CN202951355U - Filtering device and vacuum treatment device - Google Patents

Filtering device and vacuum treatment device Download PDF

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Publication number
CN202951355U
CN202951355U CN 201220497885 CN201220497885U CN202951355U CN 202951355 U CN202951355 U CN 202951355U CN 201220497885 CN201220497885 CN 201220497885 CN 201220497885 U CN201220497885 U CN 201220497885U CN 202951355 U CN202951355 U CN 202951355U
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China
Prior art keywords
filter
main body
gas
gas vent
described main
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Expired - Lifetime
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CN 201220497885
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Chinese (zh)
Inventor
陆科杰
徐朝阳
左涛涛
周宁
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Advanced Micro Fabrication Equipment Inc Shanghai
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Advanced Micro Fabrication Equipment Inc Shanghai
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Abstract

The utility model provides a filtering device which comprises a body and a filter. The body comprises a gas inlet and a gas outlet, the gas inlet and the gas outlet are formed in the side of the body, and the gas inlet is formed above the gas outlet. The filter is arranged above the body and comprises a top cover and a filter element, wherein the filter element is detachably connected with the upper surface of the body, the filter conducts filtering to the gas which passes through the body, and subsidiary products in the gas are deposited in the body. The utility model further provides a vacuum treatment device provided with the filtering device.

Description

A kind of filter and vacuum treatment installation
Technical field
The utility model relates to semi-conductor processing equipment, particularly, relates to for the filter of cold filtration heat pump Exhaust Gas and the vacuum treatment installation with this filter.
Background technology
In the manufacture process of semiconductor equipment, in the processing procedures such as etching, deposition, oxidation, sputter, usually can utilize plasma to machined part (wafer) process.Usually, for plasma processing apparatus, as the mode that generates plasma, can be divided into substantially and utilize corona (glow) discharge or high-frequency discharge, and utilize the mode such as microwave.
Process to machined part processing in order to produce plasma, therefore the reaction chamber that in the process of semiconductor equipment manufacturing, needs an inner vacuum, Fig. 1 shows the syndeton schematic diagram according to vacuum treatment installation of the prior art, particularly, generally can below reaction chamber 5, connect a heat pump 6, utilize 6 pairs of reaction chambers of this heat pump 5 to carry out vacuum exhaust, the air in the reaction chamber 5 is extracted out, keep reaction chamber 5 inside to be in vacuum state.
And in the process of vacuum exhaust; often can produce the byproduct in some process; these byproducts can be heated pump 6 with gas and extract out; shown in the arrow among Fig. 1; gas enters the valve 7 that is connected with heat pump 6 after extracting out from heat pump 6, and then flows to pipeline portions 8, is deposited at last in the pipeline portions 8; and the temperature of effluent air is very high in the heat pump 6, and follow-up manufacturing process is made troubles.
Therefore, the researcher expect research and development department a kind of can cool off simultaneously with the filtering and heating pump in the filter of Exhaust Gas, byproduct deposition in this filter, to avoid or to reduce the byproduct that deposits in the pipeline, is also lowered the temperature to the gas of extracting out in the heat pump simultaneously.
The utility model content
For defective of the prior art, the purpose of this utility model provides a kind of filter.
According to an aspect of the present utility model, a kind of filter is provided, described filter comprises: main body, described main body comprises a gas access and a gas vent, described gas access and described gas vent are positioned at the side of described main body, and described gas access is positioned at the top of described gas vent; Filter, described filter bits are in the top of described main body, and it comprises top cover and filter core, wherein, described filter core removably is connected with the upper surface of described main body, and described filter filters the gas of the described main body of flowing through, and makes byproduct deposition in the gas in described main body.
Preferably, described gas access and described gas vent lay respectively at two different sides of described main body, and are oriented in the following direction any between described gas access and the described gas vent:
Described gas access and described gas vent towards orthogonal;
Described gas access and described gas vent towards the opposite.
Preferably, described filter also comprises a cooling liquid flowing channel, and described cooling liquid flowing channel embeds the upper surface of described top cover, and its inside is marked with cooling fluid.
Preferably, an end of described cooling liquid flowing channel is provided with a cooling fluid entrance, and its other end is provided with a cooling liquid outlet, and described cooling fluid entrance and described cooling liquid outlet connect a cooling device, and described cooling device is carried cooling fluid to described cooling liquid flowing channel.
Preferably, described filter also comprises a sealing ring, and described sealing ring is arranged at the junction of described main body upper surface and described filter core.
Preferably, described filter core is connected in the upper surface of described main body.
Preferably, described filter core is threaded with the upper surface of described main body.
Preferably, described main body is shaped as in the shapes such as cuboid or cylinder any.
Preferably, described gas feed and described gas vent are card interface.
According to another aspect of the present utility model, a kind of vacuum treatment installation also is provided, described vacuum treatment installation comprises: reaction chamber, described reaction chamber is for the treatment of for workpiece; Heat pump, described heat pump is connected in the below of described reaction chamber, and it carries out vacuum exhaust to reaction chamber; Valve and the pipeline portions that is connected with described valve; It is characterized in that, described vacuum treatment installation also comprises: described filter, described filter are arranged between described heat pump and the described valve, wherein, the gas access of described filter connects described heat pump, and described gas vent connects described valve.
The utility model is by providing a kind of filter, make in the heat pump and flow to pipeline portions behind the effluent air cold filtration, make the byproduct in the gas of this filter of flowing through be deposited in large quantities in the filter, the byproduct that guarantees pipeline portions reduces, and this filter can also reduce the temperature of the gas of flowing through, and more is conducive to semi-conductive processing.
Description of drawings
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that other features, objects and advantages of the present utility model will become:
Fig. 1 illustrates the syndeton schematic diagram according to vacuum treatment installation of the prior art;
Fig. 2 illustrates the structural representation according to the filter of the first embodiment of the present utility model; And
Fig. 3 illustrates the syndeton schematic diagram according to the vacuum treatment installation of the second embodiment of the present utility model.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment technology contents of the present utility model is described further:
Fig. 2 shows according to the first embodiment of the present utility model, the structural representation of filter 9.Particularly, described filter 9 mainly comprises: main body 1 and filter 2, described filter 2 is positioned at the top of described main body 1, and described filter 2 removably is connected with the upper surface of described main body 1.
Further, described main body 1 comprises a gas access 11 and a gas vent 12, described gas access 11 and described gas vent 12 are positioned at the side of described main body 1, and described gas access 11 is positioned at the top of described gas vent 12, it is the more close described filter 2 of the first half that described gas access 11 is in described main body 1, described gas vent 12 is in the latter half of described main body 1, just can be filtered by described filter 2 after making gas enter described gas access 11, and after filtration, flow out from described gas vent 12.
More specifically, in embodiment illustrated in fig. 2, described main body 1 is cuboid, and preferably, described gas access 11 and described gas vent 12 lay respectively at 1 two different sides of described main body.In a preference, described gas access 11 and described gas vent 12 towards perpendicular, be that described gas access 11 is positioned at described main body 1 mutually perpendicular two sides with described gas vent 12, and described gas access 11 is positioned at the top of described gas vent 12.And then, gas enters after the described main body 1 first the latter half that flows to described main body 1 from the first half of described main body 1 that turns to through 90 ° by described gas access 11, because described gas vent 12 also is positioned at the side of described main body 1, therefore after described main body 1 the latter half of gas flow, need to again advance 90 ° turn to could flow out described main body 1 from described gas vent 12.Turn to the incidental byproduct of gas that can make the described main body 1 of flowing through more to be deposited in the described main body 1 twice of described main body 1 inside, improve the deposition of byproduct in main body 1, prevent that byproduct from entering described filter 9 pipeline afterwards, to guarantee that the byproduct in the pipeline reduces effectively, arrives the effect that the utility model will reach better.
Further, change in the example at one of the present utility model, described gas access 11 and described gas vent 12 also can be positioned at described main body 1 two opposite side surfaces, and at this moment, described gas access 11 is towards the opposite with described gas vent 12.Change in the example this this, described gas access 11 is positioned at the top of described gas vent 12 equally.Therefore, equally after gas enters described main body 1 from described gas access 11 passed through 90 ° turn to again from described gas vent 12 and flow out twice.It will be appreciated by those skilled in the art that described variation example can be achieved in conjunction with embodiment illustrated in fig. 2 equally, it will not go into details herein.
More specifically, in embodiment illustrated in fig. 2, described gas feed 11 and described gas vent 12 preferably are card interface, so that being connected of described gas feed 11 and described gas vent 12 and other equipment also makes the installation of described filter 9 and dismounting more easy simultaneously.
Described filter 2 comprises top cover 21 and filter core 22, described top cover 21 is positioned at the top of described filter core 22, described filter core 22 removably is connected with the upper surface of described main body 1, wherein, described filter core 22 mainly plays a role in filtering, its byproduct that will flow in the gas of described main body 1 carries out sedimentation, and it is deposited in the described main body 1 in a large number.Particularly, in the enforcement shown in Figure 2, can be to be threaded between the upper surface of described filter core 22 and described main body 1, make the cleaning of described filter 9 can be more convenient.And change in the example at one, described filter core 22 also can be connected in the upper surface of described main body 1, it will be appreciated by those skilled in the art that this variation example can be achieved in conjunction with embodiment illustrated in fig. 2 equally, and it will not go into details herein.
Further, in preference shown in Figure 2, described filter 9 also comprises a cooling liquid flowing channel 3, and described cooling liquid flowing channel 3 embeds the upper surface of described top cover 21, and the inside of described cooling liquid flowing channel 3 is marked with cooling fluid.The gas that described cooling liquid flowing channel 3 makes 2 pairs of described filters enter described main body 1 inside can also further cool off when filtering, and because described gas access 11 and described gas vent 12 lay respectively at two different sides and setting up and down of described main body 1, making gas enter described main body 1 inside need to turn to through twice, and then the time of the gas of the described main body 1 of flowing through increases, can obtain cooling off more fully,, improve the effect of cooling.
More specifically, as shown in Figure 2, described cooling liquid flowing channel 3 is arranged in the described top cover 21 ringwise, one end of described cooling liquid flowing channel 3 is provided with a cooling fluid entrance 31, its other end is provided with a cooling liquid outlet 32, described cooling fluid entrance 31 and described cooling liquid outlet 32 connect a cooling device (not shown), and described cooling device is carried cooling fluid to described cooling liquid flowing channel 3.
Further, described filter 9 also comprises a sealing ring 4, and described sealing ring 4 is arranged at the junction of described main body 1 upper surface and described filter core 22.The junction of the shape of described sealing ring 4 and size and described main body 1 upper surface and described filter core 22 adapts, and makes described sealing ring 4 just realize the effect of sealing.
Further, in embodiment illustrated in fig. 2, described main body 1 be shaped as cuboid, and change in the example at some, described main body 1 also can be other shapes, such as cylinder, square etc., and those skilled in the art understand, these variation examples all can be achieved in conjunction with embodiment illustrated in fig. 2, and it will not go into details herein.
Fig. 3 shows according to the second embodiment of the present utility model, the syndeton schematic diagram of vacuum treatment installation.Particularly, described vacuum treatment installation comprises: reaction chamber 5, heat pump 6, valve 7, pipeline portions 8 and filter 9.Wherein, described reaction chamber 5 is for the treatment of for workpiece.Described heat pump 6 is connected in the below of described reaction chamber 5, and it carries out vacuum exhaust to reaction chamber 5.Described valve 7 is connected with described pipeline portions 8.Described filter 9 is arranged between described heat pump 6 and the described valve 7, and wherein, the gas access 11 of the main body 1 of described filter 9 connects described heat pump 6, and described gas vent 12 connects described valve 7.When described heat pump 6 work, the gas of described reaction chamber 5 inside is by the gas access 11 of the described filter 9 of described heat pump 6 suction, and then, gas enters described main body 1 through carry out 90 ° the latter half (the right that is shown as by described main body 1 flows to its left side) that flows to described main body 1 from the first half of main body described in Fig. 11 that turns to after the filtration of described filter 2 among Fig. 3 by described gas access 11, again advances 90 ° turn to and flows to described valve 7 from described gas vent 12 and enter described pipeline portions 8.
In conjunction with above-mentioned Fig. 2 and embodiment illustrated in fig. 3, more further, those skilled in the art understand, described filter cools off by the gas of the cooling fluid in the described cooling liquid flowing channel 3 to the described filter of flowing through, and the 2 pairs of gases of flowing through of filter by described main body 1 top filter, make byproduct deposition in the gas in described main body 1, play simultaneously filter and cool stream through the effect of the gas of described filter, thereby more be conducive to semi-conductive making technology.
More than specific embodiment of the utility model is described.It will be appreciated that the utility model is not limited to above-mentioned particular implementation, those skilled in the art can make various distortion or modification within the scope of the claims, and this does not affect flesh and blood of the present utility model.

Claims (10)

1. filter, described filter comprises:
Main body, described main body comprise a gas access and a gas vent, and described gas access and described gas vent are positioned at the side of described main body, and described gas access is positioned at the top of described gas vent;
Filter, described filter bits are in the top of described main body, and it comprises top cover and filter core, wherein, described filter core removably is connected with the upper surface of described main body, and described filter filters the gas of the described main body of flowing through, and makes byproduct deposition in the gas in described main body.
2. filter according to claim 1 is characterized in that, described gas access and described gas vent lay respectively at two different sides of described main body, and is oriented in the following direction any between described gas access and the described gas vent:
Described gas access and described gas vent towards orthogonal;
Described gas access and described gas vent towards the opposite.
3. filter according to claim 2 is characterized in that, described filter also comprises a cooling liquid flowing channel, and described cooling liquid flowing channel embeds the upper surface of described top cover, and its inside is marked with cooling fluid.
4. filter according to claim 3, it is characterized in that, one end of described cooling liquid flowing channel is provided with a cooling fluid entrance, its other end is provided with a cooling liquid outlet, described cooling fluid entrance and described cooling liquid outlet connect a cooling device, and described cooling device is carried cooling fluid to described cooling liquid flowing channel.
5. filter according to claim 1 is characterized in that, described filter also comprises a sealing ring, and described sealing ring is arranged at the junction of described main body upper surface and described filter core.
6. filter according to claim 1 is characterized in that, described filter core is connected in the upper surface of described main body.
7. filter according to claim 1 is characterized in that, described filter core is threaded with the upper surface of described main body.
8. cooling filtering device according to claim 1 is characterized in that, described main body be shaped as in cuboid or the cylinder any.
9. filter according to claim 1 is characterized in that, described gas feed and described gas vent are card interface.
10. vacuum treatment installation, described vacuum treatment installation comprises:
Reaction chamber, described reaction chamber is for the treatment of for workpiece;
Heat pump, described heat pump is connected in the below of described reaction chamber, and it carries out vacuum exhaust to reaction chamber;
Valve and the pipeline portions that is connected with described valve;
It is characterized in that described vacuum treatment installation also comprises:
Each described filter in 9 according to claim 1, described filter is arranged between described heat pump and the described valve, and wherein, the gas access of described filter connects described heat pump, and described gas vent connects described valve.
CN 201220497885 2012-09-26 2012-09-26 Filtering device and vacuum treatment device Expired - Lifetime CN202951355U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220497885 CN202951355U (en) 2012-09-26 2012-09-26 Filtering device and vacuum treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220497885 CN202951355U (en) 2012-09-26 2012-09-26 Filtering device and vacuum treatment device

Publications (1)

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CN202951355U true CN202951355U (en) 2013-05-29

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CN 201220497885 Expired - Lifetime CN202951355U (en) 2012-09-26 2012-09-26 Filtering device and vacuum treatment device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109003913A (en) * 2017-06-06 2018-12-14 长鑫存储技术有限公司 Vacuum system and semiconductor device having the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109003913A (en) * 2017-06-06 2018-12-14 长鑫存储技术有限公司 Vacuum system and semiconductor device having the same

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: Filtering device and vacuum treatment device

Effective date of registration: 20150202

Granted publication date: 20130529

Pledgee: China Development Bank Co.

Pledgor: ADVANCED MICRO FABRICATION EQUIPMENT Inc. SHANGHAI

Registration number: 2009310000663

PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20170809

Granted publication date: 20130529

Pledgee: China Development Bank Co.

Pledgor: ADVANCED MICRO FABRICATION EQUIPMENT Inc. SHANGHAI

Registration number: 2009310000663

PC01 Cancellation of the registration of the contract for pledge of patent right
CP01 Change in the name or title of a patent holder

Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai

Patentee after: China micro semiconductor equipment (Shanghai) Co.,Ltd.

Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai

Patentee before: ADVANCED MICRO FABRICATION EQUIPMENT Inc. SHANGHAI

CP01 Change in the name or title of a patent holder
CX01 Expiry of patent term

Granted publication date: 20130529

CX01 Expiry of patent term