CN202983978U - Glue dipping machine - Google Patents
Glue dipping machine Download PDFInfo
- Publication number
- CN202983978U CN202983978U CN 201220652628 CN201220652628U CN202983978U CN 202983978 U CN202983978 U CN 202983978U CN 201220652628 CN201220652628 CN 201220652628 CN 201220652628 U CN201220652628 U CN 201220652628U CN 202983978 U CN202983978 U CN 202983978U
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Abstract
The utility model discloses a glue dipping machine. The glue dipping machine comprises a work table, an installation frame, a glue dipping head and a moving control mechanism, wherein the work table is used for placing a product to be dipped with glue, the installation frame is provided with the glue dipping head, the glue dipping head is arranged above the work table through the installation frame and comprises a body and glue dipping portions protruding out of the bottom of the body, the glue dipping portions are arranged at intervals along the length direction of the body, a glue storage groove inwards concaving is arranged in the bottom surface of each glue dipping portion, and the moving control mechanism controls the glue dipping head to move up and down. When the glue dipping machine is adopted to dip glue and install a cap, the glue dipping head is enabled to be stained with glue at first, the glue dipping head is pressed on a product to form a glue layer, and then the cap is placed on a product for compressing packaging. Compared with the prior art, the glue dipping machine reduces manual intervention, is favorable for guaranteeing the stability of the quality of products, and can improve cap installing efficiency, thereby improving production capacity. Besides, in the cap installing operation, an operator is far away from the glue and other chemical products, and occupational health of the operator is protected.
Description
Technical field
The utility model relates to the semiconductor manufacturing facility technical field, relates in particular to a kind of equipment that glue is added a cover that is used for dipping in encapsulation process.
Background technology
The MEMS pressure sensor is to adopt microelectronics and the produced novel sensor of micromachining technology, it can be with similar integrated circuit (IC) designing technique and manufacturing process, carry out high accuracy, produce in enormous quantities cheaply, be that consumer electronics and industrial process control product uses the MEMS sensor to open convenience with cheap cost in a large number thus, pressure control become be simple and easy to use and intellectuality.
Traditional mechanical quantity pressure sensor is based on metal elastic gonosome stress deformation, exported to the electric weight conversion by the mechanical quantity strain, therefore it can not do to such an extent that picture IC is so small as the MEMS pressure sensor, cost is also far away higher than the MEMS pressure sensor, with respect to traditional mechanical quantity sensor, the size of MEMS pressure sensor is less, and the maximum 1cm that is no more than makes cost performance increase substantially with respect to tradition " machinery " manufacturing technology.
compare with traditional sensor, to have a volume little due to the MEMS pressure sensor, lightweight, cost is low, low in energy consumption, reliability is high, be suitable for mass production, be easy to integrated and realize intelligentized characteristics, and make it can complete the irrealizable function of some traditional mechanical pick-up device in the characteristic size of micron dimension, make MEMS pressure sensor application scope more and more wider, as the TPMS(system for monitoring pressure in tyre is arranged at vehicle electric field), engine oil pressure sensor, the automobile brake system air pressure probe, air intake manifold of automotive engine pressure sensor (TMAP), the common rail for diesel engine pressure sensor, in consumer electronics field, tire gauge, sphygmomanometer, cupboard scale, health scale are arranged, washing machine, dish-washing machine, refrigerator, micro-wave oven, baking box, dust catcher pressure sensor, washing machine, water dispenser, dish-washing machine, solar water heater liquid level controlled pressure sensor, in the industrial electronic field, digital pressure gauge, digital stream scale, industrial batching weighing etc. are arranged.
Need to do in the encapsulation process of MEMS pressure sensor and add a cover action, then the existing mode of adding a cover installs suction nozzle for to draw glue on product with Semi-automatic dispenser on point gum machine, holds to be put into after lid with suction nozzle and pastes encapsulation on product.But because some MEMS pressure sensor product size is too small, can't be with the direct gluing on product of point gum machine, glue first can only be coated on flat board, then operating personnel are placed on product after dipping in glue with tweezers clamping lid on the flat board, compress to complete and add a cover encapsulation.But this mode is fully by manually-operated, and the glue amount of dipping on the one hand glue is difficult to control, and can't ensure the quality of products, and efficient is lower on the other hand, can't effectively improve production capacity.
Summary of the invention
The purpose of this utility model be to provide a kind of simple in structure, efficient is high, can guarantee the inhomogeneity glue dipping machine of glue application.
To achieve these goals, the utility model is taked following technical solution:
A kind of glue dipping machine comprises: the workbench of placing glue product to be dipped in; The installing rack of glue head is dipped in installation; Dip in the glue head by what described installing rack was arranged at described workbench top, describedly dip in the glue section of dipping in that the glue head comprises body and protrudes from described body bottom, described length direction interval of dipping in the described body of Jiao Buyan is arranged, is provided with described dipping in the storage glue groove that caves inward on glue section bottom surface; Control the described moving control mechanism that the glue head moves up and down that dips in.
Preferably, be provided with guide rod on described installing rack, the described guide rod of the described Jiao Touyan of dipping in moves up and down.
Preferably, the described shape of cross section that dips in glue section is square or rectangular.
Preferably, the area of described storage glue groove adapts with the area of glue product to be dipped in.
Preferably, described moving control mechanism is threaded screw rod and drives the motor that described threaded screw rod rotates.
As shown from the above technical solution, the utility model adopts and to dip in the glue head and first add a cover after gluing on the product again, and this dips in the glue section of dipping in that Jiao Toushang comprises the setting of a plurality of intervals, can be once to a plurality of product gluings; Storage glue groove is set dipping in glue section bottom, when dipping in glue process, first dip in glue with dipping in the glue head on glue-line, then scraper scrapes off storage glue groove unnecessary glue on every side, guarantee that thus each glue-spread all is consistent and is coated with evenly, thereby guarantee the stability of product quality, improve and add a cover efficient, realize that production capacity promotes.
Description of drawings
Fig. 1 is the schematic diagram of the glue dipping machine of an embodiment of the utility model.
Fig. 2 is the upward view that the utility model dips in the glue head.
Fig. 3 is the partial structurtes enlarged diagram that the utility model dips in the glue head.
Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is described in further detail.
The specific embodiment
As depicted in figs. 1 and 2, glue dipping machine of the present utility model comprises workbench 1, installing rack 2, guide rod 3, dips in glue head 4, moving control mechanism 5.Be used for placing the product of glue to be dipped on workbench 1, dip in glue head 4 and be arranged at the top of workbench 1 by installing rack 2, be provided with guide rod 3 on installing rack 2, dip in glue head 4 and can move up and down along guide rod 3 under the control of moving control mechanism 5.Guide rod 3 has the effect of correction, and sideslip not in the time of can guaranteeing to dip in glue head 4 and move keeps the accuracy of gluing position.The moving control mechanism 5 of the present embodiment is for being arranged at the threaded screw rod and the motor (not shown) that drives threaded screw rod on installing rack 2.Dip in glue head 4 and be fixedly mounted on the bottom of threaded screw rod, be processed with the tapped through hole that matches with threaded screw rod at the two ends of installing rack 2, when the motor-driven threaded screw rod rotates, can make and dip in glue head 4 and move up or down.
The glue head 4 that dips in of the present embodiment is comprised of the body 41 of elongated structure and the glue section of dipping in 42 that is arranged on body 41, dipping in the bottom that glue section 42 protrudes from body 41 arranges, be provided with 20 in the present embodiment and dip in glue section 42 on body 41, dip in glue section 42 and arrange along the length direction interval of body 41, the shape of cross section that dips in glue section 42 can be square or rectangle.Simultaneously with reference to Fig. 3, be processed with the storage glue groove a that caves inward from the bottom surface on glue section 42 bottom surfaces dipping in, namely dipping in glue section 42 bottoms and forming the rectangle circulus of a middle concave surrounding projection.The size of storage glue groove a of the present utility model adapts with the size that preparation encapsulates the glue product to be dipped in of adding a cover.
Below the glue method of adding a cover of dipping in of the present utility model is described further, when adopting glue dipping machine of the present utility model to add a cover encapsulation to product, comprise the following steps:
Step 2, the surplus glue that will dip on glue head 4 around storage glue groove a with scraper scrape off, and are consistent to guarantee the glue quantity that is coated with on each product, bad cleaning when preventing also simultaneously that glue coating is too much and affect product quality;
Step 3, glue product to be dipped in is positioned on workbench 1, mobile control unit 5 makes and dips in glue head 4 and move down, and will dip in glue head 4 and be pressed on glue product to be dipped in, and the glue in storage glue groove a is pressed onto on product, forms glue-line;
Step 4, lid is placed on from dipping in glue head 4 is transferred on glue-line on product and compresses, can complete and add a cover operation, then repeat abovementioned steps, the next batch product is added a cover encapsulation operation.
The utility model by employing be provided with a plurality of dip in glue section dip in the glue head wait dipping on the glue product after gluing, just lid is put on product and compresses, mode with respect to artificial glue, glue-spread on each product can be consistent, and because storage glue groove area adapts with glue product area to be dipped in, can guarantee uniformity and the degree of accuracy of glue application, the utility model once can carry out automatic glue application to a plurality of products simultaneously, has realized automated production.The utility model has compared with prior art reduced manual intervention, is conducive to guarantee the stability of product quality; can improve and add a cover efficient, thereby promote production capacity, and when adding a cover operation; operator is conducive to protect the occupational health of operator away from chemical products such as glue.
Really, technical conceive of the present utility model is not limited in above-described embodiment, can also obtain many different concrete schemes according to design of the present utility model, for example, moving control mechanism can also adopt other parts for the control displacement such as small-sized hydraulic oil cylinder; The size and the quantity that are arranged at the glue section of dipping on body also can be made corresponding variation according to the size of different product, within all should being included in the scope of technical scheme described in the utility model such as these changes and equivalent transformation.
Claims (5)
1. a glue dipping machine, is characterized in that, comprising:
Place the workbench of glue product to be dipped in;
The installing rack of glue head is dipped in installation;
Dip in the glue head by what described installing rack was arranged at described workbench top, describedly dip in the glue section of dipping in that the glue head comprises body and protrudes from described body bottom, described length direction interval of dipping in the described body of Jiao Buyan is arranged, is provided with described dipping in the storage glue groove that caves inward on glue section bottom surface;
Control the described moving control mechanism that the glue head moves up and down that dips in.
2. glue dipping machine as claimed in claim 1, it is characterized in that: be provided with guide rod on described installing rack, the described guide rod of the described Jiao Touyan of dipping in moves up and down.
3. glue dipping machine as claimed in claim 1 is characterized in that: the described shape of cross section that dips in glue section is square or rectangular.
4. glue dipping machine as claimed in claim 1 is characterized in that: the area of described storage glue groove adapts with the area of glue product to be dipped in.
5. glue dipping machine as claimed in claim 1 is characterized in that: described moving control mechanism is threaded screw rod and drives the motor that described threaded screw rod rotates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220652628 CN202983978U (en) | 2012-11-30 | 2012-11-30 | Glue dipping machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220652628 CN202983978U (en) | 2012-11-30 | 2012-11-30 | Glue dipping machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202983978U true CN202983978U (en) | 2013-06-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220652628 Expired - Fee Related CN202983978U (en) | 2012-11-30 | 2012-11-30 | Glue dipping machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202983978U (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105903639A (en) * | 2016-05-20 | 2016-08-31 | 中国电子科技集团公司第十研究所 | Full-automatic X-shaped adhesive dispensing and dipping head for chip bonding |
| CN105921356A (en) * | 2016-05-20 | 2016-09-07 | 中国电子科技集团公司第十研究所 | Full-automatic chip mounting glue dipping head shaped like Chinese character 'hui' |
| CN106024676A (en) * | 2016-05-20 | 2016-10-12 | 中国电子科技集团公司第十研究所 | Full-automatic chip mounting array cove dispensing and dipping head |
| CN106824659A (en) * | 2017-03-23 | 2017-06-13 | 福建省劲德电源科技有限公司 | A kind of conducting resinl automatic glue dipping device and its method of work for button cell shell |
| CN106890762A (en) * | 2017-03-15 | 2017-06-27 | 湖南大学 | A kind of quick, straight line, equidistantly uniform point (painting) glue device |
| CN107159533A (en) * | 2017-06-30 | 2017-09-15 | 深圳赛意法微电子有限公司 | The dispensing method and point glue equipment of wafer |
| CN110252581A (en) * | 2019-07-19 | 2019-09-20 | 中电科仪器仪表有限公司 | A kind of conductive glue is with dipping in rubber head |
| CN111389653A (en) * | 2020-04-13 | 2020-07-10 | 林汇轩 | MEMS sensor dips in mucilage binding and puts |
| CN111905965A (en) * | 2020-08-14 | 2020-11-10 | 天能电池集团股份有限公司 | Automatic scaling powder device of paining of battery |
| CN112317234A (en) * | 2020-10-21 | 2021-02-05 | 温州沿笙信息科技有限公司 | Temperature sensor packaging equipment |
| CN113441336A (en) * | 2021-07-30 | 2021-09-28 | 山西中科潞安紫外光电科技有限公司 | Integrated dotting type glue dispensing device |
| CN113695175A (en) * | 2021-07-27 | 2021-11-26 | 河南盛业电炉节能有限公司 | Automatic coating production line for nylon layer of spline hub |
| CN113731722A (en) * | 2021-08-27 | 2021-12-03 | 江西安竹科技有限公司 | Gum dipping equipment |
| WO2022247250A1 (en) * | 2021-05-28 | 2022-12-01 | 浙江天能电池(江苏)有限公司 | Method for preparation of storage battery simulation mesh |
-
2012
- 2012-11-30 CN CN 201220652628 patent/CN202983978U/en not_active Expired - Fee Related
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105921356A (en) * | 2016-05-20 | 2016-09-07 | 中国电子科技集团公司第十研究所 | Full-automatic chip mounting glue dipping head shaped like Chinese character 'hui' |
| CN106024676A (en) * | 2016-05-20 | 2016-10-12 | 中国电子科技集团公司第十研究所 | Full-automatic chip mounting array cove dispensing and dipping head |
| CN105903639B (en) * | 2016-05-20 | 2018-06-26 | 中国电子科技集团公司第十研究所 | Full-automatic chip attachment X-shaped point dips in rubber head |
| CN106024676B (en) * | 2016-05-20 | 2019-01-08 | 中国电子科技集团公司第十研究所 | Full-automatic chip attachment array recessed circle point dips in rubber head |
| CN105903639A (en) * | 2016-05-20 | 2016-08-31 | 中国电子科技集团公司第十研究所 | Full-automatic X-shaped adhesive dispensing and dipping head for chip bonding |
| CN106890762A (en) * | 2017-03-15 | 2017-06-27 | 湖南大学 | A kind of quick, straight line, equidistantly uniform point (painting) glue device |
| CN106824659A (en) * | 2017-03-23 | 2017-06-13 | 福建省劲德电源科技有限公司 | A kind of conducting resinl automatic glue dipping device and its method of work for button cell shell |
| CN107159533B (en) * | 2017-06-30 | 2020-11-20 | 深圳赛意法微电子有限公司 | Glue dispensing method and glue dispensing device for wafer |
| CN107159533A (en) * | 2017-06-30 | 2017-09-15 | 深圳赛意法微电子有限公司 | The dispensing method and point glue equipment of wafer |
| CN110252581A (en) * | 2019-07-19 | 2019-09-20 | 中电科仪器仪表有限公司 | A kind of conductive glue is with dipping in rubber head |
| CN111389653A (en) * | 2020-04-13 | 2020-07-10 | 林汇轩 | MEMS sensor dips in mucilage binding and puts |
| CN111905965A (en) * | 2020-08-14 | 2020-11-10 | 天能电池集团股份有限公司 | Automatic scaling powder device of paining of battery |
| CN112317234A (en) * | 2020-10-21 | 2021-02-05 | 温州沿笙信息科技有限公司 | Temperature sensor packaging equipment |
| WO2022247250A1 (en) * | 2021-05-28 | 2022-12-01 | 浙江天能电池(江苏)有限公司 | Method for preparation of storage battery simulation mesh |
| CN113695175A (en) * | 2021-07-27 | 2021-11-26 | 河南盛业电炉节能有限公司 | Automatic coating production line for nylon layer of spline hub |
| CN113441336A (en) * | 2021-07-30 | 2021-09-28 | 山西中科潞安紫外光电科技有限公司 | Integrated dotting type glue dispensing device |
| CN113441336B (en) * | 2021-07-30 | 2023-10-13 | 山西中科潞安紫外光电科技有限公司 | Integrated dotting type adhesive dispensing device |
| CN113731722A (en) * | 2021-08-27 | 2021-12-03 | 江西安竹科技有限公司 | Gum dipping equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20211130 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |