CN202968734U - Liquid blocking device for electroplating equipment - Google Patents
Liquid blocking device for electroplating equipment Download PDFInfo
- Publication number
- CN202968734U CN202968734U CN 201220593058 CN201220593058U CN202968734U CN 202968734 U CN202968734 U CN 202968734U CN 201220593058 CN201220593058 CN 201220593058 CN 201220593058 U CN201220593058 U CN 201220593058U CN 202968734 U CN202968734 U CN 202968734U
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- CN
- China
- Prior art keywords
- liquid
- electroplate liquid
- electroplating
- tank
- electroplating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a liquid blocking device for electroplating equipment. The liquid blocking device comprises an electroplating liquid main tank (2), and an electroplating liquid secondary tank (4) arranged above the electroplating liquid main tank (2). The liquid blocking device is characterized by also comprising an electroplating liquid transitional tank (6), a reflux tube (7) and a liquid blocking plate (8), wherein the electroplating liquid transitional tank (6) is arranged above the electroplating liquid main tank (2) and used for receiving electroplating liquid overflowed from the electroplating liquid secondary tank (4); one end of the reflux tube (7) is communicated with the electroplating liquid transitional tank (6), and the other end of the reflux tube (7) vertically extends downwards to the bottom inside the electroplating liquid main tank (2); and the liquid blocking plate (8) is arranged in the electroplating liquid transitional tank (6) and can open or close according to the liquid level height in the electroplating liquid transitional tank (6); when the liquid blocking plate is opened, the electroplating liquid can reflow to the electroplating liquid main tank (2) by virtue of the reflux tube (7). By using the liquid blocking device, the fluctuation of the liquid level of the electroplating liquid is small, the current density is stable, and the quality of the plating parts is good.
Description
Technical field
The utility model relates to a kind of electroplating device, relates in particular to a kind of electroplating device liquid-blocking device.
Background technology
During continuous electroplating, for satisfying the control requirement of plating area, can adopt the height of regulating electroplate liquid in plating tank, control the degree of depth of workpiece to be plated immersion plating liquid, control the purpose of electroplating area thereby reach.In this mode, be to improve plating quality, will make the concentration of electroplate liquid keep stable, thereby guarantee that current density is stable, so electroplate liquid should there be sufficient amount of flow, must keep the relatively stable of liquid level again.For this reason, make electroplate liquid in time be back to the female groove of electroplate liquid from the electroplate liquid pilot trench reposefully just very crucial.For reaching this purpose, mainly by pump, electroplate liquid to be added in the electroplate liquid pilot trench from the female groove of electroplate liquid, again in overflowing to the female groove of electroplate liquid, iterative cycles like this, but because electroplate liquid in existing electroplating device directly pours in the female groove of electroplate liquid by return line, this kind mode can cause the electroplate liquid liquid fluctuating larger, so it is density stabilized to be difficult to holding current, to such an extent as to plating quality is relatively poor.
Summary of the invention
Technical problem to be solved in the utility model is to provide and a kind ofly can makes the electroplating device liquid-blocking device that the electroplate liquid liquid fluctuating is little, current density is stable.
For solving the problems of the technologies described above, the utility model provides a kind of electroplating device liquid-blocking device, comprising:
The female groove of electroplate liquid; The electroplate liquid pilot trench is installed on the top of the female groove of described electroplate liquid;
Also comprise:
The electroplate liquid ramp pan, be installed on the female groove of described electroplate liquid the top, be used for accommodating the electroplate liquid that overflows from described electroplate liquid pilot trench;
Return line, an end communicates with described electroplate liquid ramp pan, and the other end extends to the bottom in the female groove of described electroplate liquid straight down;
Liquid barrier is arranged in described electroplate liquid ramp pan, and can open or close according to the liquid level in described electroplate liquid ramp pan, and when opening, electroplate liquid can be back in the female groove of described electroplate liquid by described return line.
The terminal horizontal of the described return line the other end extends to form horizontal-extending section, and the outlet of described flat extension is relative with the sidewall of the female groove of described electroplate liquid.
Compared with prior art, the beneficial effects of the utility model are:
due to a kind of electroplating device liquid-blocking device of the present utility model, include the electroplate liquid ramp pan, this electroplate liquid ramp pan communicates by the female groove of return line and electroplate liquid, be provided with liquid barrier in the electroplate liquid ramp pan, during use, liquid barrier can be opened or close according to the liquid level of electroplate liquid, the electroplate liquid of overflow is accumulated in the electroplate liquid ramp pan to be back in the female groove of electroplate liquid after a certain amount of again, such reflux type, can not produce larger liquid fluctuating, so can make current density keep temperature, therefore the utility model can make the electroplate liquid liquid fluctuating little, make current density keep stable.
Description of drawings
Fig. 1 is structural representation of the present utility model.
In figure: the female groove 2 of electroplate liquid, electroplate liquid pilot trench 4, electroplate liquid ramp pan 6, return line 7, horizontal-extending section 71, liquid barrier 8.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further details
Shown in Figure 1, a kind of electroplating device liquid-blocking device of the present utility model, mainly include the female groove 2 of electroplate liquid, electroplate liquid pilot trench 4 and electroplate liquid ramp pan 6, wherein electroplate liquid pilot trench 4 is installed on the top of the female groove 2 of electroplate liquid, and the top that electroplate liquid ramp pan 6 also is installed on the female groove 2 of electroplate liquid is used for accommodating the electroplate liquid that overflows from electroplate liquid pilot trench 4; Communicate by return line 7 between the female groove 2 of electroplate liquid and electroplate liquid ramp pan 6, one end of this return line 7 communicates with electroplate liquid ramp pan 6 bottoms, the other end extends to the bottom in the female groove 2 of electroplate liquid straight down, and forming horizontal-extending section 71, the outlet of this flat extension 71 is relative with the sidewall of electroplate liquid mother groove 2; Liquid barrier 8 is arranged in electroplate liquid ramp pan 6, and can open or close according to the liquid level in electroplate liquid ramp pan 6, when opening, electroplate liquid can be back in the female groove 2 of electroplate liquid by return line 7, thisly at first accumulate electroplate liquid in electroplate liquid ramp pan 6, the mode that refluxes again can not produce larger impact, so can make the liquid level of electroplate liquid keep stable, avoid producing larger fluctuation, thereby can make the current density in electroplate liquid keep stable, guarantee that finally plating piece has electroplating effect preferably.
In actual the use; liquid barrier 8 can adopt the principle of ' seesaw ' to be arranged in electroplate liquid ramp pan 6; namely accumulating the stressed of liquid barrier 8 two ends when a certain amount of when electroplate liquid can overbalance; thereby run-off the straight makes electroplate liquid begin to reflux by return line 7; opposite liquid barrier 8 is in the closing condition of level; those skilled in the art also can adopt other mode to make liquid barrier 8 automatically open or close in the common practise of grasping; but all belong to design concept of the present utility model, all in protection domain of the present utility model.
In sum, the utility model can make the electroplate liquid liquid fluctuating little, makes current density keep stable.
The above is only better embodiment of the present utility model; protection domain of the present utility model is not limited with above-mentioned embodiment; in every case the equivalence done according to the utility model institute disclosure of those of ordinary skills is modified or changes, and all should include in the protection domain of putting down in writing in claims.
Claims (2)
1. electroplating device liquid-blocking device comprises:
The female groove (2) of electroplate liquid;
Electroplate liquid pilot trench (4) is installed on the top of the female groove of described electroplate liquid (2);
It is characterized in that: also comprise:
Electroplate liquid ramp pan (6) is installed on the top of the female groove of described electroplate liquid (2);
Return line (7), an end communicates with described electroplate liquid ramp pan (6), and the other end extends to the bottom in the female groove of described electroplate liquid (2) straight down;
Liquid barrier (8) is arranged in described electroplate liquid ramp pan (6).
2. electroplating device liquid-blocking device according to claim 1, it is characterized in that: the terminal horizontal of described return line (7) the other end extends to form horizontal-extending section (71), and the outlet of described horizontal-extending section (71) is relative with the sidewall of the female groove of described electroplate liquid (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220593058 CN202968734U (en) | 2012-11-12 | 2012-11-12 | Liquid blocking device for electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220593058 CN202968734U (en) | 2012-11-12 | 2012-11-12 | Liquid blocking device for electroplating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202968734U true CN202968734U (en) | 2013-06-05 |
Family
ID=48509834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220593058 Expired - Fee Related CN202968734U (en) | 2012-11-12 | 2012-11-12 | Liquid blocking device for electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202968734U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102912410A (en) * | 2012-11-12 | 2013-02-06 | 江苏矽研半导体科技有限公司 | Liquid stopping device applied to electroplating equipment |
| CN105274577A (en) * | 2014-05-28 | 2016-01-27 | 北京有色金属研究总院 | High purity metal preparation electrolysis bath and use method thereof |
| CN107254697A (en) * | 2017-06-06 | 2017-10-17 | 秦皇岛瀚丰长白结晶器有限责任公司 | The gradient distribution process and electroplanting device of copper plate of crystallizer nickel-cobalt alloy plating cobalt |
-
2012
- 2012-11-12 CN CN 201220593058 patent/CN202968734U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102912410A (en) * | 2012-11-12 | 2013-02-06 | 江苏矽研半导体科技有限公司 | Liquid stopping device applied to electroplating equipment |
| CN105274577A (en) * | 2014-05-28 | 2016-01-27 | 北京有色金属研究总院 | High purity metal preparation electrolysis bath and use method thereof |
| CN107254697A (en) * | 2017-06-06 | 2017-10-17 | 秦皇岛瀚丰长白结晶器有限责任公司 | The gradient distribution process and electroplanting device of copper plate of crystallizer nickel-cobalt alloy plating cobalt |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20181112 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |