament, whole electronic-grade glass fiber cloth structure is the flattening form, and described warp thread, weft yarn all adopt the filamental thread of low-k.

2. electron level glass fiber with low dielectric constant cloth as claimed in claim 1, is characterized in that, described warp thread adopts glass fiber with low dielectric constant yarn or aramid fiber yarn, perhaps their mixing.

3. electron level glass fiber with low dielectric constant cloth as claimed in claim 1, is characterized in that, described weft yarn adopts glass fiber with low dielectric constant yarn or aramid fiber yarn, perhaps their mixing.