CN202978842U - Seal welding pad of SMD (surface mounted device) crystal resonator - Google Patents
Seal welding pad of SMD (surface mounted device) crystal resonator Download PDFInfo
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- CN202978842U CN202978842U CN 201220716008 CN201220716008U CN202978842U CN 202978842 U CN202978842 U CN 202978842U CN 201220716008 CN201220716008 CN 201220716008 CN 201220716008 U CN201220716008 U CN 201220716008U CN 202978842 U CN202978842 U CN 202978842U
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- clamping head
- elastomer
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Abstract
The utility model relates to a seal welding pad of an SMD (surface mounted device) crystal resonator. A pad body is composed of a positioning plate, a spring plate and a bottom plate, wherein the positioning plate and the spring plate are both provided with a positioning hole, and an elastic clamping mechanism on the spring plate comprises a clamping head and an elastic body; the positioning plate and the bottom plate are respectively provided with an elongated groove and an elongated hole; the thickness of the spring plate is not less than 1mm, the elastic body of the elastic clamping mechanism is sheet-like, and the width of the elastic body is not greater than the thickness of the spring plate; and the bottom plate is provided with a boss which protrudes into the positioning hole in the spring plate and limits the depth of the positioning hole. The clamping force of the elastic body of the seal welding pad provided by the utility model is increased, the seal welding pad is not easy to deform, and the service life of the seal welding pad is long. The structure of the pad body is simple, and the processing cost is low.
Description
Technical field
The utility model relates to a kind of SMD crystal resonator soldering and sealing dish, and is specifically a kind of with SMD crystal resonator soldering and sealing the dish self-holding and location.
Background technology
The SMD crystal sealing dish that generally uses at present is comprised of location-plate and base plate, and base plate, location-plate adopt diffusion welding (DW) to weld together, and are arranged with on location-plate and reach hundreds of location holes.Location hole adopts line cutting or corrosion processing to form, the location hole size monolateral than SMD crystal resonator large 0.05 millimeter to facilitate the placement of product.When carrying out crystal sealing, be first the SMD crystal resonator of wanting soldering and sealing to be put on the soldering and sealing dish, and then the soldering and sealing dish is put on soldering and sealing magnetic platform, the magnetic of soldering and sealing magnetic platform holds crystal by the through hole on base plate, and when carrying out parallel roll welding, product can not run out of the soldering and sealing dish.Along with product constantly develops to miniaturization, the SMD crystal resonator is more and more less, minimum size has been the 2*1.6 millimeter at present, thisly utilize magnetic to hold product to carry out again the suction that soldering and sealing causes because product is little and diminish, during soldering and sealing, product is often followed the soldering and sealing roller and is walked, thereby causes that product soldering and sealing is bad or damage the soldering and sealing roller.
Take away with the soldering and sealing wheel in order to prevent the SMD crystal resonator, the technical staff has developed a kind of self-holding soldering and sealing dish of being with, the SMD crystal resonator can be clamped in location hole, its structure such as Fig. 1 only draw the example for a station to shown in Figure 5 in Fig. 1 to Fig. 5.Increase latch plate 2 and median septum 3 between location-plate 1 and base plate 4, adopted diffusion welding (DW) to weld together.Latch plate 2 and median septum 3 have location hole 21,31 on all; Latch plate 2 is provided with the elastic clamping mechanism that the product that is placed in location hole is clamped, this resilient clamp machine comprises a clamping head 22, and elastomer 23, the elastomer rear end part 231 that clamping head 22 is connected with latch plate 2 is snakelike distribution along the extension of latch plate surface curvature; Clamping head 22 is arranged in location hole 21 1 sides and its circular arc sidewall sections ground embedding location hole 21; Have through hole 221 in the middle of clamping head 22, be used for stirring the loading and unloading that clamping head carries out product; Be used for respectively on location-plate and base plate stirring strip groove 12 that clamping head 22 moves and strip hole 42 by clamping head intermediate throughholes 221.The through hole 32 that has location hole 31 on median septum 3 and sink for the elastic clamping mechanism on latch plate 2.First insert clamping head intermediate throughholes 221 with pulling out pin when placing product, by the direction of arrow in Fig. 3, clamping head 22 is dialled toward location hole 21 outsides, treating that product falls discharges clamping head in location hole 21 again and product can be pressed on location hole 21 sidewalls, and during soldering and sealing, the soldering and sealing roller can not take up product.It is 0.15 millimeter high resiliency tungsten chrome alum spring steel that latch plate adopts thickness, through general corrosion processing and at latch plate surface formation location hole 21, clamping head 22, elastomer 23, and the cavity 24 that clamping head 22 and elastomer 23 are set.Because elastomer thickness is very thin, in order to guarantee that it has enough intensity, elastomer must ensure enough width, therefore, when stirring clamping head 22, elastomer 23 part 231 in its back-end can produce torsional deflection and the cavity sinking of median septum through hole 42 places formation downwards, and the effect of median septum is exactly to guarantee that elastomer has enough sinking spaces.This torsional deflection generation repeatedly can cause elastomeric flexibility decrease even to lose efficacy, and makes elastomer produce torsional deformation and can't clamp product, causes reduce its useful life.
Summary of the invention
The purpose of this utility model is for the deficiencies in the prior art, and a kind of SMD crystal resonator soldering and sealing dish is provided, and has chucking power large, the advantage of long service life.
The utility model is achieved in that the MULTILAYER COMPOSITE overlaying structure of described disk body for being comprised of location-plate, latch plate and base plate, be respectively equipped with a plurality of location holes for the treatment of the soldering and sealing product that are used for placing on location-plate, latch plate, have the hole that communicates respectively with position, four turnings of top location hole on base plate; Latch plate is provided with the elastic clamping mechanism that the product that is placed in each location hole is clamped, the elastomer that elastic clamping mechanism comprises a clamping head and clamping head is connected with latch plate, clamping head is arranged in location hole one side and clamping head sidewall sections ground embedding location hole, has through hole in the middle of clamping head; Have to stir strip groove that clamping head moves and strip hole on location-plate and base plate; The thickness of latch plate is not less than 1mm, and the elastomer of elastic clamping mechanism is laminar, and the elastomer width is not more than the thickness of latch plate; Base plate is provided with and is raised in the latch plate location hole and the boss spacing to depth of positioning hole.Make Bending Deformation in the cavity of elastomer between location-plate and base plate, be difficult for causing and be out of shape because of flexibility decrease, and latch plate is thicker, make elastomer intensity increase, chucking power increases.
A preferred version of the present utility model is: Yi Bian the elastomer of elastic clamping mechanism is set side by side with a laminar flexure strip at least outside location hole, the flexure strip end is connected with latch plate.During to the flexure strip curving, the flexure strip that is set up in parallel forms elastomer and supports, and can share the pressure that elastomer is born, and can increase elastomeric clamping strength at elastomer.
The utility model makes elastomer adopt the mode of Bending Deformation to provide chucking power for fixture by increasing the thickness of latch plate, and not only chucking power is large, and elastomer is not yielding, can extend the useful life of soldering and sealing dish; Adopt a plurality of flexure strips that are set up in parallel to share the pressure that elastomer is born, can improve further elastomeric chucking power.In addition, do not need to arrange median septum, also simplified body structure, cost processing is low.
Description of drawings
Fig. 1 is the SMD crystal resonator soldering and sealing dish structural representation that existing band clamps mechanism;
Fig. 2 is location-plate vertical view in Fig. 1;
Fig. 3 is Fig. 1 spring plank vertical view of being hit by a bullet;
Fig. 4 is median septum vertical view in Fig. 1;
Fig. 5 is base plate vertical view in Fig. 1;
Fig. 6 is the utility model SMD crystal resonator soldering and sealing dish structural representation;
Fig. 7 is Fig. 6 spring plank vertical view of being hit by a bullet;
Fig. 8 is base plate vertical view in Fig. 6.
Embodiment
The utility model as shown in Figure 6, disk body adopts diffusion welding (DW)s to weld together by location-plate 1, latch plate 2 and base plate 4, and forms the MULTILAYER COMPOSITE overlaying structure.Only draw the location hole of a station in Fig. 6.
Location-plate 1 structure has location hole 11 and is used for stirring the strip groove 12 that clamping head moves as shown in Figure 2, and strip groove 12 is opened on location hole 11.
The high resiliency tungsten chrome alum spring steel general corrosion that latch plate adopts thickness to be not less than 1mm processes, its structure as shown in Figure 7, have location hole 21 on latch plate 2, elastic clamping mechanism comprises a clamping head 22 and is sheet elastomer 23 with what clamping head 22 was connected with latch plate 2, and elastomer 23 width are not more than the thickness of latch plate; Clamping head 22 is arranged in location hole 21 1 sides and clamping head 22 sidewall sections ground embedding location holes 21, has through hole 221 in the middle of clamping head 22.The elastomer of elastic clamping mechanism is set side by side with a laminar flexure strip 25 at least on one side, the location hole outside, and this routine Elastic sheet 25 is provided with two, and flexure strip 25 ends are connected with latch plate 2.The length of two flexure strips 25 is preferably outwards shortened successively by elastomer 23, is beneficial to the elastomer 23 outwardly-bent distortion of pressurized.Latch plate 2 is through general corrosion processing and at latch plate surface formation location hole 21, clamping head 22, elastomer 23, flexure strip 25, and the cavity 24 that clamping head 22, elastomer 23, flexure strip 25 are set.
First insert clamping head intermediate throughholes 221 with pulling out pin when placing product, by the direction of arrow in Fig. 7, clamping head 22 is dialled toward location hole 21 outsides, treating that product falls discharges clamping head in location hole 21 again and product can be pressed on location hole 21 sidewalls, and during soldering and sealing, the soldering and sealing roller can not take up product.
The utility model is by increasing the thickness of latch plate, to improve elastomer intensity, not only can obtain larger chucking power, can also make in the cavity of sheet elastomer between location-plate and base plate simultaneously and make Bending Deformation, be difficult for causing because of flexibility decrease and be out of shape, can extend the life-span of whole soldering and sealing dish.Adopt a plurality of flexure strips that are set up in parallel to share the pressure that elastomer is born, can improve further elastomeric chucking power.In addition, do not need to arrange median septum, simplified body structure yet, reduced processing cost.
Claims (2)
1.SMD crystal resonator soldering and sealing dish, described disk body is the MULTILAYER COMPOSITE overlaying structure that is comprised of location-plate (1), latch plate (2) and base plate (4), be respectively equipped with a plurality of location holes (11,21) for the treatment of the soldering and sealing product that are used for placing on location-plate (1), latch plate (2), have on base plate (4) and top location hole (11,21) four holes that the position, turning communicates respectively (41); Latch plate (2) is provided with the elastic clamping mechanism that the product that is placed in each location hole (21) is clamped, the elastomer (23) that elastic clamping mechanism comprises a clamping head (22) and clamping head is connected with latch plate, clamping head (22) is arranged in location hole (21) one sides and clamping head (22) sidewall sections ground embedding location hole (21), has through hole (221) in the middle of clamping head (22); Have to stir strip groove (12) and the strip hole (42) that clamping head (22) moves on location-plate (1) and base plate (4); It is characterized in that: the thickness of latch plate (2) is not less than 1mm, and the elastomer of elastic clamping mechanism (23) is laminar, and elastomer (23) width is not more than the thickness of latch plate (2); Base plate (4) is provided with and is raised in latch plate location hole (21) and the boss (43) spacing to location hole (21) degree of depth.
2. SMD crystal resonator soldering and sealing dish according to claim 1, it is characterized in that: Yi Bian the outside is set side by side with a laminar flexure strip (25) at least, flexure strip (25) end is connected with latch plate (2) elastomer of elastic clamping mechanism (23) at location hole (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220716008 CN202978842U (en) | 2012-12-21 | 2012-12-21 | Seal welding pad of SMD (surface mounted device) crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220716008 CN202978842U (en) | 2012-12-21 | 2012-12-21 | Seal welding pad of SMD (surface mounted device) crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202978842U true CN202978842U (en) | 2013-06-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220716008 Expired - Lifetime CN202978842U (en) | 2012-12-21 | 2012-12-21 | Seal welding pad of SMD (surface mounted device) crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202978842U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117721A (en) * | 2012-12-21 | 2013-05-22 | 铜陵市晶赛电子有限责任公司 | Sealing bonding pad of surface mount device (SMD) crystal resonator |
-
2012
- 2012-12-21 CN CN 201220716008 patent/CN202978842U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117721A (en) * | 2012-12-21 | 2013-05-22 | 铜陵市晶赛电子有限责任公司 | Sealing bonding pad of surface mount device (SMD) crystal resonator |
| CN103117721B (en) * | 2012-12-21 | 2015-07-15 | 铜陵市晶赛电子有限责任公司 | Sealing bonding pad of surface mount device (SMD) crystal resonator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: The two economic and Technological Development Zone in Anhui province Tongling City Road 244061 No. 1258 Patentee after: ANHUI JINGSAI TECHNOLOGY HOLDING CO.,LTD. Address before: The two economic and Technological Development Zone in Anhui province Tongling City Road 244061 No. 1258 Patentee before: TONGLING JINGSAI ELECTRONIC CO.,LTD. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130605 |